阅读说明：本技术 半导体制造装置及半导体装置的制造方法 (Semiconductor manufacturing apparatus and method for manufacturing semiconductor device ) 是由 杉田智彦 佐藤胜广 芦立浩明 于 2019-02-20 设计创作，主要内容包括：实施方式涉及一种半导体制造装置及半导体装置的制造方法。根据一个实施方式,半导体制造装置具备衬底保持部,该衬底保持部将多个衬底以所述衬底彼此相互平行地排列的方式保持。所述装置进而具备流体喷射部,该流体喷射部具有多个开口部,且使从所述开口部喷射的所述流体的喷射方向在与所述衬底的表面平行的面内通过自激振荡而变动,所述开口部向与所述衬底的表面相距的距离处于相互邻接的所述衬底间的中心间距离以内的区域,喷射流体。(Embodiments relate to a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device. According to one embodiment, a semiconductor manufacturing apparatus includes a substrate holding unit that holds a plurality of substrates such that the substrates are arranged in parallel with each other. The apparatus further includes a fluid ejecting section having a plurality of openings, the fluid ejecting section ejecting fluid to a region where a distance from a surface of the substrate is within a center distance between the substrates adjacent to each other, and an ejecting direction of the fluid ejected from the openings is varied by self-oscillation in a plane parallel to the surface of the substrate.)

1. A semiconductor manufacturing apparatus includes:

a substrate holding unit configured to hold a plurality of substrates in a manner that the substrates are arranged in parallel with each other; and

and a fluid ejecting section having a plurality of openings, wherein an ejecting direction of the fluid ejected from the openings is varied by self-oscillation in a plane parallel to a surface of the substrate, and the openings eject the fluid to a region where a distance from the surface of the substrate is within a center-to-center distance between the adjacent substrates.

2. The semiconductor manufacturing apparatus according to claim 1, wherein

The substrate holding section holds N (N is an integer of 3 or more) substrates so that N-1 gaps are provided between the N substrates,

each opening of the fluid ejecting section ejects the fluid only to a corresponding one of the N-1 gaps,

the fluid ejecting section periodically varies an ejection direction of the fluid in a plane parallel to a surface of the substrate.

3. The semiconductor manufacturing apparatus according to claim 1, wherein

The fluid ejecting section includes: a1 st pipe having a1 st hole; a2 nd pipe having a2 nd hole and a3 rd hole and surrounding the 1 st pipe; and a3 rd pipe having a4 th hole corresponding to the opening and surrounding the 2 nd pipe; and is

Said fluid

Flows from a1 st space in the 1 st pipe to a2 nd space between the 1 st pipe and the 2 nd pipe through the 1 st hole,

flows into a3 rd space between the 2 nd pipe and the 3 rd pipe from the 2 nd space through the 2 nd hole,

from the 3 rd space back to the 2 nd space via the 3 rd hole,

said ejecting from said 3 rd space via a4 th orifice.

4. The semiconductor manufacturing apparatus according to claim 3, wherein

The 2 nd pipe has a pair of holes provided with the 2 nd hole interposed therebetween as the 3 rd hole.

5. The semiconductor manufacturing apparatus according to claim 1, wherein

The fluid ejecting section includes:

a1 st channel for transferring the fluid from an inlet to an outlet corresponding to the opening; and

and a2 nd flow path for returning the fluid in the 1 st flow path from the outlet side point to the inlet side point.

6. The semiconductor manufacturing apparatus according to claim 5, wherein

The fluid ejecting section has a pair of channels as the 2 nd channel, the channels being provided with the 1 st channel interposed therebetween.

7. The semiconductor manufacturing apparatus according to claim 5, wherein

The fluid ejection portion is provided in a pipe that supplies the fluid to the fluid inlet.

8. The semiconductor manufacturing apparatus according to claim 5, wherein

The fluid ejection unit is provided outside a pipe that supplies the fluid to the fluid inlet.

9. The semiconductor manufacturing apparatus according to claim 1, wherein

The fluid ejecting section includes:

a pipe which is divided into a1 st channel for transferring the fluid and a2 nd channel for allowing the fluid to flow in from the 1 st channel, and which has a1 st hole corresponding to the opening on the 2 nd channel side;

a1 st member provided in the pipe so as to divide the 1 st channel and the 2 nd channel, and having a2 nd hole; and

and a2 nd member provided in the 2 nd channel and forming a channel for returning the fluid in the 2 nd channel from the point on the 1 st well side to the point on the 2 nd well side.

10. The semiconductor manufacturing apparatus according to claim 9, wherein

The 2 nd member forms a pair of flow paths for returning the fluid in the 2 nd flow path from the 1 st-hole-side point to the 2 nd-hole-side point.

11. The semiconductor manufacturing apparatus according to claim 1, wherein

The fluid ejecting section periodically varies an ejection direction of the fluid in a plane parallel to a surface of the substrate.

12. The semiconductor manufacturing apparatus according to claim 11, wherein

The period of the periodic variation is 10 seconds or less.

13. A semiconductor manufacturing apparatus includes:

a substrate holding unit for holding a substrate to be processed monolithically; and

and a fluid ejecting section including an opening for ejecting a fluid onto a surface of the substrate, wherein an ejection direction of the fluid ejected from the opening is varied by self-oscillation in a plane parallel to the surface of the substrate.

14. The semiconductor manufacturing apparatus according to claim 13, wherein

The fluid ejecting section includes:

a1 st channel for transferring the fluid from an inlet to an outlet corresponding to the opening; and

and a2 nd flow path for returning the fluid in the 1 st flow path from the outlet side point to the inlet side point.

15. The semiconductor manufacturing apparatus according to claim 14, wherein

The fluid ejecting section has a pair of channels as the 2 nd channel, the channels being provided with the 1 st channel interposed therebetween.

16. A method of manufacturing a semiconductor device, comprising:

a substrate holding unit for holding a plurality of substrates in such a manner that the substrates are arranged in parallel with each other;

ejecting a fluid from a plurality of openings of a fluid ejecting section toward a region where a distance from a surface of the substrate is within a center distance between the substrates adjacent to each other; and is

The fluid ejecting section causes an ejection direction of the fluid ejected from the opening section to vary by self-oscillation in a plane parallel to a surface of the substrate.

17. The method for manufacturing a semiconductor device, according to claim 16, wherein

The substrate holding section holds N (N is an integer of 3 or more) substrates so that N-1 gaps are provided between the N substrates,

each opening of the fluid ejecting section ejects the fluid only to a corresponding one of the N-1 gaps,

the fluid ejecting section periodically varies an ejection direction of the fluid in a plane parallel to a surface of the substrate.

18. The method for manufacturing a semiconductor device, according to claim 16, wherein

The fluid ejecting section includes: a1 st pipe having a1 st hole; a2 nd pipe having a2 nd hole and a3 rd hole and surrounding the 1 st pipe; and a3 rd pipe having a4 th hole corresponding to the opening and surrounding the 2 nd pipe; and is

Said fluid

Flows from a1 st space in the 1 st pipe to a2 nd space between the 1 st pipe and the 2 nd pipe through the 1 st hole,

flows into a3 rd space between the 2 nd pipe and the 3 rd pipe from the 2 nd space through the 2 nd hole,

from the 3 rd space back to the 2 nd space via the 3 rd hole,

said ejecting from said 3 rd space via a4 th orifice.

19. The method for manufacturing a semiconductor device, according to claim 16, wherein

The fluid ejecting section includes:

a1 st channel for transferring the fluid from an inlet to an outlet corresponding to the opening; and

and a2 nd flow path for returning the fluid in the 1 st flow path from the outlet side point to the inlet side point.

20. The method for manufacturing a semiconductor device, according to claim 16, wherein

The fluid ejecting section includes:

a pipe which is divided into a1 st channel for transferring the fluid and a2 nd channel for allowing the fluid to flow in from the 1 st channel, and which has a1 st hole corresponding to the opening on the 2 nd channel side;

a1 st member provided in the pipe so as to divide the 1 st channel and the 2 nd channel, and having a2 nd hole; and

and a2 nd member provided in the 2 nd channel and forming a channel for returning the fluid in the 2 nd channel from the point on the 1 st well side to the point on the 2 nd well side.

Technical Field

Background

When a fluid such as a liquid or a gas is supplied from a nozzle to a wafer, there is a problem that the amount of the supplied fluid varies between regions on the wafer. For example, there is a problem that a region where the fluid continuously flows and a region where the fluid hardly flows are generated on the wafer.

Disclosure of Invention

Drawings

Fig. 1 is a schematic diagram showing the configuration of a semiconductor manufacturing apparatus according to embodiment 1.

Fig. 2 is a sectional view showing the structure of a substrate processing bath according to embodiment 1.

Fig. 3A to C are a perspective view and a sectional view showing the structure of the nozzle according to embodiment 1.

Fig. 4A, B is a sectional view for explaining the function of the nozzle of embodiment 1.

Fig. 5A, B is a cross-sectional view for explaining the function of the nozzle of the comparative example of embodiment 1.

Fig. 6A to C are a perspective view and a sectional view showing the structure of a nozzle according to embodiment 2.

Fig. 7 is a perspective view for explaining the function of the nozzle according to embodiment 2.

Fig. 8A, B is a perspective view showing a configuration of a nozzle according to a modification of embodiment 2.

Fig. 9 is a perspective view showing a configuration of a nozzle according to a modification of embodiment 2.

Fig. 10A to C are a perspective view and a sectional view showing the structure of the nozzle according to embodiment 3.

Embodiments relate to a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device.