阅读说明：本技术 一种二次元坐标系旋转补偿测量方法及装置 (Rotation compensation measurement method and device for quadratic element coordinate system ) 是由 龚成文 温永阔 胡靖� 于 2019-09-30 设计创作，主要内容包括：本发明涉及晶体管式封装技术领域,尤其涉及一种二次元坐标系旋转补偿测量方法；包括：建立管座基础坐标系；以夹具的X轴边线和Y轴边线画线,并以X轴边线和Y轴边线的焦点为原点；画出所述管座外圆和所述管座两个绝缘子圆；将两个绝缘子圆心连接起来构造拟合线；将所述管座基础坐标系圆心平移至所述管座圆心,将管座基础坐标系按照拟合线的角度进行旋转并保存旋转补偿后的坐标系；画出管座芯片光敏区域,根据坐标算法,得到光敏区域相对于旋转补偿后的坐标系坐标位置。根据光敏区域相对于旋转补偿后的坐标系坐标位置对管座固晶位置进行调节。本发明实施例运用坐标系旋转补偿,最大程度保证TO产品芯片固晶的准确性。(The invention relates to the technical field of transistor type packaging, in particular to a rotation compensation measurement method for a quadratic element coordinate system; the method comprises the following steps: establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focus of the X-axis sideline and the Y-axis sideline as an origin; drawing an excircle of the tube seat and two insulator circles of the tube seat; connecting the centers of the two insulators to construct a fit line; translating the circle center of the tube seat basic coordinate system to the circle center of the tube seat, rotating the tube seat basic coordinate system according to the angle of a fitting line and storing the coordinate system after rotation compensation; and drawing a light-sensitive area of the tube seat chip, and obtaining the coordinate position of the light-sensitive area relative to the coordinate system after rotation compensation according to a coordinate algorithm. And adjusting the die bonding position of the tube seat according to the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation. The embodiment of the invention utilizes the coordinate system rotation compensation, and ensures the die bonding accuracy of the TO product chip TO the maximum extent.)

1. A rotation compensation measurement method for a two-dimensional coordinate system is characterized by comprising the following steps:

s1, establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focuses of the X-axis sideline and the Y-axis sideline as an origin;

s2, drawing the excircle of the tube seat and two insulator circles of the tube seat through image measurement; specifically, the method comprises the steps of connecting the centers of the two insulators to form a fit line;

s3, translating the circle center of the tube socket base coordinate system to the circle center of the tube socket, rotating the tube socket base coordinate system according to the angle of a fitting line and storing the coordinate system after rotation compensation;

and S4, drawing the photosensitive area of the tube socket chip through image measurement again, and obtaining the coordinate position of the photosensitive area relative to the coordinate system after rotation compensation according to a coordinate algorithm.

And S5, adjusting the die bonding position of the tube seat according to the coordinate position of the photosensitive area relative to the coordinate system after rotation compensation.

2. A two-dimensional coordinate system rotation compensation measuring method according to claim 1, wherein the coordinate algorithm in step S4 specifically includes:

s41, constructing a virtual right triangle according to the X axis of the coordinate system after the rotation compensation and the circle center of the photosensitive area, and obtaining a virtual angle and the distance between the photosensitive area and the circle center of the tube seat;

and S42, obtaining the distance between the two right-angled edges according to the rectangular trigonometric function, namely the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation.

3. A two-dimensional coordinate system rotation compensation measuring device, comprising:

the measuring module (1) is used for establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focuses of the X-axis sideline and the Y-axis sideline as an origin; drawing the excircle of the tube seat, two insulator circles of the tube seat and a tube seat chip photosensitive area through image measurement; connecting the centers of the two insulators to construct a fit line;

the calculation module (2) translates the circle center of the tube seat basic coordinate system to the circle center of the tube seat, rotates the tube seat basic coordinate system according to the angle of a fitting line and stores the coordinate system after rotation compensation; obtaining the coordinate position of the photosensitive area relative to the coordinate system after rotation compensation according to a coordinate algorithm;

and the position adjusting module (3) is used for adjusting the die bonding position of the tube seat according to the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation.

4. A rotation-compensated measuring device of a two-dimensional coordinate system according to claim 3, characterized in that the calculating module (2) comprises in particular: constructing a virtual right-angled triangle according to the X axis of the coordinate system after the rotation compensation and the circle center of the photosensitive area to obtain a virtual angle and the distance between the photosensitive area and the circle center of the tube seat; and solving the distance between the two rectangular edges according to the rectangular trigonometric function, namely the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation.

Technical Field

The invention relates to the technical field of transistor type packaging, in particular to a rotation compensation measurement method and device for a quadratic element coordinate system.

Background

The semiconductor TO-CAN (transistor-type package) has the advantages of small volume, light weight, high efficiency, long service life, easiness in modulation, low price and the like, and is widely applied TO the fields of industry, medicine and military, such as material processing, optical fiber communication, laser ranging, target indication, laser guidance, laser radar, space optical communication and the like. With the continuous development of the TO-CAN (transistor-packaged) semiconductor in various application fields, the requirements on the precision of chip precision fixing and mounting of the TO-CAN (transistor-packaged) semiconductor product are higher and higher.

At present, the measurement of the TO encapsulation die bonding mounting is always carried out by taking a mechanical coordinate system of measurement equipment as a reference coordinate system; for example, in the TO-CAN 46 product packaging process, tube seats with various PIN positions such as 2PIN, 3PIN, 4PIN … … 7PIN, 8PIN and the like exist, and the accuracy in normal measurement is inaccurate due TO the mismatching of a measuring clamp and the rotation of the tube seats in the packaging process, and the method is particularly obvious in high-speed products (note that the high-speed products require eccentric mounting on a photosensitive surface of a chip so as TO meet the requirement of the return loss degree of the products in the using process and ensure the normal signal transmission).

The mechanical coordinate system of the product cannot be accurately measured due TO the fact that the TO tube seat rotates slightly, so that the chip mounting precision of the product is seriously affected, and finally the product performance cannot meet the requirement.

Disclosure of Invention

In order TO overcome the defects of the prior art, the invention provides a rotation compensation measurement method and device for a quadratic element coordinate system, which can ensure the die bonding and mounting accuracy of a TO product chip TO the maximum extent.

On one hand, the invention embodiment provides a two-dimensional coordinate system rotation compensation measuring method, which comprises the following steps:

s1, establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focuses of the X-axis sideline and the Y-axis sideline as an origin;

s2, drawing the excircle of the tube seat and two insulator circles of the tube seat through image measurement; specifically, the method comprises the steps of connecting the centers of the two insulators to form a fit line;

s3, translating the circle center of the tube socket base coordinate system to the circle center of the tube socket, rotating the tube socket base coordinate system according to the angle of a fitting line and storing the coordinate system after rotation compensation;

and S4, drawing the photosensitive area of the tube socket chip through image measurement again, and obtaining the coordinate position of the photosensitive area relative to the coordinate system after rotation compensation according to a coordinate algorithm.

And S5, adjusting the die bonding position of the tube seat according to the coordinate position of the photosensitive area relative to the coordinate system after rotation compensation.

On the other hand, the rotation compensation measuring device of the two-dimensional coordinate system in the embodiment of the present invention includes:

the measuring module is used for establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focuses of the X-axis sideline and the Y-axis sideline as an origin; drawing the excircle of the tube seat, two insulator circles of the tube seat and a tube seat chip photosensitive area through image measurement; connecting the centers of the two insulators to construct a fit line;

the calculation module translates the circle center of the tube seat base coordinate system to the circle center of the tube seat, rotates the tube seat base coordinate system according to the angle of a fitting line and stores the coordinate system after rotation compensation; obtaining the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation according to a coordinate automatic matching algorithm;

and the position adjusting module is used for adjusting the die bonding position of the tube seat according to the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation.

The embodiment of the invention provides a quadratic element coordinate system rotation compensation measuring method and device, which solve the problem of inaccurate chip die bonding and mounting measurement precision caused by rotation of a TO tube seat O by using coordinate system rotation compensation and ensure the die bonding accuracy of a TO product chip TO the maximum extent.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the technical description of the present invention will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

FIG. 1 is a schematic flow chart of a rotation compensation measurement method for a two-dimensional coordinate system according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a coordinate algorithm of a rotation compensation measurement method of a two-dimensional coordinate system according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a rotation compensation measuring apparatus of a two-dimensional coordinate system according to an embodiment of the present invention;

reference numerals:

the measuring module-1 calculates the module-2 and adjusts the module-3 in position.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

FIG. 1 is a schematic flow chart of a rotation compensation measurement method for a two-dimensional coordinate system according to an embodiment of the present invention; as shown in fig. 1, the method comprises the following steps:

s1, establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focuses of the X-axis sideline and the Y-axis sideline as an origin;

s2, drawing the excircle of the tube seat and two insulator circles of the tube seat through image measurement; specifically, the method comprises the steps of connecting the centers of the two insulators to form a fit line;

s3, translating the circle center of the tube seat base coordinate system to the circle center of the tube seat, rotating the tube seat base coordinate system according to the angle of a fitting line and storing the rotated coordinate system;

and S4, drawing the photosensitive area of the tube socket chip through image measurement again, and obtaining the coordinate position of the photosensitive area of the tube socket chip relative to the coordinate system after rotation compensation according to the coordinate automatic matching algorithm.

And S5, adjusting the die bonding position of the tube socket according to the coordinate position of the tube socket chip photosensitive area relative to the coordinate system after the rotation compensation.

Specifically, in an algorithm commonly used in the measurement industry, a standard block with a known size is taken for measurement, a distance measured by an image measuring instrument is A, the known size of the standard block is B, B is input, a fixed value of X is calculated according to a formula of B ═ XA, and all distances measured later are converted according to the ratio; for example, a TO46 die bonding semi-finished product is placed on a hole position in a test fixture, a straight line measurement function is applied, lines are drawn by an X-axis side line and a Y-axis side line of the fixture, the focuses of the two lines are used as the original points, and a coordinate system is established through a basic coordinate system function TO determine the reference position of the fixture; moving the lens position of the image measuring instrument TO be above the TO46 die bonding semi-finished product, adjusting the image most clearly, and drawing the outer circle of the TO46 tube seat through the circle drawing function; and then, circles of two insulators of the TO46 tube seat are drawn through a circle drawing function. The connection line of the centers of the two insulators is parallel to the X axis of the tube seat through a tube seat drawing, the circles of the two insulators are selected, and the centers of the two insulators are connected through a fitting line structure function; and selecting the excircle of the tube seat, and moving the original point of the basic coordinate system to the circle center of the tube seat through translation coordinates in the coordinate system function. Selecting a fit line of the center of the middle insulator, performing rotation correction compensation on the basic coordinate system of the tube seat according to the angle of the fit line through a rotation coordinate in the function of the basic coordinate system, and storing the rotation-compensated coordinate system; and drawing the area of the photosensitive surface of the chip to be measured by a circle drawing function, automatically displaying X, Y position accuracy (-22, 14.3) of the photosensitive surface after rotation compensation relative to the center of the tube seat according to a coordinate algorithm, and adjusting the die bonding position of the die bonding equipment according to the X, Y position accuracy so as to ensure that the die bonding accuracy of the chip meets the standard requirement.

In order to further explain the technical scheme of the invention in detail, the measurement results of normal measurement and a quadratic element coordinate system rotation compensation measurement method are compared through tube seats of different models.

For example, the photosensitive surface of a 4PIN tube seat chip is required to be mounted relative to a tube seat by 0 +/-25 um and 0 +/-25 um; normal measurement is adopted, and the measurement result shows that the position of the light-sensitive surface of the chip relative to the center of the tube seat is (1, -23.9); the rotation compensation measurement method of a quadratic element coordinate system is adopted, and the measurement result shows that the position of the chip light-sensitive surface relative to the center of the tube seat is (-5.1, -23.1); measured in two ways, X results were found to differ by 6.1um and Y results by 0.8 um.

For example, the photosensitive surface of a 5PIN tube seat chip is required to be mounted relative to the tube seat by 0 +/-15 um and 60 +/-15 um; normal measurement is adopted, and the measurement result shows that the position of the light-sensitive surface of the chip relative to the center of the tube seat is (16.3, 50.3); a quadratic element coordinate system rotation compensation measurement method is adopted, and the measurement result shows that the position of the chip photosensitive surface relative to the center of the tube seat is (4.8, 53.2); through two kinds of mode measurement, it is 11.5um to find the X result difference, and the precision 16.3um of X axle exceeds standard during normal measurement, and the Y result difference is 2.9 um.

For example, the photosensitive surface of a 6PIN tube seat chip is required to be mounted relative to a tube seat by 0 +/-15 um and-60 +/-15 um; normal measurement is adopted, the measurement result shows that the position of the light-sensitive surface of the chip relative to the center of the tube seat is (-39.5, -34.9), a two-dimensional coordinate system rotation compensation measurement method is adopted, and the measurement result shows that the position of the light-sensitive surface of the chip relative to the center of the tube seat is (-25, -45.2); measured in two ways, X results were found to differ by 14.5um and Y results by 10.3 um. When the two methods are used for measurement, the X-axis precision exceeds the standard, and the Y-axis precision-34.9 which is not measured by coordinate system rotation compensation exceeds the standard.

For example, the light-sensitive surface of a 7PIN tube seat chip is required to be mounted relative to a tube seat of-60 +/-15 um and 0 +/-15 um; normal measurement is adopted, the measurement result shows that the position of the light-sensitive surface of the chip relative to the center of the tube seat is (-59.3, -21.9), a two-dimensional coordinate system rotation compensation measurement method is adopted, the measurement result shows that the position of the light-sensitive surface of the chip relative to the center of the tube seat is (-62.8, -8.6), measurement is carried out in two modes, the difference of an X result is 3.5um, and the difference of a Y result is 13.3 um. The precision of the Y axis exceeds 21.9 in normal measurement, but the precision of an actual product does not exceed the standard.

The embodiment of the invention provides a quadratic element coordinate system rotation compensation measuring method, which solves the problem of inaccurate chip die bonding and mounting measurement precision caused by rotation of a TO tube seat O by using coordinate system rotation compensation and ensures the accuracy of TO product chip die bonding TO the maximum extent.

Further, fig. 2 is a schematic diagram of a coordinate algorithm of a rotation compensation measurement method of a two-dimensional coordinate system according to an embodiment of the present invention; as shown in fig. 2, the coordinate algorithm in step S4 specifically includes:

s41, constructing a virtual right triangle according to the X axis of the coordinate system after the rotation compensation and the circle center of the photosensitive area, and obtaining a virtual angle and the distance between the photosensitive area and the circle center of the tube seat;

and S42, obtaining the distance between the two right-angled edges according to the rectangular trigonometric function, namely the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation.

Specifically, after the coordinate rotation compensation, a virtual angle is constructed in the coordinate algorithm according to the X axis after the rotation compensation and the center of the photosensitive area, the angle is set to be β, and after the angle β is known, a virtual right triangle is constructed. Drawing a photosensitive area, wherein the distance of the photosensitive area relative to the center of the stem is set as a distance a, when an angle beta and a are known, the distance of b (b) is calculated according to sin beta multiplied by a) according to sin beta which is a Y value in a coordinate system according to a right triangle trigonometric function, and the distance of c (c) is calculated according to cos beta multiplied by a) according to cos beta which is c/a which is an X value in the coordinate system; finally, the (X, Y) coordinate of the photosensitive area relative to the coordinate system after the rotation compensation, namely the center of the tube seat, is obtained.

FIG. 3 is a schematic structural diagram of a rotation compensation measuring apparatus of a two-dimensional coordinate system according to an embodiment of the present invention; as shown in fig. 2, includes:

the measuring module 1 is used for establishing a tube seat basic coordinate system; drawing lines by using an X-axis sideline and a Y-axis sideline of the clamp, and taking the focuses of the X-axis sideline and the Y-axis sideline as an origin; drawing the excircle of the tube seat, two insulator circles of the tube seat and a light-sensitive area of a tube seat chip through image measurement; connecting the centers of the two insulators to construct a fit line;

the calculation module 2 is used for translating the circle center of the tube socket base coordinate system to the circle center of the tube socket, rotating the tube socket base coordinate system according to the angle of a fitting line and storing the coordinate system after rotation compensation; obtaining the coordinate position of the photosensitive area of the tube seat chip relative to the coordinate system after the rotation compensation according to a coordinate automatic matching algorithm;

and the position adjusting module 3 is used for adjusting the die bonding position of the tube seat according to the coordinate position of the tube seat chip photosensitive area relative to the coordinate system after the rotation compensation.

The embodiment of the invention provides a quadratic element coordinate system rotation compensation measuring device for executing the method, which solves the problem of inaccurate chip die-bonding mounting measurement precision caused by rotation of a TO tube seat O by using coordinate system rotation compensation, and ensures the die-bonding accuracy of a TO product chip TO the maximum extent.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.