阅读说明：本技术 辨识造成晶圆刮伤的机械手臂的方法 (Method for identifying mechanical arm causing wafer scratch ) 是由 陈彦良 于 2019-06-28 设计创作，主要内容包括：一种辨识造成晶圆刮伤的机械手臂的方法。在用于辨识造成在晶圆上产生刮伤的机械手臂的方法中,检测在晶圆上的至少一个刮伤痕迹。确定至少一个刮伤痕迹的第一刮伤尺寸。将经确定的第一刮伤尺寸与多个第一机械手臂尺寸相比较以产生多个第一比较结果,其中第一比较结果分别对应于多个机械手臂。机械手臂中的一者是基于第一比较结果来辨识。(A method for identifying a robot causing wafer scratches. In a method for identifying a robot arm causing a scratch on a wafer, at least one scratch trace on the wafer is detected. A first scratch size of the at least one scratch trace is determined. The determined first scratch size is compared with a plurality of first robot sizes to generate a plurality of first comparison results, wherein the first comparison results respectively correspond to the plurality of robots. One of the robots is identified based on the first comparison result.)

1. A method for identifying a robot causing wafer scratches, comprising:

detecting at least one scratch mark on a wafer;

determining a first scratch size of the at least one scratch mark;

comparing the determined first scratch size with a plurality of first robot sizes to generate a plurality of first comparison results, wherein the plurality of first comparison results respectively correspond to a plurality of robots; and

identifying a robot of the plurality of robots based on the first comparison results.

2. The method of claim 1, wherein the number of the at least one scratch mark is two, each of the first robot dimensions is a distance between two end effectors of the corresponding robot, and the first scratch size is a distance between two of the scratch marks.

3. The method of claim 1, wherein each of the first plurality of robot dimensions is a width of an end effector of the corresponding robot, and the first scratch dimension is a width of the at least one scratch trace.

4. The method of claim 1, wherein each of the first plurality of robot dimensions is a width of a forearm of the corresponding robot, and the first scratch dimension is a width of the at least one scratch trace.

5. The method of claim 1, wherein each of the first plurality of robot dimensions is a distance between a terminal tip of an end effector of the corresponding robot and a farthest point on an edge of the wafer when the corresponding robot is facing the wafer and extends to a maximum extent in an extending direction of the corresponding robot; and the first scratch size is a distance between an end point of the at least one scratch mark and the farthest point on the edge of the wafer in a direction of a length of the at least one scratch mark.

6. A method for identifying a robot causing wafer scratches, comprising:

detecting at least one scratch mark on a wafer;

determining a scratch orientation of the at least one scratch trace;

comparing the determined scratch orientation with a plurality of robot arm orientations to generate a plurality of first comparison results, wherein the plurality of first comparison results respectively correspond to a plurality of robot arms; and

one of the plurality of robots is recognized based on the plurality of first comparison results.

7. The method of claim 6, further comprising:

determining a scratch size of the at least one scratch mark; and

comparing the determined scratch size with a plurality of robot arm sizes to generate a plurality of second comparison results, wherein the plurality of second comparison results respectively correspond to the plurality of robot arms.

8. The method of claim 7, wherein each of the plurality of robot dimensions is a distance between an end effector of the corresponding robot and a farthest point on an edge of the wafer in a direction perpendicular to an extension direction of the corresponding robot; and the scratch size is a distance between the at least one scratch trace and the farthest point on the wafer edge in a direction perpendicular to a length of the at least one scratch trace.

9. A method for identifying a robot causing wafer scratches, comprising:

reading a wafer at a first reading station;

after reading the wafer at the first reading station, using a plurality of robots to handle the wafer;

reading the wafer at a second reading station after manipulating the wafer using the plurality of robots;

detecting a scratch mark on the wafer at the second reading station;

comparing the parameters of the scratch trace with the parameters of a robot operating on the wafer between the first reading station and the second reading station to generate a comparison result; and

one of the plurality of robotic arms is recognized based on the plurality of comparison results.

10. The method of claim 9, further comprising:

projecting light onto the wafer via a point projector; and

an image of the wafer and at least one scratch mark on the image are obtained via an infrared camera and a Complementary Metal Oxide Semiconductor (CMOS) image sensor.

Technical Field

The present disclosure relates to a method for identifying a robot causing wafer scratches.

Background

The wafer may be transferred multiple times by the robot during the wafer fabrication process. Typically, the wafers or stacks of wafers may be arranged substantially flush with the floor so that the robot arm may slide in a substantially horizontal direction under each wafer for picking up and transferring the wafers. However, when a wafer or robot is tilted, the robot that is sliding to pick up another wafer directly above the first wafer may strike and scratch the top surface of the first wafer.

Disclosure of Invention

The present disclosure provides a method for identifying a robot arm causing wafer scratches, comprising: detecting at least one scratch mark on the wafer; determining a first scratch size of at least one scratch mark; comparing the determined first scratch size with a plurality of first robot sizes to generate a plurality of first comparison results, wherein the first comparison results respectively correspond to the plurality of robots; and identifying the mechanical arm in the mechanical arms based on the first comparison result.

The present disclosure provides a method for identifying a robot arm causing wafer scratches, comprising: detecting at least one scratch mark on the wafer; determining a scratch orientation of at least one scratch trace; comparing the determined orientation of the scratch with a plurality of robot arm orientations to generate a plurality of first comparison results, wherein the first comparison results respectively correspond to the plurality of robot arms; and identifying one of the robots based on the first comparison result.

The present disclosure provides a method for identifying a robot arm causing wafer scratches, comprising: reading the wafer at a first reading station; after reading the wafer at the first reading station, using a plurality of mechanical arms to operate the wafer; reading the wafer at a second reading station after the wafer is manipulated using the robot arm; detecting a scratch mark on the wafer at a second reading station; comparing the parameter of the scratch mark with a robot arm parameter operated on the wafer between the first reading station and the second reading station to generate a comparison result; and identifying one of the robots based on the comparison.

Drawings

Aspects of the present disclosure will be best understood from the following description when read with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 depicts a top view of a robot, a wafer, and corresponding robot dimensions, according to some embodiments;

FIG. 2A depicts a top view of a robot, wafer, and corresponding orientation, according to some embodiments;

FIG. 2B depicts a top view of a robot, wafer, and corresponding orientation, according to some embodiments;

FIG. 3 depicts a flow diagram of a method for identifying a robot that caused a scratch to be created on a wafer, according to some embodiments;

FIG. 4 shows a top view of a wafer having a scratch according to some embodiments;

FIG. 5A depicts a top view of a robot and wafer according to some embodiments;

FIG. 5B depicts a top view of another robot and wafer, according to some embodiments;

FIG. 6 shows a top view of a wafer having a scratch according to some embodiments;

FIG. 7 shows a top view of a wafer having a scratch according to some embodiments;

FIG. 8 shows a top view of a wafer having a scratch and two robots, according to some embodiments;

FIG. 9 depicts a flow diagram of a method for identifying a robot that caused a scratch on a wafer according to some embodiments;

FIG. 10 is a schematic diagram of a point projector, an infrared camera, a complementary metal-oxide-semiconductor (CMOS) image sensor, and a wafer, according to some embodiments;

fig. 11 is a schematic diagram of a system for identifying a robot causing a scratch on a wafer, according to some embodiments.

[ notation ] to show

1 mechanical arm

2 mechanical arm

11 end effect device

12 front arm

20 wafer

21 farthest point

22 farthest point

23 plane edge

24 center

26 point array

31 scratch mark

32 scratch mark

101 camera module

102 processor

103 cloud database

107 point projector

108 Infrared camera

109 CMOS image sensor

111 terminal tip

Distance A

A' scratch size

A1 Robotic arm size

A2 Robotic arm size

Size B

Size of B' scratch

B1 robot arm size

B2 robot arm size

Size C

Distance D

D' size of scratch

D1 robot arm size

D2 robot arm size

E size of robot arm

E' scratch size

E1 mechanical arm

E2 mechanical arm

F' scratch size

O' scratch orientation

O1 robot arm orientation

O2 robot arm orientation

OW orientation

Step S01

Step S02

Step S03

Step S04

Step S11

Step S12

Step S13

Step S14

Step S15

Step S16

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Furthermore, spatially relative terms such as "below … …," "below … …," "lower," "above … …," "upper," and the like may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly as such.

The ability to quickly and efficiently identify the transfer step in which the scratch occurred increases the cost-effectiveness of the wafer fabrication process. Different robotic arms are used by different stations at different transfer steps. Some embodiments of the present disclosure are able to effectively identify robots that are potential candidates for creating scratches and thereby reduce the number of transfer steps and transfer stations in which scratches may occur.

To facilitate the process of checking whether the robot is a candidate for establishing a detected scratch, robot parameters including the size and orientation of the robot holding the wafer are entered into a cloud database. Each of the robot dimensions corresponds to a physical dimension of the corresponding robot. The wafer is placed under a camera module for determining the orientation and/or location of scratches on the wafer. The computer then compares the detected orientation and/or size of the scratch to the inputted orientation and/or size of the robot arm to generate a comparison. If the computer finds that the size of the scratch detected on the wafer matches the robot arm size in the cloud database, the comparison result corresponding to the robot arm size matches and the robot arm corresponding to the comparison result can be identified, and the robot arm can be considered as a possible cause for the scratch on the wafer. If the computer finds that the size of the detected scratch on the wafer is excluded from the robot arm sizes in the cloud database, the comparison result corresponding to the robot arm sizes is excluded and the robot arm corresponding to the comparison result is not identified. Similarly, if the computer finds that the orientation of the detected scratch on the wafer matches or excludes the robot orientation in the cloud database, the comparison result corresponding to the robot orientation is a match or an exclusion, respectively, and the robot corresponding to the comparison result may or may not be identified, respectively. If the computer finds that the location and size of the detected scratches on the wafer match the robot orientation and the robot size corresponding to the same robot in the cloud database, respectively, the comparison results corresponding to the robot orientation and the robot size match and the robot corresponding to the comparison results can be identified. If the computer cannot find the robot arm size or orientation corresponding to the detected scratch size or orientation in the cloud database, the comparison result is neither matched nor excluded.

The robot dimensions collected and entered into the cloud database for a particular robot relate to physical characteristics of the robot reflected in the scratch on the wafer by the robot. In some embodiments, referring to fig. 1, dimension B is the width of the end effector 11 of the robot arm 1. The scratch mark produced by the end effector 11 of the robot arm 1 has a width of B or less. Referring again to fig. 1, dimension a is the distance between two end effectors 11 of the same robot arm 1. The scratch marks produced by the two end effectors 11 of the robot arm 1 have a distance a between the two end effectors. Referring again to fig. 1, dimension D is the distance between the terminal tip 111 of the end effector 11 of the robot 1 and the farthest point 21 on the edge of the wafer 20 when the robot 1 extends to the largest extent toward the wafer 20 in the direction of extension of the robot 1. The scratch marks produced by the end effector 11 of the robot 1 are in the direction of extension of the robot 1 and at a distance D, or greater, from the farthest point on the edge of the wafer 20. Referring again to fig. 1, dimension E is the distance between the end effector 11 and the farthest point 22 on the edge of the wafer 20 in a direction perpendicular to the extension of the robot arm 1. The scratch marks produced by the end effector 11 are in a direction perpendicular to the extension of the robot arm 1 and at a distance E from the farthest point 22 on the edge of the wafer 20. Referring again to fig. 1, dimension C is the width of the forearm 12 of the robot arm 1. The scratch mark produced by the forearm 12 of the robot arm 1 has a width of C or less.

The robot orientation collected for the robot and input into the cloud database is the robot's orientation relative to the orientation of the wafer on which the robot is operating. The orientation of the wafer may be defined according to the orientation of the orientation mark of the wafer. The orientation mark of the wafer may be a planar edge, a notch, or the like. Referring to fig. 2A, the orientation OW of the wafer 20 is defined in terms of the planar edge 23 of the wafer. In some embodiments as shown in fig. 2B, the orientation OW of the wafer 20 may also be defined in terms of the notch 23 of the wafer. Robot 1 operates on wafer 20 in an orientation O1 relative to orientation OW. The scratch marks produced by the robot arm 1 have the same orientation O1 as the robot arm 1.

FIG. 3 depicts a flow diagram of a method for identifying a robot that caused a scratch on a wafer, according to some embodiments. In step S01, at least one scratch mark on the wafer is detected. In step S02, at least one scratching parameter of the detected scratching trace is determined. The scratch parameter may be scratch size, scratch orientation, combinations thereof, and the like.

In step S03, the scratching parameters are compared with the robot parameters inputted in the cloud database to generate corresponding comparison parameters. Each of the robot parameters corresponds to a particular robot used in the wafer fabrication process. Referring again to fig. 1, the robot arm parameters may be the following: the distance a between the two end effectors 11 of the robot arm 1; width B of the end effector 11 of the robot arm 1; the width C of the forearm 12 of the robot arm 1; the distance D between the terminal tip 111 of the end effector 11 of the robot arm 1 and the farthest point 21 on the wafer edge when the robot arm 1 is facing the wafer and extends to the largest extent in the extension direction of the robot arm 1; a distance E between the end effector 11 of the robot 1 and the farthest point 22 on the wafer edge in a direction perpendicular to the extension direction of the robot 1, a combination of the above, and so on. Referring again to fig. 2A and 2B, the robot parameter may be the orientation O1 of the robot 1 relative to the orientation OW of the wafer 20.

In some embodiments, the robot dimension is the distance between two end effectors of the robot, and the scratch dimension is the distance between two of the scratch marks. If the scratch size is substantially equal to the robot size, determining that the robot size matches the scratch size. In other words, the corresponding comparison result is a match.

In some embodiments, the robot dimension is a width of a robot end effector of the robot, and the scratch dimension is a width of a scratch trace. If the scratch size is substantially equal to or smaller than the robot arm size, determining that the robot arm size matches the scratch size. In other words, the corresponding comparison result is a match.

In some embodiments, the robot arm dimension is a width of a forearm of the robot arm, and the scratch dimension is a width of a scratch mark. If the scratch size is substantially equal to or smaller than the robot arm size, determining that the robot arm size matches the scratch size. In other words, the corresponding comparison result is a match.

In other embodiments, the robot dimension is the distance between the terminal tip of the end effector of the robot and the farthest point on the edge of the wafer when the robot is facing the wafer and extending to the widest extent in the direction of extension of the robot; and the scratch size is the distance between the farthest point on the edge of the wafer and the end point on the scratch mark closest to the edge in the length direction of the scratch mark. If the scratch size is substantially equal to or larger than the robot arm size, determining that the robot arm size matches the scratch size. In other words, the corresponding comparison result is a match. Or the size of the mechanical arm is the distance between the terminal tip of the end effector of the mechanical arm and the center of the wafer when the mechanical arm faces the wafer and extends to the maximum range in the extending direction of the mechanical arm; and the scratch size is the distance between the farthest point on the edge of the wafer and the end point on the scratch mark closest to the edge in the length direction of the scratch mark. If the scratch size is substantially equal to or smaller than the robot arm size, determining that the robot arm size matches the scratch size. In other words, the corresponding comparison result is a match.

In other embodiments, the robot dimension is the distance between an end effector of the robot and the farthest point on the wafer edge in a direction perpendicular to the direction of extension of the robot; and the scratch size is the distance between the scratch trace and the farthest point on the edge of the wafer in the direction perpendicular to the length of the scratch trace. If the scratch size is substantially equal to the robot size, determining that the robot size matches the scratch size. In other words, the corresponding comparison result is a match. Or the size of the mechanical arm is the distance between an end effector of the mechanical arm and the center of the wafer in the direction perpendicular to the extending direction of the mechanical arm; and the scratch size is the distance between the scratch trace and the farthest point on the edge of the wafer in the direction perpendicular to the length of the scratch trace. If the scratch size is substantially equal to the robot size, determining that the robot size matches the scratch size. In other words, the corresponding comparison result is a match.

In step S04, the robot is identified based on the comparison result in step S03. If the robot has corresponding robot parameters corresponding to the comparison result matched in step S03, the robot may be identified.

Alternatively, if the robot arm has the corresponding robot arm parameter corresponding to the comparison result being a match and does not have the robot arm parameter corresponding to the comparison result being an exclusion based on the comparison in step S03, the robot arm may be recognized.

In some embodiments, if the robot dimension is the distance between two end effectors of the robot, and if the scratch dimension is substantially equal to the robot dimension, the corresponding scratch dimension is determined to match the robot dimension. In this case, the corresponding comparison result is a match. On the other hand, if the scratch size is substantially different from the robot size, the scratch mark may not have been generated by both end effectors of that particular robot, and thus the robot size is excluded and the robot is not recognized. In this case, the corresponding comparison result is exclusion. In some embodiments, if the scratch size is less than about 5% different from the robot size, the scratch size is substantially equal to the robot size; and if the scratch size is more than about 5% different from the robot arm size, the scratch size is substantially different from the robot arm size.

In other embodiments, if the robot dimension is the width of one of the end effectors of the robot, and if the scratch dimension is substantially equal to or less than the robot dimension, the corresponding scratch dimension is determined to match the robot dimension. In this case, the corresponding comparison result is a match. On the other hand, if the scratch size is larger than the robot size, the robot size is excluded because the end effector cannot generate scratches having a width wider than the width of the end effector itself, and the robot is not recognized. In this case, the corresponding comparison result is exclusion. In some embodiments, if the scratch size is less than about 5% different from the robot size, the scratch size is substantially equal to the robot size; and if the scratch size is respectively smaller than or larger than the mechanical arm size by more than about 5%, the scratch size is substantially smaller than or larger than the mechanical arm size. In these embodiments, if the scratch size is less than about 1.05 times the robot size, the robot size that is the width of one of the end effectors of the robot is determined to match the corresponding scratch size; and determining to exclude the robot size if the scratch size is larger than about 1.05 times of the robot size. In some embodiments, the robotic arm dimension that is the width of one of the end effectors of the robotic arm is between about 10mm and about 35 mm.

In other embodiments, if the robot size is the width of the forearm of the robot, and if the scratch size is substantially equal to or less than the robot size, the corresponding scratch size is determined to match the robot size. In this case, the corresponding comparison result is a match. On the other hand, if the scratch size is larger than the robot size, the robot size is excluded because the forearm cannot generate a scratch having a width wider than the width of the forearm itself, and the robot is not recognized. In this case, the corresponding comparison result is exclusion. In some embodiments, if the scratch size is less than about 5% different from the robot size, the scratch size is substantially equal to the robot size; and if the scratch size is respectively smaller than or larger than the mechanical arm size by more than about 5%, the scratch size is substantially smaller than or larger than the mechanical arm size. In these embodiments, if the scratch size is less than about 1.05 times the robot size, which is the width of the front end of the robot, is determined to match the corresponding scratch size; and determining to exclude the robot size if the scratch size is larger than about 1.05 times of the robot size.

In other embodiments, if the robot dimension is the distance between the terminal tip of the end effector of the robot and the farthest point on the edge of the wafer when the robot is facing the wafer and extending to the largest extent in the direction of extension of the robot, and if the scratch dimension is substantially equal to or greater than the robot dimension, the corresponding scratch dimension is determined to match the robot dimension. In this case, the corresponding comparison result is a match. On the other hand, if the scratch size is smaller than the robot size, the scratch mark is generated by a robot that may extend further toward the farthest point on the wafer edge than a robot corresponding to the robot size in question when the robot extends to the largest extent. In this case, the corresponding comparison result is exclusion. In some embodiments, if the scratch size is less than about 5% different from the robot size, the scratch size is substantially equal to the robot size; and if the scratch size is respectively smaller than or larger than the mechanical arm size by more than about 5%, the scratch size is substantially smaller than or larger than the mechanical arm size. In these embodiments, the robot dimension is the distance between the terminal tip of the end effector of the robot and the farthest point on the edge of the wafer when the robot is facing the wafer and extending to the widest range in the extension direction of the robot, and the robot dimension is determined to match the corresponding scratch dimension if the scratch dimension is greater than about 0.95 times the robot dimension; and if the scratch size is less than about 0.95 times the robot size, the robot size is determined to be excluded.

In some embodiments, the distance between a terminal tip of an end effector of the robot arm and a farthest point on the edge of the wafer is between about 50mm and about 105mm when the robot arm is directed toward the wafer and extends to a widest range in the direction of extension of the robot arm.

In other embodiments, if the robot dimension is the distance between the end effector of the robot and the farthest point on the edge of the wafer in a direction perpendicular to the extension direction of the robot, and if the scratch dimension is substantially equal to the robot dimension, the corresponding scratch dimension is determined to match the robot dimension. In this case, the corresponding comparison result is a match. On the other hand, if the scratch size is substantially different from the robot size, the scratch mark may not have been generated by the end effector of that particular robot, and thus the robot size is excluded and the robot is not recognized. In this case, the corresponding comparison result is exclusion. In some embodiments, if the scratch size is less than about 5% different from the robot size, the scratch size is substantially equal to the robot size; and if the scratch size is more than about 5% different from the robot arm size, the scratch size is substantially different from the robot arm size.

In some embodiments, the robot dimension, which is the distance between the end effector of the robot and the farthest point on the edge of the wafer in a direction perpendicular to the direction of extension of the robot, is between about 50mm and 105 mm.

In some embodiments, consider a wafer 20 having scratch marks 31 and 32 as shown in fig. 4. The method shown in fig. 3 is applied to the wafer 20, and in step S01, the scratch marks 31 and 32 are detected. In step S02, scratch dimensions a ', B ', and D ' are determined. Specifically, the scratch size a ' is a distance between two scratch traces 31 and 32, the scratch size B ' is a width of the scratch trace 32 generated by an end effector of a robot arm, and the scratch size D ' is a distance between the farthest point 21 on the edge of the wafer 20 and the end point on the scratch trace 31 closest to the edge in the length direction of the scratch trace.

In step S03, scratch size a ' is compared to the robot dimensions a1 and a2 shown in fig. 5A and 5B, scratch size B ' is compared to the robot dimensions B1 and B2 shown in fig. 5A and 5B, and scratch size D ' is compared to the robot dimensions D1 and D2 shown in fig. 5A and 5B. Scratch dimension B 'matches robot dimensions B1 and B2 because scratch dimension B' is substantially equal to or less than robot dimensions B1 and B2. The scratch dimension D 'matches the robot dimensions D1 and D2 because the scratch dimension D' is substantially equal to or greater than the robot dimensions D1 and D2. The scratch size a 'matches the robot size a1 because the scratch size a' is substantially equal to the robot size a 1. However, the robot dimension a2 is excluded because the scratch dimension a' is substantially different from the robot dimension a 2.

In step S04, the robot 1 of fig. 5B has the corresponding robot dimension a2 excluded, so the robot 1 is not identified as a possible robot causing the scratch marks 31 and 32 on the wafer 20. On the other hand, each of the robot dimensions of the robot arm 1 of fig. 5A matches one of the scratch dimensions of the scratch marks 31 and 32 on the wafer 20, so the robot arm 1 is identified as a possible robot arm that causes the scratch marks 31 and 32 to be generated on the wafer 20.

In the case where only one scratch is detected on the wafer, the scratch size a is predetermined and the robot size a cannot be directly used for comparison. However, if the wafer radius is known, the robot dimension E may be calculated from the robot dimension a and the robot dimension E may be compared to the scratch dimension E'.

Consider another wafer shown in fig. 6. The method shown in fig. 3 is applied to the wafer 20, and in step S01, the wafer 20 having the scratch trace 31 is detected. In step S02, scratch sizes B 'and E' are determined. Specifically, the scratch size B' is the width of the scratch mark 31 generated by the end effector of the robot arm. The dimension E' is the distance between the scratch mark 31 and the farthest point 22 on the edge of the wafer 20 in a direction perpendicular to the length of the scratch mark.

In step S03, referring again to the robots of fig. 5A and 5B, scratch size B 'is compared to robot sizes B1 and B2, and scratch size E' is compared to robots E1 and E2. Scratch dimension B 'matches robot dimensions B1 and B2 because scratch dimension B' is substantially equal to or less than robot dimensions B1 and B2. The scratch dimension E 'matches the robot dimension E1 because the scratch dimension E' is substantially equal to the robot dimension E1. However, the robot dimension a2 is excluded because the scratch dimension E' is substantially different from the robot dimension a 2. The robot arm dimensions a1 and a2 are neither matched nor excluded because no corresponding scratch size is determined from the scratch marks 31.

In step S04, the robot 1 of fig. 5B has the corresponding robot dimension E2 excluded, so the robot 1 is not identified as a possible robot causing the scratch mark 31 on the wafer 20. On the other hand, the robot arm 1 of fig. 5A has at least one robot arm dimension matching one of the scratch dimensions of the scratch mark 31 on the wafer 20, and no robot arm dimension is excluded by comparison with one of the scratch dimensions, so the robot arm 1 of fig. 5A is identified as a possible robot arm causing the scratch mark 31 to be generated on the wafer 20.

Alternatively, in the case where only one scratch is detected on the wafer, if the center 24 of the wafer can be determined, a scratch size F ' which is the distance between the center 24 of the wafer and the scratch mark 31 can be determined, and comparing this scratch size F ' to the robot size a, the robot size a should be substantially twice the value that matches the scratch size F '.

Consider another wafer shown in fig. 6. The method shown in fig. 3 is applied to the wafer 20, and in step S01, the wafer 20 having the scratch trace 31 is detected. In some embodiments, in step S02, scratch dimensions B 'and F' are determined. Specifically, the scratch size B' is the width of the scratch mark 31 generated by the end effector of the robot arm. The scratch dimension F' is the distance between the scratch mark 31 and the center 24 of the wafer 20 in a direction perpendicular to the length of the scratch mark 31.

In step S03, referring again to the robots of fig. 5A and 5B, scratch size B 'is compared to robot sizes B1 and B2, and scratch size F' is compared to robot sizes a1 and a 2. The scratch size F 'matches the robot size a1 because the scratch size F' is substantially equal to the robot size a1 times one-half. However, the robot dimension a2 is excluded because the scratch dimension F' is substantially different from the robot dimension a2 multiplied by one-half.

In step S04, the scratch size B 'matches the robot sizes B1 and B2 because the scratch size B' is substantially equal to or less than the robot sizes B1 and B2. The robot 1 of fig. 5B has the corresponding robot dimension E2 excluded, so the robot 1 is not identified as a possible robot that causes the scratch mark 31 to be generated on the wafer 20. On the other hand, the robot arm 1 of fig. 5A has at least one robot arm dimension matching one of the scratch dimensions of the scratch mark 31 on the wafer 20, and no robot arm dimension is excluded by comparison with one of the scratch dimensions, so the robot arm 1 of fig. 5A is identified as a possible robot arm causing the scratch mark 31 to be generated on the wafer 20.

Consider another wafer shown in fig. 7. The method shown in fig. 3 is applied to the wafer 20, and in step S01, the wafer 20 having the scratch trace 31 is detected. In step S02, scratch dimensions B 'and D' are determined. Specifically, the scratch size B' is the width of the scratch mark 31 generated by the end effector of the robot arm. The scratch dimension D' is the distance, in the direction of the length of the scratch mark, between the furthest point 21 on the edge of the wafer 20 and the end point on the scratch mark 31 closest to the edge.

In step S03, referring again to the robots of fig. 5A and 5B, scratch size B 'is compared to robot sizes B1 and B2, and scratch size D' is compared to robot sizes D1 and D2. Scratch dimension B 'matches robot dimensions B1 and B2 because scratch dimension B' is substantially equal to or less than robot dimensions B1 and B2. The scratch dimension D 'matches the robot dimension D1 because the scratch dimension D' is equal to or greater than D1. However, the robot dimension D2 is excluded because the scratch dimension D' is less than D2.

In step S04, the robot 1 of fig. 5B has the corresponding robot dimension D2 excluded, so the robot 1 is not identified as a possible robot causing the scratch mark 31 on the wafer 20. On the other hand, the robot arm 1 of fig. 5A has at least one robot arm dimension matching one of the scratch dimensions of the scratch mark 31 on the wafer 20, and no robot arm dimension is excluded by comparison with one of the scratch dimensions, so the robot arm 1 of fig. 5A is identified as a possible robot arm causing the scratch mark 31 to be generated on the wafer 20.

In some embodiments, consider a wafer 20 having scratch marks 31 and 32 as shown in fig. 8. In step S01, the scratch marks 31 and 32 are detected. In step S02, the scratch orientation O 'is determined and the scratch size a' is determined.

In step S03, the scratch orientation O 'is compared to the robot orientations O1 and O2, and the scratch size a' is compared to the robot sizes a1 and a2, with the robot sizes a1 and a2 being substantially the same in fig. 8.

In step S04, the robot 2 having the robot orientation O2 matching the scratch orientation O ', and the robot dimension a2 matching the scratch dimension a' is identified as a possible robot that caused the creation of the scratch marks 31 and 32 on the wafer 20. On the other hand, the robot orientation O1 of the robot 1 does not match, so the robot 1 is not recognized as a possible robot causing the scratch marks 31 and 32 on the wafer 20. Note that the robot 1 has a robot dimension a1 that matches the scratch dimension a'. However, robot 1 differs from robot 2 in the orientation in which it operates on wafer 20, and the scratch orientation helps identify the relevant robot.

Consider the same wafer 20 shown in fig. 8 with scratch marks 31 and 32. In some embodiments, in step S01, scratch marks 31 and 32 are detected. In step S02, the scratch orientation O' is determined. In step S03, the scratch orientation O' is compared to the robot orientations O1 and O2. In step S04, the robot 2 having the robot orientation O2 matching the scratch orientation O' is identified as a possible robot that caused the creation of scratch marks 31 and 32 on the wafer 20. On the other hand, the robot orientation O1 of the robot 1 does not match, so the robot 1 is not recognized as a possible robot causing the scratch marks 31 and 32 on the wafer 20. In some embodiments, a comparison of the scratch orientation and the robot orientation alone may be sufficient for identifying the robot that caused the scratch.

In some embodiments, the scratch marks of the wafer can be read at a specific station in the wafer manufacturing process. If a scratch trace is detected during one of these wafer reads, then only the robot arm parameters corresponding to the robot arm operating on the wafer between the current wafer read and the previous wafer read are compared to the scratch parameters of the detected scratch trace. In particular, referring to fig. 9, a wafer is read at a first read station in step S11. After the wafer is read at the first reading station, the wafer is manipulated by using a plurality of robot arms in step S12. After the robot is used to operate on the wafer, in step S13, the wafer is read at the second reading station. In step S14, scratches on the wafer are detected at the second reading station. In step S15, the parameters of the scratch marks are compared with the robot parameters operating on the wafer between the first reading station and the second reading station to generate a comparison result. In step S16, one of the robots is identified based on the comparison result.

As shown in fig. 10, in some embodiments of the present disclosure, the first and second reading stations may be a camera module 101 including a point projector 107, an infrared camera 108, and a Complementary Metal Oxide Semiconductor (CMOS) image sensor. To facilitate detection, light may be projected onto the wafer 20 via the spot projector 107 to produce an array of spots 26 on the wafer 20. The infrared camera 108 may be used to read the array of dots 26 reflected from the wafer 20 to calculate the location of the scratch on the wafer 20. Additionally, a two-dimensional image of the wafer 20 may be acquired via the CMOS image sensor 109 and this information may be compared to information collected by the infrared camera 108 to determine scratch dimensions such as width, length, distance, orientation, and the like. In some embodiments, the spot projector 107 is a vertical-cavity surface-emitting laser.

As shown in fig. 11, in some embodiments of the present disclosure, a system 100 for identifying a robot arm causing a scratch on a wafer is provided. The system 100 includes: a camera module 101 configured to detect and read scratches on a wafer; a processor 102 configured to determine a scratching parameter according to an algorithm; a cloud database 103 configured to store robot parameters; the processor 102 is further configured to compare the scratch parameter to the robot parameter and identify the robot based on the comparison.

By storing the robot parameters in the cloud database 103 accessible by the computer, the detected scratch marks and scratch mark parameters of the computer can be quickly calculated and compared with the stored robot parameters to generate a comparison result. Based on the comparison, a possible robot arm causing the detected scratch may be quickly identified.

In some embodiments of the present disclosure, at least one scratch mark on a wafer is detected in a method. A first scratch size of the at least one scratch trace is determined. The determined first scratch size is compared with a plurality of first robot sizes to generate a plurality of first comparison results, wherein the first comparison results respectively correspond to the plurality of robots. One of the robots is identified based on the first comparison result. In some embodiments, a second scratch size of the at least one scratch trace is additionally determined in the method; comparing the determined second scratch size with a plurality of second mechanical arm sizes to generate a plurality of second comparison results, wherein the second comparison results respectively correspond to the mechanical arms; and the robot arm of the robot arms is identified when the first comparison result corresponding to the robot arm of the robot arms is a match and the second comparison result corresponding to the robot arm of the robot arms is a match. In some embodiments, a second scratch size of the at least one scratch trace is additionally determined in the method; comparing the determined second scratch size with a plurality of second mechanical arm sizes to generate a plurality of second comparison results, wherein the second comparison results respectively correspond to the mechanical arms; and identifying the robot arm when the first comparison result corresponding to the robot arm is a match and the second comparison result corresponding to the robot arm is not excluded. In some embodiments, the number of the at least one scratch mark is two, each of the first robot dimensions is a distance between two end effectors of the corresponding robot, and the first scratch dimension is a distance between two of the scratch marks. In some embodiments, the comparison of the determined first scratch size and the first robot dimensions is performed such that when the first scratch size is substantially equal to one of the first robot dimensions, the corresponding first comparison results are a match. In some embodiments, the comparison of the determined first scratch size to the first robot dimensions is performed such that when the first scratch size is substantially different from one of the first robot dimensions, the corresponding first comparison result is an exclusion. In some embodiments, each of the first robot dimensions is a width of an end effector of the corresponding robot, and the first scratch dimension is a width of at least one scratch trace. In some embodiments, the comparison of the determined first scratch size and the first robot dimensions is performed such that when the first scratch size is substantially equal to or less than one of the first robot dimensions, the corresponding first comparison is a match. In some embodiments, each of the first robot arm dimensions is a width of a forearm of the corresponding robot arm, and the first scratch dimension is a width of at least one scratch trace. In some embodiments, the comparison of the determined first scratch size and the first robot dimensions is performed such that when the first scratch size is substantially equal to or less than one of the first robot dimensions, the corresponding first comparison results in a match. In some embodiments, each of the first robot dimensions is a distance between a terminal tip of an end effector of the corresponding robot and a farthest point on an edge of the wafer when the corresponding robot is facing the wafer and extending to a greatest extent in a direction of extension of the corresponding robot; and the first scratch size is a distance between an end point of the at least one scratch mark and a farthest point on the edge of the wafer in a direction of a length of the at least one scratch mark. In some embodiments, the comparison of the determined first scratch size and the first robot dimensions is performed such that when the first scratch size is substantially equal to or greater than one of the first robot dimensions, the corresponding first comparison results in a match.

In some embodiments of the present disclosure, at least one scratch mark on a wafer is detected in a method. Determining a scratch orientation of the at least one scratch trace. The determined orientation of the scratch is compared with a plurality of robot arm orientations to generate a plurality of first comparison results, wherein the first comparison results respectively correspond to the plurality of robot arms. One of the robots is identified based on the first comparison result. In some embodiments, a scratch size of at least one scratch mark is additionally determined in the method, and the determined scratch size is compared with a plurality of robot arm sizes to generate a plurality of second comparison results, wherein the second comparison results respectively correspond to the robot arms. In some embodiments, the one of the robots is identified when the first comparison result corresponding to the one of the robots is a match and the second comparison result corresponding to the one of the robots is a match. In some embodiments, each of the robot dimensions is a distance between an end effector of the corresponding robot and a farthest point on an edge of the wafer in a direction perpendicular to an extension direction of the corresponding robot; and the scratch size is the distance between the at least one scratch mark and the farthest point on the edge of the wafer in a direction perpendicular to the length of the at least one scratch mark. In some embodiments, the comparison of the determined scratch size to the plurality of robot arm sizes is performed such that when the scratch size is substantially equal to one of the robot arm sizes, the corresponding second comparison is a match.

In some embodiments of the present disclosure, a wafer is read at a first read station in a method. After the wafer is read at the first read station, the wafer is manipulated using a plurality of robots. After the wafer is manipulated using the robot arm, the wafer is read at a second read station. And detecting the scratch marks on the wafer at the second reading station. The parameters of the scratch marks are compared to robot parameters operating on the wafer between the first reading station and the second station to produce a comparison result. One of the robots is identified based on the comparison. In some embodiments, in the method, light is projected onto the wafer via a spot projector and an image of the wafer and at least one scratch mark on the image are obtained via an infrared camera and a Complementary Metal Oxide Semiconductor (CMOS) image sensor. In some embodiments, the spot projector is a vertical-cavity surface-emitting laser.

The foregoing has outlined features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.