阅读说明：本技术 助焊剂、焊膏、基板、电子设备以及基板制造方法 (Flux, solder paste, substrate, electronic device, and substrate manufacturing method ) 是由 冨塚健一 沟胁敏夫 上田松太郎 平岡浩佑 于 2019-06-05 设计创作，主要内容包括：本发明提供一种助焊剂以及焊膏,其能够使昆虫等无法接近使用焊料的部件,并且还提供一种基板、电子设备以及基板的制造方法,其能够使昆虫等无法接近。根据本发明,焊锡中使用的助焊剂含有树脂、活化剂、溶剂以及驱避剂,所述驱避剂相对于所述溶剂具有溶解性,并且在所述溶剂中不具有规定的挥发性。(The invention provides a flux and a solder paste, which can prevent insects from approaching a component using the solder, and also provides a substrate, an electronic device and a method for manufacturing the substrate, which can prevent insects from approaching. According to the present invention, a flux for use in soldering includes a resin, an activator, a solvent, and a repellent that has solubility in the solvent and does not have a predetermined volatility in the solvent.)

1. A soldering flux is used for soldering tin, and is characterized in that:

contains resin, an activating agent, a solvent and a repellent,

the repellent is soluble with respect to the solvent and does not have a defined volatility in the solvent.

2. The flux of claim 1, wherein:

wherein the repellent is non-sublimable.

3. The soldering flux according to claim 1 or 2, wherein:

wherein the repellent contains pyrethroid compounds.

4. The flux according to claim 3, wherein:

the pyrethroid compound contains one or more of pyrethrin, allethrin, tetramethrin, resmethrin, prallethrin, phenothrin, cypermethrin, cyphenothrin, empenthrin, prallethrin, imiprothrin, deltamethrin, fenvalerate, cyfluthrin, ethofenprox and silafluofen.

5. The soldering flux according to any one of claims 1 to 4, wherein:

wherein the repellent contains an ester solvent.

6. The soldering flux according to any one of claims 1 to 5, wherein:

wherein the repellent is contained in an amount of 0.4 wt% or more and 4 wt% or less.

7. The soldering flux according to any one of claims 1 to 6, wherein:

wherein the resin composition contains 80 wt% or more of a solvent and 15 wt% or less of a resin.

8. A soldering flux is used for soldering tin, and is characterized in that:

the synthetic resin composition contains 80 wt% or more of solvent, 15 wt% or less of resin and 0.4 wt% or more and 4 wt% or less of pyrethroid compound.

9. A solder paste characterized in that:

the flux of any one of claims 1 to 8 and a solder alloy.

10. A substrate, characterized by:

has a conductive adhesive containing a solder alloy and a repellent.

11. An electronic device, characterized in that:

has a conductive adhesive containing a solder alloy and a repellent.

12. A method of manufacturing a substrate, comprising:

a step of applying the flux according to any one of claims 1 to 8 to a mounting portion provided on a substrate main body;

a step of providing a molten solder alloy on the mounting part coated with the flux; and

and a step of providing an electronic component on the solder alloy.

Technical Field

The invention relates to a flux, a solder paste, a substrate, an electronic device and a substrate manufacturing method.

Background

Conventionally, a flux used for soldering has been widely known (for example, see patent document 1). Specifically, the flux is a material used for mounting electronic components such as semiconductor elements, capacitors, and resistors on a printed circuit board or the like. The soldering flux is widely used in various electronic devices, including common household appliances, such as refrigerators, air conditioners and the like.

In the case of household appliances such as refrigerators and air conditioners, insects such as cockroaches may intrude into the interior of the appliance, and when these insects come into contact with the electrodes on the printed circuit board, short circuits may occur. Therefore, there is a need to deal with such insects so that they cannot approach the substrate. This need becomes even more acute, particularly in developing countries, where the overall living and hygienic conditions in developing countries are not ideal.

[ Prior Art document ]

[ patent document 1 ] Japanese patent application laid-open No. 2017-213598

In view of the above circumstances, an object of the present invention is to provide a flux and a solder paste which make it impossible for insects and the like to access a component using solder, and also to provide a substrate, an electronic device, and a method for manufacturing a substrate which make it impossible for insects and the like to access.

Disclosure of Invention

The invention relates to a soldering flux for soldering tin, which is characterized in that:

contains resin, an activating agent, a solvent and a repellent,

the repellent is soluble with respect to the solvent and does not have a defined volatility in the solvent.

In the solder resist according to the present invention,

the repellent is not sublimable.

In the solder resist according to the present invention,

the repellent contains pyrethroid compounds.

In the solder resist according to the present invention,

the pyrethroid compound contains one or more of pyrethrin, allethrin, tetramethrin, resmethrin, prallethrin, phenothrin, cypermethrin, cyphenothrin, empenthrin, prallethrin, imiprothrin, deltamethrin, fenvalerate, cyfluthrin, ethofenprox and silafluofen.

In the solder resist according to the present invention,

the repellent contains an ester solvent.

In the solder resist according to the present invention,

contains repellent in an amount of 0.4 wt% or more and 4 wt% or less.

In the solder resist according to the present invention,

the resin composition contains 80 wt% or more of a solvent and 15 wt% or less of a resin.

The solder resist according to the present invention is used for soldering, and is characterized in that:

the synthetic resin composition contains 80 wt% or more of solvent, 15 wt% or less of resin and 0.4 wt% or more and 4 wt% or less of pyrethroid compound.

The solder paste according to the present invention is characterized in that:

contains the flux and the solder alloy.

The substrate according to the present invention is characterized in that:

has a conductive adhesive containing a solder alloy and a repellent.

The electronic device according to the present invention is characterized in that:

has a conductive adhesive containing a solder alloy and a repellent.

The substrate manufacturing method according to the present invention is characterized by including:

a step of applying the flux to a mounting portion provided on a substrate main body;

a step of providing a molten solder alloy on the mounting part coated with the flux; and

and a step of providing an electronic component on the solder alloy.

Effects of the invention

According to the present invention, it is possible to prevent insects from accessing a member using solder.

Drawings

Fig. 1 is a graph showing the results of Thermogravimetry (TG) measurement of diethyltoluamide used in the fourth comparative example.

Fig. 2 is a schematic view of a manufacturing process of a substrate that can be used in the embodiment of the present invention.

Detailed Description

The flux according to the present embodiment is used when a solder alloy is provided on a substrate such as a printed circuit board. The soldering flux contains a repellent, a resin and a solvent (solvent). The repellent preferably has solubility with respect to the solvent and does not have a defined volatility in the solvent. In particular, since the flux is applied at a high temperature when the solder alloy is disposed on the substrate, the repellent may be vaporized to lose the active ingredient if the volatility of the repellent is high. Therefore, it is necessary to use repellents that do not have the prescribed volatility in the solvent. Further, it is not necessary to contain a solvent (solvent), and the present embodiment can provide a solid flux containing no solvent.

As the repellent, an insect repellent having an effect exclusively on insects may be used. By including a repellent in the flux, a high general-purpose type can be realized. That is, in the form in which solder is used as a conductive adhesive, a repellent can be simultaneously applied only by applying flux, and the repellent effect can be achieved with very high versatility. Further, by including the repellent in the flux, it is also possible to achieve an insect-repellent effect in the same process as in the conventional case. That is, by including the repellent in the flux as in the present embodiment, it is possible to achieve the insect repellent effect which has been achieved by the conventional step of additionally applying the repellent.

Additionally, the boiling point of the repellent may be below the melting temperature of the solder alloy. When the boiling point of the repellent is lower than the melting temperature of the solder alloy, it is conceivable that the repellent is vaporized by applying heat to the flux after the molten solder alloy comes into contact with the portion coated with the flux. Thus, generally speaking, the use of such repellents is not a consideration to those skilled in the art. However, it is to be noted that: the inventors of the present invention have found that a repellent having a boiling point lower than the melting temperature of the solder alloy can be used, and particularly, it is more advantageous when the repellent is a pyrethroid compound described later.

The solder alloy used in the present embodiment may be a lead-free solder containing no lead or a lead-containing solder. As the lead-free solder, Sn-In, 15 Sn-Bi, In-Ag, In-Bi, Sn-Zn, Sn-Ag, Sn-Cu, Sn-Sb, Sn-Au, Sn-Bi-Ag-Cu, Sn-Ge, Sn-Bi-Cu, Sn-Cu-Sb-Ag, Sn-Ag-Cu, Sn-Ag-Zn, Sn-Cu-Ag, Sn-Bi-Sb-Zn, Sn-Bi-Cu-Zn, Sn-Ag-Sb-Zn, Sn-Ag-Cu-Zn, Sn-Zn-Bi-Bi, Sn-Ag-Bi-Bi, Sn 20-Ag-Cu-Bi, and the like can be used. The solder alloy may be solder powder.

As the resin material, a rosin-based resin can be used. Specifically, derivatives such as rosin and modified rosin can be used. In view of the fact that some rosin-based resins have a property of attracting insects and the like, the use of a repellent in the present embodiment is very advantageous for repelling insects.

The activator may contain: any one or more or all of organic acid, amine, organic halogen compound, amine halide compound hydrogen salt, ammonium halide compound and organic phosphorus compound. The activator has the effect of, for example, removing metal oxides from the solder surface and covering the surface of the soldered part. The content of the activator is preferably not less than 0.5% by weight and not more than 5% by weight.

The content of the repellent in the soldering flux can be more than or equal to 0.4 wt% and less than or equal to 4 wt%. However, when the content of the repellent in the flux is less than 0.5% by weight, there may occur a case where the repellent effect is insufficient. When the content of the repellent in the flux is more than 3 wt%, the repellent may be hardly dissolved in the solvent. Therefore, as further defined, the lower limit of the amount of the repellent in the flux may be set to 0.5 wt% and the upper limit of the amount of the repellent in the flux may be set to 3 wt%. Further, when the content of the repellent in the flux is less than 1.0 wt%, the desired repellent effect may not be obtained. Therefore, a high insect-repellent effect can be more reliably achieved by setting the lower limit of the content of the repellent in the flux to 1.0 wt%. As described above, the repellent is advantageously contained in the soldering flux in an amount of 0.5 wt% or more and 3 wt% or less, and is more advantageously contained in the soldering flux in an amount of 1.0 wt% or more and 3 wt% or less.

The content of the organic acid in the soldering flux can be 0-4 wt%. As the organic acid, specifically, there can be used: succinic acid, glutaric acid, palmitic acid, phthalic acid, stearic acid, sebacic acid, and the like.

The amine may be present in the flux in an amount of 0 wt% to 1 wt%. As amines, in particular, it is possible to use: imidazolyl, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, polyetheramine, polyoxyalkylamine, polyoxyethyleneamine, polyoxypropylene amine, 2-ethylaminoethanol, diethanolamine, triethanolamine, aminoalcohol and the like.

The content of the organohalogen compound flux may be 0 wt% to 1 wt%. As the organic halogen compound, specifically, there can be used: 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1, 2-propanediol, 1, 4-dibromo-2-butanol, 1, 3-dibromo-2-propanol, 2, 3-dibromo-1, 4-butanediol, 2, 3-dibromo-2-butene-1, 4-diol, and the like.

The hydrogen salt of the halogenated amine compound may be contained in the flux in an amount of 0 wt% or more and 1 wt% or less. Specific examples of the amine compound as the hydrogen salt of the amine halide compound include: ethylamine, diethylamine, dibutylamine, isopropylamine, diphenylguanidine, cyclohexylamine, etc. Specific examples of the hydrogen halide acid include: hydrochloric acid, hydrobromic acid, hydroiodic acid, and the like. As an example of the hydrogen salt of the halogenated amine compound, ethylamine hydrobromide and the like can be mentioned.

The content of the organic phosphorus compound in the soldering flux can be more than or equal to 0 wt% and less than or equal to 1 wt%. Specific examples of the organic phosphorus compound include: phosphate esters such as phenylphosphate, diethylpropylene phosphate, diethyl phosphate (p-methylbenzyl), and (2-ethylhexyl) -2-ethylhexyl phosphonate.

The content of the resin such as rosin in the flux may be 5 wt% or more and 15 wt% or less. In general, flux having a low viscosity is generally used in household electrical appliances such as refrigerators and air conditioners from the viewpoint of mass production, and the content of resin such as rosin is low, generally 15 wt% or less. In this regard, since the resin such as rosin has a high boiling point, volatilization of the repellent can be more easily prevented when the content is high. On the contrary, when the content of the resin such as rosin in the flux is 15 wt% or less, the repellent is more volatile. However, the inventors of the present invention have found that the pyrethroid compound described later is not easily volatilized even when the resin content is low.

The repellent contained in the flux preferably has no sublimability. In the present embodiment, having sublimability means that it is converted from a solid phase to a gas at room temperature (25 ℃).

The repellent contained in the soldering flux is preferably not derived from foodstuff. The ingredients specified as being derived from the foodstuff may be exemplified by: mint, tannin, pepper, mustard, etc.

The repellent may contain pyrethroid compounds. The pyrethroid compound can be any one or more of pyrethrin, allethrin, tetramethrin, resmethrin, prallethrin, phenothrin, cypermethrin, cyphenothrin, empenthrin, prallethrin, imiprothrin, deltamethrin, fenvalerate, cyfluthrin, ethofenprox and silafluofen. The present inventors have found that pyrethroid compounds are easily soluble in a solvent (solvent) such as isopropyl alcohol, have low volatility after being dissolved in the solvent, and have a good repellent effect on general insects including cockroaches. Therefore, the pyrethroid compound is very useful as an insect repellent against insects such as cockroaches which are desired to come close to electronic devices such as refrigerators and air conditioners. The repellent may contain a plurality of components such as a pyrethroid compound and an ester solvent described later, or may contain only one component.

The repellent may also contain an ester solvent. The ester solvent may contain: any one or more of benzyl benzoate, phenyl salicylate, benzyl salicylate, dibutyl sebacate, dimethyl phthalate, dibutyl phthalate and di-n-propyl bipyridyl carboxylate. The compound has the advantages that benzyl benzoate, phenyl salicylate, benzyl salicylate and dibutyl sebacate have good repellent effects on ticks, dimethyl phthalate and dibutyl phthalate have good repellent effects on sanitary pests such as ticks, mosquitoes and lice, and di-n-propyl bipyridyl carboxylate has good repellent effects on mosquitoes, gadflies, gnats, fleas, bed bugs, ticks, culicos and the like. On the other hand, since the pyrethroid compound does not exert a beneficial repellent effect on cockroaches and the like, it is advantageous from this viewpoint to use the pyrethroid compound as an insect repellent.

In addition, the repellent may also contain: 2-ethyl-1, 3-hexanediol, diethylamide di-N-propyl isooctanoate, 2, 3: 4, 5-bis (delta 2-butene) tetrahydrofurfural, N-octyl-bicycloheptene dicarboximide, citronella oil, eucalyptus oil and junenol. Wherein, the 2-ethyl-1, 3-hexanediol has good repellent effect on sanitary pests such as mosquitoes, lice, ticks and the like, and the diethylamide di-N-propyl isooctanoate salt, 2, 3: 4, 5-bis (2-butene) tetrahydrofurfural and N-octyl-bicycloheptenedicarboximide have good repellent effects on mosquitoes, gadflies, gnats, fleas, bed bugs, ticks, culicoides and the like. The citronella oil and the eucalyptus oil have good repellent effect on insects such as cockroaches. The hinokitiol has good repellent effect on tick, termite, cockroach and the like.

The solvent may contain one or more of isopropyl alcohol, ethanol, acetone, toluene, xylene, ethyl acetate, ethyl cellosolve, butyl cellosolve, and glycol ether, or may be composed of only isopropyl alcohol.

The solvent may be contained in the flux in an amount of 80 wt% or more, and further 84 wt% or more, if necessary.

The present embodiment can provide a solder paste containing a flux and a solder alloy.

The present embodiment can also provide a substrate and an electronic device using the solder alloy and the repellent as the conductive adhesive. Refrigerators and air conditioners may be exemplified as the electronic devices.

The flux may be free of thixotropic agents for imparting viscosity to the solder paste. When the soldering flux does not contain the thixotropic agent, the repellent is more volatile. Therefore, it would be extremely beneficial to use a repellent that does not have the specified volatility in a flux that does not contain a thixotropic agent.

< solubility test >

The solvency of the repellent in the flux was verified by the following test.

In this embodiment, the repellent having "solubility" with respect to the solvent means that: the repellent was suitably mixed with a solvent (suitably heated if necessary) to prepare a solution by dissolution, and after leaving the solution at room temperature (25 ℃) for one week, no precipitate could be visually observed in the solution and separated. In contrast, if a precipitate is found in the solution by visual observation under the above conditions and is separated, it means that it has no solubility in the present embodiment.

< volatility test >

Verification of volatility by TG assay

In this embodiment, the repellent not having "a defined volatility" relative to the solvent means that: the repellent was measured under the following conditions using a TGD9600 scale thermoelastic balance measuring device manufactured by ULVAC (department of loving) of japan, and the measured result was that the residue was 50% or more. Conversely, a residual of less than 50% when measured under the same conditions indicates that the repellent has a predetermined volatility.

Sample amount of repellent: 2 to 5mg

Temperature rise rate: heating to 240 deg.C at a temperature of 10 deg.C/min

Measuring gasAtmosphere: n is a radical of₂

When the flux contains a repellent having no predetermined volatility, the solder alloy component is Sn-3Ag-0.5Cu (melting point 217 ℃ C.) and reflow soldering is performed. The flux was confirmed to have a repellent effect after soldering using conditions of a solder melting temperature of 205 ℃, an immersion depth of 1mm, and an immersion time of 10 seconds.