阅读说明：本技术 一种纤维增强的电子设备背板及其制备方法 (Fiber-reinforced electronic equipment back plate and preparation method thereof ) 是由 严庆云 纪磊 周洪涛 何玲玲 于 2018-07-04 设计创作，主要内容包括：本发明实施例提供了一种纤维增强的电子设备背板及其制备方法,其中该纤维增强的电子设备背板,包括背板基板和增强纤维膜；所述增强纤维膜粘贴在所述背板基板的内侧面。本发明提供的纤维增强的电子设备背板,通过在背板基板的内侧粘贴有增强纤维膜,可以提高电子设备背板的抗冲击强度,降低电子设备背板的破碎概率；同时可以保证在电子设备背板出现破碎时,碎片仍然原位粘附在增强纤维膜上,因此依然能保持电子设备背板的形态,不会造成碎片的飞溅,从而可以避免出现相关安全隐患。(The embodiment of the invention provides a fiber-reinforced electronic equipment backboard and a preparation method thereof, wherein the fiber-reinforced electronic equipment backboard comprises a backboard substrate and a reinforced fiber membrane; the reinforced fiber membrane is adhered to the inner side surface of the back plate substrate. According to the fiber-reinforced electronic equipment back plate, the reinforced fiber membrane is adhered to the inner side of the back plate substrate, so that the impact strength of the electronic equipment back plate can be improved, and the breakage probability of the electronic equipment back plate is reduced; meanwhile, when the electronic equipment back plate is broken, the fragments are still adhered to the reinforced fiber membrane in situ, so that the form of the electronic equipment back plate can be still maintained, the fragments cannot splash, and the occurrence of related potential safety hazards can be avoided.)

1. A fiber-reinforced electronic device backplane is characterized by comprising a backplane substrate and a fiber-reinforced membrane; the reinforced fiber membrane is adhered to the inner side surface of the back plate substrate.

2. The electronic device backplane according to claim 1, wherein the backplane substrate is made of an inorganic non-metallic material, preferably ceramic, glass or glass-ceramic.

3. The electronic device backplane of claim 2, wherein the ceramic is a zirconia ceramic.

4. The electronic device backplane of claim 2, wherein the glass-ceramic is a lithium silicate glass-ceramic.

5. The electronic device backsheet of claim 1, wherein the reinforcing fiber membrane has an elastic modulus of: 60-300GPa, and preferably the reinforced fiber membrane is a bidirectional fiber membrane.

6. The electronic device backsheet of claim 1, wherein the reinforcing fiber film is selected from an aramid fiber film, a carbon fiber film, a glass fiber film, a quartz fiber film, or a polyethylene fiber film.

7. The electronic device backsheet of claim 1, wherein the reinforcing fiber film has a thickness of 0.05-0.5 mm.

8. The method of making an electronic device backplane of any of claims 1-7, comprising:

obtaining a back plate substrate and a reinforced fiber membrane;

coating a coupling agent on the inner side surface of the back plate substrate, and coating an adhesive after drying;

and (3) flatly paving the reinforced fiber membrane on the inner side surface of the back plate substrate coated with the adhesive, and carrying out curing treatment.

9. The method for preparing the electronic device backplane according to claim 8, wherein the coupling agent is at least one selected from a zirconate coupling agent, a phosphate monomer 10-methacryloyloxydecyl dihydrogen phosphate, an aluminate coupling agent, an aluminum-titanium composite coupling agent, and an aluminum-zirconium composite coupling agent.

10. The method for preparing the electronic device back sheet according to claim 8, wherein the adhesive is at least one selected from a photo-curing adhesive, a thermal curing adhesive, a reactive adhesive and an air-drying adhesive, and preferably the adhesive is at least one selected from an epoxy adhesive, an acrylate adhesive and an unsaturated resin adhesive.

Technical Field

The invention relates to the technical field of electronic equipment back plates, in particular to a fiber-reinforced electronic equipment back plate and a preparation method thereof.

Background

With the development of electronic technology, electronic components in electronic devices, such as mobile phones, are more and more, and therefore, the contacts between the electronic components inside the electronic devices are also more and more compact, and a back plate (also referred to as a back case of the electronic device) of the electronic device, which is an important part of the electronic device, mainly functions to protect the electronic device from being damaged from the outside.

With the development of material science, plastics, metals, inorganic non-metallic materials and the like are used for manufacturing the backboard of the electronic equipment; among them, plastics are gradually being eliminated because of their poor scratch resistance and their thickness not being too thin. In addition, with the development of the 5G technology, since the requirement of the 5G signal on signal transmission is very strict, and the metal material itself has a certain signal shielding effect, it is difficult to adapt to the development trend of future electronic devices. Inorganic nonmetallic materials, such as ceramics, glasses, and glass ceramics (also referred to as glass ceramics) interposed between ceramics and glasses, have attracted attention because they can overcome the above-mentioned defects of plastics and metals.

However, inorganic non-metallic materials, such as zirconia ceramics, glass, etc., have poor toughness, are brittle materials, and are fragile after being impacted by external force. The manufacturing process of the existing electronic equipment back plate made of inorganic non-metallic materials is generally only to process the back plate to a standard size and directly put into the market after polishing, and is free of any explosion-proof treatment and auxiliary reinforcing treatment, so that the phenomenon of falling and breaking of the product after being put into the market is avoided, the broken inorganic non-metallic material back cover can form sharp fragments generally, meanwhile, the fragments can splash, related safety problems exist, and potential safety hazards are left for the application of the electronic equipment back plate made of inorganic non-metallic materials.

Disclosure of Invention

The invention aims to provide a fiber-reinforced electronic equipment backboard so as to solve the potential safety hazard of the conventional electronic equipment backboard made of inorganic non-metallic materials. Meanwhile, the invention also provides a preparation method of the fiber-reinforced electronic equipment backboard. The specific technical scheme is as follows:

the invention firstly provides a fiber-reinforced electronic equipment back plate, which comprises a back plate substrate and a reinforced fiber membrane; the reinforced fiber membrane is adhered to the inner side surface of the back plate substrate.

In some embodiments of the present invention, the material of the back plate substrate is an inorganic non-metallic material, preferably ceramic, glass or glass ceramic.

In some embodiments of the invention, the ceramic is a zirconia ceramic.

In some embodiments of the invention, the glass-ceramic is a lithium silicate glass-ceramic.

In some embodiments of the invention, the reinforcing fiber membrane has an elastic modulus of: 60-300GPa, and preferably the reinforced fiber membrane is a bidirectional fiber membrane.

In some embodiments of the invention, the reinforcing fiber film is selected from an aramid fiber film, a carbon fiber film, a glass fiber film, a quartz fiber film, or a polyethylene fiber film.

In some embodiments of the invention, the thickness of the reinforced fiber membrane is 0.05 to 0.5 mm.

The invention also provides a preparation method of the electronic equipment backboard, which comprises the following steps:

obtaining a back plate substrate and a reinforced fiber membrane;

coating a coupling agent on the inner side surface of the back plate substrate, and coating an adhesive after drying;

and (3) flatly paving the reinforced fiber membrane on the inner side surface of the back plate substrate coated with the adhesive, and carrying out curing treatment.

In some embodiments of the present invention, the coupling agent is at least one selected from a zirconate coupling agent, a phosphate monomer 10-methacryloyloxydecyl dihydrogen phosphate, an aluminate coupling agent, an aluminum-titanium composite coupling agent, and an aluminum-zirconium composite coupling agent.

In some embodiments of the present invention, the adhesive is selected from at least one of a photo-curing adhesive, a thermal curing adhesive, a reactive adhesive, and an air-drying adhesive, and preferably, the adhesive is selected from at least one of an epoxy adhesive, an acrylate adhesive, and an unsaturated resin adhesive.

According to the fiber-reinforced electronic equipment back plate, the reinforced fiber membrane is adhered to the inner side of the back plate substrate, so that the impact strength of the electronic equipment back plate can be improved, and the breakage probability of the electronic equipment back plate is reduced; meanwhile, when the electronic equipment back plate is broken, the fragments are still adhered to the reinforced fiber membrane in situ, so that the form of the electronic equipment back plate can be still maintained, the fragments cannot splash, and the occurrence of related potential safety hazards can be avoided.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a top view of a tool used in the testing of the present invention;

FIG. 2 is a side view of a tool used in the testing of the present invention;

fig. 3 shows the positional relationship between the mobile phone backplane/backplane substrate and the fixture during testing.

Detailed Description

The invention firstly provides a fiber-reinforced electronic equipment back plate, which comprises a back plate substrate and a reinforced fiber membrane; the reinforced fiber membrane is adhered to the inner side surface of the back plate substrate.

According to the invention, the reinforced fiber membrane with high elastic modulus is compounded with the backboard substrate, so that the overall impact strength of the backboard of the electronic equipment is improved.

In the present invention, the electronic device may be a mobile electronic device, such as a mobile phone, a tablet computer, etc. Accordingly, the electronic device backplane may be a mobile phone backplane, a tablet computer backplane, or the like.

In the present invention, the backplane substrate refers to a backplane that has been manufactured according to the existing backplane manufacturing process and can be used for assembling electronic devices, and is different from the fiber-reinforced backplane for electronic devices of the present invention in that the fiber-reinforced backplane does not have a fiber-reinforced film.

In the present invention, the inner side surface of the electronic device backplane substrate refers to a surface of the backplane substrate close to electronic components inside the device.

It can be understood that the technical scheme of the invention can be applied to the electronic equipment back plate made of any material so as to improve the shock resistance of the back plate; the back plate is particularly suitable for the electronic equipment back plate with the back plate substrate made of fragile materials; therefore, in some embodiments of the present invention, the material of the backplane substrate of the electronic device is an inorganic non-metallic material with poor toughness and brittle performance; more specifically, the material of the backplate substrate is ceramic, glass ceramic or the like. In the present invention, the terms "ceramic" and "glass-ceramic" between the ceramic and the glass (also referred to as "glass-ceramics") have the common meanings in the field of inorganic nonmetallic materials, and their respective components, structural features, preparation processes and the specific varieties contained in them can be determined by those skilled in the art without creative efforts, and the details of the present invention are not repeated herein. In some more specific embodiments of the present invention, the material of the electronic device back plate is zirconia ceramic; in another more specific embodiment of the present invention, the material of the electronic device back plate is lithium silicate glass ceramic.

The reinforced fiber membrane adopted by the invention refers to a fiber membrane with higher elastic modulus, and it can be understood that the larger the elastic modulus of the fiber membrane is, the better the elastic modulus is; in some embodiments of the invention, the reinforcing fiber membrane has an elastic modulus of: 60-300GPa, and in some embodiments of the invention, the reinforcing fiber membrane has an elastic modulus of: 60-200 GPa. Preferably, the reinforced fiber membrane is a bidirectional fiber membrane, and the bidirectional fiber membrane is a fiber membrane formed by interweaving fiber yarns transversely and longitudinally, so that bidirectional tension can be borne, and the impact resistance effect is better. The reinforced fiber membranes adopted by the invention are all commercial products, and a person skilled in the art can select a proper reinforced fiber membrane to realize the technical scheme of the invention according to actual needs; in some more specific embodiments of the present invention, the reinforcing fiber film is selected from an aramid fiber film, a carbon fiber film, a glass fiber film, a quartz fiber film, or a polyethylene fiber film.

In some embodiments of the invention, the thickness of the reinforced fiber membrane is 0.05 to 0.5 mm. In the specific implementation process, a person skilled in the art can select a reinforced fiber membrane with a proper thickness according to actual needs; in the specific implementation process, a layer of reinforced fiber film may be adhered to the inner side surface of the back plate substrate, or multiple layers of reinforced fiber films may be adhered to the inner side surface of the back plate substrate. For example, when the elastic modulus of the reinforcing fiber film is small or the thickness is small, the elastic modulus or the thickness can be further increased by compounding a plurality of layers of the fiber films.

In the specific implementation process, the size of the reinforced fiber membrane is preferably consistent with that of the inner side surface of the back plate substrate, so that the reinforced fiber membrane can completely cover the inner side surface of the back plate substrate, and the optimal safe explosion-proof effect is realized.

The invention also provides a preparation method of the fiber-reinforced electronic equipment back plate, which comprises the following steps:

(1) obtaining a back plate substrate and a reinforced fiber membrane;

(2) coating a coupling agent on the inner side of the electronic equipment back plate, and coating an adhesive after drying;

(3) and (3) flatly laying the reinforced fiber membrane on the inner side of the electronic equipment back plate coated with the adhesive, and carrying out curing treatment.

In some embodiments of the present invention, the coupling agent used in step (2) may be at least one selected from a zirconate coupling agent, phosphate monomer 10-methacryloyloxydecyl dihydrogen phosphate, an aluminate coupling agent, an aluminum-titanium composite coupling agent, and an aluminum-zirconium composite coupling agent. By applying the coupling agent, the adhesive strength can be enhanced.

In some embodiments of the present invention, the adhesive used in step (2), which is divided by the curing manner, may be at least one selected from the group consisting of a photo-curing adhesive, a thermal-curing adhesive, a reactive adhesive, and an air-drying adhesive; the adhesive can be at least one selected from epoxy resin adhesive, acrylate adhesive and unsaturated resin adhesive according to the composition division. In practice, the curing of step (3) may be determined according to the particular adhesive used, and the curing conditions required for the adhesive.

In the concrete implementation process, after the solidification is finished, a rough edge trimming step can be carried out according to actual needs, and rough edges of fiber film corners of the solidified electronic equipment backboard are removed by using a tool.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Electronic device backplane preparation examples