阅读说明：本技术 一种超薄碳化硅单晶衬底的制备设备及方法 (Preparation equipment and method of ultrathin silicon carbide single crystal substrate ) 是由 王新强 王丕龙 杨玉珍 朱建英 赵旺 于 2021-08-03 设计创作，主要内容包括：本发明提供了一种超薄碳化硅单晶衬底的制备设备及方法,包括安装平台,安装平台包括台面板,台面板顶部的中央转动连接有旋转送料台,旋转送料台的轴体穿过台面板底部与传送电机的输出轴固定连接,传送电机固定安装于台面板的底部,一种超薄碳化硅单晶衬底的制备设备的制备方法,包括以下步骤：1对碳化硅晶圆底衬进行清洁；2正性光刻胶将晶圆底衬正面覆盖进行加固；3底衬背部减薄,本发明通过控制器控制调节液压缸并配合螺纹杆和升降筒的结构设置,从而调整筛选翼板的高低位置,从而筛选金刚石研磨液中的大颗粒金刚石,可效避免含金刚石颗粒的减薄基底在减薄碳化硅过程中由于粘合剂表面露出的金刚石造成深浅不一的划痕,提高成品率和成品质量。(The invention provides a preparation device and a preparation method of an ultrathin silicon carbide single crystal substrate, which comprises an installation platform, wherein the installation platform comprises a table board, the center of the top of the table board is rotatably connected with a rotary feeding table, a shaft body of the rotary feeding table penetrates through the bottom of the table board to be fixedly connected with an output shaft of a conveying motor, and the conveying motor is fixedly arranged at the bottom of the table board, and the preparation method of the preparation device of the ultrathin silicon carbide single crystal substrate comprises the following steps: 1 cleaning a silicon carbide wafer substrate; 2, positive photoresist covers the front side of the wafer substrate for reinforcement; and 3, thinning the back of the bottom lining, controlling and adjusting the hydraulic cylinder by the controller and matching with the structural arrangement of the threaded rod and the lifting cylinder, so as to adjust the height position of the screening wing plate, thereby screening large-particle diamonds in the diamond grinding fluid, effectively avoiding scratches with different depths caused by the diamonds exposed on the surface of the adhesive in the process of thinning the silicon carbide of the thinned substrate containing diamond particles, and improving the yield and the quality of finished products.)

1. A preparation equipment of an ultrathin silicon carbide single crystal substrate is characterized in that: the polishing device comprises an installation platform (100), wherein the installation platform (100) comprises a table top plate (102), the center of the top of the table top plate (102) is rotatably connected with a rotary feeding table (200), a shaft body of the rotary feeding table (200) penetrates through the bottom of the table top plate (102) to be fixedly connected with an output shaft of a conveying motor (103), the conveying motor (103) is fixedly installed at the bottom of the table top plate (102), at least two wafer bottom linings (400) are uniformly and fixedly connected to the periphery of the top of the rotary feeding table (200), a grinding support (107) is fixedly connected to the left side of the top of the table top plate (102), the top of the grinding support (107) is in bearing connection with a lead screw (106) and a sliding shaft (108) along the horizontal direction, a liquid screening polishing head (300) is arranged between the lead screw (106) and the sliding shaft (108), and one end of the lead screw (106) is fixedly connected with the output shaft of a reciprocating motor (105), reciprocating motor (105) fixed mounting in grind support (107) surface, reciprocating motor (105) are used for the drive sieve liquid grinding head (300) is horizontal reciprocating motion back and forth, the bottom left side of platen (102) just corresponds wafer end liner (400) position department fixed mounting has jacking pneumatic cylinder (104), jacking pneumatic cylinder (104) are used for the jacking wafer end liner (400) are ground the attenuate, one side of wafer end liner (400) is provided with attenuate liquid sprinkler (500), be used for to wafer end liner (400) grinding face sprays attenuate liquid, the right side of platen (102) bottom is provided with controller (101), controller (101) are used for controlling rotatory pay-off platform (200) with sieve liquid grinding head (300) operation.

2. An apparatus for producing an ultra-thin silicon carbide single crystal substrate according to claim 1, characterized in that: the rotary feeding table (200) comprises a rotary base (201), wherein a bearing of the rotary base (201) is connected to the center of the top of the table panel (102), two sliding holes (20101) are uniformly formed in the periphery of the top of the rotary base (201), a sliding block seat (203) is connected to the inside of each sliding hole (20101) in a sliding mode, a vacuum sucker (204) is arranged at the top of each sliding block seat (203), each vacuum sucker (204) is connected with a vacuumizing device, a jacking plate (202) is fixedly connected to the bottom of each sliding block seat (203), and a jacking hydraulic cylinder (104) is used for jacking the jacking plate (202).

3. The production apparatus of an ultrathin silicon carbide single crystal substrate as claimed in claim 2, characterized in that: the liquid screening grinding head (300) comprises a mounting frame (302), an internal thread sleeve (303) and a sliding sleeve (301) are fixedly connected between the left side and the right side of the inner wall of the mounting frame (302) side by side, the internal thread sleeve (303) is in threaded connection with a lead screw (106), the sliding sleeve (301) is in sliding connection with a sliding shaft (108), an adjusting hydraulic cylinder (304) is fixedly mounted at the center of the top of the inner wall of the mounting frame (302), a protective cover (305) is fixedly connected with the bottom of the mounting frame (302), a friction block (306) is arranged inside the protective cover (305), the bottom end of a telescopic shaft of the adjusting hydraulic cylinder (304) penetrates through the protective cover (305) and the friction block (306) and is connected to the top of a threaded rod (313) through a bearing, a grinding disc seat (311) is fixedly connected with the bottom of the threaded rod (313), and a lifting device (307) is meshed with the surface of the threaded rod (313), the center of the peripheral surface of the lifting drum (307) is sleeved with a fixing ring (309) and a position supplementing spring (317), the top of the position supplementing spring (317) is rotatably connected with the top of the lifting drum (307), the peripheral surface of the fixing ring (309) is uniformly provided with screening wing plates (308), the peripheral surface of the grinding disc seat (311) is uniformly provided with an interval groove (31101), the screening wing plates (308) are inserted into the interval groove (31101), the outer part of the lifting drum (307) is sleeved with a bevel gear I (314), the bevel gear I (314) is fixedly connected with the top of the grinding disc seat (311), one side of the top of the bevel gear I (314) is meshed with a bevel gear II (315), the bevel gear II (315) is fixedly connected with an output shaft of the grinding motor (310), and the grinding motor (310) is fixedly installed on the surface of the follow-up motor support (316), the follow-up motor support (316) is fixedly connected to the bottom of the mounting frame (302), the follow-up motor support (316) is a structure for providing vertical displacement of the grinding motor (310), and at least two grinding blocks (312) are uniformly arranged at the bottom of the grinding disc seat (311).

4. An apparatus for producing an ultrathin silicon carbide single crystal substrate as claimed in claim 3, characterized in that: the servo motor bracket (316) comprises a fixed plate (31601) and a servo plate (31603), the top of the fixed plate (31601) is fixedly connected with the bottom of the mounting frame (302), the right side of the fixed plate (31601) is provided with two guide edges (31605), the left side of the servo plate (31603) is provided with a guide groove (31604) corresponding to the guide edge (31605), the guide edge (31605) is connected inside the guide groove (31604) in a sliding manner, a reaction spring (31602) is arranged between the fixed plate (31601) and the servo plate (31603), and the grinding motor (310) is fixedly mounted on the left side of the servo plate (31603) and close to the bottom.

5. An apparatus for producing an ultra-thin silicon carbide single crystal substrate according to claim 4, wherein: the adjusting hydraulic cylinder (304), the friction block (306), the lifting cylinder (307), the threaded rod (313) and the grinding disc seat (311) are positioned on the same vertical plane.

6. An apparatus for producing an ultra-thin silicon carbide single crystal substrate according to claim 4, wherein: the grinding blocks (312) are made of copper or iron, and the two grinding blocks (312) are arranged on two sides of the screening wing plate (308).

7. An apparatus for producing an ultra-thin silicon carbide single crystal substrate according to claim 4, wherein: the friction block (306) is made of rubber materials and is internally provided with a circular truncated cone-shaped hole.

8. An apparatus for producing an ultra-thin silicon carbide single crystal substrate according to claim 4, wherein: the conveying motor (103), the jacking hydraulic cylinder (104), the reciprocating motor (105), the vacuum chuck (204), the adjusting hydraulic cylinder (304) and the grinding motor (310) are electrically connected with the controller (101) through electric wires.

9. A method for producing an ultrathin silicon carbide single crystal substrate, comprising the apparatus for producing an ultrathin silicon carbide single crystal substrate as claimed in any one of claims 1 to 8, characterized by comprising the steps of:

s1, cleaning the carborundum wafer substrate (400);

s2 positive photoresist covers the front side of the wafer substrate (400) for reinforcement;

s3, thinning the back of the bottom lining;

s31, placing bottom linings, uniformly placing the back surfaces of the wafer bottom linings (400) upwards on a rotary feeding table (200), adsorbing and fixing the wafer bottom linings through a vacuum chuck (204), and driving the rotary feeding table (200) to rotate through a transmission motor (103) to move one wafer bottom lining (400) to a working area below a liquid screening grinding head (300);

s32 grinding and thinning, driving by a grinding motor (310), enabling a grinding disc seat (311) to drive a grinding block (312) and a screening wing plate (308) to rotate, driving a screening liquid grinding head (300) to do reciprocating motion in a working area by a reciprocating motor (105), simultaneously jacking a jacking plate (202) by a jacking hydraulic cylinder (104) at the bottom of a table panel (102) to drive a sliding block seat (203), a vacuum chuck (204) and a wafer bottom lining (400) to lift close to the screening liquid grinding head (300), spraying thinning liquid to the grinding surface of the wafer bottom lining (400) by a thinning liquid spraying device (500), and during grinding, firstly approaching the grinding surface by the screening wing plate (308), sweeping away oversize diamond particles in the thinning liquid, and then grinding and thinning by the grinding block (312);

and S32, cleaning the thinned surface, and rotating the rotary feeding table (200) to perform the thinning operation of the next wafer substrate (400).

10. A method for producing an ultrathin silicon carbide single crystal substrate as claimed in claim 9, characterized in that: and after the grinding and thinning process of the wafer substrate (400) is finished, the positive photoresist in the S2 is eliminated by utilizing a photoetching machine to carry out exposure treatment.

Technical Field

The invention belongs to the technical field of silicon carbide processing, and particularly relates to preparation equipment and a preparation method of an ultrathin silicon carbide single crystal substrate.

Background

The silicon carbide single crystal material has the characteristics of wide forbidden band, high thermal conductivity, high breakdown electric field, high radiation resistance and the like, so that the prepared semiconductor device can meet the requirements of high-power and strong-radiation devices at present, is an ideal substrate material for preparing high-temperature, high-frequency, high-power and radiation-resistant devices, and leaves the corner in the fields of hybrid electric vehicles, high-voltage power transmission, LED illumination, aerospace and the like, and the growth of high-quality silicon carbide crystals is the basis for realizing the excellent performance of the silicon carbide-based devices.

The silicon carbide substrate is typically ground with a diamond thinning wheel, and the diamond powder is consolidated in a binder, which may be stationary during thinning of the silicon carbide substrate. More diamond powder particles will cause deeper scratches on the silicon carbide surface when the adhesive surface is exposed. The diamond powder has certain particle size distribution, so that more and less diamonds are exposed on the surface of the adhesive, and scratches with different depths are caused in the process of thinning the silicon carbide. The deep scratches will increase the possibility that some of the scratches will not be removed during the subsequent processing of the silicon carbide substrate, or increase the removal amount to remove all the scratches. If the removal amount of the subsequent process is increased in order to ensure that scratches on the surface of the substrate are completely removed, the material cost of the subsequent process is increased, a thicker silicon carbide substrate is also needed, the loss of the silicon carbide substrate is also increased, and the polishing of the workpiece by the diamond thinning liquid also has the problem that the subsequent production and processing process is influenced due to the fact that the silicon carbide surface generates too deep scratches caused by uneven size or uneven distribution of diamond particles.

Disclosure of Invention

The invention is realized by the following steps:

on one hand, the invention provides preparation equipment of an ultrathin silicon carbide single crystal substrate, which comprises an installation platform, wherein the installation platform comprises a table board, the center of the top of the table board is rotatably connected with a rotary feeding table, a shaft body of the rotary feeding table penetrates through the bottom of the table board and is fixedly connected with an output shaft of a conveying motor, the conveying motor is fixedly installed at the bottom of the table board, the periphery of the top of the rotary feeding table is uniformly and fixedly connected with at least two wafer bottom linings, the left side of the top of the table board is fixedly connected with a grinding support, the top of the grinding support is in bearing connection with a lead screw and a sliding shaft along the horizontal direction, a liquid screening grinding head is arranged between the lead screw and the sliding shaft, one end of the lead screw is fixedly connected with an output shaft of a reciprocating motor, the reciprocating motor is fixedly installed on the surface of the grinding support, and the reciprocating motor is used for driving the liquid screening grinding head to do transverse reciprocating motion back and forth, the bottom left side of deck plate just corresponds wafer end liner position department fixed mounting has the jacking pneumatic cylinder, the jacking pneumatic cylinder is used for the jacking the wafer end liner grinds the attenuate, one side of wafer end liner is provided with attenuate liquid sprinkler for to the wafer end liner lapping surface sprays attenuate liquid, the right side of deck plate bottom is provided with the controller, the controller is used for controlling rotatory pay-off platform with sieve liquid grinding head operation.

In an embodiment of the invention, the rotary feeding table comprises a rotary base, the rotary base is connected to the center of the top of the table panel through a bearing, the periphery of the top of the rotary base is uniformly provided with two sliding holes, sliding block seats are connected to the inside of the sliding holes in a sliding manner, vacuum chucks are arranged on the tops of the sliding block seats, the vacuum chucks are connected with vacuum pumping equipment, the bottoms of the sliding block seats are fixedly connected with jacking plates, and the jacking hydraulic cylinders are used for jacking the jacking plates.

In one embodiment of the invention, the screening fluid grinding head comprises a mounting frame, an internal thread sleeve and a sliding sleeve are fixedly connected between the left side and the right side of the inner wall of the mounting frame side by side, the internal thread sleeve is in threaded connection with the lead screw, the sliding sleeve is in sliding connection with the sliding shaft, an adjusting hydraulic cylinder is fixedly installed at the center of the top of the inner wall of the mounting frame, a protective cover is fixedly connected to the bottom of the mounting frame, a friction block is arranged inside the protective cover, the bottom end of a telescopic shaft of the adjusting hydraulic cylinder penetrates through the protective cover and a bearing of the friction block to be connected to the top of a threaded rod, the bottom of the threaded rod is fixedly connected with a grinding disc seat, a lifting cylinder is meshed with the surface of the threaded rod, a fixing ring and a position-supplementing spring are sleeved at the center of the peripheral surface of the lifting cylinder, the top of the position-supplementing spring is rotatably connected with the top of the lifting cylinder, and screening wing plates are uniformly arranged on the peripheral surface of the fixing ring, the grinding disc seat is characterized in that the peripheral surface of the grinding disc seat is uniformly provided with an interval groove, the screening wing plate is inserted into the interval groove, the outer part of the lifting cylinder is sleeved with a first bevel gear, the first bevel gear is fixedly connected to the top of the grinding disc seat, one side of the top of the first bevel gear is meshed with a second bevel gear, the second bevel gear is fixedly connected with an output shaft of a grinding motor, the grinding motor is fixedly installed on the surface of a servo motor support, the servo motor support is fixedly connected to the bottom of the installation frame, the servo motor support is a structure for providing up-and-down displacement of the grinding motor, and the bottom of the grinding disc seat is uniformly provided with at least two grinding blocks.

In an embodiment of the invention, the servo motor bracket comprises a fixed plate and a servo plate, the top of the fixed plate is fixedly connected with the bottom of the mounting frame, two guide edges are arranged on the right side of the fixed plate, a guide groove is arranged on the left side of the servo plate and corresponds to the guide edges, the guide edges are slidably connected inside the guide groove, a reaction spring is arranged between the fixed plate and the servo plate, and the grinding motor is fixedly mounted on the left side of the servo plate and close to the bottom.

In one embodiment of the invention, the adjusting hydraulic cylinder, the friction block, the lifting cylinder, the threaded rod and the grinding disc seat are located on the same vertical plane.

In one embodiment of the present invention, the grinding blocks are made of copper or iron, and two grinding blocks are arranged on two sides of the screening wing plate.

In an embodiment of the present invention, the friction block is made of rubber, and a circular truncated cone-shaped hole is formed inside the friction block.

In an embodiment of the present invention, the conveying motor, the jacking hydraulic cylinder, the reciprocating motor, the vacuum chuck, the adjusting hydraulic cylinder and the grinding motor are electrically connected to the controller through wires.

On the other hand, a method for manufacturing an apparatus for manufacturing an ultra-thin silicon carbide single crystal substrate, comprising the steps of:

s1, cleaning the silicon carbide wafer substrate;

s2, the positive photoresist covers the front side of the wafer substrate for reinforcement;

s3, thinning the back of the bottom lining;

s31, placing the bottom linings, uniformly placing the back surfaces of the wafer bottom linings upwards on a rotary feeding table, fixing the wafer bottom linings by adsorption of a vacuum chuck, and driving the rotary feeding table to rotate by a transmission motor to move a wafer bottom lining to a working area below a liquid screening grinding head;

s32 grinding and thinning, driving by a grinding motor, enabling a grinding disc seat to drive a grinding block and a screening wing plate to rotate, driving a screening liquid grinding head to reciprocate in a working area by a reciprocating motor, simultaneously jacking a jacking plate by a jacking hydraulic cylinder at the bottom of a table panel to drive a sliding block seat, a vacuum chuck and a wafer bottom liner to lift close to the screening liquid grinding head, spraying a thinning liquid to the grinding surface of the wafer bottom liner by a thinning liquid spraying device, during grinding, firstly approaching the grinding surface by the screening wing plate, sweeping away oversize diamond particles in the thinning liquid, and then grinding and thinning by the grinding block;

and S32, cleaning the surface after thinning, and rotating the rotary feeding table to perform the next wafer bottom lining thinning operation.

In an embodiment of the present invention, the positive photoresist in S2 is removed by exposing the positive photoresist to light using a photolithography machine after the wafer substrate grinding and thinning process is completed.

The invention has the beneficial effects that:

1. according to the invention, the controller controls the adjusting hydraulic cylinder and is matched with the threaded rod and the lifting simple structure, so that the height position of the screening wing plate is adjusted, and large-particle diamonds in the diamond grinding fluid are screened, thereby ensuring the thinning effect, effectively avoiding scratches with different depths caused by diamonds exposed on the surface of a bonding agent during the process of thinning silicon carbide of the thinning base containing diamond particles, reducing the loss and processing cost of the silicon carbide substrate, and improving the yield and the quality of finished products.

2. The controller controls the transmission motor to rotate so as to drive the rotating base to rotate, so that the wafer bottom linings adsorbed and fixed by the vacuum chuck are driven to rotate and are transmitted to the working area at the bottom of the liquid screening grinding head to be thinned, in the process, the controller controls the telescopic motion of the telescopic shaft of the jacking hydraulic cylinder to jack the jacking plate, so that the wafer bottom linings adsorbed by the vacuum chuck are lifted by the sliding block base to move upwards for feeding and thinning, a plurality of wafer bottom linings can be sequentially placed, and the controller controls the cooperation of the rotary feeding table and the liquid screening grinding head to realize automatic thinning and stirring of the plurality of wafer bottom linings, so that the working efficiency is improved.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic view of the overall structure of the present disclosure;

FIG. 2 is a schematic perspective view of a fluid-sieving grinding head disclosed in the present invention;

FIG. 3 is a schematic exploded perspective view of a liquid sieving grinding head according to the present invention;

FIG. 4 is a schematic perspective view of a servo motor bracket according to the present disclosure;

FIG. 5 is a flow chart of a preparation method disclosed by the present invention.

Description of reference numerals: 100. mounting a platform; 101. a controller; 102. a table top plate; 103. a transfer motor; 104. a jacking hydraulic cylinder; 105. a reciprocating motor; 106. a lead screw; 107. grinding the support; 108. a slide shaft; 200. rotating the feeding table; 201. rotating the base; 20101. a slide hole; 202. a jacking plate; 203. a slider seat; 204. a vacuum chuck; 300. a liquid screening grinding head; 301. a sliding sleeve; 302. installing a frame; 303. an internal thread sleeve; 304. adjusting a hydraulic cylinder; 305. a protective cover; 306. a friction block; 307. lifting is simple; 308. screening wing plates; 309. a fixing ring; 310. grinding the motor; 311. grinding a disc seat; 31101. an inter-zone groove; 312. grinding blocks; 313. a threaded rod; 314. a first bevel gear; 315. a second bevel gear; 316. a servo motor support; 31601. a fixing plate; 31602. a counter-force spring; 31603. a follower plate; 31604. a guide groove; 31605. a guide edge; 317. a position compensating spring; 400. a wafer substrate; 500. a thinning liquid spraying device.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

Example one

Referring to fig. 1-4, the present invention provides an apparatus for preparing an ultra-thin silicon carbide single crystal substrate, comprising an installation platform 100, wherein the installation platform 100 comprises a table top 102, the center of the top of the table top 102 is rotatably connected with a rotary feeding table 200, the shaft body of the rotary feeding table 200 passes through the bottom of the table top 102 and is fixedly connected with the output shaft of a transmission motor 103, the transmission motor 103 is fixedly installed at the bottom of the table top 102, at least two wafer bottom linings 400 are uniformly and fixedly connected to the periphery of the top of the rotary feeding table 200, the left side of the top of the table top 102 is fixedly connected with a grinding bracket 107, the top of the grinding bracket 107 is horizontally and axially connected with a lead screw 106 and a sliding shaft 108, a grinding fluid 300 is disposed between the lead screw 106 and the sliding shaft 108, one end of the lead screw 106 is fixedly connected with the output shaft of a reciprocating motor 105, the reciprocating motor 105 is fixedly installed on the surface of the grinding bracket 107, the reciprocating motor 105 is used for driving the grinding fluid 300 to perform a transverse reciprocating motion back and forth, a jacking hydraulic cylinder 104 is fixedly mounted on the left side of the bottom of the table panel 102 and corresponds to the position of the wafer bottom liner 400, the jacking hydraulic cylinder 104 is used for jacking the wafer bottom liner 400 for grinding and thinning, a thinning liquid spraying device 500 is arranged on one side of the wafer bottom liner 400 and used for spraying thinning liquid to the grinding surface of the wafer bottom liner 400, a controller 101 is arranged on the right side of the bottom of the table panel 102, and the controller 101 is used for controlling the rotary feeding table 200 and the liquid screening and grinding head 300 to operate.

The rotary feeding table 200 comprises a rotating base 201, the rotating base 201 is connected to the center of the top of the table top plate 102 through a bearing, two sliding holes 20101 are evenly formed in the periphery of the top of the rotating base 201, a sliding block seat 203 is connected to the inside of each sliding hole 20101 in a sliding mode, vacuum suction cups 204 are arranged at the top of each sliding block seat 203, each vacuum suction cup 204 is connected with a vacuumizing device, a jacking plate 202 is fixedly connected to the bottom of each sliding block seat 203, and a jacking hydraulic cylinder 104 is used for jacking the jacking plate 202.

Specifically, the controller 101 controls the transmission motor 103 to rotate, so as to drive the rotary base 201 to rotate, and further drive the wafer bottom liner 400 adsorbed and fixed by the vacuum chuck 204 to rotate and transmit the wafer bottom liner 400 to a working area at the bottom of the liquid sieving grinding head 300 for thinning, in the process, the controller 101 controls the telescopic motion of the telescopic shaft of the jacking hydraulic cylinder 104 to jack up the jacking plate 202, so as to drive the slider seat 203 to lift the wafer bottom liner 400 adsorbed by the vacuum chuck 204 to move upwards for feeding and thinning.

The screening grinding head 300 comprises a mounting frame 302, an internal thread sleeve 303 and a sliding sleeve 301 are fixedly connected between the left side and the right side of the inner wall of the mounting frame 302 side by side, the internal thread sleeve 303 is in threaded connection with a lead screw 106, the sliding sleeve 301 is in sliding connection with a sliding shaft 108, an adjusting hydraulic cylinder 304 is fixedly mounted at the center of the top of the inner wall of the mounting frame 302, a protective cover 305 is fixedly connected to the bottom of the mounting frame 302, a friction block 306 is arranged inside the protective cover 305, the bottom end of the telescopic shaft of the adjusting hydraulic cylinder 304 penetrates through the protective cover 305 and the friction block 306 to be connected to the top of a threaded rod 313 in a bearing mode, a grinding disc seat 311 is fixedly connected to the bottom of the threaded rod 313, a lifting cylinder 307 is meshed to the surface of the threaded rod 313, a fixing ring 309 and a position supplementing spring 317 are sleeved at the center of the peripheral surface of the lifting cylinder 307, the top of the position supplementing spring 317 is rotatably connected with the top of the lifting cylinder 307, and screening wing plates 308 are uniformly arranged on the peripheral surface of the fixing ring, the surface all around of grinding disc seat 311 evenly is provided with interval groove 31101, screening pterygoid lamina 308 is pegged graft inside interval groove 31101, bevel gear 314 is established to the outside cover of a lifting cylinder 307, bevel gear 314 fixed connection is in the top of grinding disc seat 311, one side meshing at bevel gear 314 top has bevel gear two 315, bevel gear two 315 and grinding motor 310's output shaft fixed connection, grinding motor 310 fixed mounting is in follow-up motor support 316 surface, follow-up motor support 316 fixed connection is in the installing frame 302 bottom, follow-up motor support 316 is for providing the structure of grinding motor 310 displacement from top to bottom, grinding disc seat 311 bottom evenly is provided with two at least abrasive brick 312.

Specifically, the controller 101 controls the telescopic shaft of the adjusting hydraulic cylinder 304 to extend and retract to drive the threaded rod 313 and the lifting cylinder 307 to lift, the top of the lifting cylinder 307 is pushed into the protective cover 305 and stops the lifting cylinder 307 from rotating with the friction block 306, the controller 101 controls the grinding motor 310 to rotate to drive the bevel gear I314 to rotate, so as to drive the bevel gear II 315, the grinding disc seat 311 and the threaded rod 313 to rotate, so that the lifting cylinder 307 drives the fixing ring 309 and the screening wing plate 308 to move up and down through the compensation spring 317, so as to adjust the distance between the screening wing plate 308 and the bottom of the grinding block 312, the telescopic shaft of the lifting hydraulic cylinder 104 extends to enable the lifting cylinder 307 to be separated from the friction block 306 to complete the adjustment of the screening wing plate 308, and after the oversize grinding particles of the diamond thinning liquid are removed through the screening wing plate 308, the grinding block 312 grinds the grinding liquid, so as to prevent the large particles from generating deep scratches on the surface of the bottom lining in the grinding process, therefore, the problem that more raw materials need to be wasted for remediation at the later stage occurs;

the follower motor bracket 316 comprises a fixed plate 31601 and a follower plate 31603, the top of the fixed plate 31601 is fixedly connected with the bottom of the mounting frame 302, the right side of the fixed plate 31601 is provided with two guide ribs 31605, the left side of the follower plate 31603 is provided with a guide groove 31604 corresponding to the guide ribs 31605, the guide ribs 31605 are slidably connected inside the guide grooves 31604, a reaction spring 31602 is arranged between the fixed plate 31601 and the follower plate 31603, the grinding motor 310 is fixedly mounted on the left side of the follower plate 31603 and close to the bottom, when the position of the screening wing plate 308 is adjusted, the grinding disc seat 311 needs to move up and down along with the adjustment hydraulic cylinder 304, so that the grinding motor 310 also needs to move up and down along with the adjustment, the follower plate 31603 is slidably connected with the fixed plate 31601, and the reaction spring 31602 is used for enabling the grinding motor 310 to move along with each part during adjustment.

The adjusting hydraulic cylinder 304, the friction block 306, the lifting cylinder 307, the threaded rod 313 and the grinding disc seat 311 are positioned on the same vertical plane.

The grinding blocks 312 are made of copper or iron, and the two grinding blocks 312 are disposed on both sides of the screening wing plate 308.

The friction block 306 is made of rubber material and is provided with a circular truncated cone-shaped hole inside.

The conveying motor 103, the jacking hydraulic cylinder 104, the reciprocating motor 105, the vacuum chuck 204, the adjusting hydraulic cylinder 304 and the grinding motor 310 are electrically connected with the controller 101 through electric wires.

Example two:

referring to fig. 5, a method for manufacturing an apparatus for manufacturing an ultra-thin silicon carbide single crystal substrate includes the steps of:

s1, cleaning the sic wafer substrate 400;

s2, the positive photoresist covers the front side of the wafer substrate 400 for reinforcement;

s3, thinning the back of the bottom lining;

s31, placing the wafer substrates 400 on the rotary feeding table 200 with the back surfaces facing upwards uniformly, fixing the wafer substrates by adsorption of the vacuum chuck 204, and moving one wafer substrate 400 to a working area below the liquid sieving grinding head 300 by driving the rotary feeding table 200 to rotate through the transmission motor 103;

s32 grinding and thinning, driven by a grinding motor 310, so that a grinding disc seat 311 drives a grinding block 312 and a screening wing plate 308 to rotate, a reciprocating motor 105 drives a screening fluid grinding head 300 to reciprocate in a working area, meanwhile, a jacking hydraulic cylinder 104 at the bottom of a table panel 102 jacks up a jacking plate 202 to drive a slider seat 203, a vacuum chuck 204 and a wafer bottom liner 400 to lift close to the screening fluid grinding head 300, and meanwhile, a thinning fluid spraying device 500 sprays thinning fluid to the grinding surface of the wafer bottom liner 400, during grinding, the screening wing plate 308 is close to the grinding surface to sweep away oversize diamond particles in the thinning fluid, and then grinding and thinning are carried out through the grinding block 312;

and S32, cleaning the thinned surface, and rotating the rotary feeding table 200 to perform the next thinning operation of the wafer substrate 400.

After the grinding and thinning process of the wafer substrate 400 is completed, the positive photoresist in the step S2 is removed by exposing the positive photoresist with a photolithography machine.

It should be understood that the specific order or hierarchy of steps in the processes disclosed is an example of exemplary approaches. Based upon design preferences, it is understood that the specific order or hierarchy of steps in the processes may be rearranged without departing from the scope of the present disclosure. The accompanying method claims present elements of the various steps in a sample order, and are not intended to be limited to the specific order or hierarchy presented.

In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the invention.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

What has been described above includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent that the term "includes" is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term "comprising" as "comprising" is interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean "non-exclusive or".