Method of manufacturing display substrate, and display apparatus
阅读说明:本技术 制造显示基板的方法、显示基板和显示设备 (Method of manufacturing display substrate, and display apparatus ) 是由 张子予 谢春燕 于 2019-08-26 设计创作,主要内容包括:提供了一种制造具有显示区域和周边区域的显示基板的方法。所述方法包括:在衬底基板上并且在显示区域中形成多个发光元件;在多个发光元件的远离衬底基板的一侧形成封装层,用于封装多个发光元件;形成绝缘层,其中,绝缘层形成在封装层和衬底基板之间;以及在周边区域中并且在绝缘层的远离衬底基板的一侧形成第一阻挡墙,第一阻挡墙形成实质上围绕第一区域的第一围墙。第一阻挡墙的远离衬底基板的一侧宽于第一阻挡墙的靠近衬底基板的一侧。(A method of manufacturing a display substrate having a display area and a peripheral area is provided. The method comprises the following steps: forming a plurality of light emitting elements on a base substrate and in a display region; forming an encapsulation layer on one side of the plurality of light-emitting elements far away from the substrate base plate, wherein the encapsulation layer is used for encapsulating the plurality of light-emitting elements; forming an insulating layer, wherein the insulating layer is formed between the encapsulation layer and the substrate base plate; and forming a first barrier wall in the peripheral region and on a side of the insulating layer away from the substrate base plate, the first barrier wall forming a first fence substantially surrounding the first region. One side of the first barrier wall far away from the substrate base plate is wider than one side of the first barrier wall close to the substrate base plate.)
1. A method of manufacturing a display substrate having a display area and a peripheral area, the method comprising:
forming a plurality of light emitting elements on a base substrate and in the display region;
forming an encapsulation layer on one side of the plurality of light-emitting elements far away from the substrate base plate, wherein the encapsulation layer is used for encapsulating the plurality of light-emitting elements;
forming an insulating layer, wherein the insulating layer is formed between the encapsulation layer and the base substrate; and
forming a first barrier wall in the peripheral region and on a side of the insulating layer remote from the substrate base plate, the first barrier wall forming a first fence substantially surrounding the first region;
wherein the first barrier wall is formed to include a first lower portion in contact with the insulating layer and a first upper portion on a side of the first lower portion away from the insulating layer;
the orthographic projection of the first upper part on the substrate base plate covers the orthographic projection of the first lower part on the substrate base plate; and is
The first barrier wall is formed such that a side of the first barrier wall remote from the substrate base plate is wider than a side of the first barrier wall close to the substrate base plate in a width direction of the first barrier wall from the peripheral region to the display region.
2. The method of claim 1, wherein forming the first barrier wall comprises:
forming a negative photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate;
exposing the negative photoresist material layer by using a mask plate with a light-transmitting area corresponding to the first barrier wall to generate an exposed negative photoresist material layer; and
developing the exposed negative photoresist material layer to form the first barrier wall;
wherein the first blocking wall is formed to have an undercut profile.
3. The method of claim 2, wherein the side surfaces of the first lower portion are substantially coplanar with the side surfaces of the first upper portion.
4. The method of claim 1, wherein forming the first barrier wall comprises:
forming a layer of image reversal photoresist material in the peripheral region and on a side of the insulating layer remote from the substrate base plate;
exposing the image reversal photoresist material layer by using a mask plate with a light transmission area corresponding to the first barrier wall to generate a first exposure photoresist material layer;
reversely baking the first exposed photoresist material layer to generate a reverse photoresist material layer;
exposing the reverse photoresist material layer to generate a second exposed photoresist material layer; and
developing the second exposed photoresist material layer to form the first barrier wall;
wherein the first blocking wall is formed to have an undercut profile.
5. The method of claim 4, wherein the sides of the first lower portion are substantially coplanar with the sides of the first upper portion.
6. The method of claim 1, wherein forming the first barrier wall comprises:
forming a first material layer in the peripheral region and on a side of the insulating layer remote from the substrate base plate;
forming a second material layer in the peripheral region and on a side of the first material layer remote from the substrate base plate; and
and patterning the first material layer and the second material layer to form the first barrier wall.
7. The method of claim 6, wherein the first material layer is a first positive photoresist material layer and the second material layer is a second positive photoresist material layer; and is
The first positive photoresist material layer is more sensitive to exposure than the second positive photoresist material layer;
wherein forming the first barrier wall includes:
forming the first positive photoresist material layer in the peripheral region and on a side of the insulating layer remote from the substrate;
forming a second positive photoresist material layer in the peripheral region and on a side of the first positive photoresist material layer remote from the substrate;
simultaneously exposing the first positive photoresist material layer and the second positive photoresist material layer using a mask plate having a light-shielding region corresponding to the first barrier wall to generate an exposed first positive photoresist material layer and an exposed second positive photoresist material layer; and
developing the exposed first positive photoresist material layer and the exposed second positive photoresist material layer to form the first barrier wall;
wherein the first lower portion is generated by developing the exposed first positive photoresist material layer;
creating the first upper portion by developing the exposed second positive photoresist material layer; and is
The side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
8. The method of claim 6, wherein the first material layer is a positive photoresist material layer and the second material layer is a negative photoresist material layer;
wherein forming the first barrier wall includes:
forming the positive photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate;
forming the negative photoresist material layer in the peripheral region and on a side of the positive photoresist material layer away from the substrate;
exposing the negative photoresist material layer by using a first mask plate with a light-transmitting area corresponding to the first barrier wall to generate an exposed negative photoresist material layer;
developing the exposed negative photoresist material layer to create the first upper portion;
exposing the positive photoresist material layer by using a second mask plate with a shading area corresponding to the first barrier wall to generate an exposed positive photoresist material layer; and
developing the exposed positive photoresist material layer to create the first lower portion;
wherein the side surfaces of the first lower portion and the first upper portion are not coplanar.
9. The method of claim 6, wherein the first material layer is a first negative photoresist material layer and the second material layer is a second negative photoresist material layer; and is
The second negative-working photoresist material layer is more sensitive to exposure than the first negative-working photoresist material layer;
wherein forming the first barrier wall includes:
forming the first negative photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate;
forming a second negative photoresist material layer in the peripheral region and on a side of the first negative photoresist material layer away from the substrate;
simultaneously exposing the first negative photoresist material layer and the second negative photoresist material layer using a mask having a light-transmitting region corresponding to the first barrier wall to generate an exposed first negative photoresist material layer and an exposed second negative photoresist material layer; and
developing the exposed first negative photoresist material layer and the exposed second negative photoresist material layer to form the first barrier wall;
wherein the first lower portion is generated by developing the exposed first negative photoresist material layer;
creating the first upper portion by developing the exposed second negative photoresist material layer; and is
The side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
10. The method of claim 6, wherein the first material layer is a metal material layer and the second material layer is a photoresist material layer; and is
Wherein forming the first barrier wall includes:
forming the metal material layer in the peripheral region and on a side of the insulating layer away from the substrate base plate;
forming the photoresist material layer in the peripheral area and on a side of the metal material layer away from the substrate base plate;
exposing the photoresist material layer to produce an exposed photoresist material layer;
developing the exposed photoresist material layer to form the first upper portion; and
the metallic material layer is etched to form the first lower portion.
11. The method of any of claims 6 to 10, wherein the first lower portion has a first side in contact with the insulating layer and a second side opposite the first side, the first and second sides being connected by a side of the first lower portion;
the first upper portion having a third side in contact with the first lower portion and a fourth side opposite the third side, the third and fourth sides connected by a side of the first upper portion; and is
The third side is wider than the first side and the second side in the width direction of the first blocking wall.
12. The method of any of claims 1 to 11, further comprising: forming a second barrier wall in the peripheral region and on a side of the insulating layer remote from the substrate base plate, the second barrier wall forming a second enclosure substantially surrounding a second region;
wherein the first blocking wall substantially surrounds the second blocking wall.
13. The method of any of claims 1 to 12, further comprising: punching a hole penetrating through the display substrate to form a window area;
wherein the first fence substantially surrounds the window area.
14. The method of any of claims 1 to 13, further comprising: forming an inorganic barrier layer covering the first barrier wall;
the inorganic blocking layer is limited in the peripheral region; and is
The inorganic barrier layer is formed in direct contact with the first barrier wall and the insulating layer.
15. The method of claim 14, further comprising: and one or a combination of the organic material layer and the cathode layer which are separated into discontinuous parts by the side face of the first barrier wall is formed on one side of the inorganic barrier layer far away from the substrate base plate.
16. The method of any of claims 1 to 15, further comprising: a crack prevention layer is formed in an angled space between a side of the first barrier wall and a surface of the insulating layer.
17. The method of claim 16, wherein forming the crack prevention layer comprises:
forming a positive photoresist material layer on one side of the first barrier wall far away from the substrate base plate; and
patterning the positive photoresist material layer to form the crack prevention layer;
wherein, during the patterning of the positive photoresist material layer, the positive photoresist material layer is removed except for a portion located in the angled space between the side of the first barrier wall and the surface of the insulating layer, thereby forming the crack prevention layer.
18. A display substrate having a display area and a peripheral area, the display substrate comprising:
a substrate base plate;
a plurality of light emitting elements on the substrate base plate and in the display area;
the packaging layer is positioned on one side of the plurality of light-emitting elements, which is far away from the substrate base plate, and is used for packaging the plurality of light-emitting elements;
an insulating layer between the encapsulation layer and the substrate base plate; and
a first barrier wall located in the peripheral region and located on a side of the insulating layer away from the substrate, the first barrier wall forming a first enclosure substantially surrounding the first region;
the first barrier wall comprises a first lower part contacting with the insulating layer and a first upper part positioned on one side of the first lower part far away from the insulating layer;
the orthographic projection of the first upper part on the substrate base plate covers the orthographic projection of the first lower part on the substrate base plate; and is
And along the width direction of the first barrier wall from the peripheral area to the display area, one side of the first barrier wall far away from the substrate base plate is wider than one side of the first barrier wall close to the substrate base plate.
19. The display substrate of claim 18, wherein the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion;
the first lower portion has a first side in contact with the insulating layer and a second side opposite the first side, the first and second sides being connected by a side face of the first lower portion;
the first upper portion having a third side in contact with the first lower portion and a fourth side opposite the third side, the third and fourth sides connected by a side of the first upper portion; and is
The third side is wider than the first side and the second side in the width direction of the first blocking wall.
20. The display substrate of any one of claims 18 to 19, further comprising: a second barrier wall located in the peripheral region and on a side of the insulating layer away from the substrate, the second barrier wall forming a second enclosure substantially surrounding a second region;
wherein the first blocking wall substantially surrounds the second blocking wall.
21. The display substrate of any of claims 18-20, wherein the first fence substantially surrounds a window area of the display substrate; and is
The display substrate has a hole through the window area to mount an accessory in the hole.
22. The display substrate of any one of claims 18 to 21, further comprising: an inorganic barrier layer covering the first barrier wall;
the inorganic blocking layer is limited in the peripheral region; and is
The inorganic barrier layer is in direct contact with the first barrier wall, the crack prevention layer, and the insulating layer.
23. The display substrate of claim 22, further comprising one or a combination of an organic material layer and a cathode layer on a side of the inorganic barrier layer remote from the substrate separated into discrete portions by sides of the first barrier walls.
24. The method of any of claims 18 to 23, further comprising: a crack prevention layer located in an angled space between a side of the first barrier wall and a surface of the insulation layer.
25. The display substrate according to claim 24, wherein the first barrier wall comprises a first lower portion in contact with the insulating layer and a first upper portion on a side of the first lower portion away from the insulating layer;
the orthographic projection of the first upper part on the substrate base plate covers the orthographic projection of the first lower part on the substrate base plate;
a first side surface of the first lower portion and a surface of the insulating layer form a first angled space;
a second side of the first lower portion forms a second angled space with the surface of the insulating layer; and is
The crack prevention layer includes a first crack prevention sub-layer located in the first angled space and a second crack prevention sub-layer located in the second angled space.
26. The display substrate of claim 25, wherein the first barrier wall comprises a negative photoresist material; and, the crack prevention layer includes a positive photoresist material.
27. The display substrate of claim 25, wherein the first portion comprises a positive photoresist material; and, the second portion comprises a positive photoresist material.
28. The display substrate of claim 25, wherein the first portion comprises a positive photoresist material; and, the second portion comprises a negative photoresist material.
29. The display substrate of claim 25, wherein the first portion comprises a negative photoresist material; and, the second portion comprises a negative photoresist material.
30. The display substrate of claim 25, wherein the first portion comprises a metallic material; and, the second portion comprises a photoresist material.
31. A display device comprising the display substrate of any one of claims 18 to 30, and one or more integrated circuits connected to the display substrate.
Technical Field
The present invention relates to a display technology, and more particularly, to a method of manufacturing a display substrate, and a display apparatus.
Background
An Organic Light Emitting Diode (OLED) display device is a self-light emitting device and does not require a backlight. OLED display devices also provide brighter colors and a larger color gamut than conventional Liquid Crystal Display (LCD) devices. In addition, OLED display devices can be made more flexible, thinner, and lighter than typical LCD devices. An OLED display device generally includes an anode, an organic layer including a light emitting layer, and a cathode. The OLED may be a bottom-emission type OLED or a top-emission type OLED.
Disclosure of Invention
In one aspect, the present invention provides a method of manufacturing a display substrate having a display area and a peripheral area, comprising: forming a plurality of light emitting elements on a base substrate and in a display region; forming an encapsulation layer on one side of the plurality of light-emitting elements far away from the substrate base plate, wherein the encapsulation layer is used for encapsulating the plurality of light-emitting elements; forming an insulating layer, wherein the insulating layer is formed between the encapsulation layer and the substrate base plate; forming a first barrier wall in the peripheral region and on a side of the insulating layer away from the substrate base plate, the first barrier wall forming a first fence substantially surrounding the first region; wherein the first barrier wall is formed to include a first lower portion contacting the insulating layer and a first upper portion located on a side of the first lower portion away from the insulating layer; the orthographic projection of the first upper part on the substrate base plate covers the orthographic projection of the first lower part on the substrate base plate; and the first barrier wall is formed such that a side of the first barrier wall remote from the substrate base plate is wider than a side of the first barrier wall close to the substrate base plate in a width direction of the first barrier wall from the peripheral region to the display region.
Optionally, forming the first barrier wall includes: forming a negative photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; exposing the negative photoresist material layer by using a mask plate with a light-transmitting area corresponding to the first barrier wall to generate an exposed negative photoresist material layer; and developing the exposed negative photoresist material layer to form a first barrier wall; wherein the first blocking wall is formed to have an undercut profile.
Optionally, the side surfaces of the first lower portion are substantially coplanar with the side surfaces of the first upper portion.
Optionally, forming the first barrier wall includes: forming an image reversal photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate base plate; exposing the image reversal photoresist material layer by using a mask plate with a light transmission area corresponding to the first barrier wall to generate a first exposure photoresist material layer; reversely baking the first exposed photoresist material layer to generate a reverse photoresist material layer; exposing the reverse photoresist material layer to produce a second exposed photoresist material layer; developing the second exposure photoresist material layer to form a first barrier wall; wherein the first blocking wall is formed to have an undercut profile.
Optionally, the side surfaces of the first lower portion are substantially coplanar with the side surfaces of the first upper portion.
Optionally, forming the first barrier wall includes: forming a first material layer in the peripheral region and on a side of the insulating layer away from the substrate base plate; forming a second material layer in the peripheral area and on the side of the first material layer far away from the substrate base plate; and patterning the first material layer and the second material layer to form a first barrier wall.
Optionally, the first material layer is a first positive photoresist material layer and the second material layer is a second positive photoresist material layer; and the first positive photoresist material layer is more sensitive to exposure than the second positive photoresist material layer; wherein forming the first barrier wall includes: forming a first positive photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; forming a second positive photoresist material layer in the peripheral area and on the side of the first positive photoresist material layer away from the substrate; simultaneously exposing the first positive photoresist material layer and the second positive photoresist material layer by using a mask plate having a shading area corresponding to the first barrier wall to generate an exposed first positive photoresist material layer and an exposed second positive photoresist material layer; developing the exposed first positive photoresist material layer and the exposed second positive photoresist material layer to form a first barrier wall; wherein the first lower portion is generated by developing the exposed first positive photoresist material layer; generating a first upper portion by developing the exposed second positive photoresist material layer; and, the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
Optionally, the first material layer is a positive photoresist material layer and the second material layer is a negative photoresist material layer; wherein forming the first barrier wall includes: forming a positive photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; forming a negative photoresist material layer in the peripheral region and on a side of the positive photoresist material layer away from the substrate; exposing the negative photoresist material layer by using a first mask plate with a light-transmitting area corresponding to the first barrier wall to generate an exposed negative photoresist material layer; developing the exposed negative photoresist material layer to produce a first upper portion; exposing the positive photoresist material layer by using a second mask plate with a shading area corresponding to the first barrier wall to generate an exposed positive photoresist material layer; and developing the exposed positive photoresist material layer to produce a first lower portion; wherein the side surfaces of the first lower portion and the first upper portion are not coplanar.
Optionally, the first material layer is a first negative photoresist material layer and the second material layer is a second negative photoresist material layer; and the second negative photoresist material layer is more sensitive to exposure than the first negative photoresist material layer; wherein forming the first barrier wall includes: forming a first negative photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; forming a second negative photoresist material layer in the peripheral area and on the side of the first negative photoresist material layer away from the substrate; simultaneously exposing the first negative photoresist material layer and the second negative photoresist material layer by using a mask plate having a light-transmitting region corresponding to the first barrier wall to generate an exposed first negative photoresist material layer and an exposed second negative photoresist material layer; developing the exposed first negative photoresist material layer and the exposed second negative photoresist material layer to form a first barrier wall; wherein the first lower portion is generated by developing the exposed first negative photoresist material layer; generating a first upper portion by developing the exposed second negative photoresist material layer; and, the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
Optionally, the first material layer is a metal material layer and the second material layer is a photoresist material layer; and wherein forming the first barrier wall comprises: forming a metal material layer in the peripheral area and on one side of the insulating layer away from the substrate; forming a photoresist material layer in the peripheral area and on one side of the metal material layer far away from the substrate base plate; exposing the photoresist material layer to produce an exposed photoresist material layer; developing the exposed photoresist material layer to form a first upper portion; and etching the metal material layer to form a first lower portion.
Optionally, the first lower portion has a first side in contact with the insulating layer and a second side opposite the first side, the first side and the second side being connected by a side face of the first lower portion; the first upper portion has a third side in contact with the first lower portion and a fourth side opposite the third side, the third and fourth sides being connected by a side of the first upper portion; and the third side is wider than the first and second sides in a width direction of the first blocking wall.
Optionally, the method further comprises: forming a second barrier wall in the peripheral region and on a side of the insulating layer away from the substrate base plate, the second barrier wall forming a second enclosure substantially surrounding the second region; wherein the first barrier wall substantially surrounds the second barrier wall.
Optionally, the method further comprises: punching a hole penetrating through the display substrate to form a window area; wherein the first fence substantially surrounds the window area.
Optionally, the method further comprises: forming an inorganic barrier layer covering the first barrier wall; the inorganic barrier layer is limited in the peripheral area; and the inorganic barrier layer is formed in direct contact with the first barrier wall and the insulating layer.
Optionally, the method further comprises: one or a combination of an organic material layer and a cathode layer separated into discrete portions by the side surfaces of the first barrier walls is formed on the side of the inorganic barrier layer remote from the substrate base plate.
Optionally, the method further comprises: a crack prevention layer is formed in an angled space between a side surface of the first barrier wall and a surface of the insulating layer.
Optionally, forming the crack prevention layer includes: forming a positive photoresist material layer on one side of the first barrier wall far away from the substrate base plate; and patterning the positive photoresist material layer to form a crack prevention layer; wherein, during the patterning of the positive photoresist material layer, the positive photoresist material layer is removed except for a portion located in an angled space between a side of the first barrier wall and a surface of the insulating layer, thereby forming a crack prevention layer.
In another aspect, the present invention provides a display substrate having a display area and a peripheral area, comprising: a substrate base plate; a plurality of light emitting elements on the substrate base plate and in the display area; the packaging layer is positioned on one side of the plurality of light-emitting elements far away from the substrate and used for packaging the plurality of light-emitting elements; an insulating layer between the encapsulation layer and the substrate base plate; and a first barrier wall located in the peripheral region and on a side of the insulating layer remote from the substrate, the first barrier wall forming a first enclosure substantially surrounding the first region; the first barrier wall comprises a first lower part contacting with the insulating layer and a first upper part positioned on one side of the first lower part far away from the insulating layer; the orthographic projection of the first upper part on the substrate base plate covers the orthographic projection of the first lower part on the substrate base plate; and along the width direction of the first barrier wall from the peripheral area to the display area, one side of the first barrier wall far away from the substrate base plate is wider than one side of the first barrier wall close to the substrate base plate.
Optionally, the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion; the first lower portion has a first side in contact with the insulating layer and a second side opposite the first side, the first side and the second side being connected by a side of the first lower portion; the first upper portion has a third side in contact with the first lower portion and a fourth side opposite the third side, the third and fourth sides being connected by a side of the first upper portion; and the third side is wider than the first and second sides in a width direction of the first blocking wall.
Optionally, the display substrate further includes a second barrier wall located in the peripheral region and located on a side of the insulating layer away from the substrate, the second barrier wall forming a second enclosure substantially surrounding the second region; wherein the first barrier wall substantially surrounds the second barrier wall.
Optionally, the first fence substantially surrounds a window area of the display substrate; and the display substrate has a hole penetrating the window area to mount the accessory therein.
Optionally, the display substrate further comprises: an inorganic barrier layer covering the first barrier wall; the inorganic barrier layer is limited in the peripheral area; and the inorganic barrier layer is in direct contact with the first barrier wall, the crack prevention layer and the insulating layer.
Optionally, the display substrate further comprises one or a combination of an organic material layer and a cathode layer, which are located on the side of the inorganic barrier layer remote from the substrate, separated into discrete portions by the sides of the first barrier walls.
Optionally, the display substrate further comprises: a crack prevention layer located in an angled space between a side of the first barrier wall and a surface of the insulation layer.
Optionally, the first barrier wall includes a first lower portion in contact with the insulating layer and a first upper portion located on a side of the first lower portion away from the insulating layer; the orthographic projection of the first upper part on the substrate base plate covers the orthographic projection of the first lower part on the substrate base plate; a first side surface of the first lower part and the surface of the insulating layer form a first angle forming space; the second side of the first lower portion and the surface of the insulating layer form a second angled space; and, the crack prevention layer includes a first crack prevention sub-layer located in the first angle forming space and a second crack prevention sub-layer located in the second angle forming space.
Optionally, the first barrier wall comprises a negative photoresist material; and, the crack prevention layer includes a positive photoresist material.
Optionally, the first portion comprises a positive photoresist material; and, the second portion includes a positive photoresist material.
Optionally, the first portion comprises a positive photoresist material; and, the second portion comprises a negative photoresist material.
Optionally, the first portion comprises a negative photoresist material; and, the second portion comprises a negative photoresist material.
Optionally, the first portion comprises a metallic material; and, the second portion includes a photoresist material.
In another aspect, the present invention provides a display device comprising a display substrate as described herein or manufactured by the method described herein and one or more integrated circuits connected to the display substrate.
Drawings
The following drawings are merely exemplary for purposes of illustrating various embodiments in accordance with the disclosure and are not intended to limit the scope of the invention.
Fig. 1A is a cross-sectional view of a portion of a display substrate in some embodiments according to the present disclosure.
Fig. 1B is a cross-sectional view of a portion of a display substrate in some embodiments according to the present disclosure.
Fig. 2A is a plan view of a display substrate in some embodiments according to the present disclosure.
Fig. 2B is a plan view of a display substrate in some embodiments according to the present disclosure.
Fig. 2C is a plan view of a display substrate in some embodiments according to the present disclosure.
Fig. 3A is a schematic view illustrating a structure of a first barrier wall in some embodiments according to the present disclosure.
Fig. 3B is a schematic diagram illustrating the structure of the first barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure.
Fig. 3C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the first barrier wall in some embodiments according to the present disclosure.
Fig. 4A is a schematic view illustrating a structure of a second barrier wall in some embodiments according to the present disclosure.
Fig. 4B is a schematic diagram illustrating the structure of the second barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure.
Fig. 4C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the second barrier wall in some embodiments according to the present disclosure.
Fig. 5A is a schematic view illustrating a structure of a first barrier wall in some embodiments according to the present disclosure.
Fig. 5B is a schematic diagram illustrating the structure of the first barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure.
Fig. 5C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the first barrier wall in some embodiments according to the present disclosure.
Fig. 6A is a schematic view illustrating a structure of a second barrier wall in some embodiments according to the present disclosure.
Fig. 6B is a schematic diagram illustrating the structures of the second barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure.
Fig. 6C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the second barrier wall in some embodiments according to the present disclosure.
Fig. 7 is a cross-sectional view of a portion of a display substrate in some embodiments according to the present disclosure.
Fig. 8A is a schematic view illustrating a structure of a first barrier wall in some embodiments according to the present disclosure.
Fig. 8B is a schematic view illustrating the structure of the first barrier wall and the crack prevention layer in some embodiments according to the present disclosure.
Fig. 8C is a schematic view illustrating structures of the first barrier wall, the crack prevention layer, and the inorganic barrier layer in some embodiments according to the present disclosure.
Fig. 8D is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the first barrier wall in some embodiments according to the present disclosure.
Fig. 9A is a schematic view illustrating a structure of a second barrier wall in some embodiments according to the present disclosure.
Fig. 9B is a schematic view illustrating the structure of a second barrier wall and a crack prevention layer in some embodiments according to the present disclosure.
Fig. 9C is a schematic view illustrating structures of a second barrier wall, a crack prevention layer, and an inorganic barrier layer in some embodiments according to the present disclosure.
Fig. 9D is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the second barrier wall in some embodiments according to the present disclosure.
Fig. 10A-10C illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Fig. 11A-11C illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Fig. 12A-12C illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Fig. 13A-13D illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Fig. 14A-14E illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Fig. 15A-15D illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Fig. 16A-16F illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure.
Detailed Description
The present disclosure will now be described more specifically with reference to the following examples. It is noted that the following description of some embodiments is presented for purposes of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
It has been found in the present disclosure that display panels or display substrates are particularly susceptible to moisture and oxygen penetration into window areas formed to mount accessories such as cameras. The window region is typically formed by punching a hole through the display substrate. Therefore, once the window region is formed, the encapsulation layer may not encapsulate the display substrate. In particular, the manufacturing process of the organic light emitting diode display substrate generally employs an open mask process to deposit one or more organic material layers and an electrode layer without any patterning step, for example. The encapsulation layer in the window region fails to satisfactorily encapsulate these organic material layers and electrode layers, resulting in exposure of the display substrate to external oxygen and moisture. Furthermore, the process of forming the window region can potentially create cracks in the border adjacent to the window region. The cracks may propagate into the display area of the display substrate, further adversely affecting the display components in the display area.
Accordingly, the present disclosure provides, among other things, a method of manufacturing a display substrate, and a display apparatus that substantially obviate one or more of the problems due to limitations and disadvantages of the related art. In one aspect, the present disclosure provides a display substrate having a display area and a peripheral area. In some embodiments, a display substrate includes: a substrate base plate; a plurality of light emitting elements on the substrate base plate and in the display region; the packaging layer is positioned on one side of the plurality of light-emitting elements far away from the substrate and used for packaging the plurality of light-emitting elements; an insulating layer between the encapsulation layer and the substrate base plate; and a first barrier wall located in the peripheral region and on a side of the insulating layer away from the substrate, the first barrier wall forming a first enclosure substantially surrounding the first region. Optionally, the first barrier wall includes a first lower portion in contact with the insulating layer and a first upper portion located on a side of the first lower portion away from the insulating layer. Optionally, the orthographic projection of the first upper portion on the substrate base plate covers the orthographic projection of the first lower portion on the substrate base plate. Optionally, in a width direction from the peripheral region to the display region of the first barrier wall, a side of the first barrier wall away from the substrate base plate is wider than a side of the first barrier wall close to the substrate base plate.
As used herein, the term "display area" refers to an area of a display panel where an image is actually displayed on a display substrate (e.g., a counter substrate or an array substrate). Alternatively, the display region may include a sub-pixel region and an inter-sub-pixel region. The sub-pixel region refers to a light emitting region of a sub-pixel, such as a region corresponding to a pixel electrode in a liquid crystal display or a region corresponding to a light emitting layer in an organic light emitting diode display panel. The inter-subpixel region refers to a region between adjacent subpixel regions, such as a region corresponding to a black matrix in a liquid crystal display or a region corresponding to a pixel defining layer in an organic light emitting diode display panel. Optionally, the inter-sub-pixel region is a region between adjacent sub-pixel regions in the same pixel. Optionally, the inter-sub-pixel region is a region between two adjacent sub-pixel regions from two adjacent pixels.
As used herein, the term "peripheral area" refers to an area of a display substrate (e.g., a counter substrate or an array substrate) in a display panel where various circuits and traces for sending signals to the display substrate are disposed. To increase the transparency of the display device, non-transparent or non-transparent components of the display device (e.g., a battery, a printed circuit board, a metal frame) may be disposed in the peripheral region rather than in the display region.
The term "substantially surrounds" as used herein refers to surrounding at least 50% (e.g., at least 60%, at least 70%, at least 80%, at least 90%, at least 95%, at least 99%, and at least 100%) of the perimeter of a region.
Various suitable light emitting elements can be used in the present display panel. Examples of suitable light-emitting elements include: organic light emitting diodes, quantum dot light emitting diodes, and micro light emitting diodes.
Fig. 1A is a cross-sectional view of a portion of a display substrate in some embodiments according to the present disclosure. Fig. 1B is a cross-sectional view of a portion of a display substrate in some embodiments according to the present disclosure. Referring to fig. 1A and 1B, in some embodiments, the display substrate has a display area DA and a peripheral area PA. In some embodiments, a display substrate includes: a
Fig. 2A is a plan view of a display substrate in some embodiments according to the present disclosure. Referring to fig. 2A, a first enclosing wall formed by the
Fig. 2B is a plan view of a display substrate in some embodiments according to the present disclosure. Referring to fig. 2B, the display substrate has a substantially rectangular shape. In some embodiments, a first enclosing wall formed by the
Fig. 2C is a plan view of a display substrate in some embodiments according to the present disclosure. Referring to fig. 2C, the display substrate has a substantially circular shape. In some embodiments, a first enclosure formed by the first barrier walls located in the peripheral area PA substantially surrounds the first area EA 1. The first enclosing wall does not surround the display area DA, but substantially surrounds the inner peripheral area IPA, which is substantially surrounded by the display area DA. The area of the inner peripheral region IPA is equal to or larger than the area of the first region EA 1. Optionally, the peripheral region comprises an inner peripheral region IPA. Optionally, the first perimeter wall substantially surrounds a window region WR of the display substrate, the display substrate having a hole through the window region WR for mounting an accessory (e.g., a camera, a fingerprint sensor) therein. Alternatively, the area of the first region EA1 is equal to or larger than the area of the window region WR.
Referring to fig. 1A and 1B, in some embodiments, the first blocking wall is formed to have an undercut profile. Fig. 3A is a schematic view illustrating a structure of a first barrier wall in some embodiments according to the present disclosure. Fig. 3B is a schematic diagram illustrating the structure of the first barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure. Fig. 3C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the first barrier wall in some embodiments according to the present disclosure. Referring to fig. 3A, in some embodiments, the
As used herein, the term "side" is used in its original sense and refers without limitation to a side connecting the top and bottom sides, e.g., a side connecting the top side of the first lower portion 161l remote from the
In some embodiments, as shown in fig. 3A, the sides of the first lower portion 161l are not coplanar with the sides of the first
Referring to fig. 1A and 3B, in some embodiments, the display substrate further includes an
Specifically, referring to fig. 3A-3B, the
Referring to fig. 1A and 3C, in some embodiments, the display substrate further includes one or a combination of an organic material layer 142 (e.g., an organic light emitting layer) and a
The
Optionally, the
Referring to fig. 1A and 1B, in some embodiments, the
In one example, the at least one inorganic sub-layer (e.g., one or both of the first
In some embodiments, the display substrate may include any suitable number of barrier walls that each form a perimeter wall that substantially surrounds an area (e.g., the window area or display area discussed in fig. 2A and 2B). Alternatively, the display substrate may include a total number of barrier walls of 1 to 20. In some embodiments, as shown in fig. 1A, 1B, 2A and 2B, the display substrate further includes a second barrier wall 161' located in the peripheral area PA and located on a side of the insulating
In some embodiments, the second barrier wall 161' has a structure similar to that of the
In some embodiments, as shown in fig. 4A, the sides of the second lower portion 161'l are not coplanar with the sides of the second upper portion 161' u. Optionally, the second lower portion 161' l has a first side S1' (bottom side) in contact with the insulating
In some embodiments, the side of the second upper portion 161'u away from the
In some embodiments,
In some embodiments, one or a combination of the
In some embodiments, at least one inorganic encapsulation sublayer (e.g., one or both of the first
Optionally, each of the first and second fences substantially surrounds a window area of the display substrate, and the display substrate has a hole through the window area to mount the accessory therein. Examples of accessories that may be installed in the window area include: an earpiece, a camera, a light sensor, a distance sensor, an infrared sensor, a fingerprint sensor, an acoustic sensor, an indicator, a button, a knob, or any combination thereof.
In some embodiments, each of the first and
Various suitable materials and various suitable manufacturing methods may be used to fabricate the
In some embodiments, the
Referring to fig. 1 and 1B, in some embodiments, the display base plate further includes a
A corresponding one of the plurality of
In some embodiments, the display substrate further comprises: a
In some embodiments, the display substrate further comprises: and a
In some embodiments, the display substrate further includes a
Referring to fig. 1B, in some embodiments, the sides of the first lower portion are substantially coplanar with the sides of the first upper portion. Fig. 5A is a schematic view illustrating a structure of a first barrier wall in some embodiments according to the present disclosure. Fig. 5B is a schematic diagram illustrating the structure of the first barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure. Fig. 5C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the first barrier wall in some embodiments according to the present disclosure. The structure shown in fig. 5A to 5C is similar to the structure shown in fig. 3A to 3C except that the side surface of the first lower portion 161l is substantially coplanar with the side surface of the first
Fig. 6A is a schematic view illustrating a structure of a second barrier wall in some embodiments according to the present disclosure. Fig. 6B is a schematic diagram illustrating the structures of the second barrier wall and the inorganic barrier layer in some embodiments according to the present disclosure. Fig. 6C is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the second barrier wall in some embodiments according to the present disclosure. The structure shown in fig. 6A to 6C is similar to that shown in fig. 4A to 4C except that the side of the second lower portion 161'l is substantially coplanar with the side of the second upper portion 161' u. For example, as shown in fig. 6A, third side LS3 of second lower portion 161' l is substantially coplanar with third side LS3' of second upper portion 161' u. In another example, fourth side LS4 of second lower portion 161' l is substantially coplanar with fourth side LS4' of second upper portion 161' u.
In some embodiments, the display substrate further comprises: a crack prevention layer located in an angled space between a side of the first barrier wall and a surface of the insulation layer. Fig. 7 is a cross-sectional view of a portion of a display substrate in some embodiments according to the present disclosure. Referring to fig. 7, in some embodiments, the display substrate has a display area DA and a peripheral area PA. In some embodiments, a display substrate includes: a
Fig. 8A is a schematic view illustrating a structure of a first barrier wall in some embodiments according to the present disclosure. Fig. 8B is a schematic view illustrating the structure of the first barrier wall and the crack prevention layer in some embodiments according to the present disclosure. Fig. 8C is a schematic view illustrating structures of the first barrier wall, the crack prevention layer, and the inorganic barrier layer in some embodiments according to the present disclosure. Fig. 8D is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the first barrier wall in some embodiments according to the present disclosure. Referring to fig. 8A, in some embodiments, the
In some embodiments, first side LS1 of first lower portion 161l forms a first angled space AS1 with surface S of insulating
Optionally, the first
Referring to fig. 7 and 8C, in some embodiments, the display substrate further includes an
Specifically, referring to fig. 8A to 8C, the
By having the crack prevention layer 162 (including the first
Referring to fig. 7 and 8D, in some embodiments, the display substrate further includes one or a combination of an organic material layer 142 (e.g., an organic light emitting layer) and a
In one example, the at least one inorganic sub-layer (e.g., one or both of the first
Fig. 9A is a schematic view illustrating a structure of a second barrier wall in some embodiments according to the present disclosure. Fig. 9B is a schematic view illustrating the structure of a second barrier wall and a crack prevention layer in some embodiments according to the present disclosure. Fig. 9C is a schematic view illustrating structures of a second barrier wall, a crack prevention layer, and an inorganic barrier layer in some embodiments according to the present disclosure. Fig. 9D is a schematic diagram illustrating the structure of an organic material layer and a cathode layer on the second barrier wall in some embodiments according to the present disclosure. Referring to fig. 7, 9B to 9D, the
In some embodiments, the side of the second upper portion 161'u away from the
In some embodiments, the
In some embodiments, one or a combination of the
In some embodiments, at least one inorganic sub-layer of the encapsulation layer 150 (e.g., one or both of the first
Various suitable materials and various suitable manufacturing methods may be used to fabricate the crack-preventing
Alternatively, the
Alternatively, the
Alternatively, the
In another aspect, the present disclosure provides a method of manufacturing a display substrate having a display area and a peripheral area. In some embodiments, the method comprises: forming a plurality of light emitting elements on a base substrate and in a display region; forming an encapsulation layer on one side of the plurality of light-emitting elements far away from the substrate base plate, wherein the encapsulation layer is used for encapsulating the plurality of light-emitting elements; forming an insulating layer, wherein the insulating layer is formed between the encapsulation layer and the substrate base plate; and forming a first barrier wall in the peripheral region and on a side of the insulating layer away from the substrate base plate, the first barrier wall forming a first fence substantially surrounding the first region. Alternatively, the first barrier wall is formed to include a first lower portion that contacts the insulating layer and a first upper portion on a side of the first lower portion away from the insulating layer. Optionally, the orthographic projection of the first upper portion on the substrate base plate covers the orthographic projection of the first lower portion on the substrate base plate. Alternatively, the first barrier wall is formed such that a side of the first barrier wall remote from the substrate base plate is wider than a side of the first barrier wall close to the substrate base plate in a width direction of the first barrier wall from the peripheral region to the display region.
In some embodiments, the step of forming the first barrier wall includes: forming a negative photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; exposing the negative photoresist material layer by using a mask plate with a light-transmitting area corresponding to the first barrier wall to generate an exposed negative photoresist material layer; and developing the exposed negative photoresist material layer to form a first barrier wall. Optionally, the first blocking wall is formed with an undercut profile.
In some embodiments, the side surfaces of the first lower portion are substantially coplanar with the side surfaces of the first upper portion.
In some embodiments, the step of forming the first barrier wall includes: forming an image reversal photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate base plate; exposing the image reversal photoresist material layer by using a mask plate with a light transmission area corresponding to the first barrier wall to generate a first exposure photoresist material layer; reverse baking the first exposed photoresist material layer to produce a reverse photoresist material layer; exposing the reverse photoresist material layer to produce a second exposed photoresist material layer; and developing the second exposed photoresist material layer to form a first barrier wall. Optionally, the first blocking wall is formed with an undercut profile.
In some embodiments, the side surfaces of the first lower portion are substantially coplanar with the side surfaces of the first upper portion.
In some embodiments, the step of forming the first barrier wall includes: forming a first material layer in the peripheral region and on a side of the insulating layer away from the substrate base plate; forming a second material layer in the peripheral area and on the side of the first material layer far away from the substrate base plate; and patterning the first material layer and the second material layer to form a first barrier wall.
In some embodiments, the first material layer is a first positive photoresist material layer and the second material layer is a second positive photoresist material layer. Optionally, the first layer of positive photoresist material is more sensitive to exposure than the second layer of positive photoresist material. Optionally, the step of forming the first barrier wall includes: forming a first positive photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; forming a second positive photoresist material layer in the peripheral area and on the side of the first positive photoresist material layer away from the substrate; simultaneously exposing the first positive photoresist material layer and the second positive photoresist material layer by using a mask plate having a shading area corresponding to the first barrier wall to generate an exposed first positive photoresist material layer and an exposed second positive photoresist material layer; and developing the exposed first positive photoresist material layer and the exposed second positive photoresist material layer to form a first barrier wall. Optionally, the first lower portion is generated by developing the exposed first positive photoresist material layer. Optionally, the first upper portion is created by developing the exposed second positive photoresist material layer. Optionally, the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
In some embodiments, the first material layer is a positive photoresist material layer and the second material layer is a negative photoresist material layer. Optionally, the step of forming the first barrier wall includes: forming a positive photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; forming a negative photoresist material layer in the peripheral region and on a side of the positive photoresist material layer away from the substrate; exposing the negative photoresist material layer by using a first mask plate with a light-transmitting area corresponding to the first barrier wall to generate an exposed negative photoresist material layer; developing the exposed negative photoresist material layer to produce a first upper portion; exposing the positive photoresist material layer by using a second mask plate with a shading area corresponding to the first barrier wall to generate an exposed positive photoresist material layer; and developing the exposed positive photoresist material layer to produce a first lower portion. Optionally, the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
In some embodiments, the first material layer is a first negative photoresist material layer and the second material layer is a second negative photoresist material layer. Optionally, the second layer of negative photoresist material is more sensitive to exposure than the first layer of negative photoresist material. Optionally, the step of forming the first barrier wall includes: forming a first negative photoresist material layer in the peripheral region and on a side of the insulating layer away from the substrate; forming a second negative photoresist material layer in the peripheral area and on the side of the first negative photoresist material layer away from the substrate; simultaneously exposing the first negative photoresist material layer and the second negative photoresist material layer by using a mask plate having a light-transmitting region corresponding to the first barrier wall to generate an exposed first negative photoresist material layer and an exposed second negative photoresist material layer; and developing the exposed first negative photoresist material layer and the exposed second negative photoresist material layer to form a first barrier wall. Optionally, the first lower portion is generated by developing the exposed first negative photoresist material layer. Optionally, the first upper portion is created by developing the exposed second negative photoresist material layer. Optionally, the side surfaces of the first lower portion are not coplanar with the side surfaces of the first upper portion.
In some embodiments, the first material layer is a metal material layer and the second material layer is a photoresist material layer. Optionally, the step of forming the first barrier wall includes: forming a metal material layer in the peripheral area and on one side of the insulating layer away from the substrate; forming a photoresist material layer in the peripheral area and on one side of the metal material layer far away from the substrate base plate; exposing the photoresist material layer to produce an exposed photoresist material layer; developing the exposed photoresist material layer to form a first upper portion; and etching the metal material layer to form a first lower portion.
In some embodiments, the first lower portion has a first side in contact with the insulating layer and a second side opposite the first side, the first side and the second side being connected by a side face of the first lower portion; the first upper portion has a third side in contact with the first lower portion and a fourth side opposite the third side, the third and fourth sides being connected by a side of the first upper portion; and the third side is wider than the first and second sides in a width direction of the first blocking wall.
In some embodiments, the method further comprises: and forming a second barrier wall in the peripheral region and on the side of the insulating layer far away from the substrate base plate, wherein the second barrier wall forms a second enclosing wall which substantially surrounds the second region.
In some embodiments, the method further comprises: holes are punched through the display substrate to form window regions. Optionally, the first fence substantially surrounds the window area.
Fig. 10A-10C illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 10A, a negative
Fig. 11A-11C illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 11A, a first positive
Fig. 12A-12C illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 12A, a first negative
Fig. 13A-13D illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 13A, a positive
Fig. 14A-14E illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 14A, a
Fig. 15A-15D illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 15A, a
In some embodiments, the method further comprises: a crack prevention layer is formed in an angled space between a side surface of the first barrier wall and a surface of the insulating layer. Optionally, the step of forming a crack prevention layer includes: forming a positive photoresist material layer on one side of the first barrier wall far away from the substrate base plate; and patterning the positive photoresist material layer to form a crack prevention layer. Optionally, during the patterning of the positive photoresist material layer, the positive photoresist material layer is removed except for a portion located in an angled space between a side of the first barrier wall and a surface of the insulating layer, thereby forming a crack prevention layer.
In some embodiments, the first barrier wall is formed to include a first lower portion in contact with the insulating layer and a first upper portion on a side of the first lower portion away from the insulating layer. The side surface of the first lower portion is formed to be covered with the crack prevention layer, and the side surface of the first upper portion is formed without the crack prevention layer. An orthographic projection of the first upper portion on the substrate base plate covers an orthographic projection of the first lower portion on the substrate base plate. The first side of the first lower portion and the surface of the insulating layer form a first angled space. The second side of the first lower portion forms a second angled space with the surface of the insulating layer.
In some embodiments, the first barrier wall is formed such that a side of the first upper portion remote from the substrate base is wider than a side of the first upper portion close to the substrate base; and the side of the first lower part far away from the substrate base plate is wider than the side of the first lower part close to the substrate base plate. Optionally, a cross section of the first barrier wall along a plane perpendicular to the insulating layer in a direction from the first side face to the second side face has a substantially inverted trapezoidal shape.
In some embodiments, the crack prevention layer is formed to include a first crack prevention sub-layer located in the first angled space and a second crack prevention sub-layer located in the second angled space. Optionally, a second crack prevention sub-layer is formed to cover the first side of the first lower portion. Optionally, a second crack prevention sublayer is formed to cover the second side of the first lower portion. Alternatively, the first lower portion, the first crack prevention sub-layer, and the second crack prevention sub-layer are formed to together constitute a structure having a side away from the base substrate narrower than a side close to the base substrate. Alternatively, the crack prevention layer is formed such that a height of the first crack prevention sublayer with respect to the surface of the insulating layer is not more than half of a height of the first barrier wall with respect to the surface of the insulating layer, and a height of the second crack prevention sublayer with respect to the surface of the insulating layer is not more than half of the height of the first barrier wall with respect to the surface of the insulating layer.
In some embodiments, the method further comprises: an inorganic barrier layer covering the first barrier wall and the crack prevention layer is formed. The inorganic barrier layer is confined to the peripheral region. Alternatively, the inorganic barrier layer is formed in direct contact with the first barrier wall, the crack prevention layer, and the insulating layer. Alternatively, the inorganic barrier layer is formed to completely cover the side of the structure formed by the first barrier wall and the crack prevention layer together without cracks.
In some embodiments, the method further comprises: one or a combination of the organic material layer and the cathode layer is formed on one side of the inorganic barrier layer far away from the substrate, and the organic material layer and the cathode layer are separated into discontinuous parts by the side face of the first barrier wall.
In some embodiments, the method further comprises: an encapsulation layer is formed to encapsulate the plurality of light emitting elements. Optionally, at least one inorganic sublayer of the encapsulation layer is formed to extend from the display area into the peripheral area. Optionally, the at least one inorganic sublayer of the encapsulation layer is formed on a side of the inorganic barrier layer remote from the substrate base plate. Optionally, the at least one inorganic sublayer of the encapsulation layer is formed to completely cover, without cracks, the portions of the inorganic barrier layer covering the sides of the structure formed by the first barrier walls and the crack prevention layer together.
In some embodiments, the method further comprises: and forming a second barrier wall in the peripheral region and on the side of the insulating layer far away from the substrate base plate, wherein the second barrier wall forms a second enclosing wall which substantially surrounds the second region.
Fig. 16A-16F illustrate methods of manufacturing a display substrate in some embodiments according to the present disclosure. Referring to fig. 16A, a negative
Referring to fig. 16B, due to the properties of the negative photoresist material, the exposure and development of the negative photoresist material results in an undercut profile of the
Referring to fig. 16C, subsequently, a positive photoresist material layer 17 is formed on the insulating
Referring to fig. 16D, the positive photoresist material is removed except for the positive photoresist material in the first and second angled spaces AS1 and AS2 because the positive photoresist material in these spaces is not exposed to light. The
Referring to fig. 16E, an
Referring to fig. 16F, one or a combination of an
Referring to fig. 7, an
In another aspect, the present disclosure provides a display device comprising a display substrate described herein or manufactured by the method described herein and one or more integrated circuits connected to the display substrate. Optionally, the display device comprises a display panel. Optionally, the display panel comprises a display substrate as described herein or manufactured by the method as described herein, and a counter substrate. Examples of suitable display devices include, but are not limited to: electronic paper, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, GPS, and the like. Optionally, the display device further comprises one or more integrated circuits connected to the display panel.
The foregoing descriptions of embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or exemplary embodiments disclosed. The foregoing description is, therefore, to be considered illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in the art. The embodiments were chosen and described in order to explain the principles of the invention and its best mode practical application to enable one skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the following claims and their equivalents, in which all terms are to be interpreted in their broadest reasonable sense unless otherwise indicated. Thus, the terms "invention," "present invention," and the like, do not necessarily limit the scope of the claims to particular embodiments, and references to exemplary embodiments of the invention do not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. Furthermore, these claims may refer to the use of the terms "first," "second," etc. followed by a noun or element. Such terms are to be understood as a meaning and not as a limitation on the number of elements modified by such a meaning unless a specific number is given. Any advantages and benefits described do not necessarily apply to all embodiments of the invention. It will be appreciated by those skilled in the art that changes may be made to the embodiments described without departing from the scope of the invention as defined by the appended claims. Furthermore, no element or component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the appended claims.
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