阅读说明：本技术 一种研磨头的保护罩 (Protective cover of grinding heads ) 是由 王力 曹佩珊 张勇 温川江 于 2019-10-11 设计创作，主要内容包括：本发明涉及半导体制造技术领域,尤其涉及一种研磨头的保护罩,用于防止研磨头上的杂质掉落,研磨头包括一圆盘形的主体,主体上设有一连接件,保护罩自上而下套设于主体上；保护罩包括：一第一保护罩,覆盖于主体的顶面并至少部分覆盖于主体的周向,第一保护罩覆盖于主体的顶面部分形成一承漏面,用于承接杂质；一第二保护罩,为形成于承漏面的周向的一环形凸起,环形凸起具有一第一预设高度,用于防止承漏面上的杂质洒出。本发明技术方案的有益效果在于：提供一种研磨头的保护罩,可以防止研磨头重组、研磨头自身磨损、机台磨损等原因产生的杂质掉落在研磨垫上,减少晶圆的刮伤,从而提高晶圆的良率。(The invention relates to the technical field of semiconductor manufacturing, in particular to a protective cover of a grinding head, which is used for preventing impurities on the grinding head from falling off and comprises a disc-shaped main body, wherein a 0 connecting piece is arranged on the main body, the protective cover is sleeved on the main body from top to bottom, the protective cover comprises a st protective cover, the st protective cover covers the top surface of the main body and at least partially covers the circumferential direction of the main body, a th protective cover covers the top surface of the main body to form a leakage bearing surface for bearing the impurities, and a th protective cover is a annular bulge formed on the circumferential direction of the leakage bearing surface, and the annular bulge has a th preset height and is used for preventing the impurities on the leakage bearing surface from spilling out.)

The protective cover of the grinding head of 1 and types is used for preventing impurities on the grinding head from falling off, the grinding head comprises a disc-shaped main body, the main body is provided with a connecting piece, and the protective cover is sleeved on the main body from top to bottom and comprises:

a protective cover covering the top surface of the main body and at least partially covering the periphery of the main body, wherein the protective cover covers the top surface of the main body to form a leakage-bearing surface for bearing the impurities;

and a second protective cover which is a annular bulge formed on the circumference of the leakage-bearing surface, wherein the annular bulge has a st preset height and is used for preventing impurities on the leakage-bearing surface from spilling.

2. The protective cover of claim 1, wherein a filtering hole is formed at a second predetermined height of of the annular protrusion to communicate the inside and outside of the annular protrusion, and the second predetermined height is smaller than the predetermined height.

3. The protective cover according to claim 2, characterized in that the outer side of the annular projection is provided with secondary filter means for secondary filtering of impurities.

4. The protective cover of claim 3, wherein the secondary filtration device comprises:

annular filter screen, the cover is located the bellied outside of annular, and with the position of crossing the filtration pore corresponds, be used for filtering impurity.

5. The protective cover of claim 4, wherein the outer side of the annular protrusion is annularly provided with grooves, the filter hole is positioned at the groove bottom of the grooves, and the annular filter screen is embedded in the grooves.

6. The protective cover of claim 5, wherein the recess has pairs of oppositely disposed flanges at the opening to allow the annular filter screen to nest within the recess.

7. The protective cover of claim 1, wherein said second cover top portion is folded toward said connector and forms an arcuate recess with a predetermined arc.

8. The protective cover of claim 1, wherein said predetermined height is not less than the height of said connector.

9. The protective cover of claim 1, wherein said th protective cover and said second protective cover are made of an elastic material.

10. The protective cover of claim 9, wherein said resilient material is rubber.

11. The shield of claim 1 wherein said -th shield and said -second shield are integrally formed.

Technical Field

The invention relates to the technical field of semiconductor manufacturing, in particular to a protective cover of grinding heads.

Background

The CMP process is a Mechanical Chemical Polishing (CMP) process for planarizing a wafer by CMP, and the prevention of wafer scratching during the CMP process is an important factor for controlling the quality of the wafer.

The invention provides a protective cover of grinding heads, which is used for preventing impurities from accumulating on the grinding heads and reducing wafer scratches caused by the impurities falling on the grinding heads, thereby improving the yield of wafers.

Disclosure of Invention

In response to the above-mentioned problems of the prior art, protective caps for polishing heads have been provided.

The specific technical scheme is as follows:

the invention comprises a protective cover of grinding heads, which is used for preventing impurities on the grinding heads from falling off, wherein the grinding head comprises a disc-shaped main body, the main body is provided with connecting pieces, and the protective cover is sleeved on the main body from top to bottom, and comprises:

a protective cover covering the top surface of the main body and at least partially covering the periphery of the main body, wherein the protective cover covers the top surface of the main body to form a leakage-bearing surface for bearing the impurities;

and a second protective cover which is a annular bulge formed on the circumference of the leakage-bearing surface, wherein the annular bulge has a st preset height and is used for preventing impurities on the leakage-bearing surface from spilling.

Preferably, a filtering hole is distributed at a second preset height of of the annular protrusion, so that the inner side and the outer side of the annular protrusion are communicated, and the second preset height is smaller than the preset height.

Preferably, the outer side of the annular bulge is provided with secondary filtering devices for secondary filtering of impurities.

Preferably, the secondary filtration device comprises:

annular filter screen, the cover is located the bellied outside of annular, and with the position of crossing the filtration pore corresponds, be used for filtering impurity.

Preferably, grooves are annularly formed in the outer side of the annular protrusion, the filtering holes are located at the bottoms of the grooves, and the annular filter screen is embedded in the grooves.

Preferably, the opening of the groove is provided with pairs of oppositely arranged flanges, so that the annular filter screen card is embedded in the groove.

Preferably, the top of the second protective cover is folded towards the direction of the connecting piece, and an arc groove with a preset radian is formed.

Preferably, the th preset height is not lower than the height of the connecting piece.

Preferably, the th protective cover and the second protective cover are made of elastic materials.

Preferably, the elastic material is rubber.

Preferably, the th boot and the second boot are integrally formed.

The technical scheme has the advantages that the grinding head protection covers are provided, so that impurities generated by grinding head recombination, grinding head self abrasion, machine abrasion and the like can be prevented from falling on the grinding pad, the scratching of wafers is reduced, and the yield of the wafers is improved.

Drawings

Embodiments of the present invention will be described more fully with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.

Fig. 1 is an assembly structural view of a protective cover in an embodiment of the present invention;

FIG. 2 is a sectional view showing a protective cover according to an embodiment of the present invention;

FIG. 3 is a sectional view showing an assembled structure of the shield case according to the embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a groove in an embodiment of the present invention;

fig. 5 is a schematic view of the overall structure of the protective cover in the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only partial embodiments of of the present invention, rather than all embodiments.

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.

The invention will now be described in further with reference to the following figures and examples, but not as a limitation of the invention.

The invention comprises grinding head protective covers for preventing impurities on the grinding head from falling off, as shown in figure 1, the grinding head 1 comprises a disc-shaped main body 11, a connecting piece 12 is arranged on the main body 11, and a protective cover 2 is sleeved on the main body 11 from top to bottom, wherein the protective cover 2 comprises:

a protection cover 21 covering the top surface of the main body 11 and at least partially covering the circumference of the main body 11, a protection cover 21 covering the top surface of the main body 11 forms a leakage-receiving surface 210 for receiving impurities;

the second protection cover 22 is a annular projection formed on the circumference of the leakage surface 210, and the annular projection has a st preset height for preventing the impurities on the leakage surface 210 from spilling out.

Fig. 5 is a schematic overall structure diagram before the protective cover 2 is assembled, in this embodiment, the polishing head 1 includes a main body 11 and a connecting member 12, the protective cover 2 includes an upper portion and a lower portion, a th protective cover 21 is a lower portion of the protective cover 2, a second protective cover 22 is an upper portion of the protective cover 2, a th protective cover 21 and a second protective cover 22 are formed integrally, a th protective cover 21 is used for covering a top surface of the main body 11 and a circumferential direction of the main body 11 to prevent impurities on the main body 11 from falling onto the wafer and the polishing pad, meanwhile, a leak-receiving surface 210 formed by a portion of the th protective cover 21 covering the surface of the main body 11 is used for receiving the main body itself and impurities falling off the machine table.

Specifically, because the polishing head 1 is in a rotating state during the polishing process, centrifugal force is formed, and if no protection measure is taken, the impurities on the leak-receiving surface 210 are thrown out along with the rotation of the polishing head 1, causing the impurities to fall on the wafer or the polishing pad, therefore, the second protecting cover 22 is disposed on the leak-receiving surface 210 formed by the protecting cover 21, the height of the second protecting cover 22 is slightly higher than the top surface of the connecting member 12, which mainly functions to prevent the impurities accumulated on the leak-receiving surface 210 from spilling out, thereby reducing the wafer scratch caused by the impurities on the polishing head 1 falling on the polishing pad, and improving the wafer yield.

In the preferred embodiments, as shown in fig. 4, a plurality of filtering holes 221 are uniformly distributed at a second predetermined height of the annular protrusion 22, so that the inner side and the outer side of the annular protrusion 22 are communicated, and the second predetermined height is smaller than the predetermined height.

Specifically, the aperture of the filtering hole 221 should be determined according to the size of the impurities to be filtered, and in this embodiment, the aperture of the filtering hole 221 should be smaller than the size of the impurities to prevent the impurities from being spilled through the filtering hole 221. The filtering holes 221 can be used to throw out the micro liquid, so that impurities such as hard particles, residues, abrasive dust, residual liquid with high concentration and the like are retained in the annular protrusion 22, and the impurities are prevented from falling on the polishing pad to cause wafer scratching, thereby improving the yield of wafers.

In the preferred embodiments, as shown in fig. 1 and fig. 2, secondary filtering means is disposed outside the annular protrusion, the secondary filtering means is an annular filter net 3, which is sleeved outside the annular protrusion 22, and the annular filter net 3 corresponds to the position of the plurality of filtering holes 221 for filtering impurities.

A portion of the second protective cover 22 that is attached to the screen 3 is provided with a plurality of filter holes 221 (fig. 4), and foreign substances enter the screen 3 through the plurality of filter holes 221.

Specifically, a plurality of filtering holes 221 are uniformly distributed at the second preset height of the annular protrusion 22, and the portion of the annular protrusion 22 having the filtering holes 221 is correspondingly sleeved with the annular filter net 3, so that the annular filter net 3 is communicated with the plurality of filtering holes 221.

It should be noted that, the secondary filtering device is not limited to the use of the ring filter net 3, the use of the ring filter net 3 is only a preferred embodiment, and it may also include of setting a filtering tank (not shown) with a thinner filtering hole, which is embedded in a groove of the ring protrusion 22, and the filtering tank may be a closed filtering tank with a double embedding opening or a semi-closed filtering tank with a single embedding opening, and the like.

, centrifugal force is formed when the grinding head 1 is in rotation, which makes the impurities on the leakage surface 210 throw out to the outside, so that part of the impurities with smaller particles pass through the plurality of filtering holes 221 and enter the annular filter screen 3, the annular filter screen 3 has higher filtering precision, only can throw out the tiny liquid, can effectively filter the impurities into the annular filter screen 3, prevent the impurities from falling onto the grinding pad, and can remove the impurities by regularly replacing the annular filter screen 3.

In a preferred embodiment, as shown in fig. 4, grooves 220 are annularly arranged on the outer side of the annular protrusion 22, a plurality of filtering holes 221 are positioned at the bottom of the grooves 220, and the annular filter screen 3 is embedded in the grooves 220;

the opening of the recess 220 has pairs of oppositely disposed flanges to allow the ring screen 3 to be snap-fitted into the recess 220.

Specifically, in the present embodiment, circles of grooves 220 are formed in the circumferential direction outside the annular protrusion 22, and pairs of oppositely arranged flanges are provided at the opening of the grooves 220. the annular filter net 3 is inserted into the grooves 220, so that the annular filter net 3 is fitted into the grooves 220, and the annular filter net 3 is fixed by using the grooves 220, so that the installation and removal of the annular filter net 3 are facilitated.

Specifically, the plurality of filtering holes 221 are disposed at the bottom of the groove 220, and the impurities with smaller particles in the annular protrusion 22 can pass through the filtering holes 221 on the groove 220 and enter the filter screen, so as to prevent the impurities from falling onto the polishing pad to cause wafer scratching, thereby improving the yield of the wafer.

It should be noted that, the above-mentioned technical solution uses the groove 220 to fix the ring-shaped filter screen 3, which is only a preferred embodiment of the present invention and is not limited thereto. Other means may be used to fix the ring-shaped filter 3 at the position corresponding to the filtering hole 221, for example, an adhesive material is used to attach the ring-shaped filter 3 to the outside of the ring-shaped protrusion 22.

In the preferred embodiment, as shown in FIG. 3, the top of the second boot 22 is folded back toward the connector 12 and forms an arcuate groove 222 of predetermined curvature .

Specifically, the slightly curved groove 222 formed by folding the top of the second shield 22 inward provides -shaped shielding effect to prevent impurities from being thrown out of the second shield 22.

The technical scheme has the advantages that the grinding head protection covers are provided, so that impurities generated by grinding head recombination, grinding head self abrasion, machine abrasion and the like can be prevented from falling on the grinding pad, the scratching of wafers is reduced, and the yield of the wafers is improved.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.