阅读说明：本技术 一种电子数码***芯片自动分切设备 (Automatic cutting equipment for electronic digital laser tube chip ) 是由 刘毅 李新斌 黄志斌 谷峻峰 王浩 李兆歧 邵志 于 2019-10-29 设计创作，主要内容包括：一种电子数码雷管芯片自动分切设备,涉及一种雷管生产设备。包括将芯片模具自动传输到工作台上并定位的底模机构、将芯片上模具举起并将上下模具装配到一起的合模机构、起承重支撑并固定整台设备的架体机构、能够自动换取芯片并且做出分切操作同时能替换模具的取料分切换模机构、收集分切废料的废料收集机构、将底模提升到工作台上的底模升降机构、使底模弹簧手抓张开的底模顶尖机构、将储料仓内为分切的芯片推出的芯片出仓机构、承装并且举升芯片的上料机构、将装配后的上下模具推出的推模装置。本发明采用取料、分切、换模三位一体芯片分离方案,将复杂的工艺简单化,将设备的体积减小的同时并节约了成本且提高了生产效率。(An automatic cutting device for an electronic digital detonator chip relates to detonator production equipment. The automatic die cutting and cutting device comprises a bottom die mechanism for automatically conveying and positioning a chip die to a workbench, a die assembly mechanism for lifting the chip upper die and assembling an upper die and a lower die together, a frame body mechanism for lifting a bearing support and fixing the whole device, a material taking, cutting and die changing mechanism capable of automatically changing the chip and performing cutting operation and simultaneously replacing the die, a waste collecting mechanism for collecting cut waste materials, a bottom die lifting mechanism for lifting the bottom die to the workbench, a bottom die top mechanism for enabling a bottom die spring to manually grip an opened bottom die, a chip discharging mechanism for pushing out the cut chips in a storage bin, a loading mechanism for loading and lifting the chips, and a die pushing device for pushing out the assembled upper die and lower dies. The invention adopts a trinity chip separation scheme of material taking, cutting and mold changing, simplifies the complex process, reduces the volume of the equipment, saves the cost and improves the production efficiency.)

1. An automatic cutting device for an electronic digital thunder chip is characterized in that the device is connected with a transmission device, a cylinder on the transmission device is used for placing a bottom die on a bottom die lifting part (7) arranged on a frame body (3), the bottom die lifting part (7) is lifted to be arranged on a table board, the bottom die is pulled to the other side and is arranged at a blocking cylinder, two bottom die molds which are arranged side by side are arranged in a table board slideway, a loading mechanism (10) is provided with uncut chips and is arranged right in front of the bottom die molds which are arranged side by side, two chip warehouse outlet mechanisms (9) and a loading mechanism (10) which are arranged side by side are provided with chips, meanwhile, a whole-plate chip hand-grasping (4-3) telescopic cylinder stretches out to grasp and clamp the chips, a rodless cylinder on a material taking and mold changing mechanism (4) slides and is connected with the chips to a chip separating mechanism (6), and the whole-plate chip hand grasping (4-3) grasps the chips, meanwhile, a knife on the chip splitting mechanism (4-2) is connected through a cylinder, a chip separating mechanism (6) is connected with the chip through a cylinder, a waste material slide way (5) is communicated with a collecting box, a mold changing hand-holding portion (4-1) holds the chip and is connected with the chip through a rodless cylinder to be sent into a bottom mold which is placed in parallel at the moment and is jacked up by a bottom mold jacking mechanism (8), a bottom mold translation portion (2) is close to the other side, the bottom mold close to the front side enters the right lower portion of mold closing lifting (1), the mold closing lifting (1) cylinder stretches out and enters an upper mold of the chip splitting device from a transmission device to descend and is assembled with the bottom mold, and a combined mold of a mold pushing device (11) is connected to the transmission.

2. The automatic electronic digital thunder chip slitting device according to claim 1, wherein the die assembly lifting (1) is provided with a bottom die translation part (2), a material taking, slitting and die changing mechanism (4), a waste material slide way (5), a chip separating mechanism (6), an upper bottom die lifting part (7), a bottom die tip mechanism (8), a chip warehouse discharging mechanism (9), a feeding mechanism (10) and a die pushing device (11) which are all mounted on a bottom plate directly above the frame body (3).

Technical Field

The invention relates to detonator production equipment, in particular to automatic cutting equipment for an electronic digital detonator chip.

Background

At present, all domestic factories do not have reliable-forming automatic digital detonator chip slitting equipment in the field of digital detonator production and assembly, and most factories adopt manual assembly of chips in a mold. The main problems of the mode are that 1, the number of operators is large; 2. the labor intensity is high, and the production efficiency is low; 3. the operator directly contacts the detonator, the man-machine isolation is not realized, the personnel danger is high, and the requirements of safe production and safe personnel ordering cannot be met. Improvements are needed.

Disclosure of Invention

The invention aims to provide automatic cutting equipment for chips of an electronic digital detonator.

The purpose of the invention is realized by the following technical scheme:

an automatic cutting device for chips of electronic digital thunder is connected with a transmission device, a cylinder on the transmission device is used for placing a bottom die on a bottom die lifting part arranged on a frame body, the bottom die is lifted on a table board after the bottom die lifting part is lifted, the bottom die is pulled to the other side and is arranged at a stop cylinder, two bottom die molds which are arranged side by side are arranged in a table board slideway, a feeding mechanism is provided with a chip which is not cut and is arranged right ahead the bottom die molds which are arranged side by side, two chip warehouse-out mechanisms which are arranged side by side and a chip are arranged in the feeding mechanism, meanwhile, a whole chip hand-grasping telescopic cylinder extends out of the hand-grasping clamping chip, a rodless cylinder on a material taking and cutting mechanism slides and is connected with the chip to a chip separating mechanism, the whole chip hand-grasping chip is clamped on the chip separating mechanism, a knife on the chip cutting mechanism is connected through the cylinder, the die change hand gripping part grabs the chip and is connected the chip by rodless cylinder and send into the bottom mould that places side by side this moment and by the top mechanism jack-up spring hand claw of die block in, die block translation portion die block is by the opposite side, and the die block that leans on preceding one side gets into under the compound die goes up and down, and compound die lift cylinder stretches out and gets into the last mould decline of chip slitting equipment and accomplish the assembly with the die block from the transmission equipment simultaneously with the die block, and the assembling die of ejector tooling is connected to on the transmission equipment.

The automatic cutting equipment for the electronic digital thunder chip is characterized in that the die assembly lifting bottom die translation part, the material taking cutting die changing mechanism, the waste material slide way, the chip separating mechanism, the bottom die lifting part, the bottom die tip mechanism, the chip warehouse discharging mechanism feeding mechanism and the die pushing device are all arranged on a bottom plate directly above the frame body.

The invention has the advantages and effects that:

the invention perfects the whole digital detonator production line, realizes complete man-machine isolation, solves the potential safety hazard in the production process, meets the requirement of safety personnel, and has the characteristics of safety, reliability, labor intensity reduction and the like.

The invention has simple structure and convenient operation. The mode of automatically arranging and cutting chips is used, so that the aim of man-machine isolation of dangerous working procedures is fulfilled, potential safety hazards are eliminated, and the production safety is improved; the labor intensity is reduced; the number of field workers is reduced, full-line automatic production is completed, digital and informatization production management is realized, and the safety production management level and the production efficiency are further improved. The practicability is strong.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a mold closing lifting structure of the present invention;

FIG. 3 is a schematic structural view of a bottom mold translation mechanism according to the present invention;

FIG. 4 is a schematic structural view of a frame body mechanism according to the present invention;

FIG. 5 is a schematic structural view of a material taking, slitting and die changing mechanism according to the present invention;

FIG. 5-1 is a schematic view of the chip mold changing gripper mechanism and the frame structure according to the present invention;

FIG. 5-2 is a schematic view of a chip splitting mechanism according to the present invention;

fig. 5-3 are schematic structural views of the whole-board chip hand-grasping mechanism of the invention.

FIG. 6 is a schematic view of the structure of the waste chute mechanism and frame of the present invention;

FIG. 7 is a schematic diagram of a chip separating mechanism and a frame structure according to the present invention;

FIG. 8 is a schematic diagram of a bottom die lifting mechanism and a frame structure according to the present invention;

fig. 9 is a schematic structural view of a bottom die center mechanism and a frame body according to the present invention;

FIG. 10 is a schematic view of a chip discharge mechanism and a frame structure according to the present invention;

FIG. 11 is a schematic view of a feeding mechanism and a frame structure according to the present invention;

FIG. 12 is a schematic view of a mold pushing mechanism and a frame structure according to the present invention;

fig. 13 is a schematic view of the waste collecting mechanism and the frame structure of the present invention.

In the figure: 1. a mold closing lifting device; 2. a bottom die translation mechanism; 3. a frame body mechanism; 4. a material taking, slitting and die changing mechanism; 5. a waste chute mechanism; 6. a chip separation mechanism; 7. a bottom die tip mechanism; 8. a chip delivery mechanism; 9. a feeding mechanism; 10. a feeding mechanism; 11. and (4) a mold pushing device.

Detailed Description

The present invention will be described in detail with reference to the embodiments shown in the drawings.

As shown in fig. 1, the automatic cutting device for digital detonator chips of the present invention comprises a top die, a bottom die entering device, a bottom die translation mechanism 2 for loading cut and separated chips and assembling the chips into a combined die ejecting device, a conveying device 1, a bottom die translation mechanism 2 for loading the bottom die into the device, a chip separating and separating mechanism 3 for separating the chips in a storage bin and feeding the chips into a corresponding bottom die chip cutting and mold changing mechanism, a chip separating mechanism 4 for separating the cut chips and feeding the chips into a designated position, a mold closing and lifting mechanism 5 for forming a combined die by the top die and the bottom die, a pushing mechanism 6 for ejecting the combined die to the conveying device, a waste material slideway mechanism 7 for guiding waste materials to enter a waste material collector, and a waste material collecting mechanism for collecting and storing. Referring to fig. 1 to 13, the working process principle of the present invention is as follows:

the cylinder on the transmission equipment connected with the equipment pushes the bottom die into a bottom die lifting part 7 arranged on a frame body 3, the bottom die lifting part 7 lifts the bottom die to a table top after being lifted under the action of the cylinder, a cylinder of a bottom die translation part 2 drives a pulling plate to do linear motion to pull the bottom die to the other side to touch a blocking cylinder to stop resisting force, the operation is repeated until two bottom die molds which are parallel are arranged in a table top slideway, meanwhile, a feeding mechanism 10 cylinder drives two bins to send chips which are not cut to the right front of the parallel bottom die molds, tooth-carrying push plates on two parallel chip bin outlet mechanisms 9 are driven by the cylinder to do linear motion to push out the chips in a feeding mechanism 10, meanwhile, a whole plate chip hand-gripping 4-3 telescopic cylinder extends to drive a hand claw to move downwards, the hand gripping chip is stopped and the telescopic cylinder retracts to drive the hand claw gripping the chip to lift, a rodless cylinder on the material taking, cutting and mold changing mechanism 4 makes linear motion and drives a chip clamping mechanism to clamp a chip onto a chip separating mechanism 6, at the moment, a whole plate chip paw 4-3 paw is loosened to clamp the chip onto the chip separating mechanism 6, the rodless cylinder makes linear motion to return to the original position, a knife on a chip cutting mechanism 4-) is driven by the cylinder to fall down to cut the chip and then return to the original position, the cylinder of the chip separating mechanism 6 drives the chip to move forwards and gradually separate, the generated waste materials flow into a collecting box along a waste material slideway 5, a mold changing paw portion 4-1 grabs the chip at the moment and drives the chip to be fed into a bottom mold which is arranged in parallel at the moment by the rodless cylinder to be jacked into a spring paw by a bottom mold jacking mechanism 8, the rodless cylinder returns to the original position, a bottom mold translation portion) pulls the bottom mold to the other side, and the bottom mold close to the front side enters, the matched die lifting 1 cylinder extends out to drive an upper die which enters the chip slitting equipment from the conveying equipment and the bottom die to descend and complete assembly with the bottom die at the same time, and then the die pushing device 11 pushes out the combined die at the moment to the conveying equipment.

A cylinder on a conveying device connected with the device pushes a bottom die into a bottom die lifting part 7 arranged on a frame body 3, the bottom die lifting part 7 lifts the bottom die to a table board, a bottom die translation part 2 pulls the bottom die to the other side to touch a blocking cylinder to stop, the operation is repeated until two bottom die molds which are parallel are arranged in a table board slideway, meanwhile, a feeding mechanism 10 sends chips which are not cut to the right front of the parallel bottom die molds, two parallel chip warehouse-out mechanisms 9 push out the chips in the feeding mechanism 10, meanwhile, a whole-plate chip hand-grasping 4-3 telescopic cylinder extends out to grasp the chips by hand, a rodless cylinder on a material taking and cutting and mold changing mechanism 4 slides and drives the chips to a chip separating mechanism 6, at the moment, the whole-plate chip hand grasping 4-3 hand-releases that the chips are clamped on the chip separating mechanism 6, and the rodless cylinder returns to the original position, meanwhile, a knife on the chip splitting mechanism 4-2 is driven by a cylinder to fall down to cut the chip and then the knife returns to the original position, a chip separating mechanism 6 drives the chip to move forward and simultaneously and gradually separate, the generated waste material flows into a collecting box along a waste material slideway 5, a die changing hand gripping part 4-1 grips the chip at the moment and is driven by a rodless cylinder to send the chip into a bottom die which is arranged in parallel at the moment and is jacked up by a bottom die top mechanism 8 into a spring paw, and the rodless cylinder returns to the original position, and simultaneously, the bottom die translation part 2 pulls the bottom die to the other side, the bottom die close to the front side enters right below the die assembly lifting 1, the die assembly lifting 1 cylinder stretches out to drive an upper die which enters the chip slitting equipment from the conveying equipment and simultaneously with the bottom die to descend and complete assembly with the bottom die, and then the die pushing device 11 pushes out the combined die at the moment to the conveying equipment. This is the overall motion flow of this device.

The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like of the present invention shall be included in the protection scope of the present invention.