阅读说明：本技术 散热器及具有该散热器的电子装置 (Radiator and electronic device with same ) 是由 张育维 于 2018-07-20 设计创作，主要内容包括：一种散热器,至少包括壳体,所述壳体包括上壳体和下壳体,所述上壳体和所述下壳体相对设置,并密封以形成空腔,所述散热器还包括毛细结构和散热液,所述毛细结构和所述散热液容置于所述空腔内,所述上壳体的面积大于所述下壳体,所述上壳体相对所述下壳体的边缘形成突出部。本发明还提供了一种具有散热器的电子装置。(heat sink, at least including a shell, the shell including an upper shell and a lower shell, the upper shell and the lower shell set oppositely and sealed to form a cavity, the heat sink also including a capillary structure and a heat dissipating liquid, the capillary structure and the heat dissipating liquid contained in the cavity, the upper shell area is larger than the lower shell, the upper shell forms a protruding part relative to the lower shell edge, the invention also provides electronic device with heat sink.)

The radiator at least comprises a shell, and is characterized in that the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are oppositely arranged and sealed to form a cavity, the radiator further comprises a capillary structure and radiating liquid, the capillary structure and the radiating liquid are contained in the cavity, the area of the upper shell is larger than that of the lower shell, and a protruding portion is formed on the edge of the upper shell, which is opposite to the lower shell.

2. The heat sink of claim 1, wherein the capillary structure is disposed on at least of the upper and lower housings.

3. The heat sink of claim 1, wherein: the housing is made of a metal material.

4. The heat sink of claim 1, wherein the protrusion is part of the upper case.

The electronic device at least comprises a middle frame, and is characterized in that the electronic device further comprises a radiator, the radiator comprises a shell, a capillary structure and heat dissipation liquid, the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are oppositely arranged and sealed to form a cavity, the capillary structure and the heat dissipation liquid are contained in the cavity, the area of the upper shell is larger than that of the lower shell, a protruding part is formed on the edge of the upper shell, which is opposite to the lower shell, the middle frame comprises a groove, and the groove is used for containing the radiator.

6. The electronic device of claim 5, wherein: the cross section of the groove is in a step shape, and the step-shaped cross section is matched with the structure of the shell, so that the shell is just accommodated in the groove.

7. The electronic device of claim 6, wherein: the protruding part in the shell is correspondingly embedded into the stepped structure of the groove, so that the shell is assembled to the middle frame.

8. The electronic device as claimed in claim 5, wherein the middle frame includes an th surface and a second surface opposite to the th surface, the groove extends through the th surface and the second surface, a surface of the upper housing away from the lower housing is flush with the th surface, and a surface of the lower housing away from the upper housing is flush with the second surface.

9. The electronic device of claim 5, wherein the middle frame comprises an th surface and a second surface disposed opposite to the th surface, and the groove penetrates the th surface or the second surface.

10. The electronic device of claim 5, wherein: the electronic device further comprises a back cover, a circuit board, a battery and a display screen, wherein the radiator is embedded in the middle frame, the circuit board and the battery are arranged adjacently, the circuit board and the battery are located between the back cover and the middle frame, the circuit board and the battery are located between the back cover and the radiator, the middle frame and the radiator are located between the circuit board and the display screen, and the middle frame and the radiator are located between the battery and the display screen.

Technical Field

The invention relates to radiators and an electronic device with the radiators.

Background

At present, VC (vacuum-Chamber Vapor Chamber) is widely applied to electronic devices by for obtaining better heat dissipation effect, however, the assembly of VC at present achieves the purpose of being mounted on the electronic devices by adding extra elements on the VC itself.

Disclosure of Invention

In view of the above, it is desirable to provide heat sinks that do not affect the thickness of the electronic device itself.

The invention also provides electronic devices with the heat sink.

radiator, at least including the casing, the casing includes upper casing and lower casing, the upper casing and the lower casing set up relatively, and sealed in order to form the cavity, the radiator still includes capillary structure and radiating liquid, the capillary structure with the radiating liquid holding is in the cavity, the area of upper casing is greater than the lower casing, the edge that the upper casing is relative the lower casing forms the protruding portion.

electronic device, at least including the center, the electronic device also includes the radiator, the radiator includes casing, capillary structure and radiating liquid, the casing includes upper casing and lower casing, upper casing and lower casing relative setting, and sealed in order to form the cavity, capillary structure with the radiating liquid holding in the cavity, the area of upper casing is greater than the lower casing, the edge that the upper casing is relative the lower casing forms the protruding portion, the center includes the recess, the recess is used for acceping the radiator.

In summary, the heat sink is formed by combining an upper shell and a lower shell with different sizes , wherein the upper shell forms a protrusion part corresponding to the edge of the lower shell, and the protrusion part is correspondingly embedded into the stepped structure of the groove, so that the heat sink can be assembled to the middle frame without other fastening elements, thereby reducing the time for assembling the heat sink to the electronic device, and improving the production efficiency.

Drawings

Fig. 1 is an exploded view of an electronic device according to a preferred embodiment of the invention.

Fig. 2 is a cross-sectional view of the middle frame and the heat sink in the electronic device shown in fig. 1.

Fig. 3 is a cross-sectional view of a heat sink in the electronic device shown in fig. 1.

Description of the main elements

Electronic device	100
		Middle frame	10
th surface	101
		Second surface	103
Groove	105
		Heat radiator	30
Shell body	301
		Upper shell	3011
Projection part	3012
		Lower casing	3013
Hollow cavity	3015
		Heat dissipating liquid	303
Capillary structure	305
		Back cover	40
Circuit board	50
		Battery with a battery cell	60
Display screen	70

The following detailed description is provided to further illustrate the present invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only partial embodiments of of the present invention, rather than all embodiments.

It should be noted that when elements are referred to as being "connected" to another elements, it can be directly connected to another elements or intervening elements may be present at the same time, and when elements are referred to as being "disposed" to another elements, it can be directly disposed on another elements or intervening elements may be present at the same time.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1, the present invention provides electronic devices 100. the electronic devices 100 may be, but are not limited to, a mobile phone, a tablet computer, a watch, etc. in this embodiment, the electronic device 100 is illustrated as a mobile phone.

The electronic device 100 at least includes a back cover 40, a circuit board 50, a battery 60, a middle frame 10, a heat sink 30 and a display screen 70. Wherein, the heat sink 30 is embedded in the middle frame 10. The circuit board 50 and the battery 60 are disposed adjacent to each other. The circuit board 50 and the battery 60 are located between the back cover 40 and the middle frame 10. The circuit board 50 and the battery 60 are located between the back cover 40 and the heat sink 30. The middle frame 10 and the heat sink 30 are located between the circuit board 50 and the display screen 70. The middle frame 10 and the heat sink 30 are located between the battery 60 and the display screen 70.

It is understood that the electronic device 100 may further include, but is not limited to, an antenna, a camera, etc. for implementing its intended functions.

referring to fig. 2, the bezel 10 includes a surface 101 and a second surface 103 opposite to the surface 101, wherein the surface of the bezel 10 facing the circuit board 50 is the surface 101, and the surface of the bezel 10 facing the display screen 70 is the second surface 103. in this embodiment, the bezel 10 further includes grooves 105. the grooves 105 penetrate the surface 101 and the second surface 103. the grooves 105 are used for receiving the heat sink 30. of course, in other embodiments, the grooves 105 may penetrate only the surface 101 or the second surface 103.

It is understood that the center frame 10 may also be used to support the display screen 70, provide a ground plane, provide electromagnetic shielding, improve the structural strength of the electronic device 100, and so on.

Please , referring to fig. 3, the heat sink 30 at least includes a housing 301, a heat dissipating liquid 303 and a capillary structure 305, the heat sink 30 is used to assist heat dissipation of heat generating elements such as an IC (Integrated Circuit) and a battery 60 in the electronic device 100, so as to improve the operation performance of the electronic device 100, wherein the IC (Integrated Circuit) may be a CPU (Central Processing Unit), an RFIC (Radio frequency Integrated Circuit), a PMIC (Power Management IC), and the like.

The housing 301 may be made of a metal material, the housing 301 includes an upper housing 3011 and a lower housing 3013, the upper housing 3011 and the lower housing 3013 are disposed opposite to each other and sealed to form a cavity 3015, wherein the upper housing 3011 and the lower housing 3013 may be connected together by welding, bonding, or the like.

, the upper and lower housings 3011 and 3013 may be molded to form the housing 301 with cavities 3015.

In this embodiment, the upper casing 3011 has a larger area than the lower casing 3013. thus, when the lower casing 3013 and the upper casing 3011 are connected , the upper casing 3011 forms a protrusion 3012 with respect to the edge of the lower casing 3013, wherein the protrusion 3012 is part of of the upper casing 3011.

The housing 301 is accommodated in the groove 105 of the middle frame 10.

Specifically, referring to fig. 2 again, the cross section of the groove 105 is stepped, and the stepped cross section and the structure of the casing 301 are matched with each other, so that the casing 301 is just accommodated in the groove 105, thereby keeping the thickness of the middle frame 10 unchanged, and further ensuring the thinness of the electronic device 100, wherein the surface of the upper casing 3011 away from the lower casing 3013 is flush with the -th surface 101, and the surface of the lower casing 3013 away from the upper casing 3011 is flush with the second surface 103, meanwhile, the protrusion 3012 in the casing 301 is correspondingly embedded into the stepped structure of the groove 105, so that the heat sink 30 can be assembled to the middle frame 10 by glue, double-sided glue or welding without using other fastening elements.

The heat dissipation liquid 303 is contained in the cavity 3015, the heat dissipation liquid 303 can perform a mutual conversion between a gas phase and a liquid phase at a constant temperature of to achieve a heat dissipation function of the heat sink 30, wherein the heat dissipation liquid 303 absorbs heat by converting the liquid phase into the gas phase through evaporation, and dissipates heat by diffusion of the evaporated gas in the cavity 3015.

The capillary structure 305 is accommodated in the cavity 3015 and disposed on at least of the upper casing 3011 and the lower casing 3013, the capillary structure 305 is configured to guide the heat dissipation liquid 303 condensed when it meets with cold to flow back in the cavity 3015 by capillary phenomenon, preferably, the capillary structure 305 may be foam.

In summary, the heat sink 30 is formed by combining an upper casing 3011 and a lower casing 3013 having different sizes , wherein the upper casing 3011 forms a protrusion 3012 relative to the edge of the lower casing 3013, and the protrusion 3012 is correspondingly embedded into the stepped structure of the groove 105, so that the heat sink 30 can be assembled to the middle frame 10 by glue, double-sided tape or welding without using other fastening elements, thereby reducing the time for assembling the heat sink 30 to the electronic device 100, and improving the production efficiency.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.