阅读说明：本技术 电路板结构 (Circuit board structure ) 是由 王忠宝 于 2016-04-15 设计创作，主要内容包括：本发明涉及的电路板结构,由：线路及绝缘体组成；线路有侧边、上表面及下表面,下表面一部分实施为第二下表面,并令线路上表面供其他导体电连通用；绝缘体有上表面、下表面及预留盲孔,预留盲孔内有一物体,物体由绝缘体的一部分组成,线路设在绝缘体上表面,并至少令绝缘体与线路下表面接合,线路第二下表面是与绝缘体预留盲孔相对应设置并与位于预留盲孔内的物体接合,物体暂时设置在预留盲孔内,并等待被移除,且该物体必需是：在此电路板与组件接合时此电路板与组件电连通,且在塑料包封此电路板及组件后,才可被移除；线路第二下表面暂时接合于物体,线路第二下表面最终需与物体分离,线路第二下表面是供：裸露于大气中的导电填充物接合用。(The invention relates to a circuit board structure, comprising: a circuit and an insulator; the circuit is provided with a side edge, an upper surface and a lower surface, wherein one part of the lower surface is implemented as a second lower surface, and the upper surface of the circuit is used for other conductors to be electrically connected; the insulator has an upper surface, a lower surface and a reserved blind hole, an object is arranged in the reserved blind hole, the object is composed of a part of the insulator, the line is arranged on the upper surface of the insulator and at least enables the insulator to be jointed with the lower surface of the line, the second lower surface of the line is arranged corresponding to the reserved blind hole of the insulator and is jointed with the object in the reserved blind hole, the object is temporarily arranged in the reserved blind hole and waits to be removed, and the object is required to be: the circuit board is in electrical communication with the component when the circuit board is engaged with the component and is removable after plastic encapsulation of the circuit board and the component; the second lower surface of the wire is temporarily bonded to the object, the second lower surface of the wire is to be separated from the object, and the second lower surface of the wire is for: and the conductive filler exposed in the atmosphere is used for bonding.)

1. A circuit board structure for engaging a component and placing the component in electrical communication with the circuit board, the component being embodied as a chip or package, the circuit board comprising: a circuit and an insulator; it is characterized in that the preparation method is characterized in that,

the circuit is provided with a side edge, an upper surface and a lower surface, wherein one part of the lower surface is implemented as a second lower surface, and the upper surface of the circuit can be electrically connected with other conductors; and

the insulator is provided with an upper surface, a lower surface and a reserved blind hole, the reserved blind hole is provided with an object, the object is positioned in the reserved blind hole and consists of a part of the insulator, the line is arranged on the upper surface of the insulator and at least enables the insulator to be jointed with the lower surface of the line, the second lower surface of the line is arranged corresponding to the reserved blind hole of the insulator and is jointed with the object positioned in the reserved blind hole, the object is temporarily arranged in the reserved blind hole and waits to be removed, the second lower surface of the line is temporarily jointed with the object, the second lower surface of the line is finally required to be separated from the object, and the second lower surface of the line is used for: for joining electrically conductive fillers exposed to the atmosphere, the object to be placed in the pre-blind hole of the insulator must be: the circuit board and the component are joined and electrically connected, and a plastic material encapsulates the circuit board and the component before it is removed.

2. The circuit board structure of claim 1, wherein the reserved blind hole further comprises a reserved air vent, and the reserved air vent is disposed adjacent to the reserved blind hole.

3. The circuit board structure of claim 1, wherein the side edges of the traces engage the insulator such that the top surface of the traces is flush with or recessed from or raised above the top surface of the insulator.

4. The circuit board structure of claim 1, further comprising a carrier, wherein the carrier is bonded to the circuit board.

5. A circuit-board structure according to claim 4, characterized in that the carrier sheet is composed of conductors.

6. The circuit board structure of claim 4, wherein the circuit board further comprises a film disposed between the carrier and the lower surface of the insulator.

7. A circuit-board structure according to claim 6, characterized in that the film is an insulating or conductive film.

8. The circuit board structure of claim 1, wherein the circuit board further comprises a second insulator, a second conductive pad, a second circuit, and a second upper surface on the circuit board, and wherein:

the second insulator is provided with an upper surface, a lower surface and a blind hole, the lower surface of the second insulator is jointed with the upper surface of the insulator and covers the circuit, wherein the blind hole of the second insulator is arranged corresponding to the second upper surface of the circuit, so that the second upper surface of the circuit is exposed in the blind hole of the second insulator and is used for jointing the second circuit;

the second conductive disc is provided with a side edge, an opening, an upper surface and a lower surface, the second conductive disc is arranged on the upper surface of the second insulator, and the opening of the second conductive disc is arranged corresponding to the second upper surface of the circuit; and

the second circuit is arranged on the upper surface of the second conductive disc, and a part of the second circuit is accommodated in the second insulator blind hole and the second conductive disc opening and is jointed with the second upper surface of the circuit to be electrically communicated.

9. A circuit board structure for use in joining components and for providing electrical communication between the components and the circuit board, the components being implemented as chips or flip chips or packages, the circuit board comprising: circuit, insulator, second conducting disc and second circuit, characterized by:

the circuit is provided with a side edge, an upper surface and a lower surface, wherein the upper surface of the circuit is further provided with a second upper surface, a part of the lower surface of the circuit is implemented as the second lower surface of the circuit, and the upper surface of the circuit can be used for electrically connecting other conductors;

the insulator is provided with an upper surface, a lower surface and a reserved blind hole, wherein the reserved blind hole is provided with an object, the object is positioned in the reserved blind hole and consists of a part of the insulator, the line is positioned on the upper surface of the insulator and at least enables the insulator to be jointed with the lower surface of the line, and a second lower surface of the line is arranged corresponding to the reserved blind hole of the insulator and is jointed with the object positioned in the reserved blind hole, wherein the object is temporarily arranged in the reserved blind hole and waits to be removed, the second lower surface of the line is temporarily jointed with the object, and the second lower surface of the line is finally required to be separated from the object, and the second lower surface of the line is used for: for joining conductors exposed to the atmosphere;

the second insulator is provided with an upper surface, a lower surface and a blind hole, the lower surface of the second insulator is jointed with the upper surface of the insulator and covers the circuit, and the blind hole of the second insulator is arranged corresponding to the second upper surface of the circuit, so that the second upper surface of the circuit is exposed in the blind hole of the second insulator and is used for jointing the second circuit;

the second conductive disc is provided with a side edge, an opening, an upper surface and a lower surface, the second conductive disc is arranged on the upper surface of the second insulator, and the opening of the second conductive disc is arranged corresponding to the second upper surface of the circuit; and

the second circuit is arranged on the upper surface of the second conductive disc, and a part of the second circuit is accommodated in the second insulator blind hole and the second conductive disc opening and is jointed with the second upper surface of the circuit to be electrically communicated.

10. A circuit board structure according to claim 9, wherein the object to be placed in the pre-blind hole of the insulator is: the circuit board and the component are joined and electrically connected, and a plastic material encapsulates the circuit board and the component before it is removed.

11. The circuit board structure of claim 9, wherein the reserved blind hole further comprises a reserved air vent, and the reserved air vent is disposed adjacent to the reserved blind hole.

12. The circuit board structure of claim 9, further comprising a carrier, wherein the carrier is bonded to the circuit board.

13. A circuit board structure according to claim 12, characterized in that the carrier sheet is composed of conductors.

14. The circuit board structure of claim 12, wherein the circuit board further comprises a film disposed between the carrier and the lower surface of the insulator.

15. A circuit board structure according to claim 14, characterized in that the film is an insulating or conductive film.

16. The circuit board structure of claim 9, wherein the side edges of the traces engage the insulator such that the top surface of the traces can be flush with or recessed or raised above the top surface of the insulator.

Technical Field

A circuit board structure, especially a circuit board for electronic component connection.

Background

As shown in fig. 15A, 15B and 15C, the structure and manufacturing steps of a conventional circuit board 5A are shown, wherein fig. 15A is a top view of the circuit board 5A, fig. 15B is a cross-sectional view of a cutting line CC in fig. 15A, fig. 15C is a cross-sectional view of the circuit board 5A in fig. 15B after completion of manufacturing, and the circuit board 5A is provided with a first filler 95, first, as shown in fig. 15A to 15B, the circuit board 5A includes: an insulator 40, wherein the insulator 40 has an upper surface 41, a lower surface 42 and a blind hole (blinvia) 44, and the blind hole 44 penetrates the insulator 40; two wires 70, wherein the lower surface 72 of the wire 70 is joined to the upper surface 41 of the insulator 40, and the lower surface 72 has a second lower surface 722, at least a portion of the second lower surface 722 is exposed in the blind hole 44 of the insulator 40, and the second lower surface 722 can be implemented as a conductive pad 3A for electrically connecting other conductors; a second line 7A, the second line 7A being disposed on the upper surface 41 of the insulator 40 and being disposed between the lines 70; a solder mask (solder mask)80, the solder mask 80 being disposed on the upper surface 41 of the insulator 40 such that a portion of the upper surface 71 of the trace 70 is not covered by the solder mask 80; three protection layers 90, each protection layer 90 is bonded to the upper surface 71 and each second lower surface 722 of the circuit 70 exposed in the atmosphere (atmosphere), and the protection layers 90 are usually at least formed by stacking ni and au; by taking the structure of the circuit board 5A and the following four requirements as an example, to illustrate the limitations of the circuit board 5A, first, the four design requirements are as follows: 1) the pitch P of the two conductive pads 3A (the second lower surface 722 of the wiring 70) is 500 micrometers (μm); 2) the width K of the conductive disc 3A is 250 micrometers; 3) the second line 7A has a width W of 50 μm; 4) the distance (not shown) between the second line 7A and the line 70 is not less than (not less than) 50 μm; since the width K of the conductive plate 3A is 250 micrometers, the width D of the blind hole 40 is also 250 micrometers, and in order to prevent the circuit 70 from falling into the blind hole 44 of the insulator 40 and causing damage, the width L of the circuit 70, which is arranged corresponding to the blind hole 44, needs to be increased by at least 100 micrometers compared with the width D of the blind hole 44, so that the width L is 350 micrometers at the minimum, and the minimum distance S between the two circuits 70 is 150 micrometers, therefore, only a second circuit 7A can be arranged between the two circuits 70, making the circuit board 5A unfavorable for the requirement of high-density circuits, and meanwhile, when the protective layer 90 is joined to the circuit 70 by an electroplating process (not shown), the protective layer 90 is inevitably joined to the second lower surface 722 of the circuit 70, so that the cost of the circuit board 5A is increased; next, as shown in fig. 15C, a step of providing a first filler 95 (e.g., solder paste _ solderpaste) with tin particles to be accommodated in the blind hole 44 is provided, wherein the first filler 95 is viscous before being filled in the blind hole 44, and during the process of filling in the blind hole 44, the gas 97 is encapsulated in the blind hole 44, when the first filler 95 is heated and expanded in the process before the first filler 95 is cured by heating, and the first filler 95 is pressed out of the blind hole 44, so that a portion of the filler 95f is pressed out of the blind hole 44 and falls on the lower surface 42 of the insulator 40, and if the pressed filler 95f is not removed, after the two solder balls 96 are bonded to the circuit board 5A, the circuit board 5A electrically connects the two solder balls 96 because the pressed filler 95f is present between the two solder balls 96, and the circuit board 5A is damaged by an electrical short circuit; in addition, when the width D of the blind hole 44 is larger, the rigidity (reliability) of the insulator 40 is more likely to be insufficient, and the insulator 40 is more likely to be bent to cause damage by breaking the insulator 40, and particularly, when the number of the blind holes 44 is larger, the damage by breaking the insulator 40 is more likely to be caused; from the above, it is known that: the circuit board 5A has disadvantages that it is not easy to increase the density of the circuit, the cost is not easy to decrease, the insulator 40 is easy to break, and an electrical short circuit is caused.

Disclosure of Invention

The invention discloses a circuit board structure, and also discloses a procedure for converting a reserved blind hole of a circuit board insulator into a blind hole, and if the circuit board is provided with a conductive disc according to requirements, the circuit board is also disclosed with a conductive disc and a procedure for converting the reserved blind hole into the blind hole, when the circuit board is provided with the conductive disc, the circuit board can be arranged on the lower surface of the insulator by the conductive disc, so that the width of a circuit arranged on the upper surface of the insulator is reduced, the circuit density of the circuit board can be increased, and by arranging the reserved (reserved-inferior) blind hole, the second lower surface of the circuit is not exposed in the atmosphere when being provided with a protective layer, and the protective layer cannot be arranged, therefore, the cost of the circuit board can be reduced, and the reserved exhaust passage can be arranged on the periphery of the reserved blind hole, so that the reserved blind hole further comprises the reserved exhaust passage, make the blind hole include the exhaust passage more, make electrically conductive filler fill in the blind hole after, make the gas of being capsulated in the blind hole, in the in-process that the filler is heated the solidification, this gas can be discharged the blind hole by the exhaust passage, make some of filler extrude the quantity in the blind hole by gas and can effectively reduce, therefore can avoid the damage of electrical property short circuit, the structure of this circuit board is: the insulator is provided with a reserved blind hole; a circuit is arranged on the upper surface of the insulator, and a part of the circuit is arranged corresponding to the reserved blind hole; a conductive disc is arranged on the lower surface of the insulator, corresponds to the circuit and is positioned on the periphery of the reserved blind hole; in the manufacturing process of the packaging body (semiconductor package), before or after the circuit board is combined with the plastic, an opening process is provided, the reserved blind hole is converted into a blind hole, the blind hole penetrates through the insulator, part of the lower surface of the circuit is exposed in the blind hole, a hole filling method is provided after the circuit board is provided with the blind hole and is combined with the plastic, a conductive filler is accommodated in the blind hole of the insulator and is respectively connected with the circuit and the conductive disc through the filler, the circuit is electrically connected with the conductive disc, in addition, one or more exhaust passages can be arranged at the periphery of the blind hole and used for effectively exhausting gas or chemical solvent in the blind hole, and the damage of electrical short circuit can be avoided; when the circuit board does not have the conductive disc, the periphery of the blind hole of the insulator can be provided with an exhaust passage, and the defect of electric short circuit can be avoided; meanwhile, the insulator is provided with the reserved blind hole, so that the rigidity of the insulator can be improved, and the damage that the insulator is easy to break can be avoided; in addition, when the ratio of the thickness of the insulator to the width of the reserved blind hole is a value in a proper range, the damage of the electrical short circuit can be avoided.

Drawings

Fig. 1-1 to 1-3 are top views and cross-sectional views of the circuit board of the present invention with reserved blind holes or blind holes.

FIGS. 2-1 to 2-3B are sectional views and bottom views of the circuit board with reserved exhaust passages or exhaust passages according to the present invention.

Fig. 3 is a cross-sectional view of a circuit board with components of the present invention.

Fig. 4-1-5 are cross-sectional views of circuit boards of the present invention without conductive pads.

FIGS. 6A-1-6C-2 are bottom and cross-sectional views of a circuit board with vents and doorways in accordance with the present invention.

FIGS. 7A-1 to 7B-3 are three views of a circuit board with a default shape of a blind via according to the present invention.

FIGS. 8A-1 to 8B-2 are top and cross-sectional views of a circuit board having a second insulator according to the present invention.

Fig. 9-10 are cross-sectional views of a circuit board circuit having a second side edge according to the present invention.

Fig. 11-14C are cross-sectional views of steps in the fabrication of circuit board circuitry in electrical communication with conductive filler in accordance with the present invention.

Fig. 15A to 15C are top views and cross-sectional views of a conventional circuit board according to the present invention.

Description of reference numerals:

10. a conductive member; 20. An assembly; 21. 31, 41, 71 upper surface;

22. 32, 42, 72 lower surface; 23. 33, 73 sides;

30. 3A, 3B conductive pads; 34. 84, opening holes; 35. A side wall;

36. reserving an opening; 37. A trench wall; 38. A trench; 79. A projection;

40. a 40k, 40m insulator; 44. Blind holes; 46. Reserving a blind hole;

47. a gate opening; 48. Reserving an exhaust passage; 49. An exhaust passage;

4B, a second insulator; 50. 51, 52, 5A circuit boards;

60. plastic; 70. 7A, 7B lines; 722. A second lower surface;

712. a second upper surface; 732. A second side edge; 80. A solder mask layer;

85. 88 a carrier sheet; 86. A film; 90. A protective layer;

95. 9B, 95f filler; 96. Tin balls; 97. A gas;

99. metal particles; 100. A package body; BB and CC cutting lines;

da. D, D1, L width; l1, W, K width; h. A length;

p, spacing; s, distance; t, thickness.

Detailed Description

In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1-3, there are shown steps for electrically connecting a circuit board 50 and lines and conductive pads, wherein fig. 1-1 is a top view of the circuit board 50, fig. 1-2A is a cross-sectional view of a cut line CC of fig. 1-1, fig. 1-2B is another cross-sectional view of the cut line CC of fig. 1-1, fig. 1-3 is a cross-sectional view of the circuit board 50 having a blind via 44, and first, referring to fig. 1-1, fig. 1-2A and fig. 1-2B, the circuit board 50 comprises: two lines 70, the lines 70 being implemented as copper or other suitable conductors and having sides 73, an upper surface 71 and a lower surface 72, wherein a portion of the lower surface 72 is implemented as a second lower surface 722, and at least a portion of the upper surface 71 of the lines 70 is electrically connected to other conductors (such as tin or conductive wires (wires), conductive bumps (bumps), conductive layers (layers), or lines or other suitable conductors); an insulator 40, the insulator 40 having an upper surface 41, a lower surface 42 and a reserved blind hole 46 (dashed line), wherein the reserved blind hole 46 has an object 40k, the object 40k is located in the reserved blind hole 46, and the object 40k may be formed by a part of the insulator 40 or by other applicable objects, and the reserved blind hole 46 is in a predetermined shape, such as: a circular, rectangular, square or other suitable shape, wherein the wire 70 is disposed on the upper surface 41 of the insulator 40, and the lower surface 72 of the wire 70 is bonded to the insulator 40, wherein the second lower surface 722 of the wire 70 is disposed corresponding to the reserved blind hole 46 of the insulator 40 and is bonded to the object 40k, such that the second lower surface 722 of the wire 70 is not exposed to the atmosphere, wherein the object 40k is temporarily disposed in the reserved blind hole 46 of the insulator 40 and waits to be removed, and the second lower surface 722 of the wire 70 is also temporarily bonded to the object 40k, and the object 40k is finally (if necessary) removed, so as to convert the reserved blind hole 46 into a blind hole (44_ see fig. 1-3), and the blind hole 44 penetrates through the insulator 40, such that the second lower surface 722 of the wire 70 is exposed to the blind hole 44, and the second lower surface 722 of the wire 70 serves as: for bonding conductive fillers (95, 9B described with reference to fig. 14A-14C) exposed to the atmosphere; two second lines 7A, the two second lines 7A are arranged on the upper surface 41 of the insulator 40 and between the two lines 70; a solder mask layer 80, the solder mask layer 80 is disposed on the upper surface 41 of the insulator 40 and covers the circuit 70, wherein at least a portion of the upper surface 71 of the circuit 70 is not covered by the solder mask layer 80, so that the circuit 70 can be electrically connected to other applicable conductors, and the solder mask layer 80 is not implemented as required; two conductive pads 30, the conductive pads 30 are made of copper or other suitable conductors, the two conductive pads 30 are disposed on the lower surface 42 of the insulator 40, and at least a portion of the conductive pads 30 is disposed corresponding to the lower surface 72 of the circuit 70 and has a side 33, an upper surface 31 and a lower surface 32, wherein the conductive pads 30 of fig. 1-2A have openings 34, the openings 34 penetrate the conductive pads 30, at least a portion of the openings 34 is disposed corresponding to the second lower surface 722 of the circuit 70, and the object disposed in the openings 34 is composed of a portion of the insulator 40, and a portion of the reserved blind holes 46 can protrude from the side 33 of the conductive pads 30, so that the conductive pads 30 are composed of a plurality of conductors (see fig. 6C-1 and the description), and the reserved blind holes 46 can be disposed among the plurality of conductors as required, and the conductive pads 30 of fig. 1-2B have reserved openings 36 (dotted lines), the object in the reserved opening 36 is composed of a part of the conductive disc 30, and the circuit board 50 of the present invention can be used by selecting the structure of the conductive disc 30 shown in fig. 1-2A or fig. 1-2B as required, the lower surface 32 and the side edge 33 of the conductive disc 30 are both connected with the insulator 40, so that the upper surface 31 of the conductive disc 30 is exposed out of the lower surface 42 of the insulator 40, and the upper surface 31 of the conductive disc 30 can be flush with or recessed or protruded out of the lower surface 42 of the insulator 40 as required; a protective layer 90 (see fig. 1-1), the protective layer 90 being disposed only on the portion of the upper surface 71 of the circuit 70 exposed to the atmosphere; as shown in fig. 1-3, after the processes of fig. 1-2A and 1-2B are completed, a mechanical or laser or chemical or other suitable hole-opening method (not shown) is provided, the objects 40k in the reserved blind hole 46 and the object in the hole 34 of the conductive plate 30 shown in fig. 1-2A and the objects 40k in the reserved blind hole 46 and the objects in the reserved hole 36 of the conductive plate 30 shown in fig. 1-2B are all removed, the reserved blind hole 46 and the reserved hole 36 of the conductive plate 30 shown in fig. 1-2A and 1-2B are respectively converted into a blind hole 44 and a hole 34 of the conductive plate 30, no object is left in each blind hole 44 and the hole 34 of the conductive plate 30, the blind hole 44 is disposed corresponding to the hole 34 of the conductive plate 30, the blind hole 44 is a part of the insulator 40, and the blind hole 44 penetrates through the insulator 40, meanwhile, the blind hole 44 is disposed corresponding to the second lower surface 722 of the circuit 70, so that the second lower surface 722 of the circuit 70 is disposed in the blind hole 44, the second lower surface 722 of the circuit 70 is exposed to the atmosphere, and the second lower surface 722 of the circuit 70 is provided for: for engaging with conductive fillers (95, 9B described with reference to fig. 14A-14C) exposed to the atmosphere, the blind hole 44 penetrates through the insulator 40 and is disposed corresponding to the second lower surface 722 of the line 70, such that the second lower surface 722 of the line 70 is disposed in the blind hole 44 and the second lower surface 722 of the line 70 is exposed to the atmosphere, and the blind hole 44 has a predetermined shape, such as: a circular, rectangular, square or other suitable shape, the area of the blind hole 44 may be the same as the area of the second lower surface 722 of the circuit 70 as required, and meanwhile, the opening 34 of the conductive plate 30 in fig. 1-2A may be formed by removing the object in the opening 34 of the conductive plate 30 by an opening method before the process of converting the reserved blind hole 46 into the blind hole 44, and the reserved opening 36 of the conductive plate 30 in fig. 1-2B may be formed by removing the object in the reserved opening 36 by an opening method before the process of converting the reserved blind hole 46 into the blind hole 44, so that the reserved opening 36 is converted into the opening 34; based on the above description and the four design requirements of the circuit board 5A shown in fig. 15A to 15C, the circuit board 50 is further improved and practical than the circuit board 5A as follows: (1) increase the number of second lines 7A: when the width K of the conductive pad 30 and the conductive pad 3A of the circuit board 5A are 250 micrometers, the width Da of the reserved blind hole 46 of the insulating body 40 shown in fig. 1-2A is smaller than the width K of the conductive pad 30 because the conductive pad 30 of the circuit board 50 is disposed on the lower surface 42 of the insulating body 40, usually the width Da of the reserved blind hole 46 is between 65 and 200 micrometers, meanwhile, in order to prevent the line 70 from falling into the blind via 44 (see fig. 1-3), the width L of the two lines 70 corresponding to the reserved blind via 46 is usually increased by 100 microns compared with the width Da of the reserved blind via 46, so that the width L of the line 70 is between 165 and 300 microns, for example, the width L of the line 70 is 250 microns, the minimum distance S between the two lines 70 is 250 micrometers, so that two second lines 7A (50+50+50+50+ 250 micrometers) can be accommodated between the two lines 70, and the circuit board 50 can be provided with one more second line 7A than the circuit board 5A; (2) reducing the cost of the overcoat layer 90: since the second lower surface 722 of the circuit 70 is not exposed to the atmosphere when the protective layer 90 is disposed, the protective layer 90 cannot be bonded to the second lower surface 722 of the circuit 70, thereby reducing the amount and cost of the protective layer 90; (3) increase the bonding strength of the conductive filler to the conductive pad 30: the first filler 95 filled in the blind hole 44 of the insulator 40 can be bonded to the second lower surface 722 of the circuit 70 and the upper surface 31 of the conductive pad 30, and can increase the bonding area and strength with the conductive pad 30 by the sidewall 35 (see fig. 1-3) of the opening 34 of the conductive pad 30, thereby improving the quality of the circuit board 50; as shown in fig. 1-2A, when the thickness T of the insulator 40 is less than 100 μm, the reserved blind holes 46 are not converted into blind holes 44, so that the insulator 40 is still a complete insulator 40, thereby improving the rigidity of the insulator 40, and avoiding the damage of the insulator 40 caused by bending and breaking easily, and meanwhile, even if the number of the blind holes is increased, the damage of the insulator 40 caused by breaking can be avoided; generally, if the thickness T of the insulator 40 is less than 100 micrometers and the width D (see fig. 1-3) of the blind hole 44 is 200 micrometers, that is, if the ratio of the thickness T of the insulator 40 to the width Da (see fig. 1-2A) of the reserved blind hole 46 is not greater than 0.5 (T/Da) ≦ 0.5), the insulator 40 is prone to break due to insufficient rigidity, wherein increasing the thickness T of the insulator 40 or having the reserved blind hole 46 in the insulator 40 can increase the rigidity of the insulator 40 to reduce or avoid the above-mentioned problems, but increasing the thickness T of the insulator 40 requires more materials to increase the manufacturing cost, and is also not favorable for the development trend of the electronic industry today, and when the insulator 40 has the reserved blind hole 46, the rigidity of the insulator 40 can be increased without changing the thickness T, so that not only the use of the materials can be avoided to further reduce or prevent the damage caused by the break of the insulator 40, accordingly, in the condition that the insulator 40 has the reserved blind hole 46, as long as the ratio of the thickness T of the insulator 40 to the width Da of the reserved blind hole 46 is not more than 0.5(T/Da is less than or equal to 0.5 or less than 0.4 or between 0.30 and 0.01), the damage caused by the breakage of the insulator 40 can be reduced or avoided, wherein if the reserved blind hole 46 has more than one width Da with different sizes (dimensions), the width Da of the reserved blind hole 46 is implemented as the maximum; as shown in fig. 1-3, when the insulator 40 has the blind hole 44, and the width D of the blind hole 44 is the same as or approximately the same as the width Da of the reserved blind hole 46, the ratio of the thickness T of the insulator 40 to the width D of the blind hole 44 may also be not greater than 0.5(T/D is less than or equal to 0.5), so that the circuit board 50 is more practical; in addition, the upper surface or the lower surface of the circuit board of the present invention, such as: the surface of the insulator 40 exposed to the atmosphere can be combined with the carrier sheet (85, 88-as shown in fig. 14A) as required, or the circuit board is not provided with the conductive pad 30 (see fig. 4-1-5), so that the circuit board has more practicability.

Referring to fig. 2-1, which is a cross-sectional view of a circuit board 51, the structure and symbols of the circuit board 51 are the same as those of the circuit board 50 shown in fig. 1-2A, and the same points refer to the description of fig. 1-2A, except that: the circuit board 51 has a reserved air vent 48, the reserved air vent 48 is disposed around the reserved blind hole 46 of the insulator 40 and is disposed adjacent to the reserved blind hole 46, accordingly, the reserved blind hole 46 further includes the reserved air vent 48, and the object 40m in the reserved air vent 48 is implemented as a part of the insulator 40, and the object 40m is also bonded to the second lower surface 722 of the line 70, so that the reserved air vent 48 does not penetrate through the insulator 40.

As shown in fig. 2-2, 2-3A and 2-3B, fig. 2-3A and 2-3B are bottom views of the circuit board 50 shown in fig. 2-2, respectively, wherein fig. 2-2 is a cross-sectional view cut along the cutting line CC shown in fig. 2-3A or fig. 2-3B, and the following description is provided: firstly, as shown in fig. 2-2, after the circuit board 51 shown in fig. 2-1 is completed, a hole opening method (not shown) is provided, by which the object 40k in the reserved blind hole 46 and the object 40m in the reserved exhaust passage 48 are removed, so that the reserved blind hole 46 is converted into a blind hole 44, and the reserved exhaust passage 48 is converted into an exhaust passage 49, so that the blind hole 44 and the exhaust passage 49 both penetrate through the insulator 40, thereby, the insulator 40 of the circuit board 50 is further provided with an exhaust passage 49 and a gate 47, the gate 47 is between the blind hole 44 and the exhaust passage 49, so that the blind hole 44 and the exhaust passage 49 are communicated with each other, wherein the shape (shape) of the blind hole 44 and the exhaust passage 49 is the same as the shape of the reserved blind hole 46 (see fig. 2-1, 2-2 or 2-3A), the blind hole 44 further includes the exhaust passage 49 and the gate 47, in addition, referring to the cross-sectional views of the cutting line CC in fig. 6A-1 to 6C-2, a portion of the insulator 40 may be located between the circuit 70 and the exhaust duct 49 as required; as shown in fig. 2-3A, one or more air vents 49 may be formed around the blind hole 44, and at least a portion of the air vents 49 is disposed corresponding to the openings 34 of the conductive plate 30, and the gate 47 not only allows the gas or chemical solvent in the blind hole 44 to flow into the air vents 49, but also changes the width of the gate 47 to limit the conductive filler that can flow into the air vents 49, so as to improve the quality of the circuit board 50, especially when the conductive filler is a tin paste or other metal containing tin particles, the efficacy of the gate 47 can be better exhibited, for example: when the diameter of the tin particles in the tin paste is 75 microns and the width of the gate 47 is designed to be less than 70 microns or less, the gate 47 can limit the tin particles of 75 microns in the blind hole 44, and only the gas (97_ as shown in fig. 15C) or chemical solvent flows to the exhaust passage 49, so that after the circuit board 50 is heated, the gas or chemical solvent enclosed in the blind hole 44 of the insulator 40 can directly and rapidly exhaust to the atmosphere through the gate 47, the exhaust passage 49 of the insulator 40 and through the lower surface 42 of the insulator 40, therefore, the gas enclosed in the blind hole 44 can be effectively reduced, the amount of the tin particles extruded out of the blind hole 44 by the expanded gas can be effectively reduced, and the damage of short circuit caused by the tin metal falling off the surface of the circuit board 50 can be avoided, because the gas volume can be obviously increased due to heating during the heating process, and if the gas stays in the blind hole 44 of the insulator 40 for a longer time, the larger the volume of the gas, the greater the pressure in the blind hole 44 of the insulator 40, and thus the more easily the tin particles in the tin paste are extruded from the blind hole 44 of the insulator 40 and scattered on the surface of the circuit board 50, thereby causing damage to the circuit board due to electrical short circuit; also shown in the bottom view of fig. 2-3B, which differs from the bottom view of fig. 2-3A in that: a conductive plate 30, wherein the conductive plate 30 further includes a groove 38 and a groove wall 37, the groove 38 penetrates the conductive plate 30 to make the conductive plate 30 non-closed, and a portion of the insulator 40 is accommodated in the groove 38 and is connected to the groove wall 37, and an object accommodated in the groove 38 is composed of a portion of the insulator 40, and meanwhile, if an exhaust passage 49 is required, the size of the exhaust passage 49 can be designed according to requirements, and then the object accommodated in the groove 38 is completely or partially removed, so that the exhaust passage 49 is more flexible in use, and meanwhile, as shown in fig. 2-3A and fig. 2-3B, the opening 34 of the conductive plate 30 may be a predetermined shape, such as: a circular, rectangular, square or other suitable shape, as shown in fig. 2-3B, wherein the conductive plate 30 is made of a conductor and is non-closed, a portion of the vent 49 may protrude beyond the side 33 of the conductive plate 30 as required, thereby increasing the volume of the vent 49 for effectively exhausting the gas or chemical solvent in the blind hole to prevent the circuit board 50 from being damaged due to electrical short circuit.

As shown in fig. 3, which is a cross-sectional view of the circuit board 50, the circuit board 50 includes: a line 70, wherein the line 70 has a side 73, an upper surface 71 and a lower surface 72, wherein a portion of the lower surface 72 is implemented as a second lower surface 722, and at least a portion of the upper surface 71 of the line 70 is electrically connectable to other suitable conductors; an insulator 40, the insulator 40 having an upper surface 41, a lower surface 42 and a reserved blind hole 46, the reserved blind hole 46 being composed of a portion of the insulator 40, the line 70 being disposed on the upper surface 41 of the insulator 40, and at least a portion of the side 73 of the line 70 and the lower surface 72 being joined to the insulator 40, and the upper surface 71 of the line 70 being exposed from the upper surface 41 of the insulator 40, and the second lower surface 722 of the line 70 being disposed corresponding to the reserved blind hole 46 of the insulator 40 and joined to the insulator 40, whereby the second lower surface 722 of the line 70 is not exposed to the atmosphere, and the reserved blind hole 46 of the insulator 40 being convertible into a blind hole by a hole opening method (44_ as shown in fig. 1-3), so that the second lower surface 722 of the line 70 is exposed from the blind hole 44, and the reserved blind hole 46 further having a reserved exhaust passage (48_ as shown in; a conductive pad 30, the conductive pad 30 is disposed on the lower surface 42 of the insulator 40, and at least a portion of the conductive pad 30 is disposed corresponding to the lower surface 72 of the circuit 70, and has a side 33, an upper surface 31, a lower surface 32 and an opening 34, wherein the lower surface 32 is joined to the insulator 40, and the opening 34 of the conductive pad 30 can be replaced with a reserved opening as required (36_ see 1-2B); an electronic component (hereinafter referred to as a component) 20, wherein the component 20 can be implemented as a chip or a flip chip or a package (see fig. 11) or a module (module) or other suitable electronic components, and has an upper surface 21, a lower surface 22 and a side 23, and at least the upper surface 21 has a conductive terminal (terminal/pad _ not shown) capable of electrically connecting to the outside, and the component 20 can be electrically connected to a circuit board 50 through a conductive member (10_ as shown in fig. 12B), the component 20 is disposed on an upper surface 41 of an insulator 40, wherein at least a portion of the side 23 and the lower surface 22 are bonded to the insulator 40, and accordingly, the upper surface 21 of the component 20 can be flush with or recessed or protruded from the upper surface 41 of the insulator 40 as required; in addition, at least a portion of the side 73 of the trace 70 may be bonded to the insulator 40, such that the upper surface 71 of the trace 70 may be flush with or recessed from or protrude above the upper surface 41 of the insulator 40; or at least a part of the side edge 33 of the conductive disc 30 is jointed with the insulator 40, so that the upper surface 31 of the conductive disc 30 can be flush with or concave or convex on the lower surface 42 of the insulator 40, and a reserved exhaust passage 48 can be arranged on the periphery of a reserved blind hole 46 of the insulator 40, or the reserved blind hole 46 is replaced by a blind hole 44, or the reserved exhaust passage 48 is replaced by an exhaust passage 49; in the embodiment shown in fig. 3, at least a portion of the side 23 and the lower surface 22 of the component 20 are bonded to the insulator 40 and disposed on the upper surface 41 of the insulator 40 when the circuit board 50 is manufactured, wherein, according to the requirement, only the side 23 of the component 20 is bonded to the insulator 40 and the lower surface 22 is not bonded to the insulator 40, so that the lower surface 22 of the component 20 is exposed from the lower surface 42 of the insulator 40 to improve the heat dissipation effect of the component 20.

Fig. 4-1-4-2 are cross-sectional views of circuit boards 50, 51, the circuit boards 50, 51 are pre-configured with the function of the vent 49 to avoid the damage of the electrical short circuit caused by the conventional circuit board 5A structure shown in fig. 15C, wherein the circuit board 50 of fig. 4-1 includes: a line 70, the line 70 having a side 73, an upper surface 71 and a lower surface 72, wherein a portion of the lower surface 72 is implemented as a second lower surface 722, and at least a portion of the upper surface 71 of the line 70 is electrically connectable to an applicable conductor; an insulator 40, wherein the insulator 40 has an upper surface 41, a lower surface 42 and a reserved blind hole 46, the reserved blind hole 46 comprises a reserved vent 48, the reserved blind hole 46 and the reserved vent 48 are respectively composed of a part of the insulator 40, a line 70 is arranged on the upper surface 41 of the insulator 40, the insulator 40 is jointed with the lower surface 72 of the line 70, a second lower surface 722 of the line 70 is arranged corresponding to the reserved blind hole 46 of the insulator 40 and is jointed with the insulator 40, accordingly, the second lower surface 722 of the line 70 is not exposed in the atmosphere, and the reserved vent 48 is arranged adjacent to the reserved blind hole 46; the circuit board 50 may also have a carrier (85_ dashed) disposed on the lower surface 42 of the insulator 40, for increasing the rigidity of the circuit board 50, the carrier 85 may further have an opening 84 as required, the opening 84 penetrates the carrier 85, such that a portion of the insulator 40 is exposed in the opening 84, the width (not numbered) of the openings 84 may be greater than 5 microns or less than 10,000 microns, wherein, the opening 84 of the carrier 85 can be disposed corresponding to the reserved blind hole 46, or the opening 84 of the carrier 85 is not disposed corresponding to the reserved blind hole 46, and the carrier 85 can be disposed, at any suitable time (or step), or before providing the conductive filler (see fig. 4-2 or fig. 14B-14C), or not, and the carrier sheet 85 may be free of the opening 84 as desired; as shown in fig. 4-2, after the circuit board 51 finishes the circuit board 50 of fig. 4-1, a hole opening method (not shown) is provided, the object (40k) in the reserved blind hole 46 and the object (40m) in the reserved exhaust passage 48 are removed, the reserved blind hole 46 and the reserved exhaust passage 48 are respectively converted into a blind hole 44 and an exhaust passage 49, the blind hole 44 of the insulator 40 further comprises an exhaust passage 49 and a door opening (47_ shown in fig. 2-3A), the blind hole 44 penetrates through the insulator 40, the second lower surface 722 of the circuit 70 is exposed in the blind hole 44 and the exhaust passage 49 and exposed in the atmosphere, the carrier sheet 85 is removed, then, a first filler 95 is provided, the first filler 95 is bonded to the second lower surface 722 of the circuit 70, at least a part of the first filler 95 is accommodated in the blind hole 44 of the insulator 40 and bonded to the second lower surface 722 of the circuit 70, the first filler 95 is engaged with the circuit 70 of the circuit board 51 for electrical connection, wherein the first filler 95 is accommodated in the blind hole 44 and engaged with the second lower surface 722 of the circuit 70 by an appropriate machine (e.g. wire bonder), the first filler 95 can reduce the distance (not numbered) between the second lower surface 722 of the circuit 70 and the lower surface 42 of the insulator 40, so that the second lower surface 722 can be more easily engaged with the outside (tin, nickel, conductive wire, conductive bump, circuit or other appropriate conductor) in the blind hole 44 for electrical connection, thereby avoiding the damage of the electrical open circuit of the circuit board 51, the first filler 95 is implemented as a conductive bump (e.g. cu bump coppbump; mp bump gold bump), alloy bump or its appropriate conductor bump), and the upper surface (not numbered) of the first filler 95 can be further stacked with one or more conductive bumps (not shown) as required, the distance between the second lower surface 722 of the trace 70 and the lower surface 42 of the insulator 40 is adjusted to make the circuit board of the present invention more practical, and the first filler 95 can be implemented as a conductive filler as shown in fig. 14C (see fig. 14C); in the embodiment shown in fig. 4-2, after the reserved blind holes 46 and the reserved exhaust passages 48 are converted into the blind holes 44 and the exhaust passages 49, and before the first filler 95 is provided, the carrier sheet 85 is removed from the insulator 40, but the carrier sheet 85 shown in fig. 4-2 may also be removed from the insulator 40 after the components and the plastic (20, 60 — see fig. 14A-14C and description) are disposed on one surface of the circuit board 50 (e.g., the upper surface 41 of the insulator 40) and before the first filler 95 is provided, and the circuit 70 may include (or not include) a second side 732 depending on the requirement, the second side 732 is disposed between the lower surface 72 and the second lower surface 722, and the second lower surface 722 is recessed in the lower surface 72 of the circuit 70, so that the area of the circuit 70 exposed in the blind holes 44 can be increased by disposing the second side 732, the bonding strength between the first filler (95) contained in the blind hole 44 and the circuit 70 is increased, and the quality of the circuit board 51 is improved; as shown in FIG. 4-1, the circuit board 50 may be provided with no venting holes 48 as required, so that the blind holes 44 of the circuit board 51 shown in FIG. 4-2 do not include venting holes (49).

Referring to fig. 5, which is a cross-sectional view of a circuit board 51, the characteristics and symbols of the circuit board 51 are the same as those of the circuit board 50 shown in fig. 4-1, and the same points are described with reference to fig. 4-1, except that at least a portion of the side 73 of the circuit 70 is joined to the insulator 40, so that the upper surface 71 of the circuit 70 can be flush with or recessed or protruded from the upper surface 41 of the insulator 40, and accordingly, the entire thickness of the circuit board 51 can be made thinner and more practical, wherein the circuit board 51 does not have the reserved vent 48 as required, and the circuit board 51 is provided with a carrier sheet (85_ see fig. 4-1), the carrier sheet 85 is disposed on one surface of the circuit board 51 (e.g., the lower surface 42 of the insulator 40), and the carrier sheet (85) has openings (84), so that a portion of the lower surface 42 of the insulator 40 is exposed in the openings of the additional circuit board (85), and the openings of the carrier sheet 85 and the reserved blind holes 46 are correspondingly arranged, so that a step of electrically connecting the circuit 70 and the conductive filler can be provided according to requirements, and the steps are as follows: first, providing a component and plastic (20, 60 — see fig. 12B), where the component 20 and the plastic 60 are disposed on the same surface of the circuit board 51, where the component 20 is disposed on the surface of the circuit board 51, and the component 20 is electrically connected to the circuit board 51 (see fig. 12B for description), and then the plastic 60 covers at least a portion of the component 20; then, a hole-opening method (not shown) is provided, in which the reserved blind hole 46 is converted into a blind hole 44 by the hole-opening method, and at least a portion of the second lower surface 722 of the circuit 70 is exposed in the blind hole 44; then, a peeling method (not shown) is provided to remove the carrier sheet (85) from the circuit board 51; a conductive filler is then provided, at least a portion of which is received within blind hole 44 and engages second lower surface 722 of trace 70 to place the filler in electrical communication with trace 70.

As shown in fig. 6A-1 to 6C-2, fig. 6A-1, 6B-1 and 6C-1 are bottom views of three circuit boards 50, 51 and 52, and fig. 6A-2, 6B-2 and 6C-2 are cross-sectional views of the cutting lines BB and CC in fig. 6A-1, 6B-1 and 6C-1, respectively, the circuit boards 50, 51 and 52 include: a line 70, the line 70 having a side 73, an upper surface 71 and a lower surface 72, and a portion of the lower surface 72 being implemented as a second lower surface 722, and at least a portion of the upper surface 71 of the line 70 being electrically connectable to an appropriate conductor; an insulator 40, the insulator 40 having an upper surface 41, a lower surface 42 and a blind hole 44, the circuit 70 being disposed on the upper surface 41 of the insulator 40, wherein at least a portion of a side 73 of the circuit 70 of the circuit board 52 shown in fig. 6C-2 and the lower surface 72 thereof are joined to the insulator 40, so that the upper surface 71 of the circuit 70 is recessed in the upper surface 41 of the insulator 40, and the lower surface 72 of the circuit 70 of the circuit boards 50, 51 shown in fig. 6A-2 and 6B-2 is joined to the insulator 40, and at the same time, as shown in the cross-sectional views of the circuit boards 50, 51, 52 BB shown in fig. 6A-2, 6B-2 and 6C-2, only a portion of the second lower surface 722 of the circuit 70 is exposed in the blind hole 44, or as shown in the cross-sectional views of the cut lines CC shown in fig. 6A-2, 6B-2 and 6C-2, a portion of the insulator 40 is located between the bottom (not numbered) of, so that another portion of the second lower surface 722 of the circuit 70 is not exposed in the blind hole 44; a conductive plate 30, wherein the conductive plate 30 has a side 33, an upper surface 31, a lower surface 32 and an opening 34, and is disposed on the lower surface 42 of the insulator 40, and at least a portion of the upper surface 31 of the conductive plate 30 is electrically connected to an applicable conductor, wherein at least a portion of the side 33 and the lower surface 32 of the conductive plate 30 in fig. 6A-2 are joined to the insulator 40, such that the upper surface 31 of the conductive plate 30 is recessed in the lower surface 42 of the insulator 40, and a portion of the lower surface 32 and the side 33 of the conductive plate 30 in fig. 6B-2 are joined to the insulator 40, such that the upper surface 31 of the conductive plate 30 is protruded from the lower surface 42 of the insulator 40, and the lower surface 32 of the conductive plate 30 in fig. 6C-2 is joined to the insulator 40; as can be seen from the above description, when the circuit 70 or the conductive pad 30 is disposed on a surface of the insulator 40, at least a portion of the side 73 of the circuit 70, or at least a portion of the side 33 of the conductive pad 30, or both the circuit 70 and at least a portion of the sides 73, 33 of the conductive pad 30 are joined to the insulator 40, so that the upper surface 71 of the circuit 70 or the upper surface 31 of the conductive pad 30 is flush with or recessed from or protruded from the surface of the insulator 40; as shown in fig. 6C-1, a portion of the blind hole 44 may protrude from the side 33 of the conductive plate 30, the conductive plate 30 may be composed of a plurality of (more than one) conductors, and the blind hole 44 may be located between the plurality of conductors as required, wherein, since a portion of the blind hole 44 protrudes from the side 33 of the conductive plate 30, the blind hole 44 is not limited to be within the conductive plate 30 (see fig. 6A-1 or fig. 6B-1), so that the blind hole 44 may be more flexibly used and more practical, and if the blind hole 44 is provided with the exhaust passage (49), the volume of the exhaust passage (49) may be increased for more effectively exhausting the gas or chemical solvent in the exhaust passage (49) to avoid the circuit board 50 from being damaged due to the electrical short circuit, and the conductive plate 30 is in a predetermined shape, and, if required, an exhaust passage (not shown) may be further provided in a region outside the side 33 of the conductive plate 30, the exhaust passage is communicated with the blind hole 44, and the blind hole 44 further comprises the exhaust passage, so that the circuit board has more practicability; alternatively, as shown in fig. 6A-1, the width (not labeled) of the opening 34 of the conductive plate 30 may be larger than the width of the blind hole 44, so that a portion of the insulation 40 is disposed in the opening 34 of the conductive plate 30, or a portion of the insulation 40 is not accommodated in the opening 34 of the conductive plate 30, if necessary; alternatively, as shown in FIGS. 6A-1 to 6C-1, the circuit boards 50, 51, 52 may be provided with an exhaust passage (49) and a gate (47) around the blind hole 44 to prevent the circuit boards from being damaged by electrical short circuit.

As shown in fig. 7A-1 to 7B-3, fig. 7A-1 and 7B-1 are top views of circuit boards 50 and 51, fig. 7A-2 and 7B-2 are cross-sectional views of a cutting line CC shown in fig. 7A-1 and 7B-1, fig. 7A-3 and 7B-3 are bottom views of the circuit boards 50 and 51, and the circuit boards 50 and 51 at least include: line 70, wireThe circuit 70 has a side 73, an upper surface 71 and a lower surface 72, and a portion of the lower surface 72 is implemented as a second lower surface 722, and at least a portion of the upper surface 71 of the circuit 70 is electrically connectable to an applicable conductor; an insulator 40, wherein the insulator 40 has an upper surface 41, a lower surface 42 and a blind hole 44, the circuit 70 is disposed on the upper surface 41 of the insulator 40, at least a lower surface 72 of the circuit 70 is joined to the insulator 40, and the blind hole 44 is disposed corresponding to at least a portion of the second lower surface 722 of the circuit 70, so that at least a portion of the second lower surface 722 of the circuit 70 can be exposed in the blind hole 44; a conductive pad 30, wherein the conductive pad 30 has a side 33, an upper surface 31 and a lower surface 32, and is disposed on the lower surface 42 of the insulator 40, and at least the lower surface 32 is bonded to the insulator 40, and at least a portion of the opening 34 of the conductive pad 30 is disposed corresponding to the second lower surface 722 of the circuit 70; by comparing the differences between the circuit boards 50 and 51 and describing the present invention, another feature of the present invention is shown in the following paragraphs, which is to change the shape of the blind hole 44 to decrease the width L of the line 70, and further increase the distance (S _ as shown in fig. 1-2A) between the adjacent lines (70), so that more second lines (7A _ as shown in fig. 1-2A) can be disposed between two lines 70: first, as shown in fig. 7A-1 to 7A-3, in the circuit board 50, the blind holes 44 formed by the conventional mechanical or laser hole-forming method are generally circular or nearly circular, so that the width-to-length ratio (ratio of width to length) is usually not less than 0.97, such as: when the blind holes 44 are circular and the width D is 100 microns, the width-to-length ratio of the blind holes 44 is 1.0 (100/100), and the area of the second lower surface 722 of the trace 70 is 7,854 square microns [3.1416x (100/2) ]²]Meanwhile, in order to prevent the line 70 from falling into the blind hole 44, the width L of the line 70 needs to be increased to 200(50+100+50) microns; then, referring to the circuit board 51 shown in fig. 7B-1 to 7B-3, the circuit board 51 includes a blind hole 44 and an exhaust passage 49 having a default shape (non-circular shape), the blind hole 44 has a width D1 and a length H, wherein the width D1 of the blind hole 44 is shorter than the length H, the exhaust passage 49 allows another portion of the second lower surface 722 of the trace 70 to be exposed in the exhaust passage 49, at least a portion of the opening 34 of the conductive pad 30 is disposed corresponding to the exhaust passage 49, the blind hole 44 is disposed corresponding to at least a portion of the second lower surface 722 of the trace 70, and the width-length ratio thereof (the width D1 and the length H) is larger than the width of the second lower surface 722 of theThe ratio of H) is not only less than 0.97, but even more preferably less than 0.5, as: when the width D1 of the blind via 44 is 60 micrometers, in order to make the area of the second lower surface 722 of the circuit 70 of the circuit board 51 not smaller than the area of the second lower surface 722 of the circuit 70 of the circuit board 50 for maintaining the bonding strength between the circuit 70 and the first filler (95), the length of the second lower surface 722 of the circuit 70 of the circuit board 51 is only larger than 131(7,854/60) micrometers, so that the ratio of the width D1 of the blind via 44 of the insulator 40 to the length H is about 0.46(60 ÷ 131), and at the same time, in order to prevent the circuit 70 from falling into the blind via 44, the width L1 of the circuit 70 is only increased to 160 micrometers, so that the blind via 44 with a low aspect ratio allows the circuit board 51 to accommodate more circuits 70, which is beneficial for the electronic industry; in addition, as shown in fig. 7B-3, the function of the gate 47 can be achieved regardless of the shape of the vent 49, such as an oval shape or any other suitable shape, as long as the width of the gate 47 can limit the metal particles 99 of the conductive filler from flowing into the vent 49 (as shown in fig. 2-1-2-3B), wherein, as shown in fig. 7B-2 and 7B-3, the blind hole 44 of the circuit board 51 can protrude beyond the side 33 of the conductive plate 30 (see fig. 6C-1), so that the vent 49 (or both) can be located in a region other than the side 33 of the conductive plate 30, and the blind hole 46 and the vent 48 can be reserved to replace the blind hole 44 and the vent 49, or the vent 49 need not be arranged, or at least a portion of the line 70 or the sides 73, 33 of the conductive plate 30 can be connected to the insulator 40.

As shown in fig. 8A-1 to 8B-2, fig. 8A-1 and 8B-1 are plan views of the circuit boards 52 and 50, and fig. 8A-2 and 8B-2 are cross-sectional views of the cutting line CC shown in fig. 8A-1 and 8B-1, and first, the circuit board 52 is explained, and the circuit board 52 has: the circuit board 51, the features and symbols of the circuit board 51 are the same as those shown in fig. 7B-1 to 7B-3, and the same points are described with reference to fig. 7B-1 to 7B-3, except that a portion of the upper surface 71 of the circuit 70 is implemented as a second upper surface 712; a second insulator 4B, the second insulator 4B having an upper surface 41, a lower surface 42 and a blind hole 44, wherein the lower surface 42 of the second insulator 4B is bonded to the upper surface 41 of the insulator 40 of the circuit board 51 and covers the wire 70, and the second upper surface 712 of the wire 70 is exposed in the blind hole 44 of the second insulator 4B for the first filler (95) or for the second wire (7B _ as shown in fig. 8B-2) or for other suitable conductor bonding; a second conductive plate 3B, the second conductive plate 3B having a side 33, an opening 34, an upper surface 31 and a lower surface 32, and being disposed on the upper surface 41 of the second insulator 4B and being located at the periphery of the blind hole 44 of the second insulator 4B, the opening 34 of the second conductive plate 3B being disposed corresponding to the second upper surface 712 of the circuit 70, and at least the lower surface 32 being joined to the second insulator 4B, at least a portion of the side 33 of the second conductive plate 3B being joined to the second insulator 4B as required, the upper surface 31 of the second conductive plate 3B being electrically connected to the outside (tin, nickel, conductive wires, conductive bumps, circuits or other suitable conductors); next, a circuit board 50 is described, in which the circuit board 50 is formed by adding a second wiring 7B to a circuit board 52 shown in FIG. 8A-1 and FIG. 8A-2, the second line 7B is made of copper or nickel or other suitable conductor, and the second line 7B is disposed on the upper surface 31 of the second conductive plate 3B by plating or other suitable method, wherein a portion of the second trace 7B is received in the blind hole 44 of the second insulator 4B and the opening 34 of the second conductive pad 3B, and engages and is in electrical communication with the second upper surface 712 of the trace 70, thereby allowing the second conductive pad 3B to be in electrical communication with the trace 70, in addition, in order to improve the bondability of the second wiring 7B to the sidewall (not numbered) of the blind hole 44 of the second insulator 4B, a conductive film (not shown) may be disposed between the second line 7B and the second upper surface 712 of the line 70, the second conductive pad 3B and the sidewall of the blind hole 44 of the second insulator 4B; as can be seen from the above description, in each structure of the circuit board of the present invention, at least one insulating body and one conductive plate may be further stacked, so that the circuit board becomes a circuit board with multi-layer circuits, and the periphery of the blind hole 44 of the second insulating body 4B may be provided with a reserved exhaust passage (48) or exhaust passage (49) as shown in fig. 2-1-7B-3, and at least a portion of the second circuit 7B of the circuit board 50 may be electrically connected to a component (20) or a conductive member (10_ as shown in fig. 11) or other suitable conductors.

Referring to fig. 9 to 10, which are cross-sectional views of the circuit board 51, the features and symbols of the insulator 40, the circuit 70 and the conductive pad 30 of the circuit board 51 are the same as those of the circuit board 50 shown in fig. 7A-1 to 7A-3, and the same points refer to the descriptions of fig. 7A-1 to 7A-3, except that: a trace 70, the trace 70 includes an upper surface 71, a lower surface 72, a side 73 and a second side 732, wherein a portion of the lower surface 72 is implemented as a second lower surface 722, the second side 732 is located between the lower surface 72 and the second lower surface 722, the second lower surface 722 is capable of protruding from the lower surface 72 and having a protruding portion 79 or the second lower surface 722 is recessed in the lower surface 72 (see fig. 4-2), the embodiment is described with the trace 70 having the protruding portion 79, the protruding portion 79 is capable of being implemented as a conductive material same as or different from the trace 70, the protruding portion 79 is capable of reducing a distance (not labeled) between the second lower surface 722 of the trace 70 and the conductive pad 30, so that the first filler (95) is more easily bonded to the second lower surface 722 of the trace 70 in the blind via hole 44 to avoid electrical disconnection, and further avoid damage caused by electrical disconnection, and the following description of other features in fig. 9-10: as shown in fig. 9, the second side 732 of the circuit 70 is completely covered by the insulator 40, such that at least a portion of the second lower surface 722 is exposed in the blind hole 44 of the insulator 40; as shown in fig. 10, at least a portion of the second side 732 is not covered by the insulator 40 and is exposed in the blind hole 44 of the insulator 40, so that at least a portion of the second lower surface 722 of the circuit 70 is exposed in the blind hole 44, and as shown in fig. 10, the second side 732 may also be completely exposed in the blind hole 44 as required.

As shown in fig. 11, which is a cross-sectional view of the circuit board 50 in combination with the module 20, the circuit board 50 has: a line 70, the line 70 comprising an upper surface 71, a lower surface 72 and a side 73, and at least a portion of the upper surface 71 of the line 70 being electrically connectable to an appropriate conductor, wherein a portion of the lower surface 72 is implemented as a second lower surface 722; an insulator 40, wherein the insulator 40 has an upper surface 41, a lower surface 42 and a blind hole 44, the circuit 70 is disposed on the upper surface 41 of the insulator 40, and at least a portion of the side 73 and the lower surface 72 of the circuit 70 are joined to the insulator 40, so that the upper surface 71 of the circuit 70 can be flush with or recessed or protruded from the upper surface 41 of the insulator 40, wherein the blind hole 44 is disposed corresponding to the second lower surface 722 of the circuit 70, and the second lower surface 722 of the circuit 70 can be exposed in the blind hole 44; a conductive plate 30, wherein the conductive plate 30 is disposed on the lower surface 42 of the insulator 40, and has a side 33, an upper surface 31, a lower surface 32, an opening 34 and a sidewall 35, and at least a portion of the upper surface 31 is electrically connected to an applicable conductor, wherein the opening 34 is disposed corresponding to the second lower surface 722 of the circuit 70, and at least a portion of the side 33 and the lower surface 32 are joined to the insulator 40, such that the upper surface 31 of the conductive plate 30 can be flush with or recessed or protruded from the lower surface 42 of the insulator 40; a component 20, the component 20 being disposed on the lower surface 42 of the insulator 40 and electrically connected to the circuit board 50 by a conductive member 10(95), wherein when the component 20 is implemented as a flip chip (flip chip), the conductive member 10 is implemented as a conductive bump (bump) and the conductive bump is implemented as a first filler (95), and in the embodiment shown in fig. 11, the component 20 is implemented as a package or a module or other suitable component, wherein, if the component 20 is implemented as a package (100_ as shown in fig. 12B or 13C), the package 100 includes a chip or a flip chip, and the conductive member 10 is implemented as a solder ball or solder paste or other suitable conductor, and the solder ball or solder paste or other suitable conductor is also a first filler (95), the conductive member 10(95) is disposed between the component 20 and the circuit board 50, and a portion of the conductive member 10 is accommodated in the blind hole 44 of the insulator 40, the circuit board 50 is electrically connected to the component 20, the second lower surface 722 of the circuit 70 and the conductive plate 30 by the conductive member 10, and, if necessary, the surface of the circuit board 50 (e.g. the lower surface 42 of the insulator 40) is further provided with plastic (60_ see fig. 13B), and the plastic 60 covers the lower surface 42 of the insulator 40 of the circuit board 50, the conductive members 10(95) and a part (or all) of the component 20 to protect the component 20, as follows: the component 20 shown in fig. 11 can be replaced with the package 100 shown in fig. 12B (or the component 20 shown in fig. 13C) as required, or the circuit board 50 can be further provided with a plastic 60 as required, so that the circuit board 50 has more practicability.

As can be seen from the embodiments of the circuit board structures shown in fig. 1-11, the common essential components are the wire 70, the insulator 40 or (and) the conductive plate 30, and the various different wires 70 and conductive plates 30 shown in fig. 1-11, regardless of whether the side 73 of the wire 70 or the side 33 of the conductive plate 30 is connected to the insulator 40, as long as the wire 70 is disposed on one surface (e.g., the upper surface 41) of the insulator 40 and at least a portion of the second lower surface 722 of the wire 70 is disposed corresponding to the blind hole 44 of the insulator 40, if the circuit board has the conductive plate 30 and the conductive plate 30 is disposed on the other surface (e.g., the lower surface 42) of the insulator 40 and at least a portion of the opening 34 of the conductive plate 30 is disposed corresponding to the lower surface 72 of the wire 70, other essential components in the circuit board structure shown in fig. 1-11 can be added as required, such as: replacing blind hole 44 with a reserved blind hole 46; or an exhaust passage 49 and a doorway 47 are arranged, or an exhaust passage 49 is replaced by a reserved exhaust passage 48; or a part of the second lower surface 722 of the circuit 70 is exposed in the exhaust passage 49, or a part of the second lower surface 722 of the circuit 70 is not exposed at the bottom of the exhaust passage 49; or changing the width-length ratio of the blind hole 44 to enable the ratio of the width D1 to the length H of the blind hole 44 to be between 0.01 and 0.79; or a second insulator 4B and a second conductive disc 3B are additionally arranged, or the second insulator 4B, the second conductive disc 3B and a second line 7B are additionally arranged, so that the circuit board is provided with a plurality of layers of lines; or the circuit 70 has a second side 732, such that the second lower surface 722 of the circuit 70 is recessed or protruded from the lower surface 72; or engaging at least a portion of the side 23 and the bottom surface 22 of the component 20 with the insulator 40, or placing the component 20 in electrical communication with the circuit boards 50, 51, 52 by conductive wires or conductive bumps or suitable metals such as tin metal; or the assembly 20 and the plastic 60 are arranged on any one of the same surfaces of the circuit boards 50, 51 and 52; or the solder mask 80 may or may not be disposed on either surface of the insulator 40; or the protective layer 90 is bonded to the circuit or conductive pad exposed to the atmosphere; or providing a filler in electrical communication in engagement with the line 70; meanwhile, according to the circuit board of the present invention, a conductive film (as illustrated in fig. 8B-2) may be further disposed on the sidewall of the blind hole 44, the second lower surface 722 of the circuit 70, or (and) the conductive plate 30 to facilitate the combination with other suitable conductors; or as illustrated in the circuit boards 51, 52 shown in fig. 14A, the carrier sheet may be disposed on either surface of the circuit boards 51, 52; or as shown in fig. 12A-14C, various embodiments of converting reserved blind vias into blind vias may be used to combine any of the circuit boards of the present invention with components 20, plastic 60, etc., which may enable the circuit boards to be used more widely.

Fig. 12A to 14C are cross-sectional views illustrating various methods for converting the blind via hole reserved for insulator of the circuit board of the present invention into a blind via hole, and in the method for converting the blind via hole reserved for insulator into a blind via hole, any one of the following methods may be used: (a) firstly, providing a component, then providing a circuit board, jointing the component and the circuit board and electrically communicating, then providing a plastic coating component and the circuit board, then implementing a hole opening method, converting the reserved blind hole of the insulator into a blind hole, and then providing a conductive filler to joint the circuit and the filler according to requirements; or (b) providing a circuit board, then providing a component, connecting the component and the circuit board and electrically connecting, then providing a plastic coating component and the circuit board, and then implementing a hole opening method to convert the reserved blind hole of the insulator into a blind hole, wherein the steps are as follows: no matter the method (a) or the method (b), the hole opening method can be implemented only after the assembly is combined with the circuit board and the plastic is used for coating the assembly and the circuit board, so that the reserved blind hole of the insulator is converted into the blind hole to achieve the same effect, wherein after the reserved blind hole is converted into the blind hole, a conductive filler can be provided according to the requirement to combine the circuit with the filler, and if the circuit board still has the conductive disc, the filler is also combined with the conductive disc to electrically connect the circuit with the conductive disc; to facilitate understanding of the method for converting the insulation body reserved blind hole of the circuit board of the present invention into a blind hole, the method (b) is described as follows: fig. 12A to 12C are cross-sectional views illustrating a method for converting the pre-insulation blind via into a blind via of the circuit board according to the present invention, and the method is as follows: step (1), as shown in fig. 12A, a circuit board 51 is provided, the features and symbols of the circuit board 51 are the same as those of the circuit board 51 shown in fig. 7B-1 to 7B-3, and the same points refer to the descriptions of fig. 7B-1 to 7B-3, where two different points are: having a solder mask 80, the solder mask 80 being respectively disposed on the upper surface 41 and the lower surface 42 of the insulator 40, and the insulator 40 replacing the blind hole 44 with the reserved blind hole 46; step (2), as shown in fig. 12B, providing a component 20, a conductive member 10 and a plastic material 60, wherein the component 20 is implemented as a chip and is disposed on the upper surface 41 of the insulator 40 of the circuit board 51, the conductive member 10 is implemented as a conductive wire, the component 20 is electrically connected to the circuit 70 of the circuit board 51 through the conductive member 10, the plastic material 60 is implemented as an insulator, and the plastic material 60 is joined to the circuit board 51 and covers the component 20 and the conductive member 10 to form a package 100; step (3), as shown in fig. 12C, a hole opening method (not shown) is provided, the object (40k) in the reserved blind hole 46 is removed, the reserved blind hole 46 of the insulator 40 of the circuit board 51 is converted into a blind hole 44, the blind hole 44 penetrates through the insulator 40, and the second lower surface 722 of the circuit 70 is exposed in the blind hole 44 and exposed in the atmosphere; still referring to fig. 12C, a first filler 95 is provided, at least a portion of the first filler 95 is accommodated in the blind hole 44 of the insulator 40 and is connected to the second lower surface 722 of the circuit 70, such that the first filler 95 is electrically connected to the circuit 70 of the circuit board 51 and the first filler 95 is exposed to the atmosphere, and the circuit board 51 of the present embodiment further has the conductive pad 30, such that the first filler 95 can also be connected to the conductive pad 30 for electrical connection, and the circuit 70 of the circuit board 51 can also be electrically connected to the conductive pad 30; from the above, it is known that: before the hole opening method is implemented, the circuit board 51 may include the component 20, the conductive member 10 and the plastic 60, the component 20 is electrically connected with the circuit board 51 and is encapsulated by the plastic 60, the hole opening method is implemented, the reserved blind hole 46 is converted into the blind hole 44, and then the first filler 95 is provided to electrically connect the circuit of the circuit board with the first filler 95; the circuit board 51 can be electrically connected by the first filler 95 being joined to another circuit board 52, and the first filler 95 can be joined to the circuit board 51 before being joined to the circuit board 52 as required, or the first filler 95 can join the two circuit boards 51, 52 together at the same time, so that the package 100 is joined to the circuit board 52, wherein the circuit board 52 can be implemented as any one of the circuit boards according to the embodiments of the present invention shown in fig. 1-1 to 14C; meanwhile, the circuit board of the invention can also be according to the demand: after the hole opening method is implemented and the reserved blind hole 46 is converted into the blind hole 44, the circuit board 51 including the component 20, the conductive member 10 and the plastic 60 is encapsulated by the plastic 60, and then the first filler 95 is provided to electrically connect the circuit of the circuit board with the first filler 95 (as shown in fig. 13A to 13D).

Fig. 13A to 13D are cross-sectional views illustrating a method for converting the pre-insulation blind via into a blind via of the circuit board 51 according to the present invention, wherein: after the hole opening method is implemented, the reserved blind hole 46 is converted into the blind hole 44, and the circuit board 51 includes the component 20, the conductive component 10 and the plastic 60, and is encapsulated by the plastic 60, and then the first filler 95 is provided to electrically connect the circuit 70 of the circuit board 51 with the first filler 95, which is described as follows: step (1), as shown in fig. 13A, a circuit board 51 is provided, where the circuit board 51 includes: a line 70, the line 70 having a side 73, an upper surface 71 and a lower surface 72, wherein a portion of the lower surface 72 is implemented as a second lower surface 722, and at least a portion of the upper surface 71 of the line 70 is electrically connectable to an applicable conductor; an insulator 40, wherein the insulator 40 has an upper surface 41, a lower surface 42 and a reserved blind hole 46, the line 70 is arranged on the upper surface 41 of the insulator 40, and the side 73 and the lower surface 72 of the line 70 are jointed with the insulator 40, so that the upper surface 71 of the line 70 is exposed and is concavely arranged on the upper surface 41 of the insulator 40, the second lower surface 722 of the line 70 is arranged corresponding to the reserved blind hole 46 and is jointed with the insulator 40, and accordingly, the second lower surface 722 of the line 70 is not exposed in the atmosphere; a conductive pad 30, the conductive pad 30 is disposed on the lower surface 42 of the insulator 40, the conductive pad 30 has a side 33, an upper surface 31, a lower surface 32 and an opening 34, wherein at least the lower surface 32 is connected to the insulator 40, and at least a portion of the opening 34 is disposed corresponding to the second lower surface 722 of the circuit 70; a solder mask layer 80, wherein the solder mask layer 80 is at least disposed on the upper surface 31 of the conductive plate 30, and the solder mask layer 80 is not required to be applied according to the requirement; next, step (2), as shown in fig. 13B, an opening method (not shown) is provided to convert the reserved blind hole 46 of the insulator 40 of the circuit board 51 into the blind hole 44, so that the second lower surface 722 of the circuit 70 is exposed in the blind hole 44 and is also exposed in the atmosphere; next, in step (3), as shown in fig. 13C, the component 20 and the conductive member 10 are provided, if the component 20 is implemented as a flip chip, the conductive bumps of the flip chip can be implemented as the conductive members 10, the component 20 is disposed on one surface of the circuit board 51 (the lower surface 42 of the insulator 40), and the assembly 20 is placed in electrical communication by the conductive member 10 engaging the circuit board 51 (conductive pad 30), plastic 60 is provided, the plastic 60 is implemented as an insulator, and the plastic 60 is joined with the circuit board 51 and covers the component 20 and the conductive member 10 to form a package 100, and further, the plastic 60 can cover only a part of the component 20 as required, the component 20 and the plastic 60 can be replaced, for example, the component 20 and the plastic 60 are arranged on the other surface (the upper surface 41 of the insulator 40) of the circuit board 51, and the component 20 is electrically communicated with the circuit 70 of the circuit board 51 by the conductive member 10; step (4) as shown in fig. 13D, providing a first filler 95, at least a portion of the first filler 95 being accommodated in the blind hole 44 of the insulator 40 and engaging with the second lower surface 722 of the line 70, so that the first filler 95 is electrically connected with the line 70 of the circuit board 51, and because the circuit board 51 of this embodiment further has the conductive pad 30, accordingly, the first filler 95 is also engaged with the conductive pad 30 to be electrically connected, so that the line 70 of the circuit board 51 is also electrically connected with the conductive pad 30, and the first filler 95 is exposed to the atmosphere, wherein a distance between a top (top) of the first filler 95 and the upper surface 31 of the first conductive pad 30 is not less than (≧)40 microns, as shown in the above: although the hole opening method is implemented first, after the reserved blind hole 46 is converted into the blind hole 44, the circuit board 51 includes the component 20, the conductive member 10 and the plastic 60, and is encapsulated by the plastic 60, the step of providing the first filler 95 to electrically connect the circuit 70 of the circuit board 51 with the first filler 95 is provided, and the effect of electrically connecting the circuit 70 with the first filler 95 can also be achieved; if necessary, an exhaust passage 49 may be provided around the blind hole 44 of the insulator 40, or the blind hole 44 and the exhaust passage 49 may be replaced with a reserved blind hole 46 and a reserved exhaust passage 48, and before the step shown in fig. 13D is performed, the reserved blind hole 46 and the reserved exhaust passage 48 are converted into the blind hole 44 and the exhaust passage 49 by providing an opening method, or a carrier sheet (85, 88_ as shown in fig. 14A) is provided on the surface of the circuit board 51 without the plastic 60.

In order to overcome the above problem, a carrier sheet may be combined with any surface of the circuit board exposed to the atmosphere, and two carrier sheets (85, 88) may be combined with the circuit boards 52, 51 respectively, and shown in the step cross-sectional views of fig. 14A to 14C, so as to facilitate the following description: step (1), first, as shown in fig. 14A, two components 20 are provided, and the components 20 may be implemented as chips; step (2), still referring to fig. 14A, providing two circuit boards 51 and 52, where the structural features and symbols of the insulators 40, the lines 70 and the conductive pads 30 of the two circuit boards 51 and 52 are the same as those of the circuit board 50 shown in fig. 1-2A, please refer to fig. 1-2A for explanation, wherein the openings 34 of the conductive pads 30 can be replaced by the reserved openings (36_ as shown in fig. 1-2B), the circuit board 52 still has a carrier sheet 85, the carrier sheet 85 can be implemented as copper or other suitable conductor or as adhesive tape or other suitable insulator, the carrier sheet 85 is disposed on one surface of the circuit board 52 without the plastic 60 (e.g., the lower surface 42 of the insulator 40) and is bonded to the circuit board 52, and an insulating or conductive film (film)86 can be added between the carrier sheet 85 and the circuit board 52 as required to better bond the carrier sheet 85 to the circuit board 52, the carrier 88 is disposed on a surface of the circuit board 51 without the plastic 60 (e.g., the lower surface 42 of the insulator 40) and is engaged with the circuit board 51, and the carrier 88 is also engaged with the conductive pad 30, wherein, the carrier sheet 88 can be integrally formed with the conductive plate 30 (uniary) or be implemented as the same carrier sheet as the carrier sheet 85, wherein, if the carrying sheet 88 and the conductive plate 30 are integrally formed, the carrying sheet 88 can be firmly connected with the conductive plate 30 without peeling off (peeling-off) problem, so that the carrying sheet 88 has more practicability, a conductive film (not shown) may be disposed between the upper surface 31 of the conductive plate 30 of the circuit board 51 and the carrier sheet 88, so that a portion of the carrier sheet 88 is bonded to the upper surface 31 of the conductive plate 30 of the circuit board 51, and the assembly 20 is bonded to the circuit 51 and a surface of the circuit board 52 (e.g., the upper surface 41 of the insulator 40); step (3), providing a conductive member 10 and a plastic material 60, wherein the conductive member 10 can be implemented as a conductive wire and electrically connects the component 20 with the circuit boards 51 and 52 by the conductive member 10, and the plastic material 60 is combined with the circuit boards 51 and 52 and covers the component 20 and the conductive member 10; step (4), as shown in fig. 14B, a method (not shown) for peeling the carrier sheets 85, 88 is provided, in which the carrier sheets 88, 85 (including the film 86) are removed from the circuit boards 51, 52 by chemical, mechanical or other suitable methods, so that the surfaces of the circuit boards 51, 52 are exposed to the atmosphere; step (5), as shown in fig. 14B, a hole-opening method (not shown) is provided, which converts the reserved blind holes 46 of the circuit boards 51 and 52 into blind holes 44, and exposes at least a portion of the second lower surface 722 of the circuit 70 in the blind holes 44; and (6) as shown in fig. 14C, before providing the conductive filler, a surface of the circuit boards 52 and 51 is provided with the plastic 60, the carrier sheets (85 and 88) are removed from the insulator 40, and the hole-opening method is completed, and then, a conductive filler is provided, which may be composed of one (layer) or a plurality of (layer) conductors, such as: copper, nickel, tin, gold, palladium, solder paste or other suitable conductors, at least a portion of the filler being accommodated in the blind via 44, wherein the filler of the circuit board 51 is composed of only one conductor (first filler 95), and a portion of the filler is exposed to the atmosphere and implemented as the first filler 95, the first filler 95 may be composed of solder balls or other suitable conductors, and the filler of the circuit board 52 is composed of a plurality of conductors, such as: copper, nickel, tin, gold, palladium, tin paste, tin ball or other suitable conductor, and is implemented as the second filler 9B and the first filler 95, respectively, and the filler may consist of the first filler 95 only, or consist of the second filler 9B, or consist of the first filler 95 and the second filler 9B, and the second filler 9B is joined with the second lower surface 722 of the circuit 70 and accommodated in the blind hole 44 to electrically communicate with the circuit 70, for shortening the distance between the circuit 70 and the conductive plate 30, and at least a portion of the first filler 95 is filled in the blind hole 44 and joined with the conductive plate 30 and the second filler 9B, so as to electrically communicate the conductive plate 30 and the circuit 70, wherein the filler of the circuit board 52 consists of the first filler 95 and the second filler 9B, and as shown in fig. 14C, the circuit board 52 may be provided with no first filler 95 as required, accordingly, the filler of the circuit board 52 is only composed of the second filler 9B and exposed to the atmosphere, and the first filler 95 of the circuit board 51 can be accommodated in the blind hole 44 only as required but not connected to the conductive pad 30, and the circuit boards 51 and 52 can be free of the conductive pad 30 as required; and a reserved exhaust passage 48 can be arranged around the reserved blind hole 46 of the circuit boards 51 and 52 as shown in fig. 14A, and the reserved exhaust passage 48 is converted into an exhaust passage 49 in the hole opening method as shown in fig. 14B; after the hole opening method is completed, the carrier sheets 88 and 85 (see fig. 14A and 14B) are not removed from the circuit boards 51 and 52 as required, and the carrier sheets 85 and 88 are still bonded to the circuit boards 52 and 51, so that the carrier sheets 85 and 88 can still improve the rigidity of the circuit boards 52 and 51; in the method of converting the pre-blind via of the circuit board insulator into a blind via of the present invention (fig. 14A-14C), the side (23- _ see fig. 3) of the component 20 is also bonded to the insulator 40, and electrically connected to the circuit boards 51, 52, and then encapsulated by the plastic 60, as desired.

The above drawings are only preferred embodiments of the circuit board of the present invention, and the scope of the present invention should not be limited thereby; as shown in fig. 12A to 14C, as long as the circuit board is combined with the plastic, the circuit board can be replaced by any one of the circuit boards shown in fig. 1-1 to 14C as required, the assembly 20 and the plastic 60 can be disposed on any surface of the circuit board, and the carrier plates (85, 88) can be disposed on the other surface of the circuit board; therefore, all the numerical changes and equivalent element substitutions, or equivalent changes and modifications made according to the scope of the claims of the present application should still fall within the scope of the present patent.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.