阅读说明：本技术 一种撒料结构、塑封装置及塑封方法 (material spreading structure, plastic packaging device and plastic packaging method ) 是由 严成勉 王维斌 林正忠 陈明志 李龙祥 任轶凡 于 2019-11-06 设计创作，主要内容包括：本发明提供一种撒料结构、塑封装置及塑封方法,所述撒料结构包括上本体、下本体、进料口及出料口,其中,所述下本体位于所述上本体下方,并与所述上本体连接,所述上本体与所述下本体共同围成一收容空间；所述进料口设置于所述上本体的顶端,所述出料口设置于所述下本体的底端,且所述出料口的开口面积小于所述进料口的开口面积；其中,所述下本体的内壁自所述上本体的内壁底端至所述出料口呈直线倾斜。本发明的撒料结构、塑封装置及塑封方法改造了撒料部件的结构,避免在撒料期间撒料部件拐角部位出现残料堆积而导致作业产品不良发生。此外,撒料部件增加了导流槽,可以引导树脂流动,实现均匀撒料工作。(The invention provides material scattering structures, a plastic packaging device and a plastic packaging method, wherein each material scattering structure comprises an upper body, a lower body, a feed inlet and a discharge outlet, wherein the lower body is positioned below the upper body and connected with the upper body, the upper body and the lower body jointly enclose a accommodating space, the feed inlet is arranged at the top end of the upper body, the discharge outlet is arranged at the bottom end of the lower body, the opening area of the discharge outlet is smaller than that of the feed inlet, and the inner wall of the lower body is linearly inclined from the bottom end of the inner wall of the upper body to the discharge outlet.)

1, kind of spill material structure, its characterized in that includes:

an upper body;

the lower body is positioned below the upper body and connected with the upper body, and accommodating space is enclosed by the upper body and the lower body;

the feeding hole is formed in the top end of the upper body;

the discharge hole is formed in the bottom end of the lower body, and the opening area of the discharge hole is smaller than that of the feed hole;

wherein, the inner wall of lower body certainly the inner wall bottom of last body extremely the discharge gate is the straight line slope.

2. The spreading structure according to claim 1, further comprising at least diversion strips, wherein the diversion strips are positioned in the accommodating space, vertically connected with the inner walls of the upper body and the lower body, and extend from the feed inlet to the discharge outlet.

3. A scattering structure as claimed in claim 1, characterized in that: the containing space formed by the lower body in a surrounding mode is a chamfered table or an inverted table.

4. A scattering structure as claimed in claim 1, characterized in that: the inner wall of the upper body is vertical.

5. A scattering structure as claimed in claim 1, characterized in that: the accommodating space formed by the upper body in a surrounding mode is a prism or a cylinder.

A plastic package device of , comprising the material spreading structure of any claim 1 to 5.

7, kinds of plastic packaging method, characterized by, including the following steps:

providing a substrate;

a scattering structure as claimed in any of claims 1 to 5, wherein the scattering structure is used to uniformly scatter resin particles with preset weight on the surface of the substrate.

8. The plastic packaging method according to claim 7, characterized in that: and uniformly conveying the resin particles with the preset weight into the feeding hole through a conveying belt according to a preset feeding speed.

9. The plastic package method according to claim 7, wherein during the material spreading process, the material spreading structure is kept stationary, and the driving device drives the carrying platform to rotate the substrate on the carrying platform relative to the material spreading structure according to a predetermined path.

10. A plastic packaging method according to claim 7, characterized in that: a plurality of dies is included in the substrate.

Technical Field

The invention belongs to the field of integrated circuit packaging, and relates to material scattering structures, a plastic packaging device and a plastic packaging method.

Background

The weight of the resin dispersion of the Molding (Molding) equipment needs to be calculated with precision. If the phenomena of material scattering accumulation, unevenness and the like occur during the material scattering process, the quality problems of uneven thickness, wrinkles and the like of the plastic packaging layer can be caused. The quality problem of the plastic packaging equipment is an important factor influencing the whole process flow.

Therefore, how to design new material scattering structures and packaging methods to avoid resin accumulation in the work material and avoid uneven weight during resin scattering becomes important technical problems to be solved by those skilled in the art.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, it is an object of the present invention to provide scattering structures, comprising:

an upper body;

the lower body is positioned below the upper body and connected with the upper body, and accommodating space is enclosed by the upper body and the lower body;

the feeding hole is formed in the top end of the upper body;

the discharge hole is formed in the bottom end of the lower body, and the opening area of the discharge hole is smaller than that of the feed hole;

wherein, the inner wall of lower body certainly the inner wall bottom of last body extremely the discharge gate is the straight line slope.

Optionally, the material spreading structure further comprises at least diversion strips, wherein the diversion strips are located in the accommodating space, vertically connected with the inner walls of the upper body and the lower body, and extend from the feed inlet to the discharge outlet.

Optionally, the accommodating space formed by the lower body is a chamfered or rounded frustum.

Optionally, the inner wall of the upper body is vertical.

Optionally, the accommodating space formed by the upper body is prismatic or cylindrical.

The invention also provides plastic packaging devices, which comprise the material spreading structure of any item.

The invention also provides plastic package methods, which comprise the following steps:

providing a substrate;

uniformly spreading a predetermined weight of resin particles on the surface of the substrate using a spreading structure as described in any above.

Optionally, the resin particles with the preset weight are uniformly conveyed into the feed port through a conveyor belt according to a preset feeding speed.

Optionally, during the spreading process, the spreading structure is kept still, and the driving device drives the carrying platform to rotate the substrate on the carrying platform relative to the spreading structure according to a preset path.

Optionally, a plurality of dies is included in the substrate.

As described above, the material spreading structure, the plastic packaging device and the plastic packaging method of the present invention transform the structure of the material spreading component, and avoid the occurrence of defective work products due to the accumulation of residual materials at the corner of the material spreading component during the material spreading process. In addition, the material scattering component is additionally provided with a diversion trench, so that the resin can be guided to flow, and the uniform material scattering work is realized.

Drawings

Fig. 1 shows a schematic representation of example spreading structures.

Fig. 2 is a schematic view illustrating a resin layer formed by spreading resin particles on a wafer surface through the spreading structure shown in fig. 1.

Fig. 3 is a schematic view of the material spreading structure of the present invention.

Fig. 4 and 5 are schematic views showing that the spreading structure further includes at least two flow guide strips.

FIG. 6 is a schematic view showing a resin layer formed by spreading a predetermined amount of resin particles on a wafer surface by using the spreading structure of the present invention.

Description of the element reference numerals

100 spill material structure

101 upper structure

102 middle section structure

103 lower structure

200 wafer

300 resin layer

301 sharp corner

400 spill material structure

401 upper body

402 lower body

403 feed inlet

404 discharge hole

405 guide strip

500 wafer

600 resin layer

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

It should be noted that, referring to fig. 1 to fig. 6, the drawings provided in the present embodiment are only schematic illustrations of the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in the actual implementation, and the type, number and ratio of the components in the actual implementation can be random changes, and the layout of the components may be more complicated.

As shown in fig. 1, there are exemplary scattering structures 100, which are formed by sequentially connecting three segments from top to bottom, wherein the upper segment 101 and the lower segment 103 have vertical sidewalls, the cross-sectional dimension of the lower segment 103 is larger than that of the upper segment 101, and the sidewalls of the middle segment 102 have inclined sidewalls.

As shown in fig. 2, a schematic view of resin particles are scattered on the surface of a wafer 200 by the scattering structure 100 to form a resin layer 300 is shown. In an actual process, resin accumulation is easily caused at corners of the middle-stage structure 102 and the lower-stage structure 103 of the material scattering structure 100, since the amount of material scattering of each wafer is precisely calculated, if the accumulated resin is not shaken off the wafer, the actual amount of material scattering is not in accordance with the design, so that the final plastic package layer is not satisfactory, and if the accumulated resin is shaken off the wafer, the center part of the wafer is again caused to have an accumulated sharp corner 301, so that the final plastic package layer is not uniform.

Therefore, the present invention improves the above problems by a new design. The technical solution of the present invention will be described below by way of more specific examples.