阅读说明：本技术 一种rf射频装置的键合方法 (Bonding method of RF (radio frequency) device ) 是由 陈洁 于 2019-09-23 设计创作，主要内容包括：本发明提供了一种RF射频装置的键合方法,本发明的RF射频装置采用RF器件的封装块与线圈结构的封装块进行混合键合,并且在键合之前,进行两个封装块(待键合部分)的无效封装单元的更换,可以实现产率的提高,且可以避免现有技术中在RF芯片的封装体上沉积集成线圈所带来的多层之间的应力问题,以及多层层叠沉积所带来的不可靠性。(The invention provides a bonding method of an RF device, the RF device of the invention adopts the packaging block of an RF device and the packaging block of a coil structure to carry out mixed bonding, and before bonding, the replacement of an invalid packaging unit of two packaging blocks (to-be-bonded parts) is carried out, thereby improving the yield, and avoiding the stress problem among multiple layers caused by the deposition of an integrated coil on the packaging body of an RF chip in the prior art and the unreliability caused by the deposition of multiple layers in a laminated way.)

1. A method of bonding an RF radio frequency device, comprising:

(1) forming a first part to be bonded, wherein the first part to be bonded comprises a plurality of radio frequency chip packaging units arranged in an array;

(2) forming a second part to be bonded, wherein the second part to be bonded comprises a plurality of radio frequency coil packaging units arranged in an array;

(3) detecting the first to-be-bonded part and the second to-be-bonded part, and obtaining distribution diagrams of effective packaging units and ineffective packaging units of the first to-be-bonded part and the second to-be-bonded part;

(4) pre-aligning the first to-be-bonded part and the second to-be-bonded part, and calculating an optimal alignment position, wherein the optimal alignment position enables effective packaging units of the radio frequency chip packaging units to be aligned with effective packaging units of the radio frequency coil packaging units to the maximum extent;

(5) cutting and taking down the radio frequency chip packaging unit or the radio frequency coil packaging unit of which one of the two aligned packaging units is an invalid packaging unit at the optimal alignment position;

(6) replacing the position of the cut and taken-off invalid radio frequency chip packaging unit with another valid radio frequency chip packaging unit, and forming a valid radio frequency coil packaging unit at the position of the cut and taken-off invalid radio frequency coil packaging unit through a semiconductor process;

(7) carrying out hot-pressing bonding on the first to-be-bonded part and the second to-be-bonded part, so that the radio frequency chip packaging units are electrically connected with the radio frequency coil packaging units respectively;

(8) cutting to form individual RF devices.

2. The bonding method of an RF radio frequency device according to claim 1, wherein: the first portion to be bonded includes a first bonding surface constituted by an upper surface of the first through hole and an upper surface of the first insulating layer.

3. The bonding method of an RF radio frequency device according to claim 2, wherein: the second portion to be bonded includes a second bonding surface constituted by an upper surface of the second through hole and an upper surface of the first encapsulating resin.

4. The bonding method of an RF device according to claim 3, wherein: and (4) bonding the first through hole and the second through hole and bonding the first insulating layer and the first packaging resin in the hot-press bonding process of the step (7).

5. The bonding method of an RF radio frequency device according to claim 1, wherein: forming the second bonding portion specifically includes: forming a protective film on the carrier plate with the release film; depositing a conductive layer on the protective film and patterning to form a plurality of coils; injection molding the first sealing resin on the carrier plate to seal the plurality of coils; a plurality of second through holes are formed in the first sealing resin, and the plurality of second through holes are electrically connected to the plurality of coils, respectively.

6. The bonding method of an RF device according to claim 5, wherein: the another effective rf chip package unit obtained in the step (6) is obtained by cutting another first portion to be bonded, and the forming of the effective rf coil package unit by the semiconductor process specifically includes: and depositing another protective film at the position of the invalid radio frequency coil packaging unit which is cut and taken off, depositing metal on the other protective film and patterning to form a coil, then injecting resin at the position to form sealing resin, and then forming a conductive through hole in the sealing resin.

Technical Field

The invention relates to the field of integrated circuit package manufacturing, in particular to a bonding method of an RF device.

Background

In the existing RF radio frequency device, the RF control chip is first subjected to plastic package, then a redistribution layer is formed on the plastic package body, and an RF coil structure is formed on or in the redistribution layer. Although this method achieves an improvement in the integration level, the process requires encapsulation of the plastic package body first and then deposition of redistribution layers, which results in a reduction in the yield, and in this sequence, the overall test can only be performed at the end, which is disadvantageous for the yield.

Disclosure of Invention

In order to solve the above problems, the present invention provides a bonding method of an RF device, including:

(1) forming a first part to be bonded, wherein the first part to be bonded comprises a plurality of radio frequency chip packaging units arranged in an array;

(2) forming a second part to be bonded, wherein the second part to be bonded comprises a plurality of radio frequency coil packaging units arranged in an array;

(3) detecting the first to-be-bonded part and the second to-be-bonded part, and obtaining distribution diagrams of effective packaging units and ineffective packaging units of the first to-be-bonded part and the second to-be-bonded part;

(4) pre-aligning the first to-be-bonded part and the second to-be-bonded part, and calculating an optimal alignment position, wherein the optimal alignment position enables effective packaging units of the radio frequency chip packaging units to be aligned with effective packaging units of the radio frequency coil packaging units to the maximum extent;

(5) cutting and taking down the radio frequency chip packaging unit or the radio frequency coil packaging unit of which one of the two aligned packaging units is an invalid packaging unit at the optimal alignment position;

(6) replacing the position of the cut and taken-off invalid radio frequency chip packaging unit with another valid radio frequency chip packaging unit, and forming a valid radio frequency coil packaging unit at the position of the cut and taken-off invalid radio frequency coil packaging unit through a semiconductor process;

(7) carrying out hot-pressing bonding on the first to-be-bonded part and the second to-be-bonded part, so that the radio frequency chip packaging units are electrically connected with the radio frequency coil packaging units respectively;

(8) cutting to form individual RF devices.

The first portion to be bonded includes a first bonding surface constituted by an upper surface of the first through hole and an upper surface of the first insulating layer.

Wherein the second portion to be bonded includes a second bonding surface constituted by an upper surface of the second through hole and an upper surface of the first encapsulating resin.

And (3) bonding the first through hole and the second through hole and bonding the first insulating layer and the first packaging resin in the hot-press bonding process of the step (7).

Wherein forming the second bonding portion specifically includes: forming a protective film on the carrier plate with the release film; depositing a conductive layer on the protective film and patterning to form a plurality of coils; a first sealing resin is formed on the carrier plate in an injection molding mode so as to seal the plurality of coils; a plurality of second through holes are formed in the first sealing resin, and the plurality of second through holes are electrically connected to the plurality of coils, respectively.

Wherein the another effective rf chip package unit obtained in the step (6) is obtained by cutting another first portion to be bonded, and the forming of the effective rf coil package unit by the semiconductor process specifically includes: and depositing another protective film at the position of the invalid radio frequency coil packaging unit which is cut and taken off, depositing metal on the other protective film and patterning to form a coil, then injecting resin at the position to form sealing resin, and then forming a conductive through hole in the sealing resin.

The invention has the following advantages:

the RF radio frequency device of the invention adopts the packaging blocks of the RF device and the packaging blocks of the coil structure to carry out mixed bonding, and the replacement of the invalid packaging units of the two packaging blocks (parts to be bonded) is carried out before bonding, thereby realizing the improvement of the yield, and avoiding the stress problem among multiple layers caused by the deposition of the integrated coil on the packaging body of the RF chip in the prior art and the unreliability caused by the multilayer laminated deposition.

Drawings

FIG. 1 is a schematic illustration of the bonding of two bonding portions;

FIG. 2 is a cross-sectional view of the bonded RF device of FIG. 1;

FIGS. 3-5 are schematic diagrams (schematic top views) of the bonding method of the present invention;

fig. 6 is a cross-sectional view of the bonding method of the present invention.

Detailed Description

The RF device of the present invention is different from the prior art in that the RF coil is integrated in the redistribution layer or the interlayer dielectric layer, and in the manufacturing process, the metal layer and/or the dielectric layer are sequentially deposited in a lamination manner, and the RF coil is formed in the lamination deposition. The invention is formed by pressing the two parts, can independently manufacture a single package, improves the yield and can realize the yield of the package.

Referring to fig. 1-2, the first bonding portion includes a wiring board 10, a plurality of rf devices 11 and 12, a first encapsulation resin 13, and a redistribution layer structure. The wiring board 10 includes an interposer substrate, a printed circuit board, a package substrate, etc., which has first and second opposing surfaces. The circuit board 10 is used for externally connecting other components, can be additionally provided with external connecting terminals, and can be internally provided with a lead layer and a through hole structure.

The radio frequency devices 11, 12 include amplifiers, filters, antenna switches, etc., which are mainly used for processing radio frequency signals or controlling the package circuits. The rf devices 11, 12 may be more than two, for example, three, four, etc., which are fixed on the first surface and electrically connected to the circuit board 10.

A first encapsulation resin 13 sealing the radio frequency devices 11, 12 and the first surface; the material of the first encapsulating resin 13 is a photo-curing or thermosetting resin, such as PI, PBO, epoxy resin, silicone resin, and the like. A plurality of first through holes 14 are formed in the first encapsulation resin 13, and the plurality of first through holes 14 electrically connect the plurality of radio frequency devices.

The redistribution layer comprises a wiring layer 15, a first insulating layer 16, a second insulating layer 20 and first through holes 21, wherein the wiring layer 15 is arranged on the first packaging resin 13 and is electrically connected with the first through holes 14; the first insulating layer 16 covers the wiring layer 15; a second insulating layer 20 covering the first insulating layer 16; the first via 21 penetrates the first and second insulating layers, and the first and second insulating layers are polymer materials having a certain stress buffering effect.

The electromagnetic shielding layer 18 located between the first insulating layer 16 and the second insulating layer 20 and patterned to form a plurality of void portions 19; the plurality of void portions 19 are provided to pass through the first through-hole 21.

The second bonding portion includes an antenna assembly including a carrier plate 30, a protective film 31, a coil 32, a second encapsulation resin 33, and a second via hole 35, wherein the protective film 31 is formed on the carrier plate 30, and the coil 32 is formed on the protective film 32. The coil 32 is a spiral coil structure and is formed by depositing a metal layer and then etching. The second encapsulation resin 33 completely covers the coil 32, and a plurality of connection posts 40 electrically connect the wiring layer 15 and the coil 32, the plurality of connection posts 40 passing through the first insulating layer 16, the second insulating layer 20, and the plurality of void portions 19. The second through hole 35 is formed in the second encapsulation resin 33 and is electrically connected to the coil 32.

Wherein the first bonding portion and the second bonding portion are laminated together by thermocompression bonding, the second encapsulation resin 33 is tightly bonded with the second insulating layer 20 without a gap, and the first through hole 21 and the second through hole 35 are bonded together to form a third through hole 40 (see fig. 2).

The above bonding method may cause a failure of a partially bonded RF device due to problems of the packaging and semiconductor processes themselves, which is not favorable for improving the yield. In order to improve the yield and the yield, the invention provides a novel bonding method of an RF device, which comprises the following steps:

(1) forming a first part to be bonded, wherein the first part to be bonded comprises a plurality of radio frequency chip packaging units arranged in an array;

(2) forming a second part to be bonded, wherein the second part to be bonded comprises a plurality of radio frequency coil packaging units arranged in an array;

(3) detecting the first to-be-bonded part and the second to-be-bonded part, and obtaining distribution diagrams of effective packaging units and ineffective packaging units of the first to-be-bonded part and the second to-be-bonded part;

(4) pre-aligning the first to-be-bonded part and the second to-be-bonded part, and calculating an optimal alignment position, wherein the optimal alignment position enables effective packaging units of the radio frequency chip packaging units to be aligned with effective packaging units of the radio frequency coil packaging units to the maximum extent;

(5) cutting and taking down the radio frequency chip packaging unit or the radio frequency coil packaging unit of which one of the two aligned packaging units is an invalid packaging unit at the optimal alignment position;

(6) replacing the position of the cut and taken-off invalid radio frequency chip packaging unit with another valid radio frequency chip packaging unit, and forming a valid radio frequency coil packaging unit at the position of the cut and taken-off invalid radio frequency coil packaging unit through a semiconductor process;

(7) carrying out hot-pressing bonding on the first to-be-bonded part and the second to-be-bonded part, so that the radio frequency chip packaging units are electrically connected with the radio frequency coil packaging units respectively;

(8) cutting to form individual RF devices.

Wherein the first portion to be bonded includes a first bonding surface constituted by an upper surface of the first through hole 21 and an upper surface of the second insulating layer 20. The second portion to be bonded includes a second bonding surface constituted by an upper surface of the second through hole 35 and an upper surface of the second encapsulation resin 34. In the thermocompression bonding process of step (7), the first through hole 21 and the second through hole 35 are bonded, and the second insulating layer 20 and the second encapsulation resin 34 are bonded.

Wherein forming the second bonding portion specifically includes: forming a protective film 32 on the carrier board 30 having the release film 31; depositing a conductive layer on the protective film 32 and patterning to form a plurality of coils 33; a second sealing resin 34 is injection-molded on the carrier plate 30 to seal the plurality of coils 33; a plurality of second through holes 35 are formed in the second sealing resin 34, and the plurality of second through holes 35 are electrically connected to the plurality of coils 33, respectively.

Wherein the another effective rf chip package unit obtained in the step (6) is obtained by cutting another first portion to be bonded, and the forming of the effective rf coil package unit by the semiconductor process specifically includes: and depositing another protective film at the position of the invalid radio frequency coil packaging unit which is cut and taken off, depositing metal on the other protective film and patterning to form a coil, then injecting resin at the position to form sealing resin, and then forming a conductive through hole in the sealing resin.

Referring specifically to fig. 3-6, first, the manufactured active packaging units and inactive packaging units of the first to-be-bonded portion and the second to-be-bonded portion are tested, for example, referring to fig. 3, the plurality of rf chip packaging units arranged in an array of the first to-be-bonded portion include a plurality of active rf chip packaging units q and a plurality of inactive rf chip packaging units u, and the plurality of rf coil packaging units arranged in an array of the same second to-be-bonded portion include a plurality of active rf coil packaging units q and a plurality of inactive rf coil packaging units u, wherein for the inactive packaging units, the plurality of inactive rf coil packaging units u are respectively located at position A, B, and the plurality of inactive rf chip packaging units u are respectively located at position D, F.

Then, pre-alignment is performed, and it is found that when the positions shown in fig. 3(a) and fig. 3(B) are matched, the final valid packages are obtained most, wherein the position a corresponds to the position D, the position B corresponds to the position E, and the position C corresponds to the position F, and only one of the three groups, namely the position B, the position E, the position C, and the position F, is an invalid package unit, and the position a and the position D are invalid package units, so that the package units at the position a and the position D do not need to be changed, and the other two groups of invalid package units, namely the invalid package units at the position B and the position F, are replaced.

Referring to fig. 4(a), the inactive rf coil packaging unit u at the position B is removed by a cutting process, and then, referring to fig. 5(a), at the position B, another protective film is deposited, a coil is formed by depositing metal on the other protective film and patterning, then, a sealing resin is formed by injecting resin at the position, and then, a conductive via is formed in the sealing resin, and an active rf coil packaging unit is formed at the position B. For the radio frequency coil packaging unit, the thickness is thin, and direct replacement can cause excessive stress during bonding, cause edge warpage, affect the final packaging effectiveness, and cannot perform direct replacement like a radio frequency chip unit. In addition, the radio frequency coil manufactured by the semiconductor process is relatively low in cost and can be realized only by an additional mask.

Referring to fig. 4(b), the inactive rf chip packaging unit u at the position F is removed by a cutting process, and then, referring to fig. 5(b), at the position F, replaced with another active rf chip packaging unit.

Bonding is then performed, and referring specifically to fig. 6, which is a cross-sectional view of a second row of bonding, it can be seen that the rf coil packaging unit at position B is actually formed later, which is bonded with the rf chip packaging unit at effective position E to form the final effective package.

Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.