阅读说明：本技术 有机发光二极管显示面板及其制造方法、显示设备 (Organic light emitting diode display panel, manufacturing method thereof and display device ) 是由 王品凡 于 2018-03-30 设计创作，主要内容包括：一种有机发光二极管显示面板,包括：基底基板(10)；像素限定层(30),其位于所述基底基板(10)上,用于限定多个子像素(Sp)；多个有机发光二极管,其分别位于所述多个子像素中；和第一无机封装层(20),其位于基底基板(10)和像素限定层(30)之间,构造为封装所述多个子像素(Sp)中的所述多个有机发光二极管。所述像素限定层(30)包括彼此间隔开的多个像素限定块(30B)。所述第一无机封装层(20)包括多个第一无机封装块(20B),所述多个第一无机封装块(20B)中的每一个位于所述基底基板(10)和所述多个像素限定块(30B)中的一个之间并且构造为封装所述多个子像素(Sp)中的一个中的所述多个有机发光二极管中的一个。(an organic light emitting diode display panel includes a base substrate (10), a pixel defining layer (30) on the base substrate (10) for defining a plurality of subpixels (Sps), a plurality of organic light emitting diodes respectively located in the plurality of subpixels, and a th inorganic encapsulation layer (20) located between the base substrate (10) and the pixel defining layer (30) and configured to encapsulate the plurality of organic light emitting diodes in the plurality of subpixels (Sps), the pixel defining layer (30) including a plurality of pixel defining blocks (30B) spaced apart from each other, the th inorganic encapsulation layer (20) including a plurality of th inorganic encapsulation blocks (20B), each of the plurality of th inorganic encapsulation blocks (20B) located between the base substrate (10) and of the plurality of pixel defining blocks (30B) and configured to encapsulate of the plurality of organic light emitting diodes in of the plurality of subpixels (Sps).)

An organic light emitting diode display panel of kinds, comprising:

a base substrate;

a pixel defining layer on the base substrate for defining a plurality of sub-pixels;

a plurality of organic light emitting diodes respectively located in the plurality of sub-pixels; and

an inorganic encapsulation layer between the base substrate and the pixel defining layer configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels;

wherein the pixel defining layer comprises a plurality of pixel defining blocks spaced apart from one another, each of the plurality of pixel defining blocks configured to define of the plurality of sub-pixels;

the th inorganic encapsulation layer includes a plurality of th inorganic encapsulation blocks, each of the plurality of th inorganic encapsulation blocks being located between the base substrate and of the plurality of pixel defining blocks and being configured to encapsulate of the plurality of organic light emitting diodes located in of the plurality of sub-pixels, and

an orthographic projection of each of the plurality of inorganic package blocks on the base substrate substantially covers an orthographic projection of a periphery of of the plurality of organic light emitting diodes on the base substrate.

2. The organic light emitting diode display panel of claim 1, wherein an orthographic projection of each of the plurality of inorganic encapsulation blocks on the base substrate substantially covers an orthographic projection of of the plurality of pixel-defining blocks on the base substrate.

3. The organic light emitting diode display panel of claim 1, further comprising a second inorganic encapsulation layer on a side of the plurality of organic light emitting diodes and the pixel defining layer distal from the th inorganic encapsulation layer;

wherein the second inorganic encapsulation layer is in direct contact with a peripheral portion of each of the plurality of th inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes.

4. The organic light emitting diode display panel of claim 3, wherein the second inorganic encapsulation layer is a continuous layer extending throughout the plurality of subpixels.

5. The organic light emitting diode display panel of claim 3, wherein the second inorganic encapsulation layer comprises a plurality of second inorganic encapsulation blocks;

each of the plurality of second inorganic package blocks is in direct contact with a peripheral portion of of the plurality of inorganic package blocks to package the plurality of organic light emitting diodes, and

each orthographic projections of the plurality of second inorganic package blocks on the base substrate substantially cover a combination of the orthographic projections of of the plurality of organic light emitting diodes on the base substrate, the orthographic projections of of the plurality of inorganic package blocks on the base substrate, and the orthographic projections of of the plurality of pixel defining blocks on the base substrate.

6. The organic light emitting diode display panel of claim 5, wherein the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state, and

adjacent ones of the second plurality of inorganic package blocks are spaced apart by a th gap in the th substantially unstretched state and by a second gap in the second stretched state, the second gap distance of the second gap being greater than the th gap distance of the th gap.

7. The organic light emitting diode display panel of claim 6, further comprising organic encapsulation blocks located in the th and second gaps and attached to sidewalls of of the adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks.

8. The organic light emitting diode display panel of claim 6, further comprising two organic encapsulation blocks located in the th and second gaps and each attached to a sidewall of of the adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks.

9. The organic light-emitting diode display panel of any of claims 3-8, further comprising an organic encapsulation layer on the side of the second inorganic encapsulation layer away from the base substrate;

wherein the organic encapsulation layer comprises a plurality of th organic encapsulation blocks, each th organic encapsulation block being at least partially located in the sub-pixel region, and

an orthographic projection of each of the plurality of organic package blocks on the base substrate substantially covers an orthographic projection of of the plurality of organic light emitting diodes on the base substrate.

10. The organic light emitting diode display panel of claim 9, wherein the organic encapsulation layer further comprises a plurality of second organic encapsulation blocks in an inter-subpixel region;

the second inorganic encapsulation layer comprises a plurality of second inorganic encapsulation blocks; and is

Each of the plurality of second organic package blocks are located in a gap between adjacent ones of the plurality of second inorganic package blocks and attached to sidewalls of of the adjacent ones of the plurality of second inorganic package blocks.

11. The organic light emitting diode display panel of claim 10, wherein the organic light emitting diode display panel is a stretchable display panel having th substantially unstretched state and a second stretched state;

adjacent second inorganic package blocks of the plurality of second inorganic package blocks are spaced apart by a th gap in the second substantially unstretched state and by a second gap in the second stretched state, the second gap distance of the second gap being greater than the th gap distance of the th gap;

each of the plurality of second organic encapsulation blocks substantially fill in the th gap in the th substantially unstretched state.

12. The organic light emitting diode display panel of claim 9, wherein the organic encapsulation layer further comprises a plurality of third organic encapsulation blocks in the inter-subpixel region;

the second inorganic encapsulation layer comprises a plurality of second inorganic encapsulation blocks;

two of the third plurality of inorganic package blocks are located in a gap between adjacent second inorganic package blocks of the second plurality of inorganic package blocks and are each attached to a sidewall of of the adjacent second inorganic package blocks of the second plurality of inorganic package blocks.

13. The organic light emitting diode display panel of claim 12, wherein the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state;

adjacent second inorganic package blocks of the plurality of second inorganic package blocks are spaced apart by a th gap in the second substantially unstretched state and by a second gap in the second stretched state, the second gap distance of the second gap being greater than the th gap distance of the th gap;

two of the plurality of third organic encapsulation blocks are filled in the th gap in the th substantially unstretched state.

14. The organic light-emitting diode display panel of any of claims 9 to 13, further comprising a third inorganic encapsulation layer on a side of the organic encapsulation layer away from the base substrate.

15. An organic light emitting diode display panel as claimed in claim 14 wherein the third inorganic encapsulation layer is a continuous layer extending throughout the plurality of sub-pixels.

16. The organic light emitting diode display panel of claim 14, wherein the third inorganic encapsulation layer comprises a plurality of third inorganic encapsulation blocks;

each of the plurality of third inorganic encapsulation blocks are in direct contact with the second inorganic encapsulation layer and are in direct contact with of the plurality of organic encapsulation blocks;

each of the plurality of third inorganic package blocks has an orthographic projection on the base substrate substantially covering a combination of an orthographic projection of of the plurality of organic light emitting diodes on the base substrate and an orthographic projection of of the plurality of organic package blocks on the base substrate.

17. The organic light emitting diode display panel of claim 16, wherein the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state, and

adjacent ones of the third inorganic package blocks are spaced apart by a th gap in the th substantially unstretched state and by a second gap in the second stretched state, the second gap distance of the second gap being greater than the th gap distance of the th gap.

18. The organic light emitting diode display panel of claim 17, wherein adjacent ones of the third plurality of inorganic encapsulation blocks are spaced apart by a portion of the or plurality of organic encapsulation blocks in the gap in the substantially unstretched state.

19. The organic light emitting diode display panel of claim 16, wherein the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state, and

adjacent ones of the third inorganic package blocks are in direct contact with each other in the th substantially unstretched state and are spaced apart gaps in the second stretched state.

20. The organic light emitting diode display panel of any of claims 1-18, wherein the base substrate is a stretchable base substrate and the organic light emitting diode display panel is a stretchable organic light emitting diode display panel.

21, an organic light emitting diode display panel, comprising:

a base substrate;

a pixel defining layer on the base substrate for defining a plurality of sub-pixels;

a plurality of organic light emitting diodes respectively located in the plurality of sub-pixels;

an inorganic encapsulation layer between the base substrate and the pixel defining layer configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels;

a second inorganic encapsulation layer located on a side of the plurality of organic light emitting diodes and the pixel defining layer distal from the th inorganic encapsulation layer;

an organic encapsulation layer on the side of the second inorganic encapsulation layer away from the base substrate, and

a third inorganic encapsulation layer on the side of the organic encapsulation layer away from the base substrate.

22. The organic light emitting diode display panel of claim 21, wherein the pixel defining layer comprises a plurality of pixel defining blocks spaced apart from one another, each of the plurality of pixel defining blocks configured to define of the plurality of sub-pixels;

an th inorganic encapsulation layer including a plurality of th inorganic encapsulation blocks, each of the plurality of th inorganic encapsulation blocks being located between the base substrate and of the plurality of pixel defining blocks and being configured to encapsulate of the plurality of organic light emitting diodes located in of the plurality of sub-pixels;

an orthographic projection of each of the plurality of inorganic package blocks on the base substrate substantially covers an orthographic projection of a periphery of of the plurality of organic light emitting diodes on the base substrate;

the second inorganic encapsulation layer directly contacts with a peripheral portion of each of the plurality of inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes;

the organic encapsulation layer includes a plurality of th organic encapsulation blocks, each th organic encapsulation block being at least partially located in the sub-pixel region, and

an orthographic projection of each of the plurality of organic package blocks on the base substrate substantially covers an orthographic projection of of the plurality of organic light emitting diodes on the base substrate.

23, organic light emitting diode display device comprising the organic light emitting diode display panel of any of claims 1 to 22, .

24. The organic light emitting diode display device of claim 23, wherein the organic light emitting diode display device is a wearable display device.

25, A method of manufacturing an organic light emitting diode display panel, comprising:

forming a pixel defining layer for defining a plurality of sub-pixels on a base substrate;

forming a plurality of organic light emitting diodes in the plurality of sub-pixels, respectively; and

forming th inorganic encapsulation layer between the base substrate and the pixel defining layer, configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels;

wherein forming the pixel defining layer includes forming a plurality of pixel defining blocks spaced apart from each other, each of the plurality of pixel defining blocks being formed to define of the plurality of sub-pixels;

forming the th inorganic encapsulation layer includes forming a plurality of th inorganic encapsulation blocks, each of the plurality of th inorganic encapsulation blocks being formed between the base substrate and of the plurality of pixel defining blocks and being formed to encapsulate of the plurality of organic light emitting diodes located in of the plurality of sub-pixels, and

the th inorganic encapsulation layer is formed such that an orthogonal projection of each of the plurality of th inorganic encapsulation blocks on the base substrate substantially covers an orthogonal projection of a periphery of of the plurality of organic light emitting diodes on the base substrate.

26. The method of claim 25 wherein the th inorganic encapsulation layer is formed such that an orthographic projection of each of the plurality of th inorganic encapsulation blocks on the base substrate substantially covers an orthographic projection of each of the plurality of pixel-defining blocks on the base substrate.

27. The method of claim 25, further comprising forming a second inorganic encapsulation layer on a side of the plurality of organic light emitting diodes and the pixel defining layer distal from the th inorganic encapsulation layer;

wherein the second inorganic encapsulation layer is formed in direct contact with a peripheral portion of each of the plurality of th inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes.

28. The method of claim 27, wherein the second inorganic encapsulation layer is formed as a continuous layer extending throughout the plurality of sub-pixels.

29. The method of claim 27, wherein forming the second inorganic encapsulation layer comprises forming a plurality of second inorganic encapsulation blocks;

each of the plurality of second inorganic package blocks being formed to be in direct contact with a peripheral portion of of the plurality of th inorganic package blocks, thereby encapsulating the plurality of organic light emitting diodes, and

the second inorganic encapsulation layer is formed such that an orthogonal projection of each of the plurality of second inorganic encapsulation blocks on the base substrate substantially covers a combination of an orthogonal projection of of the plurality of organic light emitting diodes on the base substrate, an orthogonal projection of of the plurality of -th inorganic encapsulation blocks on the base substrate, and an orthogonal projection of of the plurality of pixel defining blocks on the base substrate.

30. The method of any of claims 27-29, further comprising forming an organic encapsulation layer on a side of the second inorganic encapsulation layer distal from the base substrate;

wherein forming the organic encapsulation layer includes forming th organic encapsulation blocks, each th organic encapsulation block being at least partially located in the sub-pixel region, and

the organic encapsulation layer is formed such that an orthographic projection of each th organic encapsulation blocks of the plurality on the base substrate substantially covers an orthographic projection of of the plurality of organic light emitting diodes on the base substrate.

31. The method of claim 30, wherein forming the organic encapsulation layer further comprises forming a plurality of second organic encapsulation blocks located in inter-subpixel regions;

and the organic encapsulation layer is formed such that each of the plurality of second organic encapsulation blocks are located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and attached to sidewalls of of the adjacent ones of the plurality of second inorganic encapsulation blocks.

32. The method of claim 30, wherein forming the organic encapsulation layer further comprises forming a plurality of third organic encapsulation blocks located in inter-subpixel regions;

forming the second inorganic encapsulation layer includes forming a plurality of second inorganic encapsulation blocks;

the organic encapsulation layer is formed such that two of the third plurality of organic encapsulation blocks are located in a gap between adjacent second inorganic encapsulation blocks of the second plurality of inorganic encapsulation blocks and are each attached to a sidewall of of the adjacent second inorganic encapsulation blocks of the second plurality of inorganic encapsulation blocks.

33. The method of any of claims 30-32, further comprising forming a third inorganic encapsulation layer on a side of the organic encapsulation layer distal from the base substrate.

34. The method of claim 33, wherein the third inorganic encapsulation layer is formed as a continuous layer extending throughout the plurality of sub-pixels.

35. The method of claim 33, wherein forming the third inorganic encapsulation layer comprises forming a plurality of third inorganic encapsulation blocks;

each of the plurality of third inorganic encapsulation blocks are formed in direct contact with the second inorganic encapsulation layer and in direct contact with of the plurality of organic encapsulation blocks;

the third inorganic encapsulation layer is formed such that an orthogonal projection of each of the plurality of third inorganic encapsulation blocks on the base substrate substantially covers a combination of an orthogonal projection of of the plurality of organic light emitting diodes on the base substrate and an orthogonal projection of of the plurality of -th organic encapsulation blocks on the base substrate.

Technical Field

The present invention relates to a display technology, and more particularly, to an organic light emitting diode display panel and a display apparatus, and a method of manufacturing the organic light emitting diode display panel.

Background

An Organic Light Emitting Diode (OLED) display device is a self-light emitting device and does not require a backlight. OLED display devices also provide brighter colors and a larger color gamut than conventional Liquid Crystal Display (LCD) devices. In addition, OLED display devices can be made more flexible, thinner, and lighter than typical LCDs.

Disclosure of Invention

In , the present invention provides organic light emitting diode display panel including a base substrate, a pixel defining layer on the base substrate for defining a plurality of sub-pixels, a plurality of organic light emitting diodes respectively in the plurality of sub-pixels, and a th inorganic encapsulation layer between the base substrate and the pixel defining layer configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels, wherein the pixel defining layer includes a plurality of pixel defining blocks spaced apart from each other, each 1 of the plurality of pixel defining blocks configured to define of the plurality of sub-pixels, a rd inorganic encapsulation layer including a plurality of th inorganic encapsulation blocks, each of the plurality of th inorganic encapsulation blocks being located between the base substrate and of the plurality of pixel defining blocks and configured to encapsulate each of the plurality of organic light emitting diodes located in the plurality of sub-pixels and a peripheral light emitting diode projection front substrate (i) on the base substrate and a plurality of pixel defining blocks adapted to enclose the plurality of pixels th inorganic encapsulation blocks located on the plurality of sub-pixels, and a peripheral light emitting diodes located on the base substrate 73742 and substantially covered with the plurality of organic light emitting diodes on the peripheral light emitting substrate.

Optionally, an orthographic projection of each of the plurality of inorganic package blocks on the base substrate substantially covers an orthographic projection of of the plurality of pixel-defining blocks on the base substrate.

Optionally, the organic light emitting diode display panel further comprises a second inorganic encapsulation layer positioned at side of the plurality of organic light emitting diodes and the pixel defining layer far from the th inorganic encapsulation layer, wherein the second inorganic encapsulation layer is in direct contact with a peripheral portion of each of the plurality of th inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes.

Optionally, the second inorganic encapsulation layer is a continuous layer extending throughout the plurality of sub-pixels.

Optionally, the second inorganic encapsulation layer includes a plurality of second inorganic encapsulation blocks, each of the plurality of second inorganic encapsulation blocks directly contacts a peripheral portion of of the plurality of inorganic encapsulation blocks to encapsulate the plurality of organic light emitting diodes, and an orthographic projection of each of the plurality of second inorganic encapsulation blocks on the base substrate substantially covers a combination of an orthographic projection of of the plurality of organic light emitting diodes on the base substrate, an orthographic projection of of the plurality of inorganic encapsulation blocks on the base substrate, and an orthographic projection of of the plurality of pixel-defining blocks on the base substrate.

Optionally, the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state, and adjacent ones of the plurality of second inorganic encapsulation blocks are spaced apart by a th gap in the th substantially unstretched state and by a second gap in the second stretched state, the second gap distance of the second gap being greater than a th gap distance of the th gap.

Optionally, the organic light emitting diode display panel further includes organic encapsulation blocks located in the th and second gaps and attached to sidewalls of of the adjacent second inorganic encapsulation blocks among the plurality of second inorganic encapsulation blocks.

Optionally, the organic light emitting diode display panel further includes two organic encapsulation blocks located in the th and second gaps and each attached to a sidewall of the adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks.

Optionally, the organic light emitting diode display panel further comprises an organic encapsulation layer located at side of the second inorganic encapsulation layer away from the base substrate, wherein the organic encapsulation layer comprises a plurality of th organic encapsulation blocks, each th organic encapsulation block is located at least partially in the sub-pixel region, and an orthographic projection of each of the plurality of th organic encapsulation blocks on the base substrate substantially covers an orthographic projection of of the plurality of organic light emitting diodes on the base substrate.

Optionally, the organic encapsulation layer further comprises a plurality of second organic encapsulation blocks located in the inter-subpixel region, the second inorganic encapsulation layer comprises a plurality of second inorganic encapsulation blocks, and each of the plurality of second organic encapsulation blocks are located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and attached to sidewalls of the adjacent ones of the plurality of second inorganic encapsulation blocks.

Alternatively, the organic light emitting diode display panel is a stretchable display panel having th substantially unstretched states and second stretched states, adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks are spaced apart by th gaps in the th substantially unstretched states and are spaced apart by second gaps in the second stretched states, a second gap distance of the second gaps is greater than a th gap distance of the th gaps, and every of the plurality of second organic encapsulation blocks are substantially filled in the th gaps in the th substantially unstretched states.

Optionally, the organic encapsulation layer further comprises a plurality of third organic encapsulation blocks located in the inter-subpixel region, the second inorganic encapsulation layer comprises a plurality of second inorganic encapsulation blocks, and two of the plurality of third inorganic encapsulation blocks are located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and are each attached to a sidewall of of the adjacent ones of the plurality of second inorganic encapsulation blocks.

Alternatively, the organic light emitting diode display panel is a stretchable display panel having th substantially unstretched states and second stretched states, adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks are spaced apart by th gaps in the th substantially unstretched states and are spaced apart by second gaps in the second stretched states, a second gap distance of the second gaps is greater than a th gap distance of the th gaps, and two of the plurality of third organic encapsulation blocks are filled in the th gaps in the th substantially unstretched states.

Optionally, the organic light emitting diode display panel further comprises a third inorganic encapsulation layer located on the side of the organic encapsulation layer away from the base substrate.

Optionally, the third inorganic encapsulation layer is a continuous layer extending throughout the plurality of sub-pixels.

Optionally, the third inorganic encapsulation layer includes a plurality of third inorganic encapsulation blocks, each of the plurality of third inorganic encapsulation blocks being in direct contact with the second inorganic encapsulation layer and with of the plurality of organic encapsulation blocks, an orthographic projection of each of the plurality of third inorganic encapsulation blocks on the base substrate substantially covering a combination of an orthographic projection of of the plurality of organic light emitting diodes on the base substrate and an orthographic projection of of the plurality of organic encapsulation blocks on the base substrate.

Optionally, the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state, and adjacent ones of the third inorganic encapsulation blocks are spaced apart by a th gap in the th substantially unstretched state and by a second gap in the second stretched state, the second gap distance of the second gap being greater than a th gap distance of the th gap.

Optionally, adjacent ones of the third plurality of inorganic encapsulation blocks are spaced apart in a substantially unstretched state at by portions of or the plurality of organic encapsulation blocks in the gap.

Alternatively, the organic light emitting diode display panel is a stretchable display panel having th substantially unstretched states and second stretched states, and adjacent third inorganic encapsulation blocks of the plurality of third inorganic encapsulation blocks are in direct contact with each other in the th substantially unstretched states and are spaced apart by constant gaps in the second stretched states.

Alternatively, the base substrate is a stretchable base substrate, and the organic light emitting diode display panel is a stretchable organic light emitting diode display panel.

In another aspect, the present invention provides a organic light emitting diode display panel including a base substrate, a pixel defining layer on the base substrate for defining a plurality of sub-pixels, a plurality of organic light emitting diodes respectively in the plurality of sub-pixels, a th inorganic encapsulation layer between the base substrate and the pixel defining layer configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels, a second inorganic encapsulation layer on a side of the plurality of organic light emitting diodes and the pixel defining layer remote from the th inorganic encapsulation layer, an organic encapsulation layer on a side of the second inorganic encapsulation layer remote from the base substrate, and a third inorganic encapsulation layer on a side of the organic encapsulation layer remote from the base substrate.

Optionally, the pixel defining layer includes a plurality of pixel defining blocks spaced apart from each other, each of the plurality of pixel defining blocks configured to define of the plurality of sub-pixels, the th inorganic encapsulation layer includes a plurality of th inorganic encapsulation blocks, each 853 of the plurality of nd inorganic encapsulation blocks is located between the base substrate and of the plurality of pixel defining blocks and configured to encapsulate 6 organic light emitting diodes of the plurality of organic light emitting diodes located in of the plurality of sub-pixels, each of the plurality of th inorganic encapsulation blocks is in direct contact with a peripheral portion of each of the plurality of organic light emitting diodes on the base substrate, thereby encapsulating the plurality of organic light emitting diodes, the second inorganic encapsulation layer is in direct contact with a peripheral portion of each of the plurality of th inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes, the organic light emitting diodes are located in substantially upright projection regions of the plurality of organic light emitting diodes located in upright projection regions of the plurality of organic light emitting diodes, the base substrate is located in upright projection regions , and the organic encapsulation blocks are located in upright projection regions of the plurality of organic light emitting diodes located in upright projection regions .

In another aspect, the invention provides organic light emitting diode display devices comprising the organic light emitting diode display panel described herein or an organic light emitting diode display panel made by the method described herein.

Optionally, the organic light emitting diode display device is a wearable display device.

In another aspect, the present invention provides a method of fabricating an organic light emitting diode display panel, including forming a pixel defining layer for defining a plurality of sub-pixels on a base substrate, forming a plurality of organic light emitting diodes in the plurality of sub-pixels, respectively, and forming th inorganic encapsulation layer between the base substrate and the pixel defining layer, configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels, wherein forming the pixel defining layer includes forming a plurality of pixel defining blocks spaced apart from each other, each number of the plurality of pixel defining blocks being formed to define numbers of the plurality of sub-pixels, forming a th inorganic encapsulation layer includes forming a plurality of th inorganic encapsulation blocks, each number of the plurality of th inorganic encapsulation blocks being formed between the base substrate and a 853 number of the plurality of pixel defining blocks and being formed to encapsulate each of 852 th inorganic encapsulation blocks of the plurality of organic light emitting diodes located in the plurality of sub-pixels , and forming a peripheral front projection layer of the plurality of organic light emitting diodes overlying the base substrate 8984 on the peripheral front projection substrate .

Optionally, the th inorganic encapsulation layer is formed such that an orthographic projection of each of the plurality of th inorganic encapsulation blocks on the base substrate substantially covers an orthographic projection of of the plurality of pixel-defining blocks on the base substrate.

Optionally, the method further comprises forming a second inorganic encapsulation layer on a side of the plurality of organic light emitting diodes and the pixel defining layer distal from the th inorganic encapsulation layer, wherein the second inorganic encapsulation layer is formed in direct contact with a peripheral portion of each of the plurality of th inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes.

Optionally, the second inorganic encapsulation layer is formed as a continuous layer extending throughout the plurality of sub-pixels.

Optionally, forming the second inorganic encapsulation layer includes forming a plurality of second inorganic encapsulation blocks, each of the plurality of second inorganic encapsulation blocks being formed to be in direct contact with a peripheral portion of of the plurality of inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes, and the second inorganic encapsulation layer being formed such that an orthogonal projection of each of the plurality of second inorganic encapsulation blocks on the base substrate substantially covers a combination of an orthogonal projection of of the plurality of organic light emitting diodes on the base substrate, an orthogonal projection of of the plurality of inorganic encapsulation blocks on the base substrate, and an orthogonal projection of of the plurality of pixel defining blocks on the base substrate.

Optionally, the method further comprises forming an organic encapsulation layer on the side of the second inorganic encapsulation layer away from the base substrate, wherein forming the organic encapsulation layer comprises forming a plurality of th organic encapsulation blocks, each th organic encapsulation block being at least partially located in the sub-pixel region, and the organic encapsulation layer is formed such that an orthographic projection of each of the plurality of th organic encapsulation blocks on the base substrate substantially covers an orthographic projection of of the plurality of organic light emitting diodes on the base substrate.

Optionally, forming the organic encapsulation layer further comprises forming a plurality of second organic encapsulation blocks located in the inter-subpixel region, forming the second inorganic encapsulation layer comprises forming a plurality of second inorganic encapsulation blocks, and the organic encapsulation layer is formed such that each of the plurality of second organic encapsulation blocks are located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and attached to sidewalls of of the adjacent ones of the plurality of second inorganic encapsulation blocks.

Optionally, forming the organic encapsulation layer further comprises forming a plurality of third organic encapsulation blocks located in the inter-subpixel regions, forming the second inorganic encapsulation layer comprises forming a plurality of second inorganic encapsulation blocks, and the organic encapsulation layer is formed such that two of the plurality of third organic encapsulation blocks are located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and are each attached to a sidewall of the adjacent ones of the plurality of second inorganic encapsulation blocks.

Optionally, the method further comprises forming a third inorganic encapsulation layer on the side of the organic encapsulation layer away from the base substrate.

Optionally, the third inorganic encapsulation layer is formed as a continuous layer extending throughout the plurality of sub-pixels.

Optionally, forming the third inorganic encapsulation layer includes forming a plurality of third inorganic encapsulation blocks, each of the plurality of third inorganic encapsulation blocks being formed in direct contact with the second inorganic encapsulation layer and in direct contact with of the plurality of organic encapsulation blocks, the third inorganic encapsulation layer being formed such that each of the plurality of third inorganic encapsulation blocks has an orthographic projection on the base substrate that substantially covers a combination of an orthographic projection of of the plurality of organic light emitting diodes on the base substrate and an orthographic projection of of the plurality of organic encapsulation blocks on the base substrate.

Drawings

The following drawings are merely exemplary for purposes of illustrating various embodiments in accordance with the disclosure and are not intended to limit the scope of the invention.

Fig. 1A is a schematic diagram illustrating an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 1B is a plan view of an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 1C is a schematic diagram illustrating an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 1D is a plan view of an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 1E is a schematic diagram illustrating an organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure.

Fig. 1F is a schematic diagram illustrating an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 1G is a schematic diagram illustrating an organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure.

Fig. 2A is a schematic diagram illustrating an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 2B is a plan view of an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 2C is a schematic diagram illustrating an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 2D is a plan view of an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 2E is a schematic diagram illustrating an organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure.

Fig. 3A is a schematic diagram illustrating an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 3B is a plan view of an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 3C is a schematic diagram illustrating an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 3D is a plan view of an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 3E is a schematic diagram illustrating an organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure.

Fig. 4A is a schematic diagram illustrating an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 4B is a plan view of an organic light emitting diode display panel in embodiments according to the present disclosure.

Fig. 4C is a schematic diagram illustrating an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 4D is a plan view of an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 4E is a schematic diagram illustrating an organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure.

Fig. 4F is a plan view of an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure.

Fig. 4G is a schematic diagram illustrating an organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure.

Detailed Description

It is noted that the following description of embodiments is presented herein for purposes of illustration and description only.

Accordingly, the present disclosure provides, among other things, an organic light emitting diode display panel and a display device, and a method of manufacturing the organic light emitting diode display panel, which substantially eliminate or more of the problems due to the limitations and disadvantages of the related art, in , the present disclosure provides organic light emitting diode display panels in embodiments, an organic light emitting diode display substrate includes a base substrate, a pixel defining layer on the base substrate for defining a plurality of sub-pixels, a plurality of organic light emitting diodes respectively located in the plurality of sub-pixels, and a nd inorganic encapsulation layer between the base substrate and the pixel defining layer configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels, optionally, the pixel defining layer includes a plurality of pixel defining blocks spaced apart from each other, optionally, each of the plurality of pixel defining blocks is configured to define 4 of the plurality of sub-pixels, optionally, a th inorganic encapsulation layer includes a plurality of 466 th sub-pixels, and a plurality of organic light emitting diodes 24 th inorganic encapsulation blocks is configured to define a plurality of sub-pixels, a plurality of peripheral light emitting diodes 8938 in a peripheral light emitting diode encapsulation block, and a peripheral light emitting diode encapsulation block is configured between the plurality of organic light emitting diodes 9638, optionally, a peripheral light emitting diode encapsulation block 9636, a peripheral light emitting diode encapsulation block, a peripheral encapsulation block, and a peripheral light emitting diode encapsulation block, a peripheral light emitting block, a peripheral.

As used herein, the term "stretchable" refers to or more of the length, width, and thickness of the organic light emitting diode display panel being reversibly expandable by application of an external force to the organic light emitting diode display panel.

FIG. 1A is a schematic diagram illustrating an organic light emitting diode display panel in embodiments according to the present disclosure, referring to FIG. 1A, the organic light emitting diode display panel in embodiments includes a plurality of subpixels Sp and has subpixel areas A and inter-subpixel areas B, the organic light emitting diode display panel shown in FIG. 1A in embodiments is an organic light emitting diode display panel in a substantially unused state, for example, the organic light emitting diode display panel shown in FIG. 1A may be a stretchable organic light emitting diode display panel that has been manufactured but has not been used, for example, or more of the encapsulation layers of the organic light emitting diode display panel may be a continuous layer that has not been stretched and separated into a plurality of encapsulation blocks.

As used herein, an inter-sub-pixel region refers to a region between two adjacent sub-pixel regions, such as a region corresponding to a black matrix in a liquid crystal display or a region corresponding to a pixel definition layer in an organic light emitting diode display panel.

Referring to fig. 1A, the organic light emitting diode display panel in embodiments includes a base substrate 10, a pixel defining layer 30 on the base substrate 10 for defining a plurality of subpixels Sp, a plurality of organic light emitting diodes OLED respectively in the plurality of subpixels Sp, and a th inorganic encapsulation layer 20 between the base substrate 10 and the pixel defining layer 30, configured to encapsulate the plurality of organic light emitting diodes OLED in the plurality of subpixels Sp, e.g., from a bottom side of the plurality of organic light emitting diodes OLED, each of the plurality of organic light emitting diodes OLED is surrounded on the bottom side (e.g., near an anode of the plurality of organic light emitting diodes OLED) by the pixel defining layer 30, the base substrate 10 (e.g., a passivation layer in the organic light emitting diode display panel), and the th inorganic encapsulation layer 20.

In embodiments, the pixel defining layer 30 includes a plurality of pixel defining blocks 30B spaced apart from one another, optionally, each of the plurality of pixel defining blocks 30B is configured to define of the plurality of subpixels Sp, optionally, each of the plurality of pixel defining blocks surrounds a periphery of of the plurality of subpixels Sp.

Each of the plurality of pixel defining blocks 30B can have any suitable shape, alternatively, each of the plurality of pixel defining blocks 30B has a hollow cylindrical shape, and its inner walls surround of the plurality of organic light emitting diodes OLED.

In embodiments, the th inorganic encapsulation layer 20 includes a plurality of th inorganic encapsulation blocks 20B. optionally, each of the plurality of th inorganic encapsulation blocks 20B is located between the base substrate 10 and of the plurality of pixel defining blocks 30B, and is configured to encapsulate organic light emitting diodes of of the plurality of subpixels Sp of the plurality of organic light emitting diode OLEDs, e.g., from the bottom side. optionally, each of the plurality of th inorganic encapsulation blocks 20B orthographic projection on the base substrate 10 substantially covers an orthographic projection of of the plurality of organic light emitting diode OLEDs on the base substrate 10, e.g., each of the plurality of th inorganic encapsulation blocks 20B orthographic projection on the base substrate 10 substantially covers an orthographic projection of at least one of of the plurality of organic light emitting diodes OLEDs on the base substrate 638, e.g., each of the plurality of th inorganic encapsulation blocks 20B orthographic projection on the base substrate 10 substantially covers a base substrate 638 of the plurality of pixels encapsulation blocks 20B, optionally the orthographic projection of pixels 638 on the base substrate 6310 substantially covers the base substrate 10, the upright projection of the plurality of pixels encapsulation blocks 20B substantially covers the base substrate 638.

In some embodiments of , each of the plurality of organic light emitting diodes OLED comprises a th electrode (e.g., an anode), a second electrode (e.g., a cathode), an organic light emitting layer between a th electrode and the second electrode, optionally each of the plurality of organic light emitting diodes OLED further comprises or more functional layers between a th electrode and the second electrode, optionally the second electrode is located on a side of the organic light emitting layer remote from the th electrode, optionally an orthographic projection of each of the plurality of inorganic encapsulation blocks 20B on the base substrate 10 substantially covers an orthographic projection of a periphery of an electrode of the plurality of organic light emitting diodes OLED 9 on the base substrate 10, optionally an orthographic projection of each 1 of the plurality of inorganic encapsulation blocks 20B on the base substrate 10 substantially covers a periphery of an 8610 of the plurality of organic light emitting diodes OLED 72B in the plurality of organic light emitting diodes OLED substrate , optionally the plurality of the plurality 367 th inorganic encapsulation blocks 20B substantially covers a periphery of the plurality of organic light emitting diodes OLED encapsulation blocks 20B on the base substrate 3610 substantially covers the plurality of organic light emitting diodes OLED emission substrates 3610, optionally the plurality of organic light emitting diodes OLED encapsulation blocks 3610 substantially covers the plurality of organic light emitting diodes OLED substrates 3610, optionally the plurality of organic light emitting diodes OLED substrate 3610.

Each of the plurality of inorganic packages 20B can have any suitable shape optionally, each of the plurality of inorganic packages 20B have a ring shape and an inner side thereof surrounds of the plurality of organic light emitting diodes OLEDs optionally, the ring shape is a rectangular ring shape optionally, the ring shape is a square ring shape optionally, the ring shape is a circular ring shape.

In embodiments, the organic light emitting diode display panel further includes a second inorganic encapsulation layer 40 on the side of the plurality of organic light emitting diodes OLED and pixel defining layers 30 away from the th inorganic encapsulation layer 20 as shown in fig. 1A, in embodiments, the second inorganic encapsulation layer 40 is in direct contact with the peripheral portion of each of the plurality of th inorganic encapsulation blocks 20B, thereby encapsulating the plurality of organic light emitting diodes OLED, alternatively, the second inorganic encapsulation layer 40 is in direct contact with the entirety of the peripheral portion of each of the plurality of th inorganic encapsulation blocks 20B, thereby encapsulating the plurality of organic light emitting diodes OLED.

In an initial state, as shown in fig. 1A, the second inorganic encapsulation layer 40 in embodiments is a continuous layer extending over the plurality of subpixels Sp alternatively, the second inorganic encapsulation layer 40 extends into a region between adjacent inorganic encapsulation blocks of the plurality of inorganic encapsulation blocks 20B and is in direct contact with the base substrate 10 (e.g., a passivation layer of an organic light emitting diode display panel).

In embodiments, the organic light emitting diode display panel further includes an organic encapsulation layer 50 located on the side of the second inorganic encapsulation layer 40 away from the base substrate 10 to further step encapsulate the plurality of organic light emitting diodes OLEDs, optionally, the organic encapsulation layer 50 includes a plurality of organic encapsulation blocks in embodiments, the organic encapsulation layer 50 includes a plurality of th organic encapsulation blocks 50A, optionally, each of the plurality of th organic encapsulation blocks 50A is at least partially located in the sub-pixel region a, optionally, each of the plurality of th organic encapsulation blocks 50A has an orthographic projection on the base substrate 10 substantially covering an orthographic projection of of the plurality of organic light emitting diodes OLEDs on the base substrate 10.

In embodiments, the organic encapsulation layer 50 includes a plurality of second organic encapsulation blocks 50B located in the inter-subpixel region B. each of the plurality of second organic encapsulation blocks 50B are located on the side of the second inorganic encapsulation layer 40 away from the base substrate 10 in the inter-subpixel region B. each of the plurality of second organic encapsulation blocks 50B protrude into a recess formed by the walls of the second inorganic encapsulation layer 40 in the inter-subpixel region B. each of the plurality of second organic encapsulation blocks 50B are attached to the walls of the second inorganic encapsulation layer 40 in the inter-subpixel region B that define the recess.

In embodiments, the organic light emitting diode display panel further includes a third inorganic encapsulation layer 60 located on a side of the organic encapsulation layer 50 away from the base substrate 10 as shown in fig. 1A, the third inorganic encapsulation layer 60 in embodiments includes a plurality of third inorganic encapsulation blocks 60B optionally each of the plurality of third inorganic encapsulation blocks 60B is in direct contact with the second inorganic encapsulation layer 40 and with of the plurality of organic encapsulation blocks 50A optionally each of the plurality of third inorganic encapsulation blocks 60B has an orthographic projection on the base substrate 10 substantially covering the orthographic projection of of the plurality of organic light emitting diodes OLED on the base substrate 10 and also covering the orthographic projection of of the plurality of organic encapsulation blocks 50A on the base substrate 10.

Fig. 1B is a plan view of an organic light emitting diode display panel in embodiments according to the present disclosure, as shown in fig. 1A and 1B, the organic light emitting diode display panel in an initial state includes a plurality of third inorganic encapsulation blocks 60B spaced apart from each other by a plurality of second organic encapsulation blocks 50B in an inter-subpixel region B alternatively, the plurality of second organic encapsulation blocks 50B in the inter-subpixel region B form a network extending throughout the plurality of subpixels Sp.

In some embodiments, the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state in which th substantially unstretched state the organic light emitting diode display panel is substantially unstretched, e.g., in a relaxed state, in the second stretched state the organic light emitting diode display panel is subjected to an external force, e.g., to stretch the organic light emitting diode display panel in or more dimensions, in an initial state the organic light emitting diode display panel is never stretched denier the organic light emitting diode display panel is stretched or more continuous encapsulation layers of the organic light emitting diode display panel can be torn and separated into a plurality of encapsulation pieces, e.g., the second inorganic encapsulation layer 40 in FIG. 1A is a continuous encapsulation layer in an initial state denier the organic light emitting diode display panel is stretched, the second inorganic encapsulation layer 40 can be torn into a plurality of second inorganic encapsulation pieces.

Fig. 1C is a schematic view showing an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure, as shown in fig. 1C, the second inorganic encapsulation layer 40 is separated into a plurality of second inorganic encapsulation blocks 40B, optionally, each of the plurality of second inorganic encapsulation blocks 40B is in direct contact with (e.g., the entirety of) a peripheral portion of of the plurality of inorganic encapsulation blocks 20B, thereby encapsulating the plurality of organic light emitting diode OLEDs, optionally, each of the plurality of second inorganic encapsulation blocks 40B has an orthographic projection on the base substrate 10 substantially covering an orthographic projection of of the plurality of organic light emitting diode OLEDs on the base substrate 10, covering an orthographic projection of of the plurality of inorganic encapsulation blocks 20B on the base substrate 10, and further covering an orthographic projection of of the plurality of pixel defining blocks 30B on the base substrate 10.

As shown in fig. 1C, adjacent ones of the plurality of second inorganic encapsulation blocks 40B are spaced apart by a second gap G2. in a second stretched state fig. 1D is a plan view of the organic light emitting diode display panel in a stretched state according to embodiments of the present disclosure referring to fig. 1D, adjacent ones of the plurality of subpixels Sp are spaced apart by a second gap G2. in a second stretched state and adjacent ones of the plurality of third inorganic encapsulation blocks 60B are spaced apart by a second gap G2 in a second stretched state.

In embodiments, when the organic light emitting diode display panel is stretched from an initial state to a second stretched state, or more of the plurality of second organic encapsulation blocks 50B are torn into two pieces in examples, the plurality of organic encapsulation blocks 50B are made of a relatively brittle (britle) organic material, and each of the plurality of second organic encapsulation blocks 50B are torn into two of the plurality of third organic encapsulation blocks 50 ' B, the organic light emitting diode display panel includes two of the plurality of third organic encapsulation blocks 50 ' B in a second gap G2 between adjacent ones of the plurality of second inorganic encapsulation blocks 40B, each of the two of the plurality of third organic encapsulation blocks 50 ' B is attached to a sidewall of of the adjacent ones of the plurality of second inorganic encapsulation blocks 40B.

As shown in fig. 1D, in embodiments, each of the plurality of third inorganic encapsulation blocks 60B are partially surrounded by of of the plurality of third organic encapsulation blocks 50 'B in the second stretched state adjacent ones of the plurality of third organic encapsulation blocks 50' B are spaced apart by a second gap G2 in the second stretched state.

Referring to fig. 1E, adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks 40B are spaced apart by two of the plurality of third organic encapsulation blocks 50 ' B in a substantially unstretched state at . alternatively, the organic light emitting diode display panel may be viewed in a substantially unstretched state at as having a th gap separating adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks 40B, the two of the plurality of third organic encapsulation blocks 50 ' B filling in an th gap, a th gap distance of a th gap is less than a second gap distance of a G2. thus, adjacent second inorganic encapsulation blocks of the plurality of second inorganic encapsulation blocks 40B are spaced apart by the second gap of the plurality of third inorganic encapsulation blocks 50 ' B in a substantially unstretched state at , th gap, the second gap distance of the plurality of third inorganic encapsulation blocks is referred to herein as the second gap distance between adjacent second inorganic encapsulation blocks (e.g., the second inorganic encapsulation blocks 50B) are spaced apart by the second gap distance of the plurality of third inorganic encapsulation blocks 40B in the substantially unstretched state at .

Referring to fig. 1F, the plurality of second organic encapsulation blocks 50B are made of a relatively flexible organic material, and each of the plurality of second organic encapsulation blocks 50B is not torn in the middle of the block, in contrast, when the organic light emitting diode display panel is stretched from an initial state to a second stretched state, each of the plurality of second organic encapsulation blocks 50B is separated from of two adjacent ones of the plurality of second inorganic encapsulation blocks 40B and remains attached to another of the two adjacent ones of the plurality of second inorganic encapsulation blocks 40B.

Referring to fig. 1F, the organic light emitting diode display panel further includes of the plurality of second organic package blocks 50B in the second gap G2 optionally, the of the plurality of second organic package blocks 50B in the second gap G2 are attached to sidewalls of of the adjacent second inorganic package blocks 40B.

Referring to fig. 1G, adjacent second inorganic package blocks of the plurality of second inorganic package blocks 40B are spaced apart by of the plurality of second organic package blocks 50B in a substantially unstretched state at a th substantially unstretched state, alternatively, the organic light emitting diode display panel may be viewed as having a th gap spacing adjacent second inorganic package blocks of the plurality of second inorganic package blocks 40B, the 8655 th gap distance filling the 86535 th gap, the th gap is less than the second gap distance of the G2 in a substantially unstretched state at a th substantially unstretched state, accordingly, adjacent second inorganic package blocks of the plurality of second inorganic package blocks 40B are spaced apart by the second gap distance of the G38725 in the th substantially unstretched state at the th gap, the th gap is referred to herein as the second gap distance between adjacent second inorganic package blocks of the plurality of second inorganic package blocks 40B, the th gap is referred to as the second gap distance between adjacent second inorganic package blocks of the plurality of second inorganic package blocks 40B in the substantially unstretched state at the th gap.

Fig. 2A is a schematic view illustrating an organic light emitting diode display panel in embodiments according to the present disclosure, referring to fig. 2A, in embodiments, all encapsulation layers are not continuous layers extending throughout a plurality of subpixels Sp, each encapsulation layer includes a plurality of encapsulation blocks even in an initial state, as shown in fig. 2A, in the initial state, the organic light emitting diode display panel in embodiments includes a second inorganic encapsulation layer 40 including a plurality of second inorganic encapsulation blocks 40B, adjacent ones of the plurality of second inorganic encapsulation blocks 40B are optionally spaced apart from a th gap G1. in the initial state, and a th gap G1 substantially penetrates all encapsulation layers, such that portions of the surface of the base substrate 10 are exposed.

Referring to fig. 2A and 2B, the organic light emitting diode display panel in an initial state includes a plurality of third inorganic encapsulation blocks 60B spaced apart from each other by th gaps G1 in the inter-subpixel region B alternatively, the organic encapsulation layer 50 includes only a plurality of th organic encapsulation blocks 50A and does not include a plurality of second organic encapsulation blocks in the inter-subpixel region B, each of the plurality of th organic encapsulation blocks 50A is at least partially located in the inter-subpixel region a.

In embodiments, the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state fig. 2C is a schematic diagram illustrating the organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure fig. 2D is a plan view of the organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure fig. 2E is a schematic diagram illustrating the organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure fig. 2C through 2E, in embodiments, adjacent second inorganic encapsulation blocks in the second plurality of second inorganic encapsulation blocks 40B are spaced apart by a th gap G1 in a substantially unstretched state and by a second gap G2. in a second stretched state optionally, the second gap distance of the second gap G2 is greater than the th gap distance of the th gap G1.

As shown in fig. 2C-2E, in some embodiments, the third inorganic encapsulation layer 60 includes a plurality of third inorganic encapsulation blocks 60B adjacent ones of the plurality of third inorganic encapsulation blocks 60B are spaced apart by a gap G1 in a substantially unstretched state at , and are spaced apart by a second gap G2. and a second gap G2 in a second stretched state at a second gap distance greater than a gap distance of the gap G1.

Fig. 3A is a schematic view illustrating an organic light emitting diode display panel in embodiments according to the present disclosure, the organic light emitting diode display panel in an initial state in fig. 3A is different from the organic light emitting diode display panel in an initial state in fig. 2A in that the second inorganic encapsulation layer 40 in an initial state in fig. 3A is a continuous layer extending over a plurality of subpixels Sp, whereas the second inorganic encapsulation layer 40 in an initial state in fig. 2A is not a continuous layer, and the th gap G1 in fig. 3A does not penetrate the second inorganic encapsulation layer 40 and the th gap G1 in fig. 2A penetrates all encapsulation layers, the second inorganic encapsulation layer 40 in an initial state in fig. 3A is in direct contact with the base substrate 10 (e.g., a passivation layer).

Referring to fig. 3A and 3B, the organic light emitting diode display panel in an initial state includes a plurality of third inorganic encapsulation blocks 60B spaced apart from each other by a gap G1 in an inter-subpixel region B. alternatively, the organic encapsulation layer 50 includes only a plurality of th organic encapsulation blocks 50A and does not include a plurality of second organic encapsulation blocks in the inter-subpixel region B. each of the plurality of th organic encapsulation blocks 50A is at least partially located in the inter-subpixel region a. the organic light emitting diode display panel in an initial state in fig. 3A is different from the organic light emitting diode display panel in an initial state in fig. 1A in that the organic encapsulation layer 50 does not include the plurality of second organic encapsulation blocks 50B in a gap G1.

In some embodiments, the organic light emitting diode display panel is a stretchable display panel having a th substantially unstretched state and a second stretched state fig. 3C is a schematic view showing the organic light emitting diode display panel in a stretched state in some embodiments according to the present disclosure fig. 3D is a plan view of the organic light emitting diode display panel in a stretched state in some embodiments according to the present disclosure fig. 3E is a schematic view showing the organic light emitting diode display panel in a substantially unstretched state in some embodiments according to the present disclosure fig. 3C through 3E, in some embodiments, adjacent second inorganic encapsulation blocks in the second inorganic encapsulation blocks 40B are spaced apart by a th gap G1 in a substantially unstretched state and by a second gap G2. in a second stretched state optionally, the second gap G2 is spaced apart by a distance greater than a th gap G1 in the third gap G1 the organic light emitting diode display panel in fig. 3C through 3E is different from the organic light emitting diode display panel in 2 through 3E, and the substrate 3C through 10 is in fig. 2 through 3E, and the organic light emitting diode display panel is in fig. 2 through 10.

The organic light emitting diode display panel in fig. 3C to 3E is different from the organic light emitting diode display panel in fig. 1C to 1G in that the organic light emitting diode display panel in fig. 3C to 3E does not include th gap G1 or th or more organic encapsulation blocks in second gap G2, whereas the organic light emitting diode display panel in fig. 1C to 1G includes th gap G1 or th or more organic encapsulation blocks in second gap G2 (e.g., of the plurality of second organic encapsulation blocks 50B or two of the plurality of third organic encapsulation blocks 50' B).

Fig. 4A is a schematic view illustrating an organic light emitting diode display panel in embodiments according to the present disclosure, the organic light emitting diode display panel in an initial state in fig. 4A is different from the organic light emitting diode display panel in an initial state in fig. 1A in that the third inorganic encapsulation layer 60 in an initial state in fig. 4A is a continuous layer extending over a plurality of subpixels Sp, and the third inorganic encapsulation layer 60 in an initial state in fig. 2A is not a continuous layer fig. 4B is a plan view of the organic light emitting diode display panel in embodiments according to the present disclosure, as shown in fig. 4B, the entire surface of the organic light emitting diode display panel is covered with the third inorganic encapsulation layer 60 in an initial state.

Fig. 4C is a schematic diagram illustrating an organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure, fig. 4D is a plan view of the organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure, fig. 4E is a schematic diagram illustrating the organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure, the organic light emitting diode display panel in fig. 4C to 4E is similar to the organic light emitting diode display panel in fig. 1C to 1E, the organic light emitting diode display panel in fig. 4C to 4E is different from the organic light emitting diode display panel in fig. 1C to 1E in that the orthographic projection of the third inorganic encapsulation layer 60 in fig. 4C to 4E on the base substrate 10 substantially covers the orthographic projection of the third organic encapsulation blocks 50 ' B on the base substrate 10, while the orthographic projection of the third inorganic encapsulation layer 60 in fig. 1C to 4E on the base substrate 10 substantially overlaps with the orthographic projection of the third organic encapsulation blocks 50 ' B in the plurality of organic encapsulation layers 4650B in base substrates 10, and substantially does not overlap the organic encapsulation layer 60 in fig. 1C to 3E with the third inorganic encapsulation layer 60 in fig. 10 ' without substantially overlapping the base substrate 3910 in each of the orthographic projection of the base substrate 10, E3C to 3C, the third inorganic encapsulation layer 34.

Fig. 4F is a plan view of the organic light emitting diode display panel in a stretched state in embodiments according to the present disclosure fig. 4G is a schematic view showing the organic light emitting diode display panel in a substantially unstretched state in embodiments according to the present disclosure fig. 4F to 4G are similar to the organic light emitting diode display panel in fig. 1F to 1G the organic light emitting diode display panel in fig. 4F to 4G differs from the organic light emitting diode display panel in fig. 1F to 1G in that adjacent third inorganic encapsulation blocks of the plurality of third inorganic encapsulation blocks 60B in fig. 4F to 4G are in direct contact with each other in a substantially unstretched state of and are spaced apart by a second gap G2 in a second stretched state, while adjacent third inorganic encapsulation blocks of the plurality of third inorganic encapsulation blocks 60B in fig. 1F to 1G are spaced apart by a second gap G3550B of the plurality of second organic encapsulation blocks 50B in a substantially unstretched state of and are spaced apart by a second gap G2 in a stretched state.

Optionally, the base substrate 10 is a flexible base substrate optionally or more other layers in the organic light emitting diode display panel are stretchable layers.

In embodiments, the organic light emitting diode display substrate includes a base substrate 10, a pixel defining layer 30 on the base substrate 10 for defining a plurality of subpixels Sp, a plurality of organic light emitting diodes OLEDs respectively located in the plurality of subpixels Sp, a th inorganic encapsulation layer 20 located between the base substrate 10 and the pixel defining layer 30 and configured to encapsulate the plurality of organic light emitting diodes OLEDs in the plurality of subpixels Sp, a second inorganic encapsulation layer 40 located on a side of the plurality of organic light emitting diodes OLEDs and the pixel defining layer 30 away from the th inorganic encapsulation layer 20, an organic encapsulation layer 50 located on a side of the second inorganic encapsulation layer 40 away from the base substrate 10, and a third inorganic encapsulation layer 60 located on a side of the organic encapsulation layer 50 away from the base substrate 10.

Optionally, the pixel defining layer 30 includes a plurality of pixel defining blocks 30B spaced apart from each other, each of the plurality of pixel defining blocks 30B being configured to define of the plurality of subpixels Sp. optionally, the th inorganic encapsulation layer 20 includes a plurality of th inorganic encapsulation blocks 20B, each of the plurality of th inorganic encapsulation blocks 20B being located between the base substrate 10 and of the plurality of pixel defining blocks 30B and being configured to encapsulate organic light emitting diodes of the plurality of organic light emitting diodes Sp located among of the plurality of subpixels Sp. optionally, each of the plurality of th inorganic encapsulation blocks 20B is orthographically projected on the base substrate 10 substantially covering an orthographically projected periphery of 48 of the plurality of organic light emitting diodes OLED on the base substrate 3910. optionally, the second inorganic encapsulation layer 40 and the plurality of th inorganic encapsulation blocks 20B are substantially covering an orthographically projected periphery of the plurality of organic light emitting diodes OLED blocks 638 of the plurality of organic light emitting diodes OLED on the base substrate 3910. optionally, the second inorganic encapsulation layer 40 and the plurality of th inorganic encapsulation blocks are substantially covering an orthographically projected periphery of the organic light emitting diode encapsulation blocks 638 of the base substrate 6310, such as a substantially covering a exposed peripheral portion of the organic light emitting diodes of the plurality of the organic light emitting diodes, such as substantially covered by the peripheral encapsulation blocks 59610, such as substantially covered by the peripheral organic encapsulation blocks , such as substantially covered by the organic encapsulation blocks, such as substantially covered by the peripheral portion of the peripheral encapsulation blocks of the organic encapsulation blocks, preferably, the organic encapsulation.

Optionally, the organic light emitting diode display panel further comprises a plurality of switching thin film transistors configured to control on/off switching of the plurality of driving thin film transistors, respectively.

In another aspect, the present disclosure provides methods of fabricating an organic light emitting diode display panel, in embodiments , the method includes forming a pixel defining layer on a base substrate to define a plurality of sub-pixels, forming a plurality of organic light emitting diodes in the plurality of sub-pixels, respectively, and forming a th inorganic encapsulation layer between the base substrate and the pixel defining layer, configured to encapsulate the plurality of organic light emitting diodes in the plurality of sub-pixels, optionally forming the pixel defining layer includes forming a plurality of pixel defining blocks spaced apart from each other, each 2 of the plurality of pixel defining blocks being formed to define 3 of the plurality of sub-pixels, optionally forming a th inorganic encapsulation layer includes forming a plurality of th inorganic encapsulation blocks, each of the plurality of th inorganic encapsulation blocks being formed between the base substrate and a 5 of the plurality of pixel defining blocks and forming a plurality of 465 th inorganic encapsulation blocks, and forming a plurality of front projection blocks on the base substrate, the plurality of pixels defining blocks, the base substrate, the plurality of pixels being positioned on the base substrate, optionally forming a peripheral projection inorganic encapsulation block of the plurality of pixels, such as a peripheral projection inorganic encapsulation block, the projection of the plurality of front projection diodes, on the base substrate, such as a peripheral projection substrate, 849, which is substantially no projection substrate, no projection substrate no projection.

In some embodiments , each of the plurality of organic light emitting diodes is formed to include a th electrode (e.g., an anode), a second electrode (e.g., a cathode), an organic light emitting layer between a th electrode and the second electrode optionally each 2 of the plurality of organic light emitting diodes is formed to further include or a plurality of functional layers between a th electrode and the second electrode optionally the second electrode is on a side of the organic light emitting layer remote from the th electrode optionally the th inorganic encapsulation layer is formed such that the front projection of each of the plurality of th inorganic encapsulation blocks on the base substrate substantially covers the front projection of the periphery of the th electrode of the of the plurality of organic light emitting diodes on the base substrate optionally the th inorganic encapsulation layer is formed such that the front projection of each of the plurality of th inorganic encapsulation blocks on the base substrate substantially covers the front projection of the base substrate of the plurality of the plurality of organic light emitting diodes substantially covers the plurality of the base substrate , optionally the plurality of organic light emitting diodes 72 th inorganic encapsulation layers are formed such that the plurality of the organic light emitting diodes substantially covers the base substrate substantially covers the front projection of the base substrate and the plurality of the front projection of the base substrate 365 of the plurality of the organic light emitting diode substantially covers the organic light emitting substrate , optionally the plurality of the organic light emitting diode 72.

Optionally, a second inorganic encapsulation layer is formed in direct contact with a peripheral portion (e.g., an entirety of the peripheral portion) of each of the plurality of th inorganic encapsulation blocks, thereby encapsulating the plurality of organic light emitting diodes.

In embodiments, the second inorganic encapsulation layer is formed as a continuous layer extending throughout the plurality of sub-pixels.

Optionally, the second inorganic encapsulation layer is formed such that each orthographic projections of the plurality of second inorganic encapsulation blocks on the base substrate substantially covers a combination of the orthographic projections of each of the plurality of organic light emitting diodes on the base substrate, the orthographic projections of each of the plurality of th inorganic encapsulation blocks on the base substrate 48325, and the orthographic projections of each of the plurality of pixel defining blocks on the base substrate 48325.

In embodiments, the method further includes forming an organic encapsulation layer on a side of the second inorganic encapsulation layer distal from the base substrate optionally forming the organic encapsulation layer includes forming a plurality of th organic encapsulation blocks, each th organic encapsulation block being at least partially located in the sub-pixel region optionally forming the organic encapsulation layer such that an orthographic projection of each of the plurality of th organic encapsulation blocks on the base substrate substantially covers an orthographic projection of of the plurality of organic light emitting diodes on the base substrate.

Optionally, the organic encapsulation layer is formed such that each of the plurality of second organic encapsulation blocks is located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and attached to a sidewall of of the adjacent ones of the plurality of second inorganic encapsulation blocks.

In in some embodiments, forming the organic encapsulation layer further comprises forming a plurality of third organic encapsulation blocks located in the inter-subpixel regions optionally forming the second inorganic encapsulation layer comprises forming a plurality of second inorganic encapsulation blocks optionally forming the organic encapsulation layer such that two of the plurality of third organic encapsulation blocks are located in a gap between adjacent ones of the plurality of second inorganic encapsulation blocks and are each attached to a sidewall of of the adjacent ones of the plurality of second inorganic encapsulation blocks.

In embodiments, the method further includes forming a third inorganic encapsulation layer on a side of the organic encapsulation layer remote from the base substrate.

In embodiments, the third inorganic encapsulation layer is formed as a continuous layer extending throughout the plurality of sub-pixels.

Optionally, each of the plurality of third inorganic encapsulation blocks are formed in direct contact with the second inorganic encapsulation layer and in direct contact with of the plurality of organic encapsulation blocks, optionally, the third inorganic encapsulation layer is formed such that an orthographic projection of each of the plurality of third inorganic encapsulation blocks on the base substrate substantially covers a combination of an orthographic projection of of the plurality of organic light emitting diodes on the base substrate and an orthographic projection of of the plurality of th organic encapsulation blocks on the base substrate.

In another aspect, the present disclosure provides organic light emitting diode display devices having an organic light emitting diode display panel described herein or manufactured by the methods described herein examples of suitable display devices include, but are not limited to, electronic paper, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo albums, GPS, etc. in examples, the display device is a smart watch.

Optionally, the organic light emitting diode display device is a wearable display device, such as a smart watch.

It is therefore intended that the foregoing description and the following description be regarded as illustrative rather than limiting, and that numerous modifications and variations will be apparent to those skilled in the art, it being understood that these embodiments are illustrative and that no limitation of the scope of the invention is intended, unless otherwise indicated, to be implied by virtue of the claims and their equivalents, and that no limitation of the scope of the invention is intended, unless explicitly stated otherwise, to be implied by the language of the claims , and reference to exemplary embodiments of the invention is to be implied by the recitations of such limitations, and that no limitation of the scope of the invention is intended, such as may be implied by the recitations of such limitations, the scope of the invention is to be implied by the recitations of the claims , and that no limitation of the scope of the invention is to be implied by the recitations of such limitations, such recitations of such elements, such recitations of the present invention are to be explicitly recited in the recitations of the present claims, and that no limitation of such recitations of the present invention is to be implied by the recitations of such recitations, whether or recitations of such recitations, are to be implied by the recitations, are to be otherwise, and intended, to be construed as set forth, by the recitations, to be.