阅读说明：本技术 一种半导体设备的监控方法、装置及系统 (Monitoring method, device and system for semiconductor devices ) 是由 汪世军 邢家川 张万龙 王晓峰 于 2019-09-27 设计创作，主要内容包括：本发明公开了一种半导体设备的监控方法、装置及系统,应用于监控装置,所述监控方法包括：获取所述半导体生产设备的状态数据,其中,所述半导体生产设备设置有信号采集器及RAAS接口；根据所述状态数据控制显示屏显示对应的状态图标,其中,所述状态图标具有显示特征,以通过所述显示特征识别所述半导体生产设备的当前运行状态。本发明所提供的监控方法通过利用监控装置获取半导体生产设备的状态数据,并根据状态数据控制显示屏显示于状态数据对应的状态图标,以通过状态图标所对应的显示特征识别对应半导体生产设备的运行状态,从而可以通过显示屏及时获知一个或多个半导体生产设备的生产状态,以便及时作出相应半导体生产设备管理措施。(The invention discloses a monitoring method, a monitoring device and a monitoring system of semiconductor devices, which are applied to the monitoring device, wherein the monitoring method comprises the steps of acquiring state data of the semiconductor production devices, wherein the semiconductor production devices are provided with a signal acquisition device and an RAAS interface, and controlling a display screen to display corresponding state icons according to the state data, wherein the state icons have display characteristics so as to identify the current running state of the semiconductor production devices through the display characteristics.)

1, monitoring method of semiconductor equipment, which is applied to a monitoring device, wherein the monitoring device is provided with a display screen and is connected with the semiconductor production equipment in a communication way, and the monitoring method comprises the following steps:

acquiring state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, and the state data is data which is acquired by the signal collector and is transmitted to the monitoring device through the RAAS interface after identifying equipment signals of the semiconductor production equipment;

and controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has a display characteristic so as to identify the current operation state of the semiconductor production equipment through the display characteristic.

2. The monitoring method of claim 1, wherein the obtaining status data of the semiconductor manufacturing equipment comprises:

and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is used for representing the current operation state of the semiconductor production equipment and is periodically sent to the monitoring device by the signal collector after the semiconductor production equipment operates.

3. The monitoring method of claim 1, wherein the obtaining status data of the semiconductor manufacturing equipment comprises:

sending a status data request to the semiconductor production equipment;

and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is sent to the monitoring device by the signal collector of the semiconductor production equipment in response to the state data request and represents the current operation state of the semiconductor production equipment.

4. The monitoring method of claim 1, wherein the controlling the display screen to display the corresponding status icon according to the status data comprises:

generating a display control instruction according to the state data;

and controlling the display screen to display the corresponding state icon in the display area according to the display control instruction.

5. The monitoring method of claim 4, wherein the status data includes th status data and second status data, the status icons include th status icon corresponding to the th status data and a second status icon corresponding to the second status data, and the controlling the display screen to display the corresponding status icons according to the status data includes:

when the state data is th state data, generating th display control instructions;

controlling the display screen to display a state icon in a display area according to the display control instruction;

when the state data is second state data, generating a second display control instruction;

and controlling the display screen to display a second state icon in a display area according to the second display control instruction, wherein the th state icon and the second state icon have different display characteristics.

6. The monitoring method of claim 5, wherein the th status data can be any of running status data, suspended status data, alarm status data, completed status data, or idle status data;

the second status data may be any of run status data, pause status data, alarm status data, completion status data, or idle status data that is different from the th status data.

7. The monitoring method of claim 6, wherein the display characteristic comprises at least of a color characteristic, a shape characteristic, or an area characteristic.

8. The monitoring method of any of claims 1-7, further comprising:

acquiring a viewing instruction, wherein the viewing instruction is an instruction for a user to click the state icon and send the monitoring device to view the current running state of the semiconductor production equipment corresponding to the state icon;

and displaying the current operating parameters of the semiconductor production equipment according to the viewing instruction.

9. The monitoring method of claim 8, wherein displaying the current operating parameters of the semiconductor manufacturing equipment according to the viewing instructions comprises:

and amplifying and displaying the state icon according to the viewing instruction, and displaying the current operating parameters of the semiconductor production equipment in the amplified state icon.

10. A monitoring method according to claim 9, characterized in that: the semiconductor production equipment is wafer cutting equipment; the current operation parameters comprise wafer cutting path image or video data and wafer cutting tool image data or video data.

11. The monitoring method of claim 8, further comprising:

acquiring a confirmation instruction, wherein the confirmation instruction is an instruction sent to the monitoring device after a user confirms that the current operating parameters of the semiconductor production equipment meet the generation requirement;

and changing the display characteristics of the state icon according to the confirmation instruction.

monitoring device, wherein the monitoring device is provided with a display screen and is connected with the semiconductor production equipment in a communication way, the monitoring device is characterized by comprising:

the data acquisition module is used for acquiring state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, and the state data is data which is transmitted to the monitoring device through the RAAS interface after the signal collector collects and identifies equipment signals of the semiconductor production equipment;

and the icon display module is used for controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has display characteristics so as to identify the current running state of the semiconductor production equipment through the display characteristics.

13, kinds of monitoring devices, wherein the monitoring devices are provided with display screens and are in communication connection with semiconductor production equipment, and the monitoring devices are characterized by comprising memories and processors;

the memory is used for storing a monitoring program executable by the computer;

the processor is configured to invoke the monitoring program to perform the monitoring method according to any of claims 1-11.

A monitoring system for semiconductor equipment of 14 and , wherein the monitoring system comprises the monitoring device of claim 13 and the semiconductor production equipment communicatively connected with the monitoring device.

Technical Field

The invention relates to the technical field of equipment monitoring, in particular to a monitoring method, a monitoring device and a monitoring system for semiconductor equipment.

Background

Generally, when an operator knows the operation state of each semiconductor production device, the operator needs to know the operation state of the semiconductor production device by approaching the semiconductor production device and by using a state indicator lamp arranged on the semiconductor production device.

However, in the semiconductor processing process, each production processes are critical, so that higher requirements are put on automation of a semiconductor processing production workshop, when a plurality of semiconductor production equipment are in an operating state, if the operating state of each semiconductor production equipment needs to be observed manually, not only manpower is consumed, but also the environmental purity is influenced because of the fact that unnecessary impurities are introduced by human participation.

Therefore, how to implement the operation status monitoring of the semiconductor manufacturing equipment in the automated semiconductor manufacturing plant so that the worker can know the operation status of the corresponding semiconductor manufacturing equipment in time is the hot topic being studied by those skilled in the art.

Disclosure of Invention

The invention mainly aims to provide monitoring methods, devices and systems for semiconductor equipment, and aims to realize real-time monitoring of the running state of semiconductor production equipment.

In order to achieve the above object, the present invention provides monitoring methods, applied to a monitoring device, the monitoring device is provided with a display screen and is connected with a semiconductor production device in a communication manner, the monitoring method comprises:

acquiring state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, and the state data is data which is acquired by the signal collector and is transmitted to the monitoring device through the RAAS interface after identifying equipment signals of the semiconductor production equipment;

and controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has a display characteristic so as to identify the current operation state of the semiconductor production equipment through the display characteristic.

Preferably, the acquiring the status data of the semiconductor production equipment comprises:

and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is used for representing the current operation state of the semiconductor production equipment and is periodically sent to the monitoring device by the signal collector after the semiconductor production equipment operates.

Preferably, the acquiring the status data of the semiconductor production equipment comprises:

sending a status data request to the semiconductor production equipment;

and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is sent to the monitoring device by the semiconductor production equipment in response to the state data request and represents the current operating state of the semiconductor production equipment.

Preferably, the controlling the display screen to display the corresponding status icon according to the status data includes:

generating a display control instruction according to the state data;

and controlling the display screen to display the corresponding state icon in the display area according to the display control instruction.

Preferably, the status data includes th status data and second status data, the status icon includes th status icon corresponding to the th status data and a second status icon corresponding to the second status data, the controlling the display screen to display the corresponding status icon according to the status data includes:

when the state data is th state data, generating th display control instructions;

controlling the display screen to display a state icon in a display area according to the display control instruction;

when the state data is second state data, generating a second display control instruction;

and controlling the display screen to display a second state icon in a display area according to the second display control instruction, wherein the th state icon and the second state icon have different display characteristics.

Preferably, the th status data can be any of running status data, paused status data, alarm status data, completed status data or idle status data;

the second status data may be any of run status data, pause status data, alarm status data, completion status data, or idle status data that is different from the th status data.

Preferably, the display features include at least of color features, shape features, or area features.

Preferably, the monitoring method further comprises:

acquiring a viewing instruction, wherein the viewing instruction is an instruction for a user to click the state icon and send the monitoring device to view the current running state of the semiconductor production equipment corresponding to the state icon;

and displaying the current operating parameters of the semiconductor production equipment according to the viewing instruction.

Preferably, the displaying the current operating parameters of the semiconductor production equipment according to the viewing instruction comprises:

and amplifying and displaying the state icon according to the viewing instruction, and displaying the current operating parameters of the semiconductor production equipment in the amplified state icon.

Preferably, the semiconductor production equipment is wafer cutting equipment; the current operation parameters comprise wafer cutting path image or video data and wafer cutting tool image data or video data.

Preferably, the monitoring method further comprises:

acquiring a confirmation instruction, wherein the confirmation instruction is an instruction sent to the monitoring device after a user confirms that the current operating parameters of the semiconductor production equipment meet the generation requirement;

and changing the display characteristics of the state icon according to the confirmation instruction.

The invention also provides kinds of monitoring devices, wherein the monitoring devices are provided with display screens and are in communication connection with the semiconductor production equipment, and the monitoring devices comprise:

the data acquisition module is used for acquiring state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, and the state data is data which is transmitted to the monitoring device through the RAAS interface after the signal collector collects and identifies equipment signals of the semiconductor production equipment;

and the icon display module is used for controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has display characteristics so as to identify the current running state of the semiconductor production equipment through the display characteristics.

The invention also provides monitoring devices, wherein the monitoring device is provided with a display screen and is in communication connection with the semiconductor production equipment, and the monitoring device comprises a memory and a processor;

the memory is used for storing a monitoring program executable by the computer;

the processor is used for calling the monitoring program to execute the monitoring method.

The invention also provides monitoring systems of semiconductor equipment, which comprise the monitoring device and the semiconductor production equipment which is in communication connection with the monitoring device.

Compared with the prior art, the monitoring methods provided by the invention are applied to a monitoring device, the monitoring device is provided with a display screen and is in communication connection with semiconductor production equipment, the monitoring method comprises the steps of obtaining state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, the state data is data which is sent to the monitoring device through the RAAS interface after the signal collector collects and identifies equipment signals of the semiconductor production equipment, and controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has a display characteristic so as to identify the running state of the semiconductor production equipment according to the display characteristic of the state icon.

According to the monitoring method, the monitoring device is used for acquiring the state data of the semiconductor production equipment, the display screen is controlled to display the state icons corresponding to the state data according to the state data, the running state of the corresponding semiconductor production equipment is identified according to the display characteristics corresponding to the state icons, and therefore the production states of or more semiconductor production equipment can be timely known through the display screen, and corresponding semiconductor production equipment management measures can be timely made.

Drawings

Fig. 1 is a schematic view of an application scenario of a monitoring method according to an embodiment of the present invention;

FIG. 2 is a flow chart illustrating steps in a monitoring method according to an embodiment of the present invention;

FIG. 3A is a schematic diagram of signal transmission between a semiconductor manufacturing facility signal and a monitoring device;

FIG. 3B is a flowchart illustrating sub-steps of step S10 in FIG. 2;

FIG. 4A is a flowchart illustrating sub-steps of step S11 in FIG. 2;

FIG. 4B is a flowchart illustrating sub-steps of step S112 in FIG. 4A;

FIG. 5A is a schematic flow chart illustrating the monitoring device recognizing status data and generating corresponding status icons;

FIG. 5B is a diagram illustrating a status icon of the semiconductor manufacturing apparatus displayed on the display screen by the monitoring device;

FIG. 6A is a flowchart illustrating steps in a monitoring method according to an embodiment ;

FIG. 6B is a schematic diagram of the user clicking the corresponding status icon, and then magnifying and displaying the current operating parameters of the corresponding semiconductor manufacturing equipment;

FIG. 7A is a flowchart illustrating steps in a monitoring method according to an embodiment ;

FIG. 7B is a diagram illustrating a change in the display characteristics of the status icons after the user confirms that the current operating parameters of the semiconductor manufacturing apparatus are correct;

FIG. 8 is a block diagram of a monitoring device according to an embodiment of the present invention;

fig. 9 is a schematic block diagram of a monitoring apparatus according to another embodiment of the present invention.

Detailed Description

For purposes of clarity and understanding of the objects, aspects and advantages of the present invention, reference is made to the following detailed description taken in conjunction with the accompanying drawings and examples, it being understood that the specific embodiments described herein are illustrative of the invention only and are not limiting, since other embodiments may become apparent to those skilled in the art upon consideration of the following detailed description of the invention, without any creative effort.

Furthermore, the terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a series of steps or elements is not necessarily limited to the expressly listed steps or elements, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It should be noted that the description of "", "second", etc. in this application is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated, whereby the features defined as "", "second", etc. may or may not explicitly include at least of these features.

The invention provides a monitoring method, a monitoring device and a monitoring system of semiconductor equipment, wherein the monitoring method is applied to the monitoring device which is provided with a display screen and is in communication connection with semiconductor production equipment, the monitoring method comprises the steps of acquiring state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, and the state data is data which is transmitted to the monitoring device through the RAAS interface after the signal collector collects and identifies equipment signals of the semiconductor production equipment;

and controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has a display characteristic so as to identify the current operation state of the semiconductor production equipment through the display characteristic.

According to the monitoring method, the monitoring device is used for acquiring the state data of the semiconductor production equipment, the display screen is controlled to display the state icons corresponding to the state data according to the state data, the running state of the corresponding semiconductor production equipment is identified according to the display characteristics corresponding to the state icons, and therefore the production states of or more semiconductor production equipment can be timely known through the display screen, and corresponding semiconductor production equipment management measures can be timely made.

Referring to fig. 1, fig. 1 shows monitoring systems 100 according to the present invention, where the monitoring system 100 includes a monitoring device 10 and a semiconductor manufacturing apparatus 20, where the monitoring device 10 is provided with a display 101, and the monitoring device 10 is communicatively connected to the semiconductor manufacturing apparatus 20 to obtain status data of the semiconductor manufacturing apparatus 20, where the status data is used to indicate a current operating status of the semiconductor manufacturing apparatus 20, and the number of the semiconductor manufacturing apparatus 20 may be , two or more.

The semiconductor production apparatus 20 may be communicatively connected to the monitoring device 10 in such a manner that the semiconductor production apparatus 20 is provided with a communication interface, such as at least of a CCP interface, a RAAS interface, or a SECS-GEM interface, the monitoring device 10 is connected to the communication interface of the semiconductor production apparatus 20 through a signal transmission line, thereby achieving a communication connection between the monitoring device 10 and the semiconductor production apparatus 20.

The monitoring apparatus 10 recognizes the status data to display a status icon corresponding to the status data of the semiconductor manufacturing equipment 20 on the display screen 101 according to the status data after receiving the status data of the semiconductor manufacturing equipment 20, the status icon having a display characteristic according to which a user can recognize the operation status of the semiconductor manufacturing equipment 20, wherein the status data includes any of normal operation status data, pause status data, alarm status data, completion status data or idle status data, the display characteristic may be at least of a color characteristic, a shape characteristic or an area characteristic, and different operation data of the corresponding semiconductor manufacturing equipment 20 represented by each display characteristic is preset in the monitoring apparatus 10 so as to reflect the current operation status of the semiconductor manufacturing equipment 20.

For example, the description is given taking the display feature as the color feature, but the display feature is not limited to only the color feature. When the color characteristic of the status icon corresponding to the semiconductor production equipment 20 displayed in the display screen 101 of the monitoring device 10 is red, the status icon corresponds to the semiconductor production equipment 20 in the alarm state; when the color characteristic of the status icon is green, the status icon represents that the semiconductor production equipment 20 corresponding to the status icon is in a normal operation state; when the color feature of the status icon is yellow, it represents that the semiconductor production equipment 20 corresponding to the status icon is in an idle state; when the color feature of the status icon is black or white, the semiconductor manufacturing apparatus 20 corresponding to the status icon does not establish a communication connection with the monitoring device 10.

In the present embodiment, the semiconductor manufacturing apparatus 20 is at least of a wafer dicing apparatus, a wafer bonding apparatus, and a wafer dispensing apparatus.

Referring to fig. 2, fig. 2 shows monitoring methods according to the present invention, the monitoring method is applied to a monitoring device 10, the monitoring device 10 is communicatively connected to a semiconductor manufacturing apparatus 20, and the monitoring method includes:

step S10: and acquiring state data of the semiconductor production equipment, wherein the semiconductor production equipment is provided with a signal collector and an RAAS interface, and the state data is data which is transmitted to the monitoring device through the RAAS interface after the signal collector collects and identifies equipment signals of the semiconductor production equipment.

The monitoring apparatus 10 acquires status data of the semiconductor manufacturing equipment 20, wherein the semiconductor manufacturing equipment 20 may be or more, and the status data is data for representing a current operation status of the corresponding semiconductor manufacturing equipment 20.

As shown in fig. 3A, the semiconductor production equipment 20 is provided with a signal collector 201 and an RAAS interface 202, the signal collector 201 collects equipment signals of the semiconductor production equipment 20, and recognizes the equipment signals to obtain current status data of the semiconductor production equipment 20, and sends the current status data to the monitoring device 10 through the RAAS interface 202, so that the monitoring device 10 receives data corresponding to the semiconductor production equipment 20 and recognizes the current status of the semiconductor production equipment 20.

Each signal collector 201 is provided with a corresponding ID, and the corresponding semiconductor manufacturing equipment 20 can be identified by the ID.

In some embodiments, the acquiring the status data of the semiconductor production equipment includes:

receiving status data sent by the semiconductor production equipment, wherein the status data is data representing the current operating status of the semiconductor production equipment 20 and periodically sent to the monitoring device 10 by the signal collector after the semiconductor production equipment operates.

For example, after the semiconductor production equipment 20 is operated, the signal collector 201 of the semiconductor production equipment 20 periodically sends the status data representing the current operation status of the semiconductor production equipment 10 to the monitoring device 10 with a time T as a period, so that the monitoring device 10 receives the status data of the corresponding semiconductor production equipment 20 to monitor the corresponding semiconductor production equipment 10, wherein the time T may be set to 1 second(s), 2s, 5s, 10s, or the like as required, which is not limited herein.

Referring to fig. 3B, in some embodiments, the acquiring the status data of the semiconductor manufacturing equipment includes:

step S101: sending a status data request to the semiconductor production equipment;

step S102: and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is sent to the monitoring device by a signal collector of the semiconductor production equipment in response to the state data request and represents the current operation state of the semiconductor production equipment.

Illustratively, when the monitoring apparatus 10 needs to know the operating state of the corresponding semiconductor production equipment 20, it sends a state data request to the corresponding semiconductor production equipment 20, so that the signal collector 201 of the corresponding semiconductor production equipment 20 responds to the state data request and sends state data representing the current operating state of the semiconductor production equipment 20 to the monitoring apparatus 10.

The monitoring device 10 receives the status data transmitted by the corresponding semiconductor production equipment 20 and recognizes the received status data to realize monitoring of the current operating status of the corresponding semiconductor production equipment 10.

Step S11: and controlling the display screen to display a corresponding state icon according to the state data, wherein the state icon has a display characteristic, and the current operation state of the semiconductor production equipment can be identified according to the display characteristic.

After receiving the status data corresponding to the semiconductor manufacturing apparatus 20, the monitoring device 10 identifies the corresponding status data and controls the display screen 101 to display a corresponding status icon, which has a display characteristic so that the current operating status of the corresponding semiconductor manufacturing apparatus 20 can be identified according to the display characteristic.

Referring to fig. 4A, in some embodiments, step S11 includes:

step S111: generating a display control instruction according to the state data;

step S112: and controlling the display screen to display the corresponding state icon in the display area according to the display control instruction.

Referring to fig. 4B, specifically, the status data includes th status data and second status data, the status icons include th status icon corresponding to the th status data and second status icon corresponding to the second status data, and the step S112 includes:

a step S1121 of generating a th display control instruction when the state data is th state data;

step S1122, controlling the display screen to display a state icon in a display area according to the display control instruction;

step S1123: when the state data is second state data, generating a second display control instruction;

and step S1124, controlling the display screen to display a second state icon in a display area according to the second display control instruction, wherein the display characteristics of the th state icon and the second state icon are different.

The th status data may be any of a run status data, a pause status data, an alarm status data, a completion status data, or an idle status data ;

the second status data may be any of run status data, pause status data, alarm status data, completion status data, or idle status data that is different from the th status data.

The display features include at least of color features, shape features, or area features.

Illustratively, the monitoring device 10 stores a display control command that can be generated by the semiconductor manufacturing equipment 20 according to the status data, and after the monitoring device 10 recognizes the status data, the monitoring device can generate a corresponding display control command according to the status data, and control the display screen 101 to display a corresponding status icon on the display area according to the corresponding display control command.

As shown in fig. 5A, the status data of the semiconductor manufacturing apparatus 20 includes th status data, second status data, third status data, fourth status data and fifth status data, each status data represents current operating statuses of the semiconductor manufacturing apparatus 20, and the monitoring device 10 can generate corresponding display control commands after recognizing the corresponding status data, so as to control the display screen 101 to display corresponding status icons on the display area.

When the monitoring device 10 recognizes that the corresponding status data of the semiconductor manufacturing apparatus 20 is th status data, a th display control command may be generated, and a th display control command may control the display 101 to display a th status icon in the display area.

When the monitoring apparatus 10 recognizes that the status data of the corresponding semiconductor production device 20 is the second status data, a second display control instruction may be generated, and the second display control instruction may control the display screen 101 to display a second status icon in the display area.

When the monitoring apparatus 10 recognizes that the status data of the corresponding semiconductor production device 20 is the third status data, a third display control instruction may be generated, and the third display control instruction may control the display screen 101 to display a third status icon in the display area.

When the monitoring apparatus 10 recognizes that the status data of the corresponding semiconductor production device 20 is the fourth status data, a fourth display control instruction may be generated, and the fourth display control instruction may control the display screen 101 to display a fourth status icon in the display area.

When the monitoring apparatus 10 recognizes that the status data of the corresponding semiconductor production device 20 is the fifth status data, a fifth display control instruction may be generated, and the fifth display control instruction may control the display screen 101 to display a fifth status icon in the display area.

The th status icon, the second status icon, the third status icon, the fourth status icon, and the fifth status icon are different, that is, the th status icon, the second status icon, the third status icon, the fourth status icon, and the fifth status icon have different display characteristics, wherein the display characteristics include at least of color characteristics, shape characteristics, or area characteristics.

As shown in fig. 5B, the monitoring apparatus 10 receives the corresponding status data transmitted from the 9 semiconductor manufacturing apparatuses 20, and displays status icons having different display characteristics on the display area of the display screen 101 after recognizing the corresponding status data.

The description will be given by taking an example in which the status data specifically includes normal operation status data, pause status data, alarm status data, and idle status data, and the display characteristics are color characteristics.

When the monitoring apparatus 10 recognizes that the status data of the semiconductor manufacturing equipment 20 is alarm status data, the status icon of the corresponding semiconductor manufacturing equipment 20 displayed in the corresponding control display screen 101 is displayed in red.

When the monitoring apparatus 10 recognizes that the status data of the semiconductor manufacturing equipment 20 is in the normal operation status, the status icon of the corresponding semiconductor manufacturing equipment 20 displayed in the corresponding control display screen 101 is displayed in green.

When the monitoring apparatus 10 recognizes that the status data of the semiconductor manufacturing device 20 is the idle status data, the status icon of the corresponding semiconductor manufacturing device 20 displayed in the corresponding control display screen 101 is displayed in yellow.

When the monitoring apparatus 10 recognizes that the status data of the semiconductor production equipment 20 is the pause status data, the status icon of the corresponding semiconductor production equipment 20 displayed in the corresponding control display screen 101 is displayed in gray.

As shown in fig. 5B, the operating status of the 9 semiconductor manufacturing apparatuses 20 displays a status icon corresponding to a1-a9 in the display screen 101 of the monitoring device 10, and the current operating status of the corresponding semiconductor manufacturing apparatus 20 can be identified by the color characteristics of the status icon.

Referring to fig. 6A, in some embodiments, the monitoring method further includes:

step S12: acquiring a viewing instruction, wherein the viewing instruction is an instruction for a user to click the state icon and send the monitoring device to view the current running state of the semiconductor production equipment corresponding to the state icon;

step S13: and displaying the current operating parameters of the semiconductor production equipment according to the viewing instruction.

In some embodiments, the displaying the current operating parameters of the semiconductor production equipment according to the viewing instruction includes:

and amplifying and displaying the state icon according to the viewing instruction, and displaying the current operating parameters of the semiconductor production equipment in the amplified state icon.

The semiconductor production equipment is wafer cutting equipment, and the current operation parameters comprise wafer cutting channel images or video data and wafer cutting tool image data or video data.

Illustratively, when the status icon corresponding to the semiconductor production equipment 20 indicates that the corresponding semiconductor production equipment 20 has an alarm status, the user may send an instruction to the monitoring apparatus 10 to check the current operating status of the semiconductor production equipment corresponding to the status icon by clicking the status icon.

The monitoring device 10 displays the status icon in an enlarged manner according to the viewing instruction, and displays the current operating parameter of the semiconductor production equipment in the enlarged status icon, wherein the current operating parameter is a data parameter of a processing element or a processing workpiece of the semiconductor production equipment 20 in the production process, so that a user can judge whether the semiconductor production equipment 20 really has alarm information through the data parameter, and false alarm is eliminated. For example, the current operating parameter is wafer scribe line image or video data, wafer cutter image data, or video data.

As shown in fig. 6B, when the state icon a9 corresponding to the semiconductor manufacturing apparatus 20 is displayed in an alarm state, the user clicks the state icon a9, the area of the state icon a9 is enlarged, and the corresponding current operating parameter is displayed in the enlarged state icon a9, so that the user can confirm whether the current operating parameter gives an alarm or not, thereby eliminating a false alarm condition.

Referring to fig. 7A, in some embodiments, the monitoring method further includes:

step S14: acquiring a confirmation instruction, wherein the confirmation instruction is an instruction sent to the monitoring device after a user confirms that the current operating parameters of the semiconductor production equipment meet the generation requirement;

step S15: and changing the display characteristics of the state icon according to the confirmation instruction.

Illustratively, the instruction is sent to the monitoring device 10 after the user confirms the current operating parameters of the semiconductor production equipment 20 and confirms that the current operating parameters of the semiconductor production equipment 20 meet the production requirements.

The monitoring device 10 changes the display characteristics of the status icons according to the confirmation instruction to eliminate false alarm, as shown in fig. 7B, after confirming that the current operating parameters of the semiconductor manufacturing equipment 20 displayed by the status icon a9 are correct, the user sends a confirmation instruction to the monitoring device through a mouse, a keyboard or a virtual key displayed on the display 101, and after receiving the confirmation instruction, the monitoring device 10 changes the display characteristics of the status icons to the display characteristics corresponding to the normal status, for example, changes the color of the status icons from red to green.

Referring to fig. 8, the present invention further provides kinds of monitoring devices 30, wherein the monitoring device 30 is provided with a display screen 301, and the monitoring device 30 is connected to the semiconductor manufacturing equipment 20 in a communication manner, and the monitoring device 30 includes:

a data obtaining module 301, configured to obtain status data of the semiconductor production device, where the semiconductor production device is provided with a signal collector and an RAAS interface, and the status data is data sent to the monitoring apparatus through the RAAS interface after the signal collector collects and identifies a device signal of the semiconductor production device;

an icon display module 302, configured to control the display screen to display a corresponding status icon according to the status data, where the status icon has a display characteristic, so as to identify a current operating status of the semiconductor production equipment through the display characteristic.

In some embodiments, the data acquisition module 301 is further configured to:

and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is used for representing the current operation state of the semiconductor production equipment and is periodically sent to the monitoring device by the signal collector after the semiconductor production equipment operates.

In some embodiments, the data acquisition module 301 is further configured to:

sending a status data request to the semiconductor production equipment;

and receiving state data sent by the semiconductor production equipment, wherein the state data is data which is sent to the monitoring device by the signal collector of the semiconductor production equipment in response to the state data request and represents the current operation state of the semiconductor production equipment.

In some embodiments, the icon display module 302 is further configured to:

generating a display control instruction according to the state data;

and controlling the display screen to display the corresponding state icon in the display area according to the display control instruction.

In some embodiments, the status data includes th status data and second status data, the status icons include th status icon corresponding to the th status data and second status icon corresponding to the second status data, the icon display module 302 is further configured to:

when the state data is th state data, generating th display control instructions;

controlling the display screen to display a state icon in a display area according to the display control instruction;

when the state data is second state data, generating a second display control instruction;

and controlling the display screen to display a second state icon in a display area according to the second display control instruction, wherein the th state icon and the second state icon have different display characteristics.

Wherein the th status data can be any of running status data, paused status data, alarm status data, completed status data or idle status data;

the second status data may be any of run status data, pause status data, alarm status data, completion status data, or idle status data that is different from the th status data.

The display features include at least of color features, shape features, or area features.

In some embodiments, the monitoring apparatus 30 further includes an th instruction module 303 and a parameter display module 304, where the th instruction module 303 is configured to obtain a viewing instruction, where the viewing instruction is an instruction for a user to click the status icon and send a view of a current operating state of the semiconductor manufacturing device corresponding to the status icon to the monitoring apparatus, and the parameter display module 304 is configured to display a current operating parameter of the semiconductor manufacturing device according to the viewing instruction.

In some embodiments, the parameter display module 304 is further configured to perform an enlarged display on the status icon according to the viewing instruction, and display the current operating parameters of the semiconductor manufacturing equipment in the enlarged status icon. Wherein the semiconductor production equipment is wafer cutting equipment; the current operation parameters comprise wafer cutting path image or video data and wafer cutting tool image data or video data.

In some embodiments, the monitoring apparatus 30 further includes a second instruction module 305 and a feature modification module 306, where the second instruction module 305 is configured to obtain a confirmation instruction, where the confirmation instruction is an instruction sent to the monitoring apparatus after a user confirms that the current operating parameter of the semiconductor production equipment meets a generation requirement; a feature changing module 306, configured to change a display feature of the status icon according to the confirmation instruction.

Referring to fig. 9, another monitoring device 40 is provided according to an embodiment of the present invention, wherein the monitoring device 40 is provided with a display 401, and the monitoring device 40 is communicatively connected to a semiconductor manufacturing facility, the monitoring device 40 further includes a memory 402 and a processor 403, and the memory 402 is electrically connected to the processor 403.

The memory 402 includes at least types of readable storage Media, which includes Flash memory, hard disk, multimedia Card, Card type memory (e.g., SD or DX memory, etc.), magnetic memory, magnetic disk, optical disk, etc., the memory 402 may be an internal storage unit of the monitoring apparatus 40 in embodiments , such as the hard disk of the monitoring apparatus 40, the memory 402 may also be an external storage device of the monitoring apparatus 40 in embodiments , such as a plug-in hard disk provided on the monitoring apparatus 40, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash Card (Flash Card), etc., the memory 402 may be used not only for storing application software installed in the monitoring apparatus 40 and various types of data, such as code of a computer-readable device monitoring program, etc., but also for temporarily storing data that has been output or will be output.

Processor 403, which may be a Central Processing Unit (CPU), controller, microcontroller, microprocessor or other data Processing chip in some embodiments at , may call program codes stored in memory 402 or process data to perform the monitoring methods described above.

In , the present invention further provides storage media, where the storage media store a monitoring program executable by a computer, and a processor can execute the aforementioned monitoring method when calling the monitoring program.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.