Package and method of forming a package
阅读说明:本技术 封装件和形成封装件的方法 (Package and method of forming a package ) 是由 余振华 郭庭豪 蔡豪益 刘重希 于 2019-05-29 设计创作,主要内容包括:一种方法包括将多个功能管芯放置在载体上、将多个伪管芯放置在载体上,将多个功能管芯和多个伪管芯封装在密封剂中,以及在多个功能管芯上形成再分配线并使多个功能管芯互连。再分配线、多个功能管芯、多个伪管芯和密封剂组合形成重建晶圆。多个功能管芯位于重建晶圆的中心区域中,且多个伪管芯位于重建晶圆的外围区域中,同时外围区域环绕中心区域。重建晶圆从载体上脱粘。重建晶圆接合至封装组件,封装组件选自基本上由中介层、封装衬底、印刷电路板、热模块及其组合组成的群组。本发明的实施例还涉及用于减少封装件中的翘曲的伪管芯。本发明的实施例还涉及封装件和形成封装件的方法。(A method includes placing a plurality of functional dies on a carrier, placing a plurality of dummy dies on the carrier, encapsulating the plurality of functional dies and the plurality of dummy dies in an encapsulant, and forming redistribution lines on and interconnecting the plurality of functional dies. The redistribution lines, the plurality of functional dies, the plurality of dummy dies, and the encapsulant are combined to form a reconstituted wafer. The plurality of functional dies are located in a central region of the reconstituted wafer, and the plurality of dummy dies are located in a peripheral region of the reconstituted wafer, with the peripheral region surrounding the central region. And debonding the reconstructed wafer from the carrier. The reconstituted wafer is bonded to a package assembly selected from the group consisting essentially of an interposer, a package substrate, a printed circuit board, a thermal module, and combinations thereof. Embodiments of the invention also relate to a dummy die for reducing warpage in a package. Embodiments of the invention also relate to packages and methods of forming packages.)
1. A method of forming a package, comprising:
placing a plurality of functional die on a carrier;
placing a plurality of dummy dies on the carrier;
encapsulating the plurality of functional dies and the plurality of dummy dies in an encapsulant;
forming redistribution lines on the plurality of functional dies, the redistribution lines interconnecting the plurality of functional dies, wherein the redistribution lines, the plurality of functional dies, the plurality of dummy dies, and the encapsulant combine to form a reconstituted wafer, wherein the plurality of functional dies are located in a central region of the reconstituted wafer and the plurality of dummy dies are located in a peripheral region of the reconstituted wafer, while the peripheral region surrounds the central region;
debonding the reconstituted wafer from the carrier; and
the reconstituted wafer is bonded to a package assembly selected from the group consisting of an interposer, a package substrate, a printed circuit board, a thermal module, and combinations thereof.
2. The method of claim 1, wherein the plurality of dummy dies are evenly distributed in the peripheral region.
3. The method of claim 1, wherein the reconstituted wafer bonded to the package assembly has a circular top view shape.
4. The method of claim 1, wherein the reconstituted wafer is unsawn prior to bonding to the package assembly.
5. The method of claim 1, further comprising securing the reconstituted wafer to the package assembly by bolts penetrating the reconstituted wafer.
6. The method of claim 5, wherein the bolt passes through one of the plurality of dummy dies.
7. The method of claim 1, wherein the encapsulating comprises:
dispensing the sealant; and
planarizing the encapsulant, wherein dummy dies of the plurality of dummy dies are polished in the planarizing.
8. The method of claim 1, wherein the plurality of dummy dies are thinner than the plurality of functional dies, and wherein the packaging comprises:
dispensing the sealant; and
planarizing the encapsulant, wherein after the planarizing, the layer of encapsulant covers the plurality of dummy dies.
9. A method of forming a package, comprising:
placing a plurality of logic dies on a carrier;
placing a plurality of input-output (IO) dies on the carrier;
placing a plurality of dummy dies on the carrier, wherein the plurality of dummy dies are distributed around an area where the plurality of logic chips and the plurality of input-output chips are located;
encapsulating the plurality of logic dies, the plurality of input-output dies, and the plurality of dummy dies in an encapsulant;
forming redistribution lines on the plurality of logic dies and the plurality of input-output dies, the redistribution lines electrically coupled to the plurality of logic dies and the plurality of input-output dies to form a reconstituted wafer, the reconstituted wafer comprising the plurality of logic dies, the plurality of input-output dies, the plurality of dummy dies, the encapsulant, and the redistribution lines; and
debonding the reconstituted wafer from the carrier.
10. A package, comprising:
rebuilding a wafer, comprising:
a plurality of dummy die;
a plurality of functional dies located in a central region of the package, wherein the plurality of dummy dies are assigned in alignment with a ring surrounding the plurality of functional dies;
an encapsulant encapsulating the plurality of dummy die and the plurality of functional die therein; and
a plurality of redistribution lines (RDLs) on the plurality of functional dies, wherein the plurality of RDLs interconnect all of the functional dies in the package into an integrated system.
Technical Field
Embodiments of the invention relate to packages and methods of forming packages, and more particularly, to dummy dies for reducing warpage in packages.
Background
In the formation of three-dimensional integrated circuits, the die is typically bonded to a semiconductor wafer. The bonding process typically includes selecting a known good die (top die), and bonding the top die to the bottom chip in the bottom wafer using flip-chip die bonding. Each bottom chip may be bonded to one or more top dies. After bonding, an underfill is dispensed into the space between the top die and the bottom chip, and a molding compound is molded onto the top die and the bottom wafer. After molding of the molding compound, warpage of the package may occur due to shrinkage of the molding compound. Thus, stress may be generated and applied to the bottom wafer and the top die above.
The situation is further exacerbated as the package becomes larger and larger. As package size increases, the distance from one point of the package to another increases, which results in an increase in the distance at which stress can accumulate, resulting in an increase in stress and thus an increase in the occurrence of warpage.
In the formation of conventional packages, a dummy die is used to reduce warpage and the dummy die and functional die are molded together. After forming the RDLs connected to the functional die, the reconstituted wafer is sawed into multiple packages. Dummy dies near the edge of the reconstituted wafer are removed. The resulting package may or may not include a dummy die. The resulting package has the dummy (if any) placed side-by-side with the functional die.
Disclosure of Invention
An embodiment of the present invention provides a method of forming a package, including: placing a plurality of functional die on a carrier; placing a plurality of dummy dies on the carrier; encapsulating the plurality of functional dies and the plurality of dummy dies in an encapsulant; forming redistribution lines on the plurality of functional dies, the redistribution lines interconnecting the plurality of functional dies, wherein the redistribution lines, the plurality of functional dies, the plurality of dummy dies, and the encapsulant combine to form a reconstituted wafer, wherein the plurality of functional dies are located in a central region of the reconstituted wafer and the plurality of dummy dies are located in a peripheral region of the reconstituted wafer, while the peripheral region surrounds the central region; debonding the reconstituted wafer from the carrier; and bonding the reconstituted wafer to a package assembly selected from the group consisting of an interposer, a package substrate, a printed circuit board, a thermal module, and combinations thereof.
Another embodiment of the present invention provides a method of forming a package, including: placing a plurality of logic dies on a carrier; placing a plurality of input-output (IO) dies on the carrier; placing a plurality of dummy dies on the carrier, wherein the plurality of dummy dies are distributed around an area where the plurality of logic chips and the plurality of input-output chips are located; encapsulating the plurality of logic dies, the plurality of input-output dies, and the plurality of dummy dies in an encapsulant; forming redistribution lines on the plurality of logic dies and the plurality of input-output dies, the redistribution lines electrically coupled to the plurality of logic dies and the plurality of input-output dies to form a reconstituted wafer, the reconstituted wafer comprising the plurality of logic dies, the plurality of input-output dies, the plurality of dummy dies, the encapsulant, and the redistribution lines; and debonding the reconstituted wafer from the carrier.
Yet another embodiment of the present invention provides a package, including: rebuilding a wafer, comprising: a plurality of dummy die; a plurality of functional dies located in a central region of the package, wherein the plurality of dummy dies are assigned in alignment with a ring surrounding the plurality of functional dies; an encapsulant encapsulating the plurality of dummy die and the plurality of functional die therein; and a plurality of redistribution lines (RDLs) on the plurality of functional dies, wherein the plurality of redistribution lines interconnect all functional dies in the package into an integrated system.
Drawings
Embodiments of the invention are best understood from the following detailed description when read with the accompanying drawing figures. It should be emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various elements may be arbitrarily increased or reduced for clarity of discussion.
Fig. 1-9 illustrate cross-sectional views of intermediate stages in package formation according to some embodiments.
Fig. 10 illustrates a cross-sectional view of a package according to some embodiments.
Fig. 11A and 11B illustrate top views of a reconstituted wafer including a central region and a peripheral region, according to some embodiments.
Fig. 12A, 12B, and 13-23 are top views of some reconstituted wafers according to some embodiments.
Figure 24 illustrates a process flow for forming a package according to some embodiments.
Detailed Description
The following disclosure provides many different embodiments, or examples, for implementing different functions of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to limit the invention. For example, in the description that follows, forming a first feature over or on a second feature may include embodiments in which the first and second features are in direct contact, as well as embodiments in which additional features may be formed between the first and second features such that the first and second features are not in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Further, spatial relationship terms such as "below …," "below …," "lower," "above …," "upper," and the like may be used herein to describe one element or component's relationship to another element or component as illustrated for ease of description. Spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial relationship descriptors used herein interpreted accordingly as such.
A package and method of forming the same are provided according to some embodiments. An intermediate stage of forming a package is shown according to some embodiments. Some variations of some embodiments are discussed. Like reference numerals are used to refer to like elements throughout the various views and illustrative embodiments. According to some embodiments of the present disclosure, dummy dies are placed in a peripheral region of the reconstituted wafer, and the dummy dies may surround the functional dies.
Fig. 1-9 illustrate cross-sectional views of intermediate stages in package formation, according to some embodiments of the present disclosure. The processes shown in fig. 1-9 are also reflected schematically in
Fig. 1 shows a
Fig. 1 also shows the placement of the package assembly 26 (including 26A and 26B) on the
According to some embodiments of the present disclosure, the
Fig. 2 shows the placement of dummy die 36 on
Next, referring to fig. 3,
In a subsequent step, as also shown in fig. 3, a planarization process, such as a Chemical Mechanical Polishing (CMP) process or a mechanical grinding process, is performed. The corresponding process is shown as
Fig. 4-7 illustrate the formation of a front side redistribution line (RDL) and corresponding dielectric layer. Referring to fig. 4, a
An RDL is formed to electrically connect to
Referring to fig. 6, an electroplating process is performed to form the
Referring to fig. 7, further dielectric layers and corresponding RDL layers are formed according to some embodiments of the present disclosure. The corresponding process is shown as
Fig. 8 illustrates the formation of an
According to other embodiments, the
In a subsequent process, the reconstituted
Fig. 9 illustrates the formation of a
According to some embodiments of the present disclosure, a plurality of package assemblies 62 (including, but not limited to, structures of packages, voltage regulator modules, power supply modules (two more specific package types), IPDs, IO connectors (such as sockets for IO of package 60), etc.) are bonded to the reconstituted
Fig. 10 illustrates the formation of a
Enclosures 60 (FIG. 9) and 72 (FIG. 10) may be High Performance Computing (HPC) enclosures, accelerators for Artificial Intelligence (AI) servers, other performance-demanding computing enclosures for data center applications, or enclosures for servers.
Details in the placement of
Fig. 11B shows the
According to some embodiments of the present disclosure, as shown in fig. 12A, 12B, and 13-23, dummy die 36 is primarily placed in a
It should be understood that the carrier 20 (fig. 8) may have the same (or similar) shape and size as the reconstituted
It should be understood that the reconstituted
In fig. 12A, 12B, and 13-23, die 26A represents a logic die, such as a compute die (e.g., for data computation) or other type of die, such as a passive die, photonics die, etc., and die 26B represents an IO die and may represent other type of die, such as a passive die, photonics die, etc. IO die 26B is used to reconstruct data inputs and outputs between
Fig. 12A illustrates a top view of a reconstituted
Fig. 12B illustrates a top view of a reconstituted
Fig. 13, 14 and 15 show a
In fig. 12A, 12B, and 13-15, logic/compute die 26A is arranged as an array and no IO die and dummy die are inserted into the array. Fig. 16-23 show dies arranged as a group (GD as shown in fig. 16). The group GD may have the same structure as each other. Each group GD may include a logic/compute die 26A and may or may not include other types of dies, such as IO die 26B, dummy die 36, passive device die, and/or the like. Alternatively, the setup may be considered that the
Referring to FIG. 16, each group GD includes a logic/compute die 26A, and does not include IO dies and dummy dies. In the embodiment shown in FIG. 17, each group GD includes a logic/compute die 26A, and no IO die. Fig. 18 and 19 show similar arrangements as in fig. 16 and 17, respectively, except that the reconstituted
FIG. 20 shows that each group GD includes a logic/compute die 26A and an
In the above embodiments, some processes and components are discussed in accordance with some embodiments of the present disclosure. Other components and processes may also be included. For example, test structures may be included to facilitate verification testing of 3D packages or 3D IC devices. For example, the test structures may include test pads formed in the redistribution layer or on the substrate that allow testing of 3D packages or 3D ICs, using probes and/or probe cards. Verification tests may be performed on the intermediate structure as well as the final structure. In addition, the disclosed structures and methods may be used in conjunction with testing methods that include intermediate verification of known good die to improve yield and reduce cost.
The disclosed embodiments of the invention have some advantageous features. By arranging dummy die in the reconstituted wafer, space that would otherwise be occupied by an encapsulant, such as a molding compound, is occupied by the dummy die. Since the CTE of the dummy die is closer to the CTE of the functional die than the encapsulant, the addition of the dummy die can reduce stress and warpage of the reconstituted wafer. Furthermore, the dummy die includes at least some portions in the peripheral area surrounding the functional die, and adding the dummy die in the peripheral area may improve yield in the packaging process, since the reconstituted wafer may have warpage, which causes edge portions of the reconstituted wafer to lose focus during photolithography. Occupying the edge portion of the reconstituted wafer with dummy dies not only reduces warpage, but also leaves some unused de-focused edge portion, thus improving yield.
According to some embodiments of the present disclosure, a method includes placing a plurality of functional dies on a carrier, placing a plurality of dummy dies on the carrier, encapsulating the plurality of functional dies and the plurality of dummy dies in an encapsulant, and forming and interconnecting redistribution lines on the plurality of functional dies; wherein the redistribution line, the plurality of functional dies, the plurality of dummy dies, and the encapsulant combine to form a reconstituted wafer, wherein the plurality of functional dies are located in a central region of the reconstituted wafer and the plurality of dummy dies are located in a peripheral region of the reconstituted wafer while the peripheral region surrounds the central region; debonding the reconstituted wafer from the carrier, and bonding the reconstituted wafer to a package assembly selected from the group consisting essentially of an interposer, a package substrate, a printed circuit board, a thermal module, and combinations thereof. In one embodiment, the plurality of dummy dies are substantially evenly distributed in the peripheral region. In one embodiment, the reconstituted wafer bonded to the package assembly has a circular top view shape. In one embodiment, the reconstituted wafer is unsawn prior to bonding to the package assembly. In one embodiment, the method further comprises securing the reconstituted wafer to the package assembly by bolts penetrating the reconstituted wafer. In one embodiment, the bolt passes through one of the plurality of dummy dies. In one embodiment, the packaging includes dispensing the encapsulant and planarizing the encapsulant, wherein dummy dies of the plurality of dummy dies are polished in the planarizing. In one embodiment, the plurality of dummy dies are thinner than the plurality of functional dies, and the packaging includes dispensing the encapsulant and planarizing the encapsulant, wherein after the planarizing, the encapsulant layer covers the plurality of dummy dies. In one embodiment, the plurality of functional die are placed in a plurality of groups, with an intra-group spacing between die in the same group being less than an inter-group spacing between adjacent ones of the plurality of groups. In one embodiment, the method further comprises placing an additional plurality of dummy dies between the plurality of groups. In one embodiment, the dies in one of the plurality of groups include a compute die and an input-output die. In one embodiment, the method further comprises placing a plurality of input-output dies around the plurality of functional dies.
According to some embodiments of the present disclosure, a method includes placing a plurality of logic dies on a carrier, placing a plurality of IO dies on the carrier, placing a plurality of dummy dies on the carrier, wherein the plurality of dummy dies are distributed around an area where the plurality of logic chips and the plurality of IO chips are located; encapsulating the plurality of logic dies, the plurality of IO dies, and the plurality of dummy dies in an encapsulant; forming redistribution lines on the plurality of logic dies and the plurality of IO dies and electrically coupled to form a reconstituted wafer comprising the plurality of logic dies, the plurality of IO dies, the plurality of dummy dies, the encapsulant, and the redistribution lines; and debonding the reconstituted wafer from the carrier. In one embodiment, the method further includes bonding the reconstituted wafer to a package assembly without sawing the reconstituted wafer. In one embodiment, the method further comprises inserting a dummy die between two of the plurality of logic dies prior to the packaging. In one embodiment, the plurality of logic dies are placed as part of a plurality of groups, with the intra-group spacing between dies in the same group being less than the inter-group spacing between adjacent ones of the plurality of groups. In one embodiment, the plurality of IO dies are placed as part of the plurality of groups.
According to some embodiments of the present disclosure, a package includes a reconstituted wafer including a plurality of dummy dies, a plurality of functional dies located in a central region of the package, wherein the plurality of dummy dies are allocated in alignment with a ring surrounding the plurality of functional dies; an encapsulant in which the plurality of dummy dies and the plurality of functional dies are encapsulated; and a plurality of RDLs on the plurality of functional dies, wherein the plurality of RDLs interconnect all of the functional dies in the package into an integrated system. In one embodiment, the package further comprises a package component bonded to the reconstituted wafer, wherein the package component is selected from the group consisting essentially of an interposer, a package substrate, a printed circuit board, a thermal module, and combinations thereof. In one embodiment, the reconstituted wafer bonded to the package assembly has a circular top view shape.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the described embodiments of the invention. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
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