阅读说明：本技术 连接器组件、连接模块和制造连接模块的方法 (Connector assembly, connection module and method for manufacturing connection module ) 是由 近藤快人 于 2019-05-14 设计创作，主要内容包括：本发明提供了一种连接器组件、连接模块和制造连接模块的方法。具体而言,提供了一种散热性改善的连接器组件。连接器组件(A1)包括壳体(300)、第二连接器(400)和具有管状形状并在Z-Z’方向上延伸的密封构件(500)。该壳体能与安装有第一连接器(200)的电路板(100)组合,壳体(300)和电路板(100)可限定容纳空间(R)。第二连接器在Z-Z’方向上延伸穿过壳体,能在容纳空间(R)内连接至第一连接器,并包括适于布置在容纳空间(R)内的可容纳部。密封构件在Z方向侧的第一部分(510)围绕第二连接器(400)的可容纳部装配。密封构件在Z’方向侧的第二部分(520)相对于第二连接器的可容纳部位于Z’方向侧,能靠着电路板(100)抵接并适于覆盖第一连接器。(The invention provides a connector assembly, a connection module and a method for manufacturing the connection module. Specifically, a connector assembly with improved heat dissipation is provided. The connector assembly (A1) includes a housing (300), a second connector (400), and a sealing member (500) having a tubular shape and extending in a Z-Z' direction. The housing can be combined with a circuit board (100) mounted with a first connector (200), and the housing (300) and the circuit board (100) can define a housing space (R). The second connector extends through the housing in the Z-Z' direction, is connectable to the first connector within the accommodating space (R), and includes an accommodating portion adapted to be disposed within the accommodating space (R). A first portion (510) of the sealing member on the Z-direction side is fitted around a receivable portion of the second connector (400). A second portion (520) of the sealing member on the Z '-direction side is located on the Z' -direction side with respect to the receivable portion of the second connector, can abut against the circuit board (100), and is adapted to cover the first connector.)

1. A connector assembly, comprising:

a housing combinable with a circuit board on which a first connector is mounted, the housing and the circuit board adapted to define an accommodation space;

a second connector passing through the housing in a first direction perpendicular to the circuit board, the second connector being connectable to the first connector within the accommodation space and including an accommodation part adapted to be disposed within the accommodation space; and

a sealing member having a tubular shape and extending in the first direction, the sealing member including a first portion and a second portion located on one side and the other side in the first direction, respectively, wherein,

the first portion fits around the receivable portion of the second connector; and is

The second portion is located on the other side in the first direction with respect to the receivable portion of the second connector, and is adapted to abut against the circuit board and cover the first connector.

2. The connector assembly of claim 1, wherein the first portion of the sealing member is integral with the receivable portion of the second connector.

3. A connector assembly, comprising:

a circuit board combinable with a housing through which a second connector passes in a first direction perpendicular to the circuit board, the circuit board and the housing being capable of defining an accommodation space;

a first connector mounted on the circuit board and connectable to the second connector within the accommodation space; and

a sealing member having a tubular shape and extending in the first direction, the sealing member including a first portion and a second portion located on one side and the other side in the first direction, respectively, wherein,

the second portion fits around at least a portion of the first connector and abuts the circuit board; and is

The first portion is located on the one side in the first direction with respect to the at least a portion of the first connector, and is adapted to fit around a receiving portion of the second connector, the receiving portion being disposed within the receiving space.

4. The connector assembly of claim 3, further comprising a housing, wherein,

the housing is combined with the circuit board such that the housing and the circuit board define the accommodation space; and is

The housing is configured to allow the second connector to pass through the housing in the first direction.

5. The connector assembly of claim 3 or 4, wherein the second portion of the sealing member is integral with the at least a portion of the first connector.

6. The connector assembly of any one of claims 1 to 5, wherein the sealing member is made of an elastomeric material.

7. The connector assembly of any one of claims 1 to 6,

the housing includes a top plate and a side plate having a tubular shape and extending from the top plate to the other side in the first direction;

the second connector passes through the top plate in the first direction; and is

The accommodating portion of the second connector is disposed within the housing.

8. A connection module, comprising:

a circuit board;

a housing combined with the circuit board, the housing and the circuit board defining an accommodation space;

a first connector mounted on the circuit board and accommodated in the accommodation space;

a second connector passing through the housing in a first direction perpendicular to the circuit board, the second connector being connected to the first connector within the accommodation space and including an accommodation part disposed within the accommodation space; and

a sealing member having a tubular shape and extending in the first direction, the sealing member including a first portion and a second portion located on one side and the other side in the first direction, respectively, the first portion fitting around the receivable portion of the second connector, the second portion located on the other side in the first direction with respect to the receivable portion of the second connector, abutting the circuit board and covering the first connector; and

a heat conductive resin filling the accommodating space,

wherein the first connector, the sealing member and the receiving portion of the second connector are embedded in the thermally conductive resin.

9. A connection module, comprising:

a circuit board;

a housing combined with the circuit board, the housing and the circuit board defining an accommodation space;

a first connector mounted on the circuit board and accommodated in the accommodation space;

a second connector passing through the housing in a first direction perpendicular to the circuit board, the second connector being connected to the first connector within the accommodation space and including an accommodation part disposed within the accommodation space; and

a sealing member having a tubular shape and extending in the first direction, the sealing member including a first portion and a second portion located on one side and the other side in the first direction, respectively, the second portion fitting around at least a portion of the first connector and abutting the circuit board, the first portion being located on the one side in the first direction with respect to the at least a portion of the first connector and fitting around the receivable portion of the second connector; and

a heat conductive resin filling the accommodating space,

wherein the first connector, the sealing member and the receiving portion of the second connector are embedded in the thermally conductive resin.

10. The connection module of claim 8 or 9,

the housing includes a top plate and a side plate having a tubular shape, extending from the top plate to the other side in the first direction, and abutting the circuit board; and is

The second connector passes through the top plate in the first direction.

11. A method of manufacturing a connection module, the method comprising:

combining a circuit board and a housing such that the circuit board and the housing define an accommodation space, and connecting a first connector mounted on the circuit board to a second connector passing through the housing within the accommodation space; and

filling the defined accommodation space with a molten heat conductive resin, and cooling and solidifying the filled heat conductive resin,

wherein the connection of the first connector and the second connector comprises abutting a sealing member fitted around the second connector with the circuit board and placing the sealing member so that the sealing member covers and surrounds the first connector on the circuit board.

12. A method of manufacturing a connection module, the method comprising:

combining a circuit board and a housing such that the circuit board and the housing define an accommodation space, and connecting a first connector mounted on the circuit board to a second connector passing through the housing within the accommodation space; and

filling the defined accommodation space with a molten heat conductive resin, and cooling and solidifying the filled heat conductive resin,

wherein the connection of the first connector and the second connector includes placing a sealing member that fits around the first connector and abuts the circuit board so that the sealing member fits around the second connector.

13. A method of manufacturing a connection module, the method comprising:

inserting a second connector into an opening of a housing combined with a circuit board on which a first connector is mounted, the housing and the circuit board defining a housing space; and connecting the second connector to the first connector within the receiving space; and

filling the defined accommodation space with a molten heat conductive resin, and cooling and solidifying the filled heat conductive resin,

wherein the connection of the first connector and the second connector includes placing a sealing member that fits around the first connector and abuts the circuit board so that the sealing member fits around the second connector.

Technical Field

The invention relates to a connector assembly, a connection module and a method of manufacturing a connection module.

Background

Conventional connector assemblies include connector assemblies as used in camera modules as disclosed in japanese unexamined patent application publication No. 2006-350187. The connector assembly includes a circuit board and a plug connector with a cable. The plug connector is mounted on a circuit board within a housing of the camera module, with the cable exiting the housing. The housing has a vent opening covered with a moisture permeable member. The moisture permeable member blocks moisture from the outside while allowing heat to be radiated from the circuit board to the outside.

Disclosure of Invention

Technical problem

However, the circuit board disposed in such a housing is surrounded by a space filled with air. The air surrounding the circuit board acts as a heat insulator, thereby preventing heat from being dissipated from the circuit board to the outside of the housing.

The present invention provides a connector assembly, a connection module, and a method of manufacturing a connection module, all of which contribute to improved heat dissipation.

Solution to the problem

In order to solve the above problem, a connector assembly according to a first aspect of the present invention includes a housing, a second connector, and a seal member. The housing can be combined with a circuit board on which the first connector is mounted. The housing and the circuit board are adapted to define a receiving space. The second connector passes through the housing in a first direction. The first direction is substantially perpendicular to the circuit board. The second connector is connectable to the first connector within the accommodation space and includes an accommodation part. The accommodating part is suitable for being arranged in the accommodating space. The sealing member has a tubular shape, extends in the first direction, and includes first and second portions located on one side and the other side in the first direction, respectively. The first portion fits around the receiving portion of the second connector. The second portion is located on the other side in the first direction with respect to the receivable portion of the second connector, and is adapted to abut against the circuit board and cover the first connector.

In the connector assembly of this aspect, the first portion of the sealing member is fitted around the receivable portion of the second connector, and the second portion of the sealing member is adapted to abut the circuit board and cover the first connector. In this way, when the housing and the circuit board are combined together to define the accommodation space and the first connector and the second connector are connected within the accommodation space, the second portion of the sealing member can be brought into abutment with the circuit board and cover the first connector. Thus, the sealing member makes it possible to fill the accommodating space with the thermally conductive resin. Thus, the connector assembly provides improved heat dissipation.

The first portion of the sealing member may be integral with the second connector.

A connector assembly according to a second aspect of the invention comprises a housing, a first connector and a sealing member. The circuit board can be combined with a housing through which the second connector passes in the first direction. The first direction is substantially perpendicular to the circuit board. The circuit board and the case can define an accommodation space. The first connector is mounted on the circuit board and is connectable to the second connector within the accommodation space. The sealing member has a tubular shape, extends in the first direction, and includes first and second portions located on one side and the other side in the first direction, respectively. The second portion fits around at least a portion of the first connector and abuts the circuit board. The first portion is located on the one side in the first direction with respect to the at least a portion of the first connector and is adapted to fit around a receiving portion of the second connector. The accommodating portion is disposed in the accommodating space.

In the connector assembly of this aspect, the second portion of the sealing member is fitted around at least a portion of the first connector and abuts against the circuit board, and the first portion of the sealing member is adapted to be fitted around the receivable portion of the second connector disposed within the receiving space. In this way, when the housing and the circuit board are combined together to define the accommodation space and the first connector is connected to the second connector in the accommodation space, the first portion of the sealing member can be fitted around the accommodation portion of the second connector. Thus, the sealing member makes it possible to fill the accommodating space with the thermally conductive resin. Thus, the connector assembly provides improved heat dissipation.

The connector assembly according to the second aspect may further comprise a housing. The housing may be combined with the circuit board such that the housing and the circuit board define the accommodation space. The housing may be configured to allow the second connector to pass through the housing in the first direction. In the connector assembly in this aspect, when the second connector is passed through the housing combined with the circuit board and the second connector is connected to the first connector within the accommodation space, the first portion of the seal member may be fitted around the accommodation portion of the second connector. Thus, the sealing member makes it possible to fill the accommodating space with the thermally conductive resin. Thus, the connector assembly provides improved heat dissipation.

The second portion of the sealing member may be integral with the at least a portion of the first connector.

The sealing member according to any of the above aspects may be made of an elastic material. In this case, the sealing member may elastically abut against the circuit board or be elastically fitted around the accommodating portion of the second connector.

A connection module according to an aspect of the present invention includes a circuit board, a housing, first and second connectors, a sealing member, and a heat conductive resin. The housing is combined with the circuit board, and the housing and the circuit board define a housing space. The first connector is mounted on the circuit board and is accommodated in the accommodation space. The second connector passes through the housing in a first direction. The first direction is substantially perpendicular to the circuit board. The second connector is connected to the first connector within the accommodation space and includes an accommodation part disposed within the accommodation space. The sealing member has a tubular shape, extends in the first direction, and includes first and second portions located on one side and the other side in the first direction, respectively. The first portion fits around the receiving portion of the second connector. The second portion is located on the other side in the first direction with respect to the receivable portion of the second connector, abuts the circuit board, and covers the first connector. The heat conductive resin fills the accommodation space. The first connector, the sealing member, and the receiving portion of the second connector are embedded in the thermally conductive resin.

The connection module of this aspect provides improved heat dissipation for the following reasons. The first portion of the sealing member is fitted around the receivable portion of the second connector, while the second portion of the sealing member abuts the circuit board and covers the first connector. In this way, the accommodation space defined by the housing and the circuit board may be filled with the thermally conductive resin. Therefore, heat from the circuit board and the first and second connectors can be dissipated to the outside of the housing through the heat conductive resin.

Instead of the configuration in which the first portion is fitted around the receivable portion of the second connector and the second portion abuts against the circuit board and covers the first connector, the sealing member may be configured such that the second portion is fitted around at least a portion of the first connector and abuts against the circuit board and the first portion is fitted around the receivable portion of the second connector. In this case, the first portion may be located on the one side in the first direction with respect to the at least one portion of the first connector.

The connection module of this aspect also provides improved heat dissipation for the following reasons. The sealing member as described above makes it possible to fill the accommodating space with the thermally conductive resin. Therefore, heat from the circuit board and the first and second connectors can be dissipated to the outside of the housing through the heat conductive resin.

A method of manufacturing a connection module according to a first aspect of the invention includes: combining a circuit board and a housing such that the circuit board and the housing define an accommodation space, and connecting a first connector mounted on the circuit board to a second connector passing through the housing within the accommodation space; and filling the defined accommodating space with a molten heat conductive resin, and cooling and solidifying the filled heat conductive resin. The connecting of the first connector and the second connector includes abutting a sealing member fitted around the second connector with the circuit board and placing the sealing member so that the sealing member covers and surrounds the first connector on the circuit board.

In the manufacturing method of this aspect, the seal member fitted around the second connector is placed abutting the circuit board and fitted around the first connector. This makes it possible to fill the accommodation space defined by the housing and the circuit board with the thermally conductive resin. Heat from the circuit board and the first and second connectors may be radiated to the outside of the case through the heat conductive resin. Therefore, the manufacturing method improves heat dissipation of the connection module.

In the case where the sealing member is fitted around the first connector and abuts the circuit board instead of being fitted around the second connector, the manufacturing method may be modified to include: the sealing member is fitted around the second connector when the first connector and the second connector are connected. The manufacturing method of this aspect can provide effects similar to those obtained by the manufacturing method of the first aspect.

A method of manufacturing a connection module according to a second aspect of the invention includes: inserting a second connector into an opening of a housing combined with a circuit board on which a first connector is mounted, the housing and the circuit board defining a housing space; and connecting the second connector to the first connector within the receiving space; and filling the defined accommodating space with a molten heat conductive resin, and cooling and solidifying the filled heat conductive resin. The connecting of the first connector and the second connector includes placing a sealing member that fits around the first connector and abuts the circuit board so that the sealing member fits around the second connector.

In the manufacturing method of this aspect, the seal member that is fitted around the first connector and abuts against the circuit board is placed to be fitted around the second connector. This makes it possible to fill the accommodation space defined by the housing and the circuit board with the thermally conductive resin. Heat from the circuit board and the first and second connectors may be radiated to the outside of the case through the heat conductive resin. Therefore, the manufacturing method improves heat dissipation of the connection module.

Drawings

Fig. 1 is a front upper right side perspective view of a connection module according to a first embodiment of the present invention.

Fig. 2A is a cross-sectional view of the connection module taken along line 2A-2A in fig. 1.

Fig. 2B is a cross-sectional view of the connection module taken along line 2B-2B in fig. 1.

Fig. 2C is a cross-sectional view of the connection module taken along line 2C-2C in fig. 2A.

Fig. 3A is a cross-sectional view of the connection module taken along line 2A-2A in fig. 1 in a state before the first and second connector assemblies of the connection module are combined.

Fig. 3B is a cross-sectional view of the connection module taken along line 2B-2B in fig. 1 in a state before the first and second connector assemblies of the connection module are combined.

Fig. 4A is an exploded rear upper left perspective view of the connection module.

Fig. 4B is a front lower right side exploded perspective view of the connection module.

Fig. 5A is a sectional view of a connection module according to a second embodiment of the present invention corresponding to fig. 2A.

Fig. 5B is a cross-sectional view of the connection module corresponding to fig. 2B.

Fig. 6A is an exploded sectional view of the connection module in a state before the heat conductive resin is injected, the sectional view corresponding to fig. 3A.

Fig. 6B is an exploded sectional view of the connection module in a state before the heat conductive resin is injected, the sectional view corresponding to fig. 3B.

Fig. 7 is a schematic cross-sectional view of a modified connection module of the first or second embodiment.

List of reference numerals

M1, M2, M3: connection module

A1, a1', a1 ": first connector assembly

100: circuit board

101: first side

102: second surface

110: a first electrode

120: second electrode

200. 200': first connector

210: terminal with a terminal body

211: contact part

212: tail part

220: main body

221: base seat

222: distal section

223: containing part

230: outer casing

231: pipe

A2, a2', A3': second connector assembly

300: shell body

310: top board

311: opening of the container

312: edge of a container

320: side plate

R: accommodation space

400. 400': second connector

410: terminal with a terminal body

411: contact part

412: tail part

420: main body

421: containing part

430: outer casing

431: wall(s)

432: wall(s)

433: accommodation chamber

440: connecting hole

450: accommodating hole

460: internal seal

461: through hole

500. 500', 500 ": sealing member

510. 510', 510 ": the first part

520. 520', 520 ": the second part

600: heat conductive resin

Detailed Description

Various embodiments of the present invention will now be described.

First embodiment

Now, a connection module M1 (or simply a module M1) according to various embodiments of the present invention including the first embodiment will be described with reference to fig. 1 to 4B. Fig. 1 to 4B illustrate a module M1 according to a first embodiment.

The module M1 includes a first connector assembly a1 (or simply component a1) and a second connector assembly a2 (or simply component a 2). It should be noted that the assembly a2 corresponds to the connector assembly defined in claim 1 of the appended claims and the dependent claims thereof. The Z-Z' direction indicated in fig. 2A, 2B, 3A, and 3B corresponds to the first direction in the claims.

The assembly a1 includes a circuit board 100 and a first connector 200. The Z-Z' direction is substantially perpendicular to the circuit board 100. The Z-Z 'direction includes the Z direction and the Z' direction. The Z direction corresponds to "one side in the first direction" in the claims. The Z' direction corresponds to "the other side in the first direction" in the claims.

The circuit board 100 has a first surface 101 on the Z-direction side and a second surface 102 on the Z' -direction side. The circuit board 100 further comprises at least one first electrode 110. The or each first electrode 110 may be a surface electrode provided on the first face 101 (see fig. 4A), or may be a through-hole electrode formed in the circuit board 100.

The first connector 200 is a male connector mounted on the first face 101 of the circuit board 100. The first connector 200 includes at least one terminal 210 and a body 220. The body 220 may be any type of body formed of an insulating resin and configured to hold at least one terminal 210. For example, the body 220 may include at least one receptacle 223, the or each receptacle 223 being an aperture or groove for retaining at least a portion of the or a corresponding terminal 210. In the embodiment of fig. 2A to 4B, the main body 220 includes a single housing portion 223, and this housing portion 223 is a hole that opens in the Z direction and the Z' direction and holds a single terminal 210. In another aspect, the at least one terminal 210 may be embedded in the body 220 by insert molding or other means. The main body 220 includes a base 221 disposed at the Z' -direction side and a distal portion 222 extending from the base 221 in the Z-direction.

The or each terminal 210 includes a contact portion 211 and a tail portion 212. As illustrated in fig. 2A-3B, the contact portion 211 of the or each terminal 210 may be received in a corresponding receiving portion 223 of the body 220. The or each contact 211 may be bifurcated as shown in fig. 2A to 4B, or may have a rod shape, a tubular shape, a U-shaped cross-section in a direction orthogonal to the Z-Z' direction, or other shapes. In another aspect, the contact portion 211 of at least one terminal 210 may be exposed or protrude from the distal portion 222 of the body 220. In this case, the or each contact 211 may have a plate shape or a bar shape. The tail portion 212 of the or each terminal 210 is electrically and mechanically connected to the corresponding first electrode 110 of the circuit board 100 using solder, conductive adhesive or similar material. It is to be noted that, in the case where a plurality of terminals 210 are provided, it is desirable to provide a corresponding number of first electrodes 110. In addition, the main body 223 may be optionally provided with a plurality of receiving parts 223 according to the number of the terminals 210.

The first connector 200 may also include a housing 230 made of a conductive material. The circuit board 100 further comprises at least one second electrode 120, if a housing 230 is provided. The or each second electrode 120 may also be a surface electrode provided on the first face 101, or may be a through-hole electrode formed in the circuit board 100. The housing 230 is electrically and mechanically connected to the at least one second electrode 120 using solder, conductive adhesive, or similar material. In the embodiment of fig. 4A, two second electrodes 120 are provided, the two second electrodes 120 being surface electrodes.

The housing 230 is optional, and if the housing 230 is provided, the housing 230 has a tube 231. The tube 231 has an inner shape corresponding to the outer shape of the body 220, and has an inner dimension substantially the same as or slightly smaller than the outer dimension of the tube 231 of the body 220. Thus, the body 220 is fitted in the tube 231. The dimension of the tube 231 in the Z-Z 'direction may be substantially the same as the dimension of the body 220 in the Z-Z' direction, as illustrated in fig. 2A-3B. Alternatively, the dimension of the tube 231 in the Z-Z 'direction may be smaller than the dimension of the body 220 in the Z-Z' direction, in which case only the base 221 of the body 220 fits in the tube 231.

Assembly a2 includes a housing 300 and a second connector 400. As illustrated in fig. 1 to 4B, the case 300 has a box shape with an opening (i.e., open in the Z' direction). The housing 300 may be made of a metal plate or a plastic material, etc. The housing 300 can be combined with the circuit board 100 in the Z-Z' direction. More specifically, the case 300 may be combined with the circuit board 100 such that the circuit board 100 closes the opening portion of the case 300. The combined housing 300 and circuit board 100 define a receiving space R. The housing 300 includes a top plate 310 and a side plate 320 having a tubular shape, the top plate 310 facing the circuit board 100 in the Z-Z' direction, the side plate 320 extending from the top plate 310 to abut the circuit board 100. The second connector 400 passes through the top plate 310 in the Z-Z' direction.

The housing 300 may be provided separately from the second connector 400. In this case, the top plate 310 has an opening 311 extending through the top plate 310 in the Z-Z' direction. The second connector 400 passes through the opening 311, and the edge 312 of the opening 311 of the top plate 310 is attached to the Z-direction side portion of the wall 431 (to be described) of the second connector 400.

Alternatively, the housing 300 may be formed integrally with the second connector 400. In this case, the housing 300 is integrally formed with a Z-direction side portion of a wall 431 (to be described) of the second connector 400 by insert molding, double injection molding, or other methods, so that the second connector 400 passes through the top plate 310 in the Z-Z' direction. In this case, the housing 300 is formed by molding a plastic material.

The second connector 400 is a female connector which passes through the top plate 310 of the housing 300 in the Z-Z' direction and can be connected to the first connector 200 within the receiving space R.

The second connector 400 includes at least one terminal 410 and a body 420. The body 420 is any type of body that is formed of an insulating resin and configured to hold at least one terminal 410. For example, the body 420 may include at least one receiving portion 421, the or each receiving portion 421 being an aperture or groove for holding the terminal 410 or a corresponding terminal 210. In the embodiment of fig. 2A to 4B, the main body 420 includes a single receiving portion 421, this receiving portion 223 is a through hole extending through the main body 220 in the Z-Z' direction, and the receiving portion 421 holds the single terminal 410. In another aspect, the at least one terminal 410 may be embedded in the body 420 by insert molding or other means.

The second connector 400 may also include a housing 430 made of a conductive material. The housing 430 is a generally tubular body to receive and retain the body 420 therein. The dimension of the housing 430 in the Z-Z' direction is greater than the dimension of the body 420. The housing 430 has the wall 431 mentioned above. The wall 431 is a tubular wall open in the Z' -direction. The wall 431 is located on the Z' -direction side with respect to the main body 420 of the housing 430. The wall 431 is located on the Z' -direction side with respect to the ceiling 310 of the housing 300, and is disposed within the accommodating space R. The space within the wall 431 serves as a connection hole 440 for the second connector 400 to receive or matingly receive the first connector 200 in the Z-Z' direction. For convenience of description, a state in which the first connector 200 is received or fittingly received in the connection hole 440 of the second connector 400 is referred to as a "connection state".

If the housing 430 is provided, the housing 430 also includes a wall 432. Wall 432 is a tubular wall that is open in the Z-direction. The wall 432 is located on the Z-direction side with respect to the main body 420 of the housing 430. The space within wall 432 serves as a receiving hole 450 to receive an end portion of a cable (not shown).

The or each terminal 410 includes a contact portion 411 and a tail portion 412. In one aspect, the contact portion 411 of the or each terminal 410 protrudes from the body 420 in the Z' direction and is disposed in the connection hole 440. In this regard, in the connected state, the contact portion 411 of the or each terminal 410 is in contact with the contact portion 211 of the corresponding terminal 210 in the receiving portion 223 of the first connector 200. In another aspect, the contact portion 411 of the or each terminal 410 is exposed or protrudes from the body 420 and is disposed within the connection hole 440. In this regard, in the connected state, the contact portion 411 of the or each terminal 410 contacts the contact portion 211 of the corresponding terminal 210 exposed or protruding from the distal portion 222 of the main body 220 of the first connector 200.

The tail portion 412 of at least one terminal 410 protrudes from the main body 420 in the Z-direction and is disposed in the receiving hole 450. The tail portion 412 of the or each terminal 410 is connected to a corresponding core (not shown) of the cable.

The second connector 400 may further include an inner seal 460, and the inner seal 460 may be made of an elastic material such as silicon rubber. If the inner seal 460 is provided, a portion of the receiving hole 450 of the housing 430 on the Z' -direction side may serve as the receiving chamber 433. The outer dimension of the inner seal 460 is slightly larger than the dimension of the receiving chamber 433. In this manner, in a state where the inner seal 460 is accommodated in the accommodation chamber 433, the outer peripheral surface of the inner seal 460 is in close contact with the wall surface of the accommodation chamber 433. The inner seal 460 is provided with at least one through hole 461 extending through the inner seal 460 in the Z-Z' direction. The inner dimension of the or each through hole 461 is slightly smaller than the outer dimension of a portion of the corresponding terminal 410 located on the Z' -direction side with respect to the tail portion 412 (hereinafter, referred to as "close contact portion"). As such, the or each inner peripheral surface of the inner seal 460 (i.e., the peripheral wall of the or each through-hole 461) is in close contact with the close contact portion of the corresponding terminal 410.

It is to be noted that in the case where a plurality of terminals 210 are provided, it is desirable to provide a corresponding number of terminals 410 and a corresponding number of cores of the cable. In addition, the body 420 may be optionally provided with a plurality of receiving portions 421 according to the number of the terminals 410. In the case where the second connector 400 includes the inner seal 460, the inner seal 460 may have a plurality of receiving portions 421 according to the number of the terminals 410. As described above, the inner seal 460 and the receiving chamber 433 are optional.

In the case where the outer case 430 is omitted, it is preferable that the connection hole 440 is provided at an end of the main body 220 on the Z' direction side, the wall 431 is a tubular wall surrounding (defining) the connection hole 440, the receiving hole 450 is provided at an end portion of the main body 220 on the Z direction side, and the wall 432 is a tubular wall surrounding (defining) the receiving hole 450. In the case where the second connector 400 includes the inner seal 460 and the housing 430 is omitted, it is preferable that the receiving chamber 433 is provided in a portion of the main body 220 on the Z' -direction side with respect to the receiving hole 450.

Assembly a2 also includes a sealing member 500, the sealing member 500 having a tubular shape extending in the Z-Z' direction. The dimension of the sealing member 500 in the Z-Z 'direction is smaller than or substantially equal to the dimension in the Z-Z' direction from the first face 101 of the circuit board 100 to the top plate 310, and is larger than the dimension in the Z-Z 'direction from the first face 101 of the circuit board 100 to the distal end of the wall 431 of the second connector 400 in the Z' direction. The sealing member 500 includes a first portion 510 and a second portion 520, the first portion 510 and the second portion 520 being tubular end portions of the Z-side and Z' -side of the sealing member 500, respectively.

The sealing member 500 may be provided separately from the second connector 400. In this case, the sealing member 500 is made of an elastic material (such as silicon rubber or elastomer), a plastic material, or the like. The first portion 510 of the sealing member 500 has an inner shape corresponding to the outer shape of at least a part of the wall 431 of the second connector 400 (for example, an end portion on the Z 'direction side), and has an inner dimension substantially the same as or slightly smaller than the outer dimension of at least a part of the wall 431 (an end portion on the Z' direction side). The first part 510 is fitted around at least a part of the wall 431, wherein an inner circumferential surface of the first part 510 is in close contact with an outer circumferential surface of the at least a part of the wall 431. It is apparent that the first part 510 may be fitted around the wall 431 such that the inner circumferential surface of the first part 510 is in close contact with the entire outer circumferential surface of the wall 431.

The second portion 520 of the sealing member 500 is located on the Z' -direction side with respect to at least a part of the wall 431. The inner dimension of the second portion 520 is larger than the outer dimension of the first connector 200. The second portion 520 is configured to abut against the first face 101 of the circuit board 100 within the accommodation space R and cover and surround the first connector 200.

In the case where the first connector 200 does not include the housing 230, the second portion 520 accommodates a portion (connection portion) that connects the tail portion 212 of at least one terminal 210 of the first connector 200 and at least one first electrode 110 of the circuit board 100 together. In the case where the first connector 200 includes the housing 230, the second portion 520 accommodates the connection portion and a portion connecting the housing 230 of the first connector 200 and the at least one second electrode 120 of the circuit board 100 together.

Accordingly, the sealing member 500 is fitted around at least a portion of the wall 431 and abuts the circuit board 100 so as to be disposed between the top plate 310 of the housing 300 and the circuit board 100 (i.e., disposed within the accommodation space R).

In the case where the sealing member 500 is made of an elastic material, the dimension of the second portion 520 of the sealing member 500 in the Z-Z 'direction may be slightly larger than the dimension from the first face 101 of the circuit board 100 to the Z' -direction end of the wall 431 of the second connector 400. In this case, the second portion 520 of the sealing member 500 can elastically abut against the first face 101 of the circuit board 100.

In another aspect, the sealing member 500 may be integrated with at least a portion (e.g., an end portion on the Z' -direction side) of the wall 431 of the second connector 400. More specifically, the sealing member 500 may be integrally molded on the outer circumferential surface of at least a portion of the wall 431 of the second connector 400 by insert molding, double injection molding, or other methods. Thus, the first portion 510 is formed integrally with at least a portion of the wall 431 to fit around at least a portion of the wall 431 and extend along the outer peripheral surface of the wall 431 of the second connector 400. Further, in this aspect, the second portion 520 is configured as described above. In this regard, the sealing member 500 is formed by molding a plastic material to be integrally molded with the outer circumferential surface of the wall 431 and disposed within the accommodating space R. The first portion 510 may be formed integrally with (integrally fixed to) the entire wall 431.

The "at least a portion of the wall 431" around which the first part 510 is fitted corresponds to a "receivable portion" of the second connector described in claims. In the present invention, the expression "the first portion fits around the receivable portion of the second connector" is not limited to the configuration in which the first portion of the seal member is provided as a separate member and fits around the receivable portion of the second connector, but also encompasses the configuration in which the first portion of the seal member is formed integrally with and fits around the receivable portion of the second connector.

The module M1 also includes a thermally conductive resin 600. The heat conductive resin 600 may have any thermal conductivity at least higher than that of air (0.0241W/m · K). The receiving space R may be filled with the heat conductive resin 600.

In connection with the above-described module M1, a method of manufacturing assembly a1 of module M1 is described below. The circuit board 100 and the first connector 200 are prepared. In the case where the first connector 200 includes the housing 230, at least one terminal 210 of the first connector 200 is connected to at least one first electrode 110 on or in the first face 101 of the circuit board 100 using solder, a conductive adhesive, or the like, and the housing 230 of the first connector 200 is connected to at least one second electrode 120 of the first face 101 of the circuit board 100 using solder, a conductive adhesive, or the like. In the case where the first connector 200 does not include the housing 230, at least one terminal 210 of the first connector 200 is connected to at least one first electrode 110 of the first face 101 of the circuit board 100 using solder, a conductive adhesive, or the like. Thus, the first connector 200 is mounted on the first face 101 of the circuit board 100 to manufacture the component a 1.

In connection with the above-described module M1, a first method of manufacturing assembly a2 of module M1 is described below. For purposes of illustration and not limitation, assembly a2 herein is configured such that second connector 400 is disposed separately from housing 300 and sealing member 500. The second connector 400 and the housing 300 are prepared. The second connector 400 is inserted through the opening 311 of the top plate 310 of the housing 300, and the portion of the wall 431 of the second connector 400 on the Z-direction side is attached to the edge 312 of the opening 311. Accordingly, the second connector 400 passes through the top plate 310 of the housing 300 in the Z-Z' direction. The sealing member 500 is also prepared. At least a portion of the wall 431 of the second connector 400 is pushed into the first portion 510 of the sealing member 500. As a result, the first portion 510 of the sealing member 500 is fitted around the at least a portion of the wall 431 and is arranged on the Z' -direction side with respect to the top plate 310 of the housing 300. Thereby producing assembly a 2.

The second method of manufacturing assembly a2 of module M1 described above is described below. For purposes of illustration and not limitation, assembly a2 herein is configured such that second connector 400 is integral with housing 300 and sealing member 500. The second connector 400 is placed in a first mold (not shown). Exposed in the cavity of the first mold is a portion of the second connector 400 disposed on the Z-direction side with respect to the wall 431. The cavity has a shape corresponding to the shape of the housing 300. Then, the molten plastic material is injected into the cavity of the first mold, and then cooled and solidified. As a result, the housing 300 is molded such that the ceiling 310 thereof is integrally molded on the portion of the second connector 400 on the Z-direction side with respect to the wall 431, and the second connector 400 passes through the ceiling 310 in the Z-Z' direction.

The second connector 400 is placed in a second mold (not illustrated). Exposed in the cavity of the second mold is the outer peripheral surface of at least a portion of the wall 431 of the second connector 400. The cavity has a shape corresponding to the shape of the sealing member 500. Then, the molten plastic material is injected into the cavity of the second mold, and then cooled and solidified. Thus, the sealing member 500 is integrally and securely molded with the at least a portion of the wall 431 of the second connector 400. This is the second method of making assembly a 2.

It is noted that the above methods of manufacturing assembly a2 may be combined. Specifically, the assembly a2 may be manufactured such that the housing 300 is integrally molded with the second connector 400 and the sealing member 500 is provided separately from the second connector 400 to fit around the wall 431 of the second connector 400. Assembly a2 may also be manufactured such that housing 300 is provided separately from second connector 400 for insertion through opening 311 of housing 300 and attachment to housing 300, and sealing member 500 is integrally molded with at least a portion of wall 431 of second connector 400.

The following describes a method for producing module M1 using module a1 and module a 2. More specifically, the component a1 and the component a2 were brought close to each other in the Z-Z' direction and combined with each other in the following manners (1) and (2).

(1) The circuit board 100 of the component a1 is combined with the case 300 of the component a2 such that the circuit board 100 closes the opening of the case 300, whereby the circuit board 100 and the case 300 define the accommodating space R.

(2) The first connector 200 of the assembly a1 is inserted into the sealing member 500 of the assembly a2 such that the first connector 200 is inserted into the connection hole 440 of the second connector 400 or is fittingly inserted into the connection hole 440 of the second connector 400. The second portion 520 of the sealing member 500 is brought into abutment with the first face 101 of the circuit board 100 to cover and surround the first connector 200. In this step, the contact portion 211 of the or each terminal 210 of the first connector 200 is brought into contact with the contact portion 411 of the or each terminal 410 of the second connector 400, so that the first connector 200 is electrically connected to the second connector 400. In the case where the sealing member 500 is made of an elastic material, the second portion 520 of the sealing member 500 is brought into elastic abutment and close contact with the first face 101 of the circuit board 100.

Then, the melted heat conductive resin is injected into the accommodating space R for filling. The injected heat conductive resin is cooled and solidified to form the heat conductive resin 600.

In the case where the assembly a2 is configured such that the first portion 510 of the sealing member 500 fits around a portion of the wall 431, the heat conductive resin 600 is in close contact with the circuit board 100, the top plate 310 of the housing 300, the side plates 320 of the housing 300, the sealing member 500, and the exposed portion of the wall 431 of the second connector 400, thus leaving no gap. The exposed portion of the wall 431 is a portion of the wall 431 that is located within the receiving space R and exposed from the sealing member 500.

In the case where the assembly a2 is configured such that the first portion 510 of the sealing member 500 is fitted around the entire outer circumferential surface of the wall 431, the heat conductive resin 600 is in close contact with the circuit board 100, the top plate 310 of the case 300, the side plates 320 of the case 300, and the sealing member 500, and thus no gap is left.

It should be noted that the present invention is not limited to such a configuration without a gap from the heat conductive resin 600 to each of the above-referenced elements of the assemblies a1 and a 2.

Thus, embedded in the heat conductive resin 600 are the first connector 200, the sealing member 500, and the wall 431 of the second connector 400. Thereby obtaining a module M1.

The module M1 may be manufactured within the housing of an electronic device such as a camera module. In this case, before bringing the component a1 and the component a2 closer to each other, the circuit board 100 of the component a1 is mounted on a certain component within the housing of the electronic device such that the circuit board 100 and the component are stacked in the Z-Z' direction. The circuit board 100 on the component may be inclined with respect to an imaginary plane extending perpendicular to the Z-Z' direction for at least one of the following reasons.

(a) When the circuit board 100 of assembly a1 is disposed on a component within a housing of an electronic device, the circuit board 100 may tilt due to dimensional tolerances of the component on which the circuit board 100 is disposed and/or dimensional tolerances in one or more other components of an electronic part on which the component is disposed, either indirectly or directly.

(b) In the case where the electronic device includes a floating mechanism, the circuit board 100 of the assembly a1 may tilt when the circuit board 100 is mounted directly or indirectly on the floating mechanism within the housing of the electronic device. The floating mechanism corresponds to the above-mentioned component or other components of the electronic device if the circuit board 100 is tilted due to the combination of the reasons (a) and (b).

Then, the module a2 was brought closer to the module a1 in the electronic device case in the above-described manner, and the module a2 was combined with the module a1 in the above-described manners (1) to (2). In the case where the sealing member 500 is made of an elastic material, the above step (2) includes elastically abutting (pressing) the second portion 520 of the sealing member 500 against the first face 101 of the circuit board 100. Then, the heat conductive resin is injected into the accommodating space R in the above-described manner to form the heat conductive resin 600.

It should be understood that the inclination of the circuit board 100 may occur not only when the module M1 is manufactured within the electronic device case, but also due to other factors, such as inclination of the portion (of the outside of the electronic device) on which the circuit board 100 is to be placed.

The assemblies a1 and a2 and module M1 described above provide at least the following features and effects. The assemblies a1 and a2 and the module M1 provide improved heat dissipation for the following reasons. Within the receiving space R, the first portion 510 of the sealing member 500 fits around at least a portion of the wall 431 of the second connector 400, and the second portion 520 of the sealing member 500 abuts the circuit board 100 and covers the first connector 200. This arrangement makes it possible to fill the accommodating space R with the heat conductive resin by injecting the heat conductive resin 600 into the accommodating space R because the injected heat conductive resin will not enter the interior of the sealing member 500 (i.e., the interior of the first connector 200 and the second connector 400). The heat conductive resin 600 allows heat to be radiated from the circuit board 100 and the first and second connectors 200 and 400 to the outside of the case 300.

In the case where the sealing member 500 of the module M1 is made of an elastic material, when the first connector 200 and the second connector 400 are connected together, the second portion 520 of the sealing member 500 is brought into elastic abutment with the first face 101 of the circuit board 100 (pressed against the first face 101 of the circuit board 100). This arrangement reduces the possibility of leaving a gap between the sealing member 500 and the first face 101 of the circuit board 100. This makes it more difficult for the thermally conductive resin filled in the accommodating space R to enter the inside of the sealing member 500.

Specifically, when the circuit board 100 is inclined for any of the above reasons, the inclination may be absorbed by the elastic abutment of the sealing member 500. Therefore, a gap is less likely to remain between the sealing member 500 and the first face 101 of the circuit board 100.

Second embodiment

Now, a connection module M2 (or simply a module M2) according to various embodiments of the present invention including a second embodiment will be described with reference to fig. 5A to 6B. Fig. 5A to 6B illustrate a module M2 according to a second embodiment. The connection module M2 includes a first connector assembly a1 '(or simply module a1') and a second connector assembly a2 '(or simply module a 2').

Module M2 has a similar construction to module M1, but differs from module 1 in the following aspects 1 and 2. The module M2 will be described with emphasis on the differences and the repetitive description will be omitted.

Difference 1): assembly a1' includes sealing member 500' instead of assembly a2 '. More specifically, the sealing member 500 'fits around the Z' -direction side portion of the first connector 200 of assembly a1', but not around at least a portion of the wall 431 of the second connector 400 of assembly a 2'.

Difference 2): assembly a1 'instead of assembly a2' includes a housing 300. Therefore, assembly a2' of module M2 does not include housing 300 nor seal member 500.

Assembly a1' corresponds to the connector assembly defined in claim 4 and its dependent claims in the appended claims. The Z-Z' direction is indicated in fig. 5A to 6B in a similar manner to fig. 2A, 2B, 3A, and 3B.

The case 300 is combined with the circuit board 100 such that the circuit board 100 closes the opening portion of the case 300.

The sealing member 500 'includes a first portion 510' and a second portion 520', the first portion 510' and the second portion 520 'being tubular end portions of the Z-side and the Z' -side of the sealing member 500, respectively.

The sealing member 500' may be provided separately from the first connector 200. In this case, the second portion 520' has an inner shape corresponding to the outer shape of at least a portion of the first connector 200, and has an inner dimension substantially the same as or slightly smaller than the outer dimension of at least a portion of the first connector 200. The second portion 520' of the sealing member 500' is fitted around at least a portion of the first connector 200, wherein the inner circumferential surface of the second portion 510' is in close contact with the outer circumferential surface of the at least a portion of the first connector 200. The second portion 520' also abuts the first side 101 of the circuit board 100. The second portion 520' covers the first connector 200.

In the case where the first connector 200 does not include the housing 230, the second portion 520' receives a portion (connection portion) that connects the tail portion 212 of at least one terminal 210 of the first connector 200 and at least one first electrode 110 of the circuit board 100 together. In the case where the first connector 200 includes the housing 230, the second portion 520' receives the connection portion and a portion connecting the housing 230 of the first connector 200 and the at least one second electrode 120 of the circuit board 100 together.

The above-mentioned at least part of the first connector 200 may be a part (e.g., the tubular part 231) of the housing 230 on the Z' -direction side where the first connector 200 includes the housing 230. The at least one portion of the first connector may be a portion (e.g., the base 221) of the main body 220 of the first connector 200 at the Z' -direction side where the first connector 200 does not include the housing 230.

In the case where the sealing member 500 'is provided separately from the first connector 200, the first portion 510' of the sealing member 500 'has an inner shape corresponding to an outer shape of at least a part (e.g., a part on the Z' direction side) of the wall 431 of the second connector 400. The inner dimension of the first portion 510' is substantially the same as or slightly smaller than the outer dimension of the at least a portion of the wall 431. The inner dimension of the first portion 510 'is greater than the inner dimension of the second portion 520'. Thus, the first portion 510' may fit around the at least a portion of the wall 431.

Where the sealing member 500' is made of an elastic material, the first portion 510' of the sealing member 500' may have an inner dimension that is slightly smaller than an outer dimension of the at least a portion of the wall 431. In this case, the first portion 510' may fit more tightly around at least a portion of the wall 431.

In another aspect, the sealing member 500' may be integral with at least a portion of the first connector 200. More specifically, the sealing member 500' may be integrally molded on the outer circumferential surface of at least a portion of the first connector 200 by insert molding, double injection molding, or other methods. Thus, the second portion 520' is formed integrally with the at least one portion of the first connector 200 to fit around the at least one portion of the first connector 200. The second portion 520' extends along the outer peripheral surface of the at least a portion of the first connector 200. In this aspect, the first portion 510' is also constructed as described above. In this regard, the sealing member 500' is formed by molding a plastic material to be integrally molded with an outer circumferential surface of at least a portion of the first connector 200.

In the present invention, the expression "the second portion is fitted around at least a part of the first connector" is not limited to a configuration in which the second portion of the seal member is provided as a separate member and fitted around at least a part of the first connector, but also encompasses a configuration in which the second portion of the seal member is formed integrally with and fitted around the first connector.

The method of making assembly a1' is described below. For purposes of illustration and not limitation, assembly a1 'herein will be configured such that sealing member 500' is disposed separately from first connector 200. As in the method of manufacturing the assembly a1, the first connector 200 is mounted on the first side 101 of the circuit board 100. The sealing member 500' is prepared separately from the first connector 200. At least a portion of the first connector 200 is pushed into the second portion 520 'of the sealing member 500'. As a result, the second portion 520 'of the sealing member 500' is fitted around at least a portion of the first connector 200 such that the inner circumferential surface of the second portion 510 'is in close contact with the outer circumferential surface of the at least a portion of the first connector 200, and the second portion 520' abuts against the first face 101 of the circuit board 100. As a variation of this manufacturing method, the sealing member 500' may be placed to fit around at least a portion of the first connector 200 before the first connector 200 is mounted on the circuit board 100. In this case, when the first connector 200 is mounted on the first face 101 of the circuit board 100, the second portion 520' abuts the first face 101 of the circuit board 100.

In the case where the sealing member 500' is made of an elastic material, the second portion 520' of the sealing member 500' is brought into elastic abutment and close contact with the first face 101 of the circuit board 100.

In the case where the assembly a1' is to be constructed such that the sealing member 500' is integral with at least a portion of the first connector 200, the assembly steps of the sealing member 500' should be modified as follows. The first connector 200 is placed in a mold (not illustrated). Exposed in the cavity of the mold is at least a portion of the first connector 200. The cavity has a shape corresponding to the shape of the sealing member 500'. The molten plastic material is then injected into the cavity of the mold, and then cooled and solidified. Thus, the sealing member 500' is integrally and securely molded with at least a portion of the first connector 200.

After the first connector 200 is mounted on the circuit board 100 and after the sealing member 500' is brought into abutment with the first face 101 of the circuit board 100, the housing 300 is prepared. The circuit board 100 is combined with the case 300 such that the circuit board 100 closes the opening portion of the case 300. As a result, the circuit board 100 and the case 300 define the receiving space R. Thereby producing assembly a 1'.

The assembly a2' is manufactured by a method similar to the first or second method of manufacturing the assembly a2, and does not include the step of fitting or molding the sealing member 500 around the second connector 400, nor the step of attaching the housing 300 to the second connector 400 or molding the housing 300 on the second connector 400.

The following describes a method for manufacturing module M2 using module a1 'and module a 2'. More specifically, the module a1' and the module a2' are brought close to each other in the Z-Z ' direction and combined with each other in the following manner.

The wall 431 of the second connector 400 of the assembly a2 'is inserted into the opening 311 of the housing 300 of the assembly a1', at least a portion of the wall 431 is pushed into the sealing member 500 'of the assembly a1', and the first portion 510 'of the sealing member 500' is arranged to fit around at least a portion of the wall 431 and to be in intimate contact with an outer peripheral surface of at least a portion of the wall 431. In addition, the first connector 200 of assembly a1 'is inserted or matingly inserted into the connection hole 440 of the second connector 400 of assembly a 2'. In this step, the contact portion 211 of the or each terminal 210 of the first connector 200 is brought into contact with the contact portion 411 of the or each terminal 410 of the second connector 400, so that the first connector 200 is electrically connected to the second connector 400. In the case where the sealing member 500' is made of an elastic material, the first portion 510' of the sealing member 500' is brought into elastic abutment and close contact with at least a part of the outer peripheral surface of the wall 431.

The module M2 may also be manufactured within the housing of an electronic device such as a camera module. In the case where the sealing member 500' is made of an elastic material, in the step of fitting the first portion 510' of the sealing member 500' around at least a portion of the wall 431, the second portion 520' of the sealing member 500' is brought into elastic abutment with (pressed against) the first face 101 of the circuit board 100.

Then, the melted heat conductive resin is injected and filled into the accommodating space R. The injected heat conductive resin is cooled and solidified to form the heat conductive resin 600 in which the walls 431 of the first connector 200, the sealing member 500', and the second connector 400 are embedded. Thereby obtaining a module M2.

The assemblies a1 'and a2' and the module M2 described above provide at least the following technical features and effects. The assemblies a1 'and a2' and the module M2 provide improved heat dissipation for the following reasons. Within the receiving space R, the second portion 520 'of the sealing member 500' fits around at least a portion of the first connector 200 and abuts the circuit board 100, and the first portion 510 'of the sealing member 500' fits around at least a portion of the wall 431 of the second connector 400. This arrangement makes it possible to fill the accommodating space R with the heat conductive resin by injecting the heat conductive resin 600 into the accommodating space R because the injected heat conductive resin will not enter the inside of the sealing member 500 (i.e., the inside of the first connector 200 and the second connector 400). The heat conductive resin 600 allows heat to be radiated from the circuit board 100 and the first and second connectors 200 and 400 to the outside of the case 300.

In the case where the sealing member 500' of the module M2 is made of an elastic material, the second portion 520' of the sealing member 500' is brought into elastic abutment with the first face 101 of the circuit board 100 (pressed against the first face 101 of the circuit board 100). This arrangement reduces the likelihood of leaving a gap between the sealing member 500' and the first side 101 of the circuit board 100. This makes it difficult for the heat conductive resin filled in the receiving space R to enter the inside of the sealing member 500'.

Specifically, when the circuit board 100 is inclined for any of the above reasons, the inclination may be absorbed by the elastic abutment of the sealing member 500'. Therefore, a gap is less likely to be left between the sealing member 500' and the first face 101 of the circuit board 100.

It should be understood that these connector assemblies, connection modules and methods of manufacturing the connector assemblies and connection modules are not limited to the embodiments described above, but may be modified in any manner within the scope of the claims. Next, a specific modified example will be described.

The housing 300 may be omitted from assembly a 1'. In this case, assembly a2' may include housing 300 of any aspect of assembly a 2. The assembly a1' with the housing 300 omitted corresponds to the connector assembly defined in claim 3 of the appended claims and the dependent claims thereof. A connection module comprising the thus modified assembly a1 'and assembly a2' can be manufactured in the following manner. The module a1' and the module a2' were brought close to each other in the Z-Z ' direction and combined together. As a result, the circuit board 100 of the component a1 'is combined with the case 300 of the component a2' such that the circuit board 100 closes the opening portion of the case 300, whereby the circuit board 100 and the case 300 define the accommodation space R. In addition, at least a portion of the wall 431 of the second connector 400 of the assembly a2' is pushed into the sealing member 500' of the assembly a1', and the first portion 510' of the sealing member 500' is fitted around at least a portion of the wall 431 so as to be in close contact with the outer circumferential surface of the at least a portion of the wall 431. Further, the first connector 200 of the assembly a1' is inserted or fittingly inserted into the connection hole 440 of the second connector 400. In this step, the contact portion 211 of the or each terminal 210 of the first connector 200 is brought into contact with the contact portion 411 of the or each terminal 410 of the second connector 400, so that the first connector 200 is electrically connected to the second connector 400.

As in the above embodiment and its variations, the first connector may be a male connector, and the second connector may be a female connector. Alternatively, the first connector may be a female connector and the second connector may be a male connector. An example of such a variation is shown in fig. 7 as a connection module M3 comprising assembly a1 "and assembly a 2". Assembly a1 "includes a first connector 200 'with a connecting aperture 201'. Assembly a2 "includes a second connector 400', the second connector 400' having a distal portion 401 'to be inserted or fittingly inserted into the attachment aperture 201'. The connection module M3 further includes a sealing member 500 ", the sealing member 500" includes a first portion 510 "and a second portion 520" and may have a configuration (a) or (B) as follows.

(A) The first portion 510 "of the sealing member 500" is fitted around the portion 402' (corresponding to the receivable portion) on the Z-direction side of the distal portion 401' of the second connector 400 '. In this case, the second portion 520 "of the sealing member 500" is located on the Z '-direction side with respect to the portion 402' of the second connector 400', abuts the first face 101 of the circuit board 100 within the accommodation space R, and covers and surrounds the first connector 200'. The sealing member 500 ″ may be a separate member from the second connector 400 'or may be integrally formed with the second connector 400'.

(B) The second portion 520 "of the sealing member 500" fits around at least a portion of the first connector 200'. In this case, the first portion 510 "of the sealing member 500" is located on the Z-direction side with respect to at least a part of the first connector 200', and is fitted around the portion 402' (corresponding to the receivable portion) on the Z-direction side of the distal portion 401 'of the second connector 400'. The sealing member 500 ″ may be a separate member from the first connector 200 'or may be integrally formed with the first connector 200'.

In either of the above configurations (a) and (B), the first portion 510 "of the sealing member 500" may preferably (but need not necessarily) have an inner dimension that is smaller than an inner dimension of the second portion 520 "of the sealing member 500".

The receiving portion of the second connector of the present invention only needs to be configured to be disposed within the receiving space and fitted around the first portion of the seal member of any of the above aspects or integrally molded to be fitted around the first portion. As described above, the sealing member of the present invention may be provided in the first connector or the second connector, but the present invention is not limited thereto. The sealing member of the present invention may be fixed such that the second portion abuts a circumference of the first connector when mounted on the circuit board, and the first portion is fitted around the receivable portion of the second connector.

It should be understood that the materials, shapes, sizes, numbers, positions, etc. of the elements in the connection module and the connector assembly in the above embodiments and the modifications thereof are presented by way of example only and may be modified in any manner as long as the same functions are achieved. The aspects and variants of the above described embodiments may be combined in any possible way. It should be noted that the first direction of the present invention may be any direction substantially perpendicular to the circuit board of the present invention or any direction in which the first connector and the second connector are connected together.