阅读说明：本技术 一种硅半导体集成电路用晶圆干式清洗装置及清洗方法 (Wafer dry type cleaning device and cleaning method for silicon semiconductor integrated circuit ) 是由 吴信任 沈方园 于 2019-10-08 设计创作，主要内容包括：本发明涉及一种硅半导体集成电路用晶圆干式清洗装置及清洗方法,包括基板、转动机构、调整机构、通气管与顶板,所述基板上端安装有转动机构,转动机构下端安装有调整机构,转动机构上端布置有通气管,通气管从左往右均匀安装在顶板上,且通气管为倒T型结构,转动机构包括工作筒、转动电机、一号转动杆、二号转动杆与转动支链,工作筒包括固定筒体、固定环架、伸缩环架与连接杆,调整机构包括调整板、调整螺钉、调整块、移动块与复位弹簧。本发明在清洗过程中通过转动机构带动晶圆相对通气管进行相对运动,进而提高清洁的全面性,同时避免高速气流长时间对晶圆固定位置进行冲击而使该位置受到磨损的情况发生。(The invention relates to a wafer dry-type cleaning device and a cleaning method for a silicon semiconductor integrated circuit, which comprises a substrate, a rotating mechanism, an adjusting mechanism, vent pipes and a top plate, wherein the upper end of the substrate is provided with the rotating mechanism, the lower end of the rotating mechanism is provided with the adjusting mechanism, the upper end of the rotating mechanism is provided with the vent pipes, the vent pipes are uniformly arranged on the top plate from left to right, the vent pipes are of an inverted T-shaped structure, the rotating mechanism comprises a working barrel, a rotating motor, a first rotating rod, a second rotating rod and a rotating branched chain, the working barrel comprises a fixed barrel body, a fixed ring frame, a telescopic ring frame and a connecting rod, and the adjusting mechanism comprises an adjusting plate, an adjusting. The invention drives the wafer to move relatively to the vent pipe through the rotating mechanism in the cleaning process, thereby improving the cleaning comprehensiveness and avoiding the situation that the wafer is abraded due to the impact of high-speed airflow on the fixed position of the wafer for a long time.)

1. A wafer dry type cleaning device for a silicon semiconductor integrated circuit comprises a substrate (1), a rotating mechanism (2), an adjusting mechanism (3), a vent pipe (4) and a top plate (5), and is characterized in that: the upper end of the base plate (1) is provided with a rotating mechanism (2), the lower end of the rotating mechanism (2) is provided with an adjusting mechanism (3), the upper end of the rotating mechanism (2) is provided with a vent pipe (4), the vent pipe (4) is uniformly arranged on the top plate (5) from left to right, and the vent pipe (4) is of an inverted T-shaped structure; wherein:

the rotating mechanism (2) comprises a working barrel (21), a rotating motor (22), a first rotating rod (23), a second rotating rod (24) and a rotating branched chain (25), the working barrel (21) is installed on the base plate (1), the rotating motor (22) is installed on the outer wall of the left end of the working barrel (21) through a motor base, an output shaft of the rotating motor (22) is connected with one end of the first rotating rod (23) through a coupler, the second rotating rod (24) is installed on the inner wall of the right end of the working barrel (21) through a bearing, the rotating branched chain (25) is uniformly arranged between the first rotating rod (23) and the second rotating rod (24) from left to right, and the rotating branched chain (25) is installed in the working barrel (21);

the working barrel (21) comprises two fixed barrel bodies (211), telescopic ring frames (213) and connecting rods (214), the number of the fixed barrel bodies (211) is two, the two fixed barrel bodies (211) are arranged in a bilateral symmetry manner, the fixed ring frames (212) are uniformly arranged between the two fixed barrel bodies (211) from left to right, telescopic grooves are symmetrically formed in the left side and the right side of each fixed ring frame (212), the telescopic ring frames (213) are symmetrically arranged in the telescopic grooves in a sliding fit manner, the fixed ring frames (212) and the telescopic ring frames (213) are both of inverted omega-shaped structures with openings at the upper ends, and the fixed ring frames (212) are connected with the substrate (1) through the connecting rods (214);

the rotary branched chain (25) comprises a first cleaning pipe (251), a first rotary plate (252), a second rotary plate (253), a second cleaning pipe (254), a first baffle (255), a second baffle (256), a first connecting plate (257), a second connecting plate (258) and a supporting bracket (259), wherein a vent hole (251a) is formed in the left end of the first cleaning pipe (251), the left end of the first cleaning pipe (251) is installed on the inner wall of the lower end of the vent pipe (4) in a sliding fit mode, the right end of the first cleaning pipe is installed on the first rotary plate (252), the second rotary plate (253) is arranged on the right side of the first rotary plate (252), the second cleaning pipe (254) is installed on the inner wall of the lower end of the vent pipe (4) in a sliding fit mode, cleaning holes are formed in the middle parts of the first rotary plate (252) and the second rotary plate (253), the pipe orifices of the first cleaning pipe (251) and the second cleaning pipe (254) are in butt joint with the outer side of the cleaning pipe, a first connecting plate (257) and a second connecting plate (258) are respectively and symmetrically arranged on the inner wall of the first rotating plate (252) and the inner wall of the second rotating plate (253) from top to bottom, the first connecting plate (257) and the second connecting plate (258) which are oppositely arranged from left to right are mutually clamped, and a bearing bracket (259) is connected between the first connecting plate (257) and the second connecting plate (258) which are mutually clamped;

the lower end of the first rotating plate (252) and the lower end of the second connecting plate (258) are connected with the inner wall of the telescopic ring frame (213) through bearings, the upper end of the first rotating plate (252) is connected with the first baffle (255) through bearings, the upper end of the second rotating plate (253) is connected with the second baffle (256) through bearings, the first baffle (255) and the second baffle (256) are installed on the inner wall of the telescopic ring frame (213), the left end of the first cleaning pipe located at the leftmost end of the working barrel (21) is connected with the right end of the first rotating rod (23), the right end of the second cleaning pipe located at the rightmost end of the working barrel (21) is connected with the left end of the second rotating rod (24), and the second cleaning pipe (254) located in the same vent pipe (4) is connected with the side wall of the first cleaning pipe (251).

2. The wafer dry-type cleaning apparatus for silicon semiconductor integrated circuits as claimed in claim 1, wherein: support bracket (259) including telescopic link (259a), support plate (259b), hold down spring (259c) and rubber block (259d), telescopic link (259a) quantity is two, all install one telescopic link (259a) on connecting plate (257) inner wall and No. two connecting plate (258) inner walls, and two telescopic link (259a) bilateral symmetry arrange, telescopic link (259a) are upper and lower extending structure, be provided with the spring in telescopic link (259a), install support plate (259b) on telescopic link (259a) the inside wall, control mutual joint between the relative support plate (259b) of arranging, install rubber block (259d) through hold down spring (259c) on support plate (259b) the lateral wall.

3. The wafer dry-type cleaning apparatus for silicon semiconductor integrated circuits as claimed in claim 1, wherein: adjustment mechanism (3) are including adjusting plate (31), adjusting screw (32), adjusting block (33), movable block (34) and reset spring (35), adjusting plate (31) are located base plate (1) upper end, be connected through adjusting screw (32) between both ends and the fixed barrel (211) about adjusting plate (31), adjusting block (33) have been evenly arranged from a left side to the right side in adjusting plate (31) upper end, circular through-hole has been seted up at adjusting block (33) middle part, adjusting block (33) left and right sides all hugs closely movable block (34), be connected through reset spring (35) between movable block (34) outer wall and the expansion ring frame (213), and adjusting plate (31) upper end is turned right from a left side and is evenly seted up the round hole, connecting rod (214) pass the round hole.

4. The dry cleaning apparatus for a wafer for silicon semiconductor integrated circuits as claimed in claim 3, wherein: the upper end of the adjusting block (33) is of an isosceles trapezoid structure, the moving block (34) is of an inverted right-angled trapezoid structure, and the inner side wall of the moving block (34) is an inclined plane.

5. The wafer dry-type cleaning apparatus for silicon semiconductor integrated circuits as claimed in claim 1, wherein: the cross sections of the upper end and the lower end of the cleaning opening are of stepped structures.

6. The wafer dry-type cleaning apparatus for silicon semiconductor integrated circuits as claimed in claim 1, wherein: the left end of the first cleaning pipe (251) is provided with more than one air vent (251a), and the diameters of the air vents (251a) are different.

7. The wafer dry-type cleaning apparatus for silicon semiconductor integrated circuits as claimed in claim 1, wherein: the first cleaning pipe (251) and the second cleaning pipe (254) are made of telescopic materials.

8. The cleaning method of the wafer dry cleaning apparatus for silicon semiconductor integrated circuits as claimed in any one of claims 1 to 7, comprising the steps of:

s1 wafer placement: the working cylinders (21) are adjusted through the adjusting mechanism (3) so as to place the wafers in proper positions one by one;

s2 aeration: introducing high-speed airflow containing solid carbon dioxide aerosol particles into the vent pipe (4);

s3 cleaning: when S2 is carried out, the rotating mechanism (2) drives the wafer to randomly move relative to the vent pipe (4) so as to change the contact position of the high-speed airflow and the wafer and improve the cleaning comprehensiveness;

s4 taking out the wafer: after cleaning, adjusting the working barrel (21) through the adjusting mechanism (3) so as to take out the cleaned wafer and place the wafer of the next batch;

s5 collection and arrangement: and collecting the cleaned wafers, and uniformly entering the next processing flow after finishing the arrangement.

Technical Field

The invention relates to the field of wafer processing, in particular to a wafer dry-type cleaning device and a wafer dry-type cleaning method for a silicon semiconductor integrated circuit.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Semiconductor wafers are very sensitive to the presence of micro-contaminants, and in order to achieve the goal of being contaminant free of the wafer surface, it is necessary to remove the surface contaminants and avoid having the contaminants remain on the wafer surface before processing. Therefore, in the manufacturing process of semiconductor wafers, a plurality of surface cleaning steps are required to remove metal ions, atoms, organic matters and particles attached to the surface.

Currently, wafer cleaning technologies can be broadly divided into wet cleaning and dry cleaning, and wet cleaning is still the mainstream. In the actual cleaning work, there are the following problems:

(1) the wet cleaning method is a procedure of cleaning the surface of a wafer by a mixture of a liquid acid-base solvent and deionized water, then wetting and drying the wafer, so that a lot of particles are generated in the wafer processing process, and sometimes, the wet cleaning method cannot remove the particles and increases the possibility of the particles adhering to the surface of the wafer, and the wet cleaning method easily causes environmental pollution and influences human health due to large consumption of the required ultrapure water and chemicals;

(2) in the current dry-type particle removal technology, the laser-assisted removal of particles on a wafer is the most widely studied technology at present, and compared with the wet-type cleaning method, the dry-type cleaning method does not need to consume a large amount of ultrapure water and chemicals, so that the problems of pollution and health can be avoided, and the production cost can be reduced indirectly.

Disclosure of Invention

In order to make up for the defects of the prior art, the invention provides a wafer dry-type cleaning device and a wafer dry-type cleaning method for a silicon semiconductor integrated circuit.

The technical scheme adopted by the invention to solve the technical problem is as follows: a wafer dry-type cleaning device for a silicon semiconductor integrated circuit comprises a substrate, a rotating mechanism, an adjusting mechanism, a vent pipe and a top plate, wherein the rotating mechanism is installed at the upper end of the substrate, the adjusting mechanism is installed at the lower end of the rotating mechanism, the vent pipe is arranged at the upper end of the rotating mechanism, the vent pipe is uniformly installed on the top plate from left to right, and the vent pipe is of an inverted T-shaped structure; wherein:

the rotating mechanism comprises a working barrel, a rotating motor, a first rotating rod, a second rotating rod and a rotating branched chain, the working barrel is installed on the base plate, the rotating motor is installed on the outer wall of the left end of the working barrel through a motor base, an output shaft of the rotating motor is connected with one end of the first rotating rod through a coupler, the second rotating rod is installed on the inner wall of the right end of the working barrel through a bearing, the rotating branched chain is uniformly arranged between the first rotating rod and the second rotating rod from left to right, and the rotating branched chain is installed in the working barrel; the first rotating rod, the second rotating rod and the rotating branched chain are driven to rotate in the working barrel through the rotating motor, so that the wafer can move relative to the vent pipe in the dry cleaning process, and all parts of the wafer can be fully cleaned.

The working barrel comprises two fixed barrels, fixed ring frames, telescopic ring frames and connecting rods, the two fixed barrels are arranged in bilateral symmetry, the fixed ring frames are uniformly arranged between the two fixed barrels from left to right, telescopic grooves are symmetrically formed in the left side and the right side of each fixed ring frame, the telescopic ring frames are symmetrically arranged in the telescopic grooves in a sliding fit mode, the fixed ring frames and the telescopic ring frames are of inverted omega-shaped structures with openings at the upper ends, and the fixed ring frames are connected with the base plate through the connecting rods; the purpose of synchronously adjusting the positions of the rotating branched chains is achieved by adjusting the positions of the telescopic ring frames, so that the wafers are taken and placed, and the working requirements of the wafers with different thicknesses are met.

The rotary branched chain comprises a first cleaning pipe, a first rotary plate, a second cleaning pipe, a first baffle, a second baffle, a first connecting plate, a second connecting plate and a bearing bracket, wherein the left end of the first cleaning pipe is provided with a vent hole, the left end of the first cleaning pipe is arranged on the inner wall of the lower end of the vent pipe in a sliding fit mode, the right end of the first cleaning pipe is arranged on the first rotary plate, the second rotary plate is arranged on the right side of the first rotary plate, the second cleaning pipe is arranged on the outer side of the second rotary plate, the right end of the second cleaning pipe is arranged on the inner wall of the lower end of the vent pipe in a sliding fit mode, the middle parts of the first rotary plate and the second rotary plate are provided with cleaning holes, the pipe orifice of the first cleaning pipe and the pipe orifice of the second cleaning pipe are butted with the outer side of the cleaning pipe, the inner wall of the first rotary plate and the inner wall of the second rotary plate are respectively provided with the first, a bearing bracket is connected between the first connecting plate and the second connecting plate which are mutually clamped; in the cleaning process, gas in the vent pipe enters a cavity formed between the first rotating plate and the second rotating plate through the first cleaning pipe and the second cleaning pipe to clean a wafer in the vent pipe, and the rotating branched chain can rotate in a reciprocating mode, so that the wafer can be driven to move in the bearing bracket to a certain degree, the contact position of high-speed airflow and the wafer is changed, and the cleaning comprehensiveness is guaranteed.

The lower end of the first rotating plate and the lower end of the second connecting plate are connected with the inner wall of the telescopic ring frame through bearings, the upper end of the first rotating plate is connected with the first baffle plate through bearings, the upper end of the second rotating plate is connected with the second baffle plate through bearings, the first baffle plate and the second baffle plate are both installed on the inner wall of the telescopic ring frame, the left end of the first cleaning pipe at the leftmost end of the working cylinder is connected with the right end of the first rotating rod, the right end of the second cleaning pipe at the rightmost end of the working cylinder is connected with the left end of the second rotating rod, and the second cleaning pipe in the same vent pipe is connected with the side wall of the first cleaning pipe;

preferably, the supporting bracket comprises two telescopic rods, two supporting plates, a compression spring and a rubber block, the inner walls of the first connecting plate and the second connecting plate are respectively provided with a telescopic rod, the two telescopic rods are arranged in a bilateral symmetry manner, the telescopic rods are of an up-down telescopic structure, the spring is arranged in each telescopic rod, the supporting plates are arranged on the inner side walls of the telescopic rods, the supporting plates which are oppositely arranged on the left side and the right side are mutually clamped, and the rubber block is arranged on the side walls of the supporting plates through the compression spring; in the rotating process, the wafer and the support bracket are not fixed, so that the wafer can move up and down and left and right relative to the support bracket under the telescopic action of the telescopic rod and the compression spring, the relative position and the relative distance between the side wall of the wafer and the high-speed airflow are changed, the cleaning comprehensiveness is further improved, and the situation that the wafer is abraded due to the fact that the high-speed airflow impacts the fixed position of the wafer for a long time is avoided.

Preferably, the adjusting mechanism comprises an adjusting plate, adjusting screws, adjusting blocks, moving blocks and a reset spring, the adjusting plate is located at the upper end of the base plate, the left end and the right end of the adjusting plate are connected with the fixed barrel through the adjusting screws, the adjusting blocks are uniformly arranged at the upper end of the adjusting plate from left to right, circular through holes are formed in the middle of the adjusting blocks, the moving blocks are tightly attached to the left side and the right side of the adjusting blocks, the outer wall of each moving block is connected with the telescopic ring frame through the reset spring, round holes are uniformly formed in the upper end of the adjusting plate from left to right; the height of the adjusting plate is adjusted by rotating the adjusting screw, the height of the adjusting block is changed at the same time, when the adjusting block moves upwards, the moving block is subjected to outward extrusion force, so that the distance between the left and right oppositely-arranged moving blocks is increased, otherwise, the reset spring applies inward extrusion force to the moving block, and the distance between the left and right oppositely-arranged moving blocks is reduced.

Preferably, the upper end of the adjusting block is of an isosceles trapezoid structure, the moving block is of an inverted right-angled trapezoid structure, and the inner side wall of the moving block is an inclined plane.

Preferably, the cross sections of the upper end and the lower end of the cleaning opening are of a step-shaped structure; the high-speed airflow can be radially sprayed on the side wall of the wafer, the contact range of the high-speed airflow and the side wall of the wafer is expanded, and meanwhile, the impact force of the high-speed airflow on the side wall of the wafer is reduced.

Preferably, the number of the air vents arranged at the left end of the first cleaning pipe is more than one, and the diameters of the air vents are different; different from the vent hole opposite to the middle part of the vent pipe, the gas quantity of the high-speed gas flow entering the rotating branched chain in unit time is different, and the cleaning state is changed by changing the speed of the high-speed gas flow, so that the high-speed gas flow can push the wafer to move irregularly in the rotating branched chain, and the contact position of the high-speed gas flow and the wafer is changed.

Preferably, No. one scavenge pipe and No. two scavenge pipes are scalable material.

The invention also provides a cleaning method of the wafer dry-type cleaning device for the silicon semiconductor integrated circuit, which comprises the following steps:

s1 wafer placement: the working cylinders are adjusted through the adjusting mechanism so as to place the wafers in proper positions one by one;

s2 aeration: introducing high-speed airflow containing solid carbon dioxide aerosol particles into the vent pipe;

s3 cleaning: when S2 is carried out, the rotating mechanism drives the wafer to move irregularly relative to the vent pipe so as to change the contact position of the high-speed airflow and the wafer and improve the cleaning comprehensiveness;

s4 taking out the wafer: after cleaning, adjusting the working barrel through an adjusting mechanism so as to take out the cleaned wafer and place the wafer of the next batch;

s5 collection and arrangement: and collecting the cleaned wafers, and uniformly entering the next processing flow after finishing the arrangement.

Compared with the prior art, the invention has the following advantages:

1. according to the wafer dry-type cleaning device and the cleaning method for the silicon semiconductor integrated circuit, provided by the invention, the wafer is driven to move relative to the vent pipe through the rotating mechanism in the cleaning process, so that the cleaning comprehensiveness is improved, and meanwhile, the situation that the wafer is abraded due to the fact that high-speed airflow impacts the fixed position of the wafer for a long time is avoided;

2. according to the invention, the rotating mechanism is arranged, and the rotating motor drives the first rotating rod, the second rotating rod and the rotating branched chain to rotate in the working cylinder, so that the wafer can move relative to the vent pipe in the dry cleaning process, the contact position of the high-speed airflow and the wafer is changed, and all parts of the wafer can be fully cleaned;

3. according to the invention, through the arranged adjusting mechanism, the height of the adjusting plate is adjusted by rotating the adjusting screw, and meanwhile, the height of the adjusting block is changed, so that the purpose of adjusting the distance between the moving blocks is achieved, and the wafer can be conveniently taken and placed.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged partial structural view of FIG. 1 in the direction of N according to the present invention;

FIG. 3 is an enlarged view of the S-direction of FIG. 2;

FIG. 4 is a partial schematic view of a cleaning tube of the present invention;

fig. 5 is a flow chart of the operation of the present invention.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further explained with reference to fig. 1 to 5.

A wafer dry-type cleaning device for a silicon semiconductor integrated circuit comprises a substrate 1, a rotating mechanism 2, an adjusting mechanism 3, a vent pipe 4 and a top plate 5, wherein the rotating mechanism 2 is installed at the upper end of the substrate 1, the adjusting mechanism 3 is installed at the lower end of the rotating mechanism 2, the vent pipe 4 is arranged at the upper end of the rotating mechanism 2, the vent pipe 4 is uniformly installed on the top plate 5 from left to right, and the vent pipe 4 is of an inverted T-shaped structure; wherein:

the rotating mechanism 2 comprises a working barrel 21, a rotating motor 22, a first rotating rod 23, a second rotating rod 24 and a rotating branched chain 25, the working barrel 21 is installed on the base plate 1, the rotating motor 22 is installed on the outer wall of the left end of the working barrel 21 through a motor base, an output shaft of the rotating motor 22 is connected with one end of the first rotating rod 23 through a coupler, the second rotating rod 24 is installed on the inner wall of the right end of the working barrel 21 through a bearing, the rotating branched chain 25 is uniformly arranged between the first rotating rod 23 and the second rotating rod 24 from left to right, and the rotating branched chain 25 is installed in the working barrel 21; the first rotating rod 23, the second rotating rod 24 and the rotating branched chain 25 are driven to rotate in the working barrel 21 through the rotating motor 22, so that the wafer can move relative to the vent pipe 4 in the dry cleaning process, and all parts of the wafer can be fully cleaned.

The working barrel 21 comprises two fixed barrel bodies 211, two fixed ring frames 212, two telescopic ring frames 213 and connecting rods 214, the two fixed barrel bodies 211 are arranged in bilateral symmetry, the fixed ring frames 212 are uniformly arranged between the two fixed barrel bodies 211 from left to right, telescopic grooves are symmetrically formed in the left side and the right side of each fixed ring frame 212, the telescopic ring frames 213 are symmetrically arranged in the telescopic grooves in a sliding fit mode, the fixed ring frames 212 and the telescopic ring frames 213 are of inverted omega-shaped structures with openings at the upper ends, and the fixed ring frames 212 are connected with the substrate 1 through the connecting rods 214; the purpose of synchronously adjusting the position of the rotary branched chain 25 is achieved by adjusting the position of the telescopic ring frame 213, so that the wafer can be taken and placed, and the working requirements of wafers with different thicknesses can be met.

The rotary branched chain 25 comprises a first cleaning pipe 251, a first rotary plate 252, a second rotary plate 253, a second cleaning pipe 254, a first baffle 255, a second baffle 256, a first connecting plate 257, a second connecting plate 258 and a supporting bracket 259, wherein the left end of the first cleaning pipe 251 is provided with a vent 251a, the left end of the first cleaning pipe 251 is arranged on the inner wall of the lower end of the vent pipe 4 in a sliding fit manner, the right end of the first cleaning pipe 251 is arranged on the first rotary plate 252, the second rotary plate 253 is arranged on the right side of the first rotary plate 252, the second cleaning pipe 254 is arranged on the outer side of the second rotary plate 253, the right end of the second cleaning pipe 254 is arranged on the inner wall of the lower end of the vent pipe 4 in a sliding fit manner, the middle part of the first rotary plate 252 and the middle part of the second rotary plate 253 are provided with cleaning holes, the pipe orifices of the first cleaning pipe 251 and the second cleaning pipe 254 are butted with the outer side of the cleaning pipe, the inner wall of the first rotary plate 252 and the second rotary, the first connecting plate 257 and the second connecting plate 258 which are oppositely arranged on the left and right are mutually clamped, and a bearing bracket 259 is connected between the first connecting plate 257 and the second connecting plate 258 which are mutually clamped; in the cleaning process, the gas in the vent pipe 4 enters a cavity formed between the first rotating plate 252 and the second rotating plate 253 through the first cleaning pipe 251 and the second cleaning pipe 254 to clean the wafer in the vent pipe, and the rotating branched chain 25 can rotate in a reciprocating manner, so that the wafer can be driven to move in the supporting bracket 259 to a certain extent, the contact position of the high-speed gas flow and the wafer is changed, and the cleaning comprehensiveness is ensured.

The lower end of the first rotating plate 252 and the lower end of the second connecting plate 258 are connected with the inner wall of the telescopic ring frame 213 through bearings, the upper end of the first rotating plate 252 is connected with the first baffle 255 through bearings, the upper end of the second rotating plate 253 is connected with the second baffle 256 through bearings, the first baffle 255 and the second baffle 256 are both installed on the inner wall of the telescopic ring frame 213, the left end of the first cleaning pipe located at the leftmost end of the working barrel 21 is connected with the right end of the first rotating rod 23, the right end of the second cleaning pipe located at the rightmost end of the working barrel 21 is connected with the left end of the second rotating rod 24, the second cleaning pipe 254 located in the same vent pipe 4 is connected with the side wall of the first cleaning pipe 251, and the first cleaning pipe 251 and the second cleaning pipe 254 are made of telescopic materials.

The supporting bracket 259 comprises two telescopic rods 259a, two supporting plates 259b, a compression spring 259c and two rubber blocks 259d, the number of the telescopic rods 259a is two, the inner walls of the first connecting plate 257 and the second connecting plate 258 are both provided with one telescopic rod 259a, the two telescopic rods 259a are arranged in bilateral symmetry, the telescopic rods 259a are of an up-down telescopic structure, the springs are arranged in the telescopic rods 259a, the supporting plates 259b are arranged on the inner side walls of the telescopic rods 259a, the supporting plates 259b which are arranged oppositely left and right are mutually clamped, and the rubber blocks 259d are arranged on the side walls of the supporting plates 259b through the compression springs 259 c; in the rotation process, because the wafer and the support bracket 259 are not fixed, under the telescopic action of the telescopic rod 259a and the compression spring 259c, the wafer can move up and down and left and right relative to the support bracket 259, so that the relative position and the relative distance between the side wall of the wafer and the high-speed airflow are changed, the cleaning comprehensiveness is further improved, and meanwhile, the situation that the wafer is abraded due to the fact that the high-speed airflow impacts the fixed position of the wafer for a long time is avoided.

The cross sections of the upper end and the lower end of the cleaning opening are of a step-shaped structure; the high-speed airflow can be radially sprayed on the side wall of the wafer, the contact range of the high-speed airflow and the side wall of the wafer is expanded, and meanwhile, the impact force of the high-speed airflow on the side wall of the wafer is reduced.

The left end of the first cleaning pipe 251 is provided with more than one air vent 251a, and the diameters of the air vents 251a are different; different from the air vent 251a opposite to the middle part of the breather pipe 4, the gas quantity of the high-speed gas flow entering the rotating branched chain 25 in unit time is different, and the cleaning state is changed by changing the speed of the high-speed gas flow, so that the high-speed gas flow can push the wafer to move irregularly in the rotating branched chain 25, and further the contact position of the high-speed gas flow and the wafer is changed.

The adjusting mechanism 3 comprises an adjusting plate 31, adjusting screws 32, adjusting blocks 33, moving blocks 34 and a return spring 35, the adjusting plate 31 is located at the upper end of the base plate 1, the left end and the right end of the adjusting plate 31 are connected with the fixed cylinder 211 through the adjusting screws 32, the adjusting blocks 33 are uniformly arranged on the upper end of the adjusting plate 31 from left to right, a circular through hole is formed in the middle of each adjusting block 33, the moving blocks 34 are tightly attached to the left side and the right side of each adjusting block 33, the outer wall of each moving block 34 is connected with the telescopic ring frame 213 through the return spring 35, round holes are uniformly formed in the upper end of the adjusting plate 31 from left to; the height of the adjusting plate 31 is adjusted by rotating the adjusting screw 32, meanwhile, the height of the adjusting block 33 is changed, when the adjusting block 33 moves upwards, the moving block 34 is subjected to outward extrusion force, so that the distance between the left and right oppositely arranged moving blocks 34 is increased, otherwise, the return spring 35 applies inward extrusion force to the moving block 34, and the distance between the left and right oppositely arranged moving blocks 34 is decreased.

The upper end of the adjusting block 33 is in an isosceles trapezoid structure, the moving block 34 is in an inverted right-angled trapezoid structure, and the inner side wall of the moving block 34 is an inclined surface.

The invention also provides a cleaning method of the wafer dry-type cleaning device for the silicon semiconductor integrated circuit, which comprises the following steps:

s1 wafer placement: the working cylinders 21 are adjusted through the adjusting mechanism 3 so as to place the wafers in proper positions one by one;

s2 aeration: introducing high-speed airflow containing solid carbon dioxide aerosol particles into the vent pipe 4;

s3 cleaning: when the step S2 is performed, the rotating mechanism 2 drives the wafer to perform irregular movement relative to the vent pipe 4, so as to change the contact position of the high-speed airflow and the wafer and improve the cleaning comprehensiveness;

s4 taking out the wafer: after cleaning, the working barrel 21 is adjusted through the adjusting mechanism 3 so as to take out the cleaned wafer and place the wafer of the next batch;

s5 collection and arrangement: and collecting the cleaned wafers, and uniformly entering the next processing flow after finishing the arrangement.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.