阅读说明：本技术 液冷散热装置及应用所述液冷散热装置的电子装置 (Liquid cooling heat radiator and electronic device using same ) 是由 陈钦洲 谢宜莳 于 2018-06-20 设计创作，主要内容包括：一种散热组件,应用于液冷散热装置,所述液冷散热装置应用于电子装置以冷却其发热元件,所述散热组件包括轴流风扇及换热器,所述轴流风扇既是所述液冷散热装置之散热组件之一,亦是所述电子装置之系统风扇。所述换热器覆盖所述轴流风扇出风口的部分面积。如此,可以有效地降低系统的流阻,从而避免热风回流的现象,实现较佳的散热效果。(A heat dissipation assembly is applied to a liquid cooling heat dissipation device which is applied to an electronic device to cool a heating element of the electronic device, and comprises an axial fan and a heat exchanger, wherein the axial fan is one of the heat dissipation assemblies of the liquid cooling heat dissipation device and is also a system fan of the electronic device. And the heat exchanger covers partial area of the air outlet of the axial flow fan. Therefore, the flow resistance of the system can be effectively reduced, the phenomenon of hot air backflow is avoided, and a better heat dissipation effect is realized.)

1. The utility model provides a liquid cooling heat abstractor, includes liquid cooling head, pump and radiator unit, the liquid cooling head is connected with the pump, radiator unit still with the liquid cooling head is connected, its characterized in that, liquid cooling heat abstractor's radiator unit includes:

the axial flow fan comprises an air outlet, and is used for sucking air to generate air flow and blowing the air flow out of the air outlet; and

the heat exchanger comprises a radiating fin group, the radiating fin group is in butt joint with the air outlet of the axial flow fan, and the radiating fin group covers partial area of the air outlet.

2. The liquid-cooled heat sink of claim 1, wherein the axial fan further comprises an air inlet, the air inlet configured to draw air in.

3. The liquid-cooled heat dissipating device of claim 2, wherein the axial fan comprises a plurality of blades, the plurality of blades being rotatable about a rotation axis and being configured to draw air from the inlet to generate an airflow to be blown out from the outlet of the axial fan.

4. The liquid-cooled heat sink of claim 3, wherein the inlet of the axial fan sucks air in a direction parallel to the rotation axis to generate an airflow when the blades of the axial fan rotate along the rotation axis.

5. The liquid-cooled heat sink of claim 4, wherein the outlet of the axial fan blows an airflow in an airflow direction parallel to the rotation axis when the blades of the axial fan rotate along the rotation axis.

6. The utility model provides an electronic device, includes liquid cooling heat abstractor and heating element, liquid cooling heat abstractor includes liquid cold head, pump and radiator unit, the liquid cold head is connected with the pump, radiator unit still with the liquid cold head is connected, its characterized in that, liquid cooling heat abstractor's radiator unit includes:

the axial flow fan comprises an air outlet, and is used for sucking air to generate air flow and blowing the air flow out of the air outlet; and

the heat exchanger comprises a radiating fin group, the radiating fin group is in butt joint with the air outlet of the axial flow fan, and the radiating fin group covers partial area of the air outlet.

7. The electronic device of claim 6, wherein the axial fan further has an air inlet for sucking air, and the axial fan includes a plurality of blades rotatable along a rotation axis and sucking air from the air inlet to generate an air flow for being blown out from the air outlet of the axial fan.

8. The electronic device according to claim 7, wherein when the blades of the axial fan rotate along the rotation axis, the air inlet of the axial fan sucks air in a direction parallel to the rotation axis to generate an air flow; when the blades of the axial flow fan rotate along the rotating shaft, the air outlet of the axial flow fan blows air flow along the air flow direction parallel to the rotating shaft.

9. The electronic device of claim 6, wherein the heat generating component is a graphics processor.

Technical Field

The invention relates to a liquid cooling heat dissipation device and an electronic device using the same.

Background

The liquid cooling heat radiation technology is a heat radiation technology with wide application in the heat radiation field, and the liquid cooling radiator has good heat radiation effect. Generally, the liquid-cooled heat dissipation device includes a liquid-cooled head, a water pump, a heat exchanger, a fan, a conduit, a heat transfer liquid, and the like.

In the prior art, a heat exchanger and an axial fan are usually assembled to form a heat dissipation assembly, and the assembly is then assembled and fixed to the inner side of the chassis wall of the system.

However, in order to improve the heat exchange efficiency of the liquid cooling heat dissipation device, the air outlet cross section of the axial flow fan is completely covered by the fin region in the heat exchanger, so that the flow resistance of the system fan is increased from the system level, and the phenomenon of hot air backflow is easily generated inside the case.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a liquid-cooled heat dissipation device and an electronic device using the same.

The utility model provides a liquid cooling heat abstractor, includes liquid cooling head, pump and radiator unit, the liquid cooling head is connected with the pump, radiator unit still with the liquid cooling head is connected, liquid cooling heat abstractor's radiator unit includes:

the axial flow fan comprises an air outlet, and is used for sucking air to generate air flow and blowing the air flow out of the air outlet; and

the heat exchanger comprises a radiating fin group, the radiating fin group is in butt joint with the air outlet of the axial flow fan, and the radiating fin group covers partial area of the air outlet.

Further, the axial fan is also provided with an air inlet which is used for sucking air.

Furthermore, the axial fan includes a plurality of blades, and the blades can rotate along a rotation axis, and the air is sucked from the air inlet to generate an air flow, so as to be blown out from the air outlet of the axial fan.

Further, when the blades of the axial flow fan rotate along the rotating shaft, the air inlet of the axial flow fan sucks air in a direction parallel to the rotating shaft to generate air flow.

Further, when the blades of the axial flow fan rotate along the rotating shaft, the air outlet of the axial flow fan blows air flow along the air flow direction parallel to the rotating shaft.

The utility model provides an electronic device, includes liquid cooling heat abstractor and heating element, liquid cooling heat abstractor includes liquid cold head, pump and radiator unit, the liquid cold head is connected with the pump, radiator unit still with the liquid cold head is connected, liquid cooling heat abstractor's radiator unit includes:

the axial flow fan comprises an air outlet, and is used for sucking air to generate air flow and blowing the air flow out of the air outlet; and

the heat exchanger comprises a radiating fin group, the radiating fin group is in butt joint with the air outlet of the axial flow fan, and the radiating fin group covers partial area of the air outlet.

Furthermore, the axial flow fan is also provided with an air inlet, the air inlet is used for sucking air, the axial flow fan comprises a plurality of fan blades, the fan blades can rotate along a rotating shaft, the air is sucked by the air inlet to generate air flow, and the air flow is blown out from the air outlet of the axial flow fan.

Further, when the fan blades of the axial flow fan rotate along the rotating shaft, the air inlet of the axial flow fan sucks air along the direction parallel to the rotating shaft so as to generate air flow; when the blades of the axial flow fan rotate along the rotating shaft, the air outlet of the axial flow fan blows air flow along the air flow direction parallel to the rotating shaft.

Further, the heat generating component is a graphics processor.

Compared with the prior art, the liquid-cooling heat dissipation device and the electronic device using the same have the advantages that the air outlet of the axial flow fan is in butt joint with the heat dissipation fin group of the heat exchanger, and the heat dissipation fin group covers partial area of the air outlet. Therefore, the flow resistance of the system can be effectively reduced, the phenomenon of hot air backflow is avoided, and a better heat dissipation effect is realized.

Drawings

FIG. 1 is a block diagram of a preferred embodiment of an electronic device.

Fig. 2 is a schematic view of a preferred embodiment of the heat dissipation assembly of fig. 1.

Fig. 3 is an exploded view of the preferred embodiment of the heat sink assembly of fig. 1.

Fig. 4 is another schematic diagram of the preferred embodiment of the heat dissipation assembly of fig. 1.

Description of the main elements

Electronic device 100

Heat sink assembly 10

Axial fan 11

Air outlet 12

Air inlet 13

Heat exchanger 14

Heat radiating fin set 15

Heating element 20

Liquid cooling head 32

Pump 34

Conduits 36, 38

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the liquid-cooled heat dissipating device and the electronic device using the same of the present invention will be described in detail with reference to the accompanying drawings and embodiments.

Referring to fig. 1, in a preferred embodiment of the present invention, a liquid cooling heat dissipation device is applied in an electronic device 100 for dissipating heat of a heat generating element 20. In one embodiment, the heat generating component 20 is a Graphics Processing Unit (GPU).

The liquid cooling heat dissipation device includes a heat dissipation assembly 10, a liquid cooling head 32 and a pump 34, wherein the heat dissipation assembly 10 includes an axial fan 11 and a heat exchanger 14. Wherein the liquid cooling head 32 is connected with a pump 34, the pump 34 is connected with the heat exchanger 14 through a conduit 36, and the heat exchanger 14 is also connected with the liquid cooling head 32 through a conduit 38. In this way, the liquid cooling head 32, the pump 34 and the heat dissipation assembly 10 form a heat dissipation circulation system to dissipate heat for the heating element 20. A thermally conductive liquid (not shown) may flow within these closed conduits.

The liquid cooling head 32 is disposed on the heating element 20, can absorb heat of the heating element 20, and enters the heat exchanger 14 for heat exchange through the action of the heat transfer liquid and the pump 34. After heat exchange through the heat exchanger 14, the cold liquid is then transferred to the liquid cooling head 32 through the conduit 38 to dissipate heat from the heating element 20.

Referring to fig. 2 to 4, the axial fan 11 is connected to the heat exchanger 14.

Further, the axial fan 11 has an air outlet 12, and the axial fan 11 is used for sucking air and blowing out from the air outlet 12.

The heat exchanger 14 may further include a heat dissipating fin set 15, and the heat dissipating fin set 15 includes a plurality of heat dissipating fins. The heat dissipation fin set 15 is abutted to the air outlet 12 of the axial fan 11, and the heat dissipation fin set 15 covers a partial area of the air outlet 12.

In this way, the air outlet section of the air outlet 12 of the axial fan 11 will not be completely shielded by the heat dissipation fin set 15 of the heat exchanger 14. Therefore, the flow resistance of the system in the electronic device 100 can be reduced, and the phenomenon of hot wind backflow is avoided.

For example, as shown in fig. 3, the heat dissipation fins in the heat dissipation fin set 15 may be arranged in a rectangular shape, and the air outlet 12 of the axial flow fan 11 may be arranged in a circumferential shape. When the heat dissipating fin set 15 is abutted to the air outlet 12 of the axial flow fan 11, the length of the rectangle is the same as the diameter of the circumference, and the width of the rectangle is smaller than the diameter of the circumference. Therefore, the rectangular heat dissipation fin group 15 only covers part of the area of the air outlet section of the air outlet 12, and the air outlet not covered by the heat dissipation fin group 15 can reduce the flow resistance of the system fan, thereby avoiding the phenomenon of hot air backflow.

In a preferred embodiment, the axial fan 11 further has an air inlet 13, and the air inlet 13 is used for sucking air. In addition, the axial flow fan 11 is rotatable along a rotation axis (not shown). When the axial fan 11 rotates along the rotation axis, the air inlet 13 of the axial fan 11 can suck air in a direction parallel to the rotation axis to generate an air flow.

Further, when the axial flow fan 11 rotates along the rotation axis, the air outlet 12 of the axial flow fan 11 can blow out the air flow along the air flow direction parallel to the rotation axis.

When the electronic device 100 is powered on and works, the heating element 20 starts to work and generates a certain amount of heat, and the liquid cooling head 32 absorbs the heat of the heating element 20 and exchanges heat with the heat exchanger 14 in the heat dissipation assembly 10. At this time, the air inlet 13 of the axial fan 11 sucks in air to generate an air flow, and the air flow is blown out from the air outlet 12 of the axial fan 11, and a part of the air flow blown out from the air outlet 12 enters the inside of the heat exchanger 14 to dissipate heat of the heating element 20. In addition, the heat exchanger 14 only covers part of the area of the air outlet 12.

Thus, the axial fan 11 is one of the heat dissipation components of the liquid-cooled heat dissipation device 30 and is also a system fan of the electronic device 100.

The heat dissipation device 10 and the electronic device 100 using the heat dissipation device 10 are configured such that the air outlet 12 of the axial fan 11 is in butt joint with the heat dissipation fin set 15 of the heat exchanger 14, and the heat dissipation fin set 15 covers a partial area of the air outlet 12.

In this way, the air outlet section of the air outlet 12 of the axial fan 11 will not be completely shielded by the heat dissipation fin set 15 of the heat exchanger 14. The flow resistance of the system in the electronic device 100 can be effectively reduced, thereby avoiding the backflow of hot air and achieving a better heat dissipation effect.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. It will be understood by those skilled in the art that various modifications and equivalent arrangements can be made without departing from the spirit and scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.