阅读说明：本技术 Usb插座及其制造方法 (USB socket and manufacturing method thereof ) 是由 陈杭 樊凌云 于 2019-09-18 设计创作，主要内容包括：一种USB插座,包括插接件及套设于所述插接件外的金属外壳,所述插接件包括第一端子组、金属中板、将所述第一端子组与金属中板成型为一体的第一绝缘体、第二端子组及将所述第二端子组与所述第一绝缘体成型为一体的第二绝缘体,所述第一、第二端子组分别包括位于最外侧的一对接地端子、位于一对所述接地端子内侧的一对电源端子及位于一对所述电源端子之间的若干信号端子,所述第一端子组的厚度大于所述第二端子组的厚度,所述第一端子组的接地端子与所述金属中板叠压固定后成型所述第一绝缘体,所述第一绝缘体远离所述第一端子组一侧设有若干端子槽,所述第二端子组限位于所述端子槽内注塑成型所述第二绝缘体；本申请USB插座通用性强。(USB socket comprises a plug connector and a metal shell sleeved outside the plug connector, wherein the plug connector comprises a terminal group, a metal middle plate, a 2 th insulator which forms the 0 th terminal group and the metal middle plate into a 1 body, a second terminal group and a second insulator which forms the second terminal group and the 3 th insulator into a 4 body, the 5 th and the second terminal groups respectively comprise 6 pairs of grounding terminals which are positioned on the outermost side, pairs of power terminals which are positioned on the inner side of 7 pairs of grounding terminals and a plurality of signal terminals which are positioned between pairs of power terminals, the thickness of the terminal group is larger than that of the second terminal group, the grounding terminals of the terminal group and the metal middle plate are overlapped and fixed to form the insulator, a plurality of sides of the insulator far away from the th terminal group are provided with a plurality of terminal grooves, and the second terminals of the second terminal group are limited to be positioned in the second insulator grooves in an injection molding mode.)

1, USB socket, locate including plug connector and cover the metal casing outside the plug connector, the plug connector includes terminal group, metal median plate, will 0 terminal group and metal median plate shaping are the 2 insulator, the second terminal group of 1 body and will the second terminal group with 3 insulator shaping is the second insulator of 4 body, 5, second terminal group are respectively including being located the 6 of outside to ground terminal, being located 7 right inboard to the power supply terminal and being located right a plurality of signal terminals between the power supply terminal, its characterized in that, the thickness of second terminal group is greater than the thickness of second median plate group, the ground terminal of terminal group with the metal median plate is folded and is fixed the shaping the insulator after the shaping, is kept away from the side of terminal group is equipped with a plurality of terminal grooves, the second group restriction of injection moulding is in the terminal groove there is a clearance between the second terminal and the metal insulator.

2. The USB socket according to claim 1, wherein the th insulator forms a covering base on the side of the middle metal plate , the terminal groove is formed to protrude upward from the covering base, and a gap between the ground terminal and the middle metal plate is filled with the covering base.

3. The USB socket according to claim 2, wherein the second insulator includes a base portion, a step portion extending forward from the base portion, and a mating tongue portion extending forward from the step portion, and the th and second terminal sets include contact portions exposed on upper and lower surfaces of the mating tongue portion, holding portions extending backward from the contact portions and molded in the step portion and the base portion, and solder tails extending backward from the holding portions and out of a rear end of the base portion.

4. The USB socket of claim 3, wherein the th terminal set has a thickness of 0.25mm, the second terminal set has a thickness of 0.2mm, the solder tails of the th and second terminal sets are arranged in rows, and the solder tails of the th terminal set are stamped and thinned to 0.2mm, so that the solder tails of the th and second terminal sets have a thickness and the solder tails are flush with the upper and lower surfaces of the solder tails.

5. The USB socket of claim 4, wherein the metal midplane includes a second midplane located between ground terminals of the th and second terminal sets, respectively, and no metal midplane is present between power terminals and signal terminals of the th and second terminal sets.

6. The USB socket according to claim 4, wherein the plug connector is sleeved on inner metal shell, the outer metal shell is fixed on the inner metal shell, the outer metal shell comprises an upper shell and a lower shell which are fixed on two sides of the upper and lower surfaces of the inner metal shell respectively, the upper shell and the lower shell respectively comprise an upper plate part and a lower plate part which are fixed on the upper and lower sides of the inner metal shell, an upper arc part and a lower arc part which are bent and extended from two transverse sides of the upper plate part and the lower plate part, an upper ear part and a lower ear part which are bent and extended from the free ends of the upper arc part and the lower arc part and are mutually attached, and fixing holes which are formed in the upper ear part and the lower ear part, the height of the upper arc part is not equal to the height of the lower arc part, and the USB socket realizes the design of the sinking plates of different specifications on the printed circuit board by attaching the upper ear part or the lower ear part respectively.

7. The USB socket according to claim 6, wherein the upper plate portion and the lower plate portion are respectively fixed to the upper surface of the annular body by spot welding, the side surface of the annular body has an arc-shaped structure, the upper arc-shaped portion and the lower arc-shaped portion completely cover the side surface of the annular body, and the upper ear portion and the lower ear portion are attached to each other and fixed by spot welding.

8. The USB socket according to claim 6, wherein the front end of the base has a front engaging groove, the rear end of the base has a rear engaging groove, the metal inner shell comprises a ring body, a through hole extending through the ring body for being inserted into the connector, and front and rear engaging blocks formed by punching from upper and lower surfaces of the ring body and engaged with the front and rear engaging grooves.

9. The USB socket according to claim 6, wherein the fixing hole is locked to the printed circuit board by a screw.

10, A manufacturing method of USB socket, characterized by, including the following steps:

s10, stamping to form a th terminal group, a second terminal group and a metal middle plate, wherein the th terminal group is thicker than the second terminal group, the th and the second terminal group respectively comprise pairs of ground terminals located at the outermost sides, pairs of power terminals located at the inner sides of pairs of ground terminals and a plurality of signal terminals located between pairs of the power terminals, and the metal middle plate comprises th and the second middle plate located between th and the ground terminals of the second terminal group;

s20, laminating the terminal group and the middle metal plate and fixing the same in an injection mold for injection molding to form a th insulator, wherein the th insulator is provided with a covering base part and a plurality of terminal grooves extending from the covering base part on the side of the middle metal plate ;

and S30, limiting and fixing the second terminal group in the terminal groove, and injection molding again to form the second insulator, wherein the second insulator comprises a base, a step part formed by extending the base forward and a butt tongue part formed by extending the step part forward, each conductive terminal of the th and second terminal groups comprises a contact part exposed out of the upper and lower surfaces of the butt tongue part, a holding part extending from the contact part backward and molded in the base and the step part, and a solder leg formed by extending from the holding part backward.

Technical Field

The present application relates to the field of connectors, and more particularly to USB sockets and methods of making the same.

Background

Generally, sinking Type USB sockets are only suitable for electronic products, only aiming at the adaptive sinking height of the circuit board and cannot be applied to another electronic product, the existing Type C product for the mobile terminal also has the requirement of needing to transmit large current, and in order to reduce the heat productivity of a product transmission terminal, the thickness of the transmission terminal needs to be increased to reduce impedance.

Disclosure of Invention

In view of this, it is necessary to provide USB sockets capable of transmitting large current and having simple manufacturing process.

For solving above-mentioned technical problem, this application provides kinds of USB socket, locate including plug connector and cover metal casing outside the plug connector, the plug connector includes second terminal group, metal medium plate, will third 0 terminal group and metal medium plate shaping are the 2 insulator, the second terminal group of 1 body and will second terminal group with 3 insulator shaping is the second insulator of 4 body, third 5, second terminal group are respectively including being located the 6 of outside to the ground terminal, it is right to be located 7 the inboard of ground terminal is to the power supply terminal and be located a plurality of signal terminals between the power supply terminal, the thickness of third terminal group is greater than the thickness of second terminal group, the ground terminal of second terminal group with the metal medium plate is folded and is fixed back shaping third , third keeps away from third terminal group side is equipped with a plurality of terminal grooves, second terminal group limit is located the terminal inslot injection moulding is located the second terminal group, there is the clearance between the second insulator.

Preferably, the th insulator forms a covering base covering the metal middle plate on the side of the metal middle plate , the terminal groove is formed to protrude upward from the covering base, and a gap between the ground terminal and the metal middle plate is filled with the covering base.

Preferably, the second insulator includes a base, a step portion extending forward from the base, and a mating tongue portion extending forward from the step portion, and the th and second terminal groups include contact portions exposed on upper and lower surfaces of the mating tongue portion, holding portions extending backward from the contact portions and molded in the step portion and the base, and fillets extending backward from the holding portions and extending out of a rear end of the base.

Preferably, the th terminal group has a thickness of 0.25mm, the second terminal group has a thickness of 0.2mm, the solder tails of the th and second terminal groups are arranged in rows, the solder tails of the th terminal group are stamped and thinned to be 0.2mm, and the thickness of the solder tails of the th and second terminal groups is equal to the upper and lower surfaces of the solder tails.

Preferably, the metal midplane includes a th midplane and a second midplane respectively located between the th ground terminals and the ground terminals of the second terminal group, and no metal midplane exists between the th power supply terminal and the signal terminal of the second terminal group.

Preferably, metal inner shell is located to the plug connector cover, metal outer shell is fixed in on the metal inner shell, metal outer shell is including being fixed in respectively last casing and lower casing of surface both sides about the metal inner shell, go up casing and casing down including being fixed in the last board and the lower board of side about the metal inner shell, certainly go up the board and bend with the horizontal both sides of lower board and extend the cladding in last arc portion and lower arc portion of the horizontal both sides of metal inner shell, certainly go up arc portion and bend with lower arc portion free end level and extend the last ear of laminating each other that forms and set up in down the fixed orifices on ear and the lower ear, the height of going up arc portion does not equal to the height of arc portion down, the USB socket passes through respectively go up ear or lower ear laminating realizes the heavy board design of different specifications on printed circuit board.

Preferably, the upper plate portion and the lower plate portion are respectively fixed on the upper surface of the annular body by spot welding, the side surface of the annular body is of an arc-shaped structure, the upper arc-shaped portion and the lower arc-shaped portion completely cover the side surface of the annular body, and the upper ear portion and the lower ear portion are attached and fixed by spot welding.

Preferably, the front end edge of the base part is provided with a front clamping groove, the rear end edge of the base part is provided with a rear clamping groove, the metal inner shell comprises an annular body, a through hole which penetrates through the annular body from front to rear and is used for being sleeved in the plug connector, and a front clamping block and a rear clamping block which are buckled in the front clamping groove and the rear clamping groove are formed by punching from the upper surface and the lower surface of the annular body.

Preferably, the fixing hole is locked to the printed circuit board by a screw.

In order to solve the above technical problem, the present application further provides a manufacturing method of kinds of USB sockets, including the following steps:

s10, stamping to form a th terminal group, a second terminal group and a metal middle plate, wherein the th terminal group is thicker than the second terminal group, the th and the second terminal group respectively comprise pairs of ground terminals located at the outermost sides, pairs of power terminals located at the inner sides of pairs of ground terminals and a plurality of signal terminals located between pairs of the power terminals, and the metal middle plate comprises th and the second middle plate located between th and the ground terminals of the second terminal group;

s20, laminating the terminal group and the middle metal plate and fixing the same in an injection mold for injection molding to form a th insulator, wherein the th insulator is provided with a covering base part and a plurality of terminal grooves extending from the covering base part on the side of the middle metal plate ;

s30, limiting and fixing the second terminal group in the terminal groove, and injection molding again to form the second insulator, wherein the second insulator comprises a base, a step part formed by extending from the base forward and a butt tongue part formed by extending from the step part forward, each conductive terminal of the th and second terminal groups comprises a contact part exposed out of the upper and lower surfaces of the butt tongue part, a holding part extending from the contact part backward and molded in the base and the step part, and a welding leg formed by extending from the holding part backward.

The thickness of the th terminal group and the thickness of the second terminal group of the USB socket are not , the thickness of the th terminal group is increased, the grounding terminal of the th terminal group is in direct contact with the metal middle plate and is fixed, the th terminal group and the metal middle plate are fixed conveniently in the th injection molding process, the current carrying capacity of the th terminal group is increased, the thickness of the second terminal group is smaller than that of the th terminal group, the second terminal group is limited on the th insulator and is fixed on the injection molding second insulator, the manufacturing process is simple, the prior art is avoided, the thickness of the th terminal group, the grounding terminal of the second terminal group and the thickness of the power terminal are designed to be larger than that of the signal terminal so as to improve the current transmission capability, the grounding terminal, the power terminal and the signal terminal need to be formed in a punch forming mode separately, and the material.

Simultaneously, this application USB socket go up the high being less than of arc portion down the height of arc portion, down the ear laminate in printed circuit board's surface is in order to realize the USB socket welds in with heavy board mode on printed circuit board, perhaps, go up the ear laminate in printed circuit board's surface is in order to realize the USB socket with heavy board height weld in addition on the printed circuit board, so, make the USB socket of this application laminate respectively in through last ear or lower ear the printed circuit board, the cooperation go up the arc portion with the different height of arc portion realizes the heavy board degree of depth of two kinds of differences down, reaches and is applicable to the required heavy board degree of depth requirement of different electronic equipment with USB socket, has promoted the commonality of this application USB socket, has reduced mould development cost and production management cost.

Drawings

The drawings described herein are for providing an -step understanding of the present application and constitute a part of this application, , and the present application is illustrative of the exemplary embodiments and description thereof and is not to be construed as limiting the present application.

Fig. 1 is a perspective view of a USB socket sinking plate soldered on a printed circuit board according to the present invention;

FIG. 2 is an exploded perspective view of a metal shell according to the present application;

FIG. 3 is a perspective view of the plug member of the USB jack of the present application;

FIG. 4 is an exploded perspective view of the connector of the USB jack of the present application;

FIG. 5 is an exploded perspective view of the connector of the USB jack of the present application with the second insulator removed;

fig. 6 is a perspective view of th, a second terminal group and a metal middle plate of the plug connector of the USB socket according to the present invention;

fig. 7 is a side view of th, the second terminal group and the middle metal plate of the plug connector of the USB socket according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings.

Referring to fig. 1, the USB socket with the forward and reverse sinking plates of the present application includes a plug a and metal shells 20 and 30 sleeved outside the plug a. The metal shell comprises a metal inner shell 20 and a metal outer shell 30 fixed outside the metal inner shell 20. The USB socket sinking plate is soldered to the printed circuit board 10. The application uses the X direction as the front, the Y direction as the right, and the Z direction as the upper.

Referring to fig. 1 to 4, the plug-in unit a includes an th terminal group 40, a middle metal plate 60, a th insulator 80 for molding the th terminal group 40 and the middle metal plate 60 into a body, a second terminal group 50 assembled on the side of the th insulator 80 away from the th terminal group 40 , and a second insulator 70 for combining the second terminal group 50 and the th insulator 80 into a body.

The second insulator 70 includes a base 71, a step 72 formed by extending forward from the base 71, and a butt tongue 73 formed by extending forward from the step 72. The front end edge of the base part 71 is provided with a front clamping groove 711, and the rear end edge of the base part 71 is provided with a rear clamping groove 712.

The metal inner shell 20 includes an annular body 21, a through hole 22 penetrating the annular body 21 in the front-rear direction, a pressing protrusion 23 protruding into the through hole 22 from the upper and lower surfaces of the annular body 21 by punching, a front engaging block 24 formed by punching from the rear end of the annular body 21 into the through hole 22 and engaged in the front engaging groove 711, and a rear engaging block 25 formed by punching from the rear end of the annular body 21 into the through hole 22 and engaged in the rear engaging groove 712.

The metal shell 30 includes an upper case 32 fixed to an upper side of the annular body 21, and a lower case 31 fixed to a lower side of the annular body 21 and bonded to the upper case 32, the lower case 31 includes a lower plate portion 311 spot-welded to a lower surface of the annular body 21, a lower arc portion 312 bent from both sides of the lower plate portion 311 to be attached to a lateral outer side of the annular body 21, a lower ear portion 313 bent from a free end of the lower arc portion 312 to be horizontally extended, and a lower fixing hole 314 opened in the lower ear portion 313, the upper case 32 includes an upper plate portion 321 attached to an upper surface of the annular body 21, an upper arc portion 322 bent from both sides of the upper plate portion 321 to be attached to a lateral outer side of the annular body 21, an upper ear portion 323 bent from the upper arc portion 322 to be horizontally extended, and an upper positioning hole 324 opened in the upper ear portion 323, the upper arc portion 322 and the lower arc portion 312 are fitted to cover lateral side surfaces of the annular body 21, the upper arc portion 323 and the lower ear portion 313 are completely attached to the upper ear portion , and the upper fixing hole 324 is spot-welded to correspond to the lower fixing hole.

The important point is that the height of going up arc portion 322 is less than the height of arc portion 312, lower ear 313 laminate in printed circuit board 10's surface is in order to realize the USB socket welds in with sinking the board mode on printed circuit board 10. perhaps, go up ear 323 laminate in printed circuit board 10's surface is in order to realize the USB socket welds with heavy board heights in addition on printed circuit board 10, so, make the USB socket of this application laminate respectively in printed circuit board 10 through last ear 323 or lower ear 313, the cooperation go up arc portion 322 with the different height of arc portion 312 realize two kinds of different heavy board depths, reach and be applicable to the required heavy board depth requirement of different electronic equipment with kinds of USB sockets, promoted the commonality of this application USB socket, reduced mould development cost and production management cost.

Referring to fig. 4 to 7, the th and 40 th terminal sets 50 of the plug-in unit a respectively include a contact portion 51 exposed on the upper and lower surfaces of the mating tongue, a holding portion 52 embedded in the step portion 72 and the base portion 71 and extending backward from the contact portion 51, and solder tails 53 extending from the holding portion 52 to the base portion 71, the solder tails 53 of the th and 50 th terminal sets 40 and 50 are arranged in rows at the rear end of the base portion 71, and the upper and lower surfaces of the solder tails 53 in the row are flush with each other.

The th and the 50 th terminal groups 40 and 50 each include pairs of ground terminals 54 located at the outermost side in the transverse direction, pairs of power terminals 55 located between 0 pairs of the ground terminals 54, and a plurality of signal terminals 56 located between pairs of the power terminals 55. the metal middle plate 60 includes a middle plate 61 and a second middle plate 62 independently located between the th terminal group 40 and the ground terminals 54 of the second terminal group 50, the transverse outer sides of the middle plate 61 and the second middle plate 63 are respectively exposed to the transverse outer side of the butt tongue 73 and form a retaining recess 63, the th and the second middle plates 63 and 64 are further provided with a plurality of through holes 64 for filling and fixing with plastic, the th and the second middle plates 63 and 64 are respectively located between two pairs of ground terminals 54 of the and the second terminal groups 40 and 50, and the two pairs of signal terminals 56 are not provided with the metal middle plate 60.

The thickness of the th terminal group 40 is 0.25mm, the thickness of the second terminal group 50 is 0.2mm, the ground terminal 54 of the th terminal group 40 directly contacts the th and second middle plates 61 and 62, and a gap exists between the ground terminal 54 of the second terminal group 50 and the th and second middle plates 61 and 62, the solder leg 53 of the th terminal group 40 is thinned by punching to make the thickness of the solder leg 53 of the second terminal group 50 equal to the thickness , namely 0.2mm, so that the thickness of the th terminal group 40 is increased, the current carrying capacity is increased, and meanwhile, the solder leg 53 of the th terminal group 40 is thinned, and the upper and lower surfaces of the solder leg 53 are flush with the upper and lower surfaces of the solder leg 53 of the second terminal group 50, and accordingly, the sunk plate design on both sides can be realized.

In the manufacturing process, the -th terminal group 40 and the middle metal plate 60 are overlapped with and then injection-molded 0 times to form the -th insulator 80, when positioning is performed, the power terminal 55 and the signal terminal 56 of the -th terminal group 40 are clamped at the upper and lower sides, the upper surface of the ground terminal 54 of the -th terminal group 40 and the lower surface of the corresponding position of the middle metal plate 60 are respectively clamped, and the lower surface of the ground terminal 54 is in direct contact with the upper surface of the middle metal plate 60, the insulator 80 forms a covering base 81 covering the middle metal plate 60 and the -th terminal group 40 (the power terminal 55 and the signal terminal 56) at the side of the middle metal plate 60, a , a second terminal groove 84, a third terminal groove 84, an 83, 82 formed on the covering base 81 in the front-rear direction, the third terminal , the second terminal groove 84, the 83, the 82 are respectively used for limiting the position where the contact portion 51, the holding portion 52 of the second terminal group 50 and the holding portion 52 are directly combined with the base portion 5850.

After the second terminal set 50 is limited on the th insulator 80, the th insulator 80 and the second terminal set 50 are positioned and injection molded for the second time to form the second insulator 70.

The th terminal group 40 of the plug connector A is thicker than the second terminal group 50, when the th terminal group 40 is punched, the welding leg 53 of the th terminal group 40 is simultaneously thinned to enable the thickness of the welding leg 53 of the th terminal group 40 to be equal to that of of the welding leg 53 of the second terminal group 50, when the th injection molding is carried out, the th terminal group 40 and the metal middle plate 60 are directly overlapped and fixed, then the second terminal group 50 is placed on the insulator 80 to carry out the second injection molding, and then the injection molding of the plug connector can be completed, compared with the prior art, the times of injection molding processes can be reduced.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.