阅读说明：本技术 晶圆换面防污装置及方法 (Wafer surface changing antifouling device and method ) 是由 高翔鹰 张少阳 裴文龙 陈晨 于 2019-11-05 设计创作，主要内容包括：本发明揭示了一种晶圆换面防污装置及方法,包括矩形的晶圆架,其上设置用于排列安放晶圆的直槽,直槽相互平行以致于晶圆相互之间也平行设置；第一旋升机构,设置在晶圆架的下方,用于驱动晶圆架整体升降或沿其中心轴向旋转；选择夹取机构,有选择地夹取一组晶圆,一组晶圆为排列在晶圆架上的单数项的所有晶圆；第二旋升机构,设置在选择夹取机构一侧,用于驱动选择夹取机构整体升降或沿其中心轴向旋转。本发明的有益效果体现在：通过夹取机构夹取部分晶圆,旋升机构将剩余晶圆完成整体旋转后将夹取机构上的晶圆放下,完成晶圆的换面后再进行清洗,就不会出现后一个晶圆的晶面被前面晶圆的晶背污染而影响晶圆产品的质量的问题。(The invention discloses a wafer face-changing antifouling device and a method, which comprises a rectangular wafer frame, wherein straight grooves for arranging and placing wafers are arranged on the wafer frame, the straight grooves are parallel to each other, so that the wafers are also arranged in parallel, a rotary lifting mechanism is arranged below the wafer frame and is used for driving the wafer frame to integrally lift or axially rotate along the center of the wafer frame, a clamping mechanism is selected for selectively clamping groups of wafers, groups of wafers are all wafers with singular items arranged on the wafer frame, a second rotary lifting mechanism is arranged on the side of a selected clamping mechanism and is used for driving the selected clamping mechanism to integrally lift or axially rotate along the center of the wafer frame.)

1. The antifouling device for wafer surface changing is characterized in that: comprises that

rectangular wafer rack (2), on which straight slots (20) for arranging and placing wafers (21) are arranged, the straight slots (20) are parallel to each other so that the wafers (21) are also arranged in parallel to each other;

a rotary lifting mechanism (1) arranged below the wafer rack (2) and used for driving the wafer rack (2) to wholly lift or axially rotate along the center thereof;

selecting the gripping mechanism (3), selectively gripping groups of wafers (21), wherein the groups of wafers (21) are all wafers in a single item arranged on the wafer rack (2);

and a second rotary lifting mechanism (4) arranged at the side of the selective gripping mechanism (3) and used for driving the selective gripping mechanism (3) to wholly lift or axially rotate along the center thereof.

2. The device for preventing fouling of wafer surface changing according to claim 1, wherein the selective gripping mechanism grips groups of wafers (21) or all the even numbered wafers arranged on the wafer rack (2).

3. The wafer surface changing antifouling device according to claim 1, wherein the -th rotary lifting mechanism (1) comprises a base (10), a wafer frame rotary cylinder (11) and a wafer frame lifting cylinder (12) which are arranged on the base (10), the bottom of the wafer frame lifting cylinder (12) is fixed on the rotary part of the wafer frame rotary cylinder (11), and the telescopic cylinder shaft (120) of the wafer frame lifting cylinder (12) is fixed on the bottom of the wafer frame (2).

4. The wafer surface changing antifouling device as claimed in claim 1, wherein: the selective clamping mechanism (3) is composed of two parallel clamping arms (30), the two clamping arms (30) are symmetrically arranged on two sides of the wafer (21), and the axis of the two clamping arms is perpendicular to the crystal plane of the wafer (21).

5. The wafer surface changing antifouling device as claimed in claim 4, wherein groups of grooves (31) are arranged on the clamping arms (30), the distance between adjacent grooves (31) is twice as long as the distance between adjacent wafers (21), the minimum distance between corresponding grooves (31) on two clamping arms (30) is always larger than the diameter of the wafers (21), and the positions of the grooves (31) on the clamping arms (30) correspond to the positions of the wafers (21) on the wafer rack (2).

6. The wafer surface changing antifouling device as claimed in claim 5, wherein a clamping jaw (32) is arranged between each adjacent groove (31) on the clamping arm (30), and when the clamping arm (30) rotates, the minimum distance between the corresponding clamping jaws (32) on the two clamping arms (30) is switched between a th state larger than the diameter of the wafer (21) and a second state smaller than the diameter of the wafer (21).

7. The wafer surface changing antifouling device as claimed in claim 6, wherein: the distance between the adjacent clamping jaws (32) and the grooves (31) is equal to the distance between the adjacent wafers (21).

8. The wafer face-changing antifouling device as claimed in claim 7, wherein: the second rotary lifting mechanism (4) comprises a clamping arm rotating cylinder (41) and a clamping arm lifting cylinder (42), the clamping arm rotating cylinder (41) drives the two clamping arms (30) to rotate in opposite directions simultaneously through a linkage mechanism, and the clamping arm lifting cylinder (42) drives the two clamping arms (30) to move up and down simultaneously.

9. The wafer face-changing antifouling device as claimed in claim 8, wherein: the linkage mechanism is a chain.

10. The wafer face-changing antifouling device as claimed in claim 9, wherein: the gripping arm rotating cylinder (41) drives the gripping arm (30) to rotate by 45 degrees.

11. The wafer surface changing antifouling device as claimed in claim 1, wherein: the wafer rack (2) can be provided with a plurality of wafer racks (2), and the plurality of wafer racks (2) are arranged in sequence.

12. The method according to claim 1, wherein the wafer surface changing and contamination preventing device comprises: comprises the following steps of (a) carrying out,

step 1, a wafer frame (2) is transferred to a cleaning station, all wafers (21) are sequentially placed in the wafer frame (2) at the moment, crystal faces face , and the distance between corresponding clamping jaws (32) arranged on two clamping arms (30) is larger than the diameter of each wafer (21);

step 2: the clamping arm lifting cylinder (42) drives the clamping jaws (32) to descend to a position below the horizontal diameter of the wafer, the clamping arm rotating cylinder (41) is started to enable the clamping arms (30) to rotate, and then the distance between the corresponding clamping jaws (32) arranged on the two clamping arms (30) is adjusted to be smaller than the diameter of the wafer (21);

and step 3: the clamping arm lifting cylinder (42) ascends to contact the side wall of the wafer and continues to upwards clamp and take out the wafer positioned at the clamping jaw (32), and the wafer positioned at the groove (31) of the clamping arm (30) stays on the wafer rack (2) all the time;

and 4, step 4: starting the wafer frame rotating cylinder (11) to rotate the wafer frame (2) for 180 degrees;

and 5: starting the clamping arm lifting cylinder (42), driving the clamping arm (30) to descend, and placing the wafer on the clamping jaw (31) in the wafer rack (2), wherein the wafer interval surface is arranged oppositely;

step 6: the wafer rack lifting cylinder (12) drives the wafer rack (2) to descend until the wafer rack (2) is completely immersed in the cleaning solution for cleaning;

and 7, repeating the steps 2 to 5, resetting, and enabling all the wafers (21) to be sequentially placed in the wafer rack (2) and the crystal faces to face .

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to an wafer surface changing antifouling device and method.

Background

However, the single wafer cleaning is extremely inefficient, and with the increasing demands for wafer surface cleanliness, there is a problem in the tank cleaning.

When wafers are conveyed among stations during production, in order to prevent crystal faces of adjacent wafers from being scratched, generally arranges the wafers in directions, that is, crystal backs of the front wafers are adjacent to crystal faces of the rear wafers for forming a device structure, and the crystal backs are relatively smooth, so that the crystal faces of the rear wafers cannot be scratched in the conveying process.

However, in the tank cleaning process for a plurality of wafers arranged in this way, the chemical solution used as the cleaning agent often flows from the wafer back of the front wafers to the crystal face of the rear wafers, and similarly, since the cleanliness of the wafer back is lower than that of the crystal face by levels, the front faces of the wafers are contaminated, thereby affecting the quality of the wafer products.

Therefore, how to reduce the contamination of the wafer devices during the cleaning process and improve the quality of the final wafer product is a technical problem to be solved urgently at present.

Disclosure of Invention

The invention aims to solve the problems in the prior art and provides an wafer surface changing antifouling device and method.

The purpose of the invention is realized by the following technical scheme:

the wafer surface-changing anti-fouling device comprises

rectangular wafer rack, on which straight slots for arranging and placing wafers are set, the straight slots are parallel to each other so that the wafers are also set parallel to each other;

the rotary lifting mechanism is arranged below the wafer rack and is used for driving the whole wafer rack to lift or rotate along the central axial direction of the wafer rack;

selecting a clamping mechanism to selectively clamp groups of wafers, wherein groups of wafers are all wafers in a single item arranged on the wafer rack;

and a second lifting mechanism arranged at the side of the selective gripping mechanism for driving the selective gripping mechanism to integrally lift or rotate along the central axis thereof.

Preferably, the selective gripping mechanism grips groups of wafers or all wafers of even numbers arranged on the wafer rack.

Preferably, the th rotating and lifting mechanism comprises a base, a wafer frame rotating cylinder and a wafer frame lifting cylinder, the wafer frame rotating cylinder and the wafer frame lifting cylinder are arranged on the base, the bottom of the wafer frame lifting cylinder is fixed on the rotating part of the wafer frame rotating cylinder, and the telescopic cylinder shaft of the wafer frame lifting cylinder is fixed on the bottom of the wafer frame.

Preferably, the selective clamping mechanism is two clamping arms which are parallel to each other, the two clamping arms are symmetrically placed on two sides of the wafer, and the axes of the two clamping arms are perpendicular to the crystal plane of the wafer.

Preferably, groups of grooves are arranged on the clamping arms, the distance between adjacent grooves is twice as long as the distance between adjacent wafers, the minimum distance between corresponding grooves on the two clamping arms is always larger than the diameter of the wafer, and the positions of the grooves on the clamping arms correspond to the positions of the wafers on the wafer rack.

Preferably, a clamping jaw is arranged between each adjacent groove on the clamping arm, and when the clamping arms rotate, the minimum distance between the corresponding clamping jaws on the two clamping arms is switched between an th state of being larger than the diameter of the wafer and a second state of being smaller than the diameter of the wafer.

Preferably, the distance between the adjacent clamping jaws and the groove is equal to the distance between the adjacent wafers.

Preferably, the second rotary lifting mechanism comprises a clamping arm rotating cylinder and a clamping arm lifting cylinder, the clamping arm rotating cylinder drives the two clamping arms to rotate in opposite directions through a linkage mechanism, and the clamping arm lifting cylinder drives the two clamping arms to move up and down simultaneously.

Preferably, the linkage mechanism is a chain.

Preferably, the gripping arm rotating cylinder drives the gripping arm to rotate.

Preferably, the wafer rack can be provided with a plurality of wafer racks, and the plurality of wafer racks are arranged in sequence.

A method for preventing contamination by changing a wafer surface according to the above device comprises the steps of,

step 1, transferring a wafer frame to a cleaning station, wherein all wafers are sequentially placed in the wafer frame, a crystal face faces , and the distance between corresponding clamping jaws respectively arranged on two clamping arms is larger than the diameter of each wafer;

step 2: the clamping arm lifting cylinder drives the clamping jaws to descend to a position below the horizontal diameter of the wafer, the clamping arm rotating cylinder is started to enable the clamping arms to rotate, and then the distance between the corresponding clamping jaws arranged on the two clamping arms is adjusted to enable the distance to be smaller than the diameter of the wafer;

and step 3: the clamping arm lifting cylinder ascends and contacts the side wall of the wafer, the wafer positioned at the clamping jaw is continuously clamped upwards, and the wafer positioned at the groove of the clamping arm stays on the wafer rack all the time;

and 4, step 4: starting the wafer frame rotating cylinder to rotate the wafer frame for 180 degrees;

and 5: starting the clamping arm lifting cylinder to drive the clamping arm to descend, and placing the wafers on the clamping jaws into the wafer rack, wherein the wafer interval surfaces are arranged oppositely;

step 6: the wafer frame lifting cylinder drives the wafer frame to descend until the wafer frame is completely immersed in the cleaning solution for cleaning;

and 7, repeating the steps 2 to 5, resetting, and sequentially placing all the wafers in the wafer rack, wherein the crystal face of each wafer faces .

The wafer clamping device has the advantages that wafers placed on the wafer rack at intervals are taken out through the clamping arm lifting cylinder and the clamping jaws, the wafer rack is integrally rotated by 180 degrees through the wafer rack rotating cylinder, finally the wafers clamped on the clamping jaws are put back to the original positions, namely the wafers arranged at intervals are changed in surface, so that the adjacent wafers are arranged face to face and back to back, and the position structure is put into a cleaning agent for cleaning, so that the situation that the crystal faces of the wafers are polluted because liquid medicine flows from the crystal backs of wafers to the crystal faces of wafers, and the quality of wafer products is influenced is avoided.

Drawings

FIG. 1: the invention discloses a front view of a wafer surface changing antifouling device;

FIG. 2: the invention discloses a top view of a wafer surface changing antifouling device;

FIG. 3 is a state diagram showing the clamping operation of the anti-contamination device for wafer surface changing;

FIG. 4: the invention relates to a second state diagram for clamping the wafer surface changing antifouling device.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore are not to be construed as limiting the present invention.

The wafer surface changing anti-fouling device disclosed by the invention is described in detail below with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, the anti-contamination device for wafer surface changing disclosed by the present invention comprises an th rotary lifting mechanism 1, a rectangular wafer rack 2, a clamping mechanism 3 and a second rotary lifting mechanism 4.

The rectangular wafer frame 2 is provided with straight grooves 20 for arranging and placing wafers 21, and the straight grooves 20 are arranged in parallel with each other, so that the wafers 21 are also arranged in parallel with each other. In the present invention, the wafer rack 2 may have a plurality of wafer racks 2, and the plurality of wafer racks 2 are sequentially arranged.

The -th rotary lifting mechanism 1 comprises a base 10, a wafer rack rotating cylinder 11 and a wafer rack lifting cylinder 12, wherein the wafer rack rotating cylinder 11 and the wafer rack lifting cylinder 12 are arranged on the base 10, the bottom of the wafer rack lifting cylinder 12 is fixed on the rotating part of the wafer rack rotating cylinder 11, the lifting cylinder shaft 120 of the wafer rack lifting cylinder 12 is fixed on the bottom of the wafer rack 2, namely, the -th rotary lifting mechanism 1 is arranged below the wafer rack 2, the wafer rack lifting cylinder 12 is used for driving the wafer rack 2 to integrally lift, the wafer rack rotating cylinder 11 can drive the wafer rack 2 to rotate along the central axial direction, and the wafer rack rotating cylinder 11 can rotate the wafer rack 2 by 180 degrees.

As shown in fig. 1-2, the selective gripping mechanism 3 selectively grips groups of wafers 21, and the gripped groups of wafers 21 are all wafers arranged on the wafer rack 2 at intervals, i.e. gripping wafers are singular or even all wafers on the wafer rack 2. specifically, the selective gripping mechanism 3 is two gripping arms 30 parallel to each other, the two gripping arms 30 are symmetrically arranged on two sides of the wafer 21, and the axes thereof are perpendicular to the crystal plane of the wafer 21. the length of the gripping arms 30 is at least the length of the distance from the second lifting mechanism 4 to the end of the final wafer racks 2.

groups of grooves 31 are arranged on the clamping arm 30, the distance between adjacent grooves 31 is twice as long as the distance between adjacent wafers 21, and the positions of the grooves 31 on the clamping arm 30 correspond to the positions of the wafers 21 on the wafer rack 2.

As shown in fig. 3 to 4, a clamping jaw 32 is disposed between each adjacent groove 31 of the clamping arm 30, and when the clamping arm 30 rotates, the minimum distance between the corresponding clamping jaws 32 of the two clamping arms 30 is switched between the th state of being larger than the diameter of the wafer 21 and the second state of being smaller than the diameter of the wafer 21. when the clamping arm 30 rotates, the minimum distance between the corresponding grooves 31 of the two clamping arms 30 is always larger than the diameter of the wafer 21.

The second rotary lifting mechanism 4 comprises a clamping arm rotating cylinder 41 and a clamping arm lifting cylinder 42, the clamping arm rotating cylinder 41 simultaneously drives the two clamping arms 30 to rotate oppositely through a linkage mechanism, preferably a chain, and the clamping arm lifting cylinder 42 simultaneously drives the two clamping arms 30 to move up and down, as shown in fig. 1, the second rotary lifting mechanism 4 is arranged at the side of the selective clamping mechanism 3 , the clamping arm lifting cylinder 42 thereon is used for driving the selective clamping mechanism 3 to lift integrally, and the clamping arm rotating cylinder 41 is used for driving the selective clamping mechanism 3 to rotate along the central axial direction thereof.

In the present invention, the gripper arm rotating cylinder 41 drives the gripper arm 33 to rotate by 45 °.

The working process of the wafer surface changing anti-fouling device of the invention is briefly described as follows:

step 1, a wafer frame 2 is transferred to a cleaning station, all wafers 21 are sequentially placed in the wafer frame 2 at the moment, a crystal face faces , and the distance between corresponding clamping jaws 32 respectively arranged on two clamping arms 30 is larger than the diameter of the wafer 21, as shown in fig. 3;

step 2: the clamping arm lifting cylinder 42 drives the clamping jaws 32 to descend to a position below the horizontal diameter of the wafer, the clamping arm rotating cylinder 41 is started to rotate the clamping arms 30, and then the distance between the corresponding clamping jaws 32 respectively arranged on the two clamping arms 30 is adjusted to be smaller than the diameter of the wafer 21, as shown in fig. 4;

and step 3: the clamping arm lifting cylinder 42 ascends to contact the side wall of the wafer and continues to clamp the wafer at the clamping jaw 32 upwards, and the wafer at the groove 31 of the clamping arm 30 stays on the wafer rack 2 all the time;

and 4, step 4: starting the wafer frame rotating cylinder 11 to rotate the wafer frame 2 for 180 degrees;

and 5: starting the clamping arm lifting cylinder 42 to drive the clamping arm 30 to descend, and placing the wafers on the clamping jaws 31 in the wafer rack 2, wherein the wafer spacing surfaces are arranged oppositely;

step 6: the wafer frame lifting cylinder 12 drives the wafer frame 2 to descend until the wafer frame 2 is completely immersed in the cleaning solution for cleaning;

and 7, repeating the steps 2 to 5, resetting, and sequentially placing all the wafers 21 in the wafer rack 2, wherein the crystal faces are towards .

The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.