阅读说明：本技术 复合膜及电子设备 (Composite film and electronic device ) 是由 王雪锋 于 2019-09-23 设计创作，主要内容包括：本申请涉及一种复合膜及电子设备,该复合膜包括散热层和隔热层；散热层包括相背设置的第一表面和第二表面,第一表面开设有凹槽；隔热层设置于凹槽内并与散热层贴合。本申请复合膜应用于电子设备后,复合膜能够对传递至复合膜的热量起到均热效果,并能够将均热后的热量传递给壳体,以通过壳体向外界空气进行散热,避免壳体的局部区域发烫严重。(The application relates to a composite film and an electronic device, wherein the composite film comprises a heat dissipation layer and a heat insulation layer; the heat dissipation layer comprises a first surface and a second surface which are arranged oppositely, and the first surface is provided with a groove; the heat insulating layer is arranged in the groove and is attached to the heat dissipation layer. After this application complex film was applied to electronic equipment, the soaking effect can be played to the heat of transmitting to the complex film to can give the casing with the heat transfer after the soaking, in order dispel the heat to the outside air through the casing, avoid the local area of casing to send out to scald seriously.)

1. A composite membrane, comprising:

the heat dissipation layer comprises a first surface and a second surface which are arranged oppositely, and the first surface is provided with a groove;

the heat insulation layer is arranged in the groove and attached to the heat dissipation layer.

2. The composite membrane of claim 1 wherein the side of the insulating layer remote from the second surface is flush with the first surface; or the distance between one side of the heat insulation layer away from the second surface and the second surface is smaller than the distance between the first surface and the second surface.

3. The composite film of claim 1, wherein the composite film comprises an adhesive layer disposed on a bottom of the groove, and the thermal insulation layer is connected to the heat dissipation layer through the adhesive layer.

4. The composite film of claim 3 wherein the adhesive layer extends from the bottom of the groove to between the walls of the groove and the walls of the thermal insulating layer.

5. The composite film of claim 1, wherein the composite film comprises a first layer of thermally conductive adhesive disposed on the first surface surrounding the recess.

6. The composite film of claim 5, wherein the first layer of thermally conductive adhesive extends toward the side of the recess and covers the thermally insulating layer.

7. The composite film of claim 5, wherein the composite film comprises a second layer of thermally conductive adhesive disposed on the second surface.

8. The composite film according to any one of claims 1 to 7, wherein the heat dissipation layer comprises a plate-like sheet formed of one or more of a metal and graphite.

9. The composite film according to any one of claims 1 to 7, wherein the thermal insulation layer comprises a plate-like sheet having a thermal conductivity of 0.03W/mk or less.

10. The composite membrane of claim 9, wherein the thermal insulation layer comprises a sheet of plate formed of silica aerogel.

11. An electronic device, comprising:

a housing;

a heat generating component disposed in the housing; and

the composite film according to any one of claims 1 to 10, wherein the heat-dissipating layer is connected to the heat-generating component at a side where the second surface is located, the heat-dissipating layer is connected to the case at a side where the first surface is located, and the heat-insulating layer is disposed opposite to the heat-generating component.

12. The electronic device according to claim 11, wherein the housing includes a middle frame and a rear cover connected to the middle frame, and the heat generating component includes a main board on which a chip is disposed; one of the middle frame and the rear cover is connected with one side of the first surface of the heat dissipation layer, the chip is connected with one side of the second surface of the heat dissipation layer, and the heat insulation layer is opposite to the chip.

Technical Field

The present application relates to the field of communications technologies, and in particular, to a composite film and an electronic device.

Background

Electronic devices such as smartphones and tablet computers generally use a graphite sheet to diffuse heat generated inside the electronic device to the outside. When the too big more heat of production of electronic equipment consumption, the graphite flake can give electronic equipment's casing with heat transfer, because the graphite flake heat accumulation ability is limited, the heat can not in time spread to all around to the casing can not the thermally equivalent, especially the casing forms local hotspot with the region that the part (for example CPU) that generates heat easily, leads to the local region of casing to send out to scald seriously, is unfavorable for the improvement of complete machine heat dispersion.

Disclosure of Invention

The first aspect of the application discloses a composite film, which is used for solving the technical problem that the local area of a shell of an electronic device comprising the composite film is seriously scalded and is not beneficial to improving the heat dissipation performance of the whole device.

A composite membrane, comprising:

the heat dissipation layer comprises a first surface and a second surface which are arranged oppositely, and the first surface is provided with a groove;

the heat insulation layer is arranged in the groove and attached to the heat dissipation layer.

The composite film can be applied to electronic equipment, the first surface of the heat dissipation layer can be connected with a shell of the electronic equipment, the second surface of the heat dissipation layer can be connected with a heat-generating component of the electronic equipment, and the heat insulation layer can be arranged opposite to the heat-generating component, so that, because the heat insulation layer is arranged in the groove and is attached to the heat dissipation layer, the area where the heat insulation layer is located can prevent the heat transferred to the heat dissipation layer from being transferred along the vertical direction, the temperature of the area of the shell corresponding to the heating part can be reduced, the local area of the shell is prevented from being seriously scalded, the heat on the heating part can be fully and quickly dispersed along the horizontal direction after being transferred to the heat dissipation layer, and a good heat equalizing effect is achieved, and the heat that scatters fast along the horizontal direction in the heat dissipation layer can also continue to transmit along vertical direction after bypassing the insulating layer to the heat transfer after will soaking is for the casing, dispels the heat to the outside air through the casing.

In one embodiment, the side of the thermal insulation layer away from the second surface is flush with the first surface; or the distance between one side of the heat insulation layer away from the second surface and the second surface is smaller than the distance between the first surface and the second surface.

In one embodiment, the adhesive layer extends from the bottom of the groove to between the groove wall of the groove and the side wall of the thermal insulation layer.

In one embodiment, the composite film includes a first thermal conductive adhesive layer disposed on the first surface around the groove.

In one embodiment, the first heat-conducting adhesive layer extends towards one side of the groove and covers the heat insulation layer.

In one embodiment, the composite film includes a second thermal conductive adhesive layer disposed on the second surface.

In one embodiment, the heat dissipation layer comprises a plate-like sheet formed of one or more of metal and graphite.

In one embodiment, the insulation layer comprises a sheet-like material having a thermal conductivity of 0.03W/mk or less.

In one embodiment, the insulation layer comprises a plate-like sheet formed of silica aerogel.

The second aspect of the application discloses an electronic device, which is used for solving the technical problem that the heat dissipation performance of the whole electronic device is not improved due to severe scalding of a local area of a shell of the electronic device.

An electronic device, comprising:

a housing;

a heat generating component disposed in the housing; and

the composite film, the second surface place one side on heat dissipation layer with the part that generates heat is connected, the first surface place one side on heat dissipation layer with the casing is connected, the insulating layer with the part that generates heat sets up relatively.

Above-mentioned electronic equipment can reduce the casing and correspond the regional temperature in the part that generates heat, the local area of avoiding the casing is sent out to scald seriously, the heat transfer on the part that generates heat can be followed the horizontal direction and dispersed fast behind the heat dissipation layer, play good soaking effect, and the heat that disperses fast along the horizontal direction in the heat dissipation layer can also continue to follow vertical direction transmission after bypassing the insulating layer, in order to transmit the heat after the soaking for the casing, in order to dispel the heat to the outside air through the casing.

In one embodiment, the housing includes a middle frame and a rear cover connected to the middle frame, and the heat generating component includes a main board on which a chip is disposed; one of the middle frame and the rear cover is connected with one side of the first surface of the heat dissipation layer, the chip is connected with one side of the second surface of the heat dissipation layer, and the heat insulation layer is opposite to the chip.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic sectional view taken along the sectional line II-II in FIG. 1;

FIG. 3 is a schematic structural view of the composite membrane of FIG. 2;

FIG. 4 is an exploded view of the composite membrane of FIG. 3;

FIG. 5 is a schematic cross-sectional view of one embodiment taken along section line III-III of FIG. 3;

FIG. 6 is a schematic cross-sectional view of one embodiment taken along section line III-III of FIG. 3;

FIG. 7 is a schematic cross-sectional view of one embodiment taken along section line III-III of FIG. 3;

FIG. 8 is a schematic cross-sectional view of one embodiment taken along section line III-III of FIG. 3;

FIG. 9 is a schematic cross-sectional view of one embodiment taken along section line III-III of FIG. 3.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Referring to fig. 1, the electronic device 10 will be described with reference to a smart phone as an example. Those skilled in the art will readily understand that the electronic device 10 of the present application may be any device having communication and storage functions, such as a smart terminal, for example, a smart phone, a tablet computer, a notebook computer, a mobile phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, etc., and the representation form of the smart terminal is not limited herein. Of course, wearable devices such as smartwatches are also applicable to the electronic device 10 according to the embodiments of the present application.

Referring to fig. 2, the electronic device 10 includes a body 100 and a composite membrane 200.

The body 100 is an entity that performs the functions of the electronic device 10. The body 100 includes a middle frame 110, a display screen 120, and a rear cover 130. The display screen 120 and the rear cover 130 are respectively connected to two opposite sides of the middle frame 110 to form an accommodating cavity C, a main board 140 including an integrated chip 141 and a circuit may be disposed in the accommodating cavity C, the main board 140 belongs to one of heat generating components of the electronic device 10, of course, the heat generating components may also include a power supply disposed inside the electronic device 10, and the middle frame 110 may be a metal middle frame, so that heat inside the accommodating cavity C is timely diffused into the external air through the metal middle frame to maintain the normal operation of the electronic device 10.

In one embodiment, the middle frame 110 includes a first side surface 111 and a second side surface 112 disposed opposite to each other, the display screen 120 has a displayable surface 121, and a side of the display screen 120 facing away from the displayable surface 121 is disposed on the first side surface 111 of the middle frame 110. The rear cover 130 is disposed on the second side surface 112, that is, the rear cover 130 is located on a side of the display screen 120 opposite to the displayable surface 121. The middle frame 110 and the rear cover 130 form a housing of the electronic device 10, the middle frame 110 and the rear cover 130 may be integrally formed, and the electronic device 10 does not use the middle frame 110 that is independently disposed. In addition, the display screen 120 may be omitted, i.e., the electronic device 10 does not have a display function.

In one embodiment, the Display screen 120 may be a Liquid Crystal Display (LCD) screen for displaying information, and the LCD screen may be a Thin Film Transistor (TFT) screen or an In-Plane Switching (IPS) screen or a Liquid Crystal Display (SLCD) screen.

In an embodiment, the display screen 120 may also adopt an OLED (Organic Light-Emitting display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) screen, which is not described herein again.

Referring to fig. 3 and 4, the composite film 200 includes a heat dissipation layer 210 and a thermal insulation layer 220. The heat dissipation layer 210 and the thermal insulation layer 220 are attached to each other in the thickness direction of the composite film 200. In an embodiment, the heat dissipation layer 210 includes a first surface 211 and a second surface 212 that are disposed opposite to each other, the first surface 211 is provided with a groove 2111, and the thermal insulation layer 220 is disposed in the groove 2111 and attached to the heat dissipation layer 210.

In one embodiment, the heat dissipation layer 210 may be a plate-shaped sheet formed of a material having a thermal conductivity of about 200W/mk to 3000W/mk, i.e., one or a combination of a metal (e.g., copper, aluminum, silver, nickel, etc.) and graphite. The laminated structure of copper and graphite may be selected for use in consideration of unit price or characteristics. In one embodiment, heat spreading layer 210 comprises a plate-like sheet formed of graphite, and heat spreading layer 210 has a thickness of 0.02mm to 0.05 mm. The heat dissipation layer 210 may be a synthetic graphite sheet, a natural graphite sheet, or a synthetic graphite sheet and a natural graphite sheet compounded together.

In one embodiment, the thermal insulation layer 220 may be a plate-shaped sheet material with a thermal conductivity of 0.03W/mk or less, so as to achieve good thermal insulation. In one embodiment, the insulation layer 220 comprises a sheet of plate formed from aerogel. The aerogel is a high-quality high-efficiency heat insulation material, has extremely high porosity, can effectively reduce the solid phase heat conduction of the material, and can effectively inhibit gas phase heat transfer. The aerogel can be an oxide aerogel material, a carbon aerogel material and a carbide aerogel material. The oxide aerogel material is taken as an example for explanation, and the oxide aerogel material can be silicon dioxide, aluminum oxide, titanium dioxide, copper oxide and the like. In one embodiment, the thermal insulation layer 220 comprises a plate-shaped sheet formed by silica aerogel, the porosity of the silica aerogel is as high as 80% -99.8%, and the room temperature thermal conductivity can be as low as 0.012W/mk. In one embodiment, the thickness of the thermal insulation layer 220 is 0.08mm to 0.3mm, such as 0.08mm, 0.12mm, 0.3mm, and the like.

In other embodiments, the thermal insulation layer 220 may be a plate-shaped sheet with a thermal conductivity of 0.03W/mk or more, but the thermal insulation effect may not be as good as that of a plate-shaped sheet formed of aerogel. For example, the thermal insulation layer 220 may be a sheet-like sheet formed of glass fiber or a sheet-like sheet formed of asbestos. The thermal conductivity of the glass fiber material at room temperature is 1.09W/mk, and the thermal conductivity of the asbestos material is 0.16W/mk-0.37W/mk, so that the thermal conductivity of the plate-shaped sheet formed by the glass fiber or the plate-shaped sheet formed by the asbestos is far greater than that of the plate-shaped sheet formed by the gel, and the aerogel material is preferably adopted in the aspect of heat insulation effect.

In one embodiment, referring to fig. 5, a side 221 of thermal insulating layer 220 away from second surface 212 is flush with first surface 211, i.e., a distance between a side of thermal insulating layer 220 away from second surface 212 and second surface 212 is equal to a distance between first surface 211 and second surface 212. It is understood that in other embodiments, the distance between the side of thermal insulating layer 220 away from second surface 212 and second surface 212 may be less than the distance between first surface 211 and second surface 212.

In one embodiment, referring to fig. 5, the composite film 200 further includes an adhesive layer 230 disposed on the bottom of the groove 2111, and the thermal insulation layer 220 is connected to the heat dissipation layer 210 through the adhesive layer 230. Further, referring to fig. 6, the adhesive layer 230 may extend from the bottom of the groove 2111 to between the wall of the groove 2111 and the sidewall of the thermal insulation layer 220 to increase the bonding strength between the heat dissipation layer 210 and the thermal insulation layer 220. The adhesive layer 230 may be one of acrylic, epoxy, Aramid, polyurethane, Polyamide, Polyethylene, EVA, Polyester, and polyvinyl chloride, or may be a net-shaped or pore-free hot melt adhesive sheet having a plurality of pores and formed by stacking fibers that can be thermally bonded.

Referring to fig. 3, the first surface 211 of the heat dissipation layer 210 is connected to the middle frame 110. In other embodiments, the side of the heat dissipation layer 210 where the first surface 211 is located can also be connected with the back cover 130. The second surface 212 of the heat dissipation layer 210 is connected to a heat generating component (e.g., a chip 141 disposed on the circuit board 140), and the thermal insulation layer 220 is disposed opposite to the heat generating component (e.g., opposite to the chip 141).

In the electronic device 10 of the present application, the first surface 211 of the heat dissipation layer 210 can be connected to the housing of the electronic device 10, the second surface 212 of the heat dissipation layer 210 can be connected to the heat generating component of the electronic device 10, and the thermal insulation layer 220 can be disposed opposite to the heat generating component, so that the thermal insulation layer 220 is disposed in the groove 2111 and attached to the heat dissipation layer 210, and the area where the thermal insulation layer 220 is disposed can prevent the heat transferred to the heat dissipation layer 210 from being transferred in the vertical direction (the thickness direction of the heat dissipation layer 210), i.e., the temperature of the area where the housing corresponds to the heat generating component can be reduced, thereby preventing the local area of the housing from being seriously scalded, and the heat on the heat generating component can be sufficiently and quickly dissipated in the horizontal direction after being transferred to the heat dissipation layer 210, thereby achieving a good uniform heat effect, and the heat quickly dissipated in the horizontal direction in the, so as to transfer the heat after soaking to the shell and radiate the heat to the outside air through the shell.

In an embodiment, referring to fig. 7, the composite film 200 further includes a first thermal adhesive layer 240, and the first thermal adhesive layer 240 is disposed on the first surface 211 around the groove 2111. With this configuration, the first surface 211 of the heat dissipation layer 210 may be bonded to the middle frame 110 or the rear cover 130 through the first thermal conductive adhesive layer 240, and may uniformly transfer heat generated by the chip 141 to the middle frame 110 or the rear cover 130. The first heat-conducting adhesive layer 240 may be any one of an organic silicon heat-conducting adhesive, an epoxy resin AB adhesive, a polyurethane adhesive, and a polyurethane heat-conducting adhesive. The first thermal adhesive layer 240 may be made of the same material as the adhesive layer 230 or different material from the adhesive layer 230, and when the material of the first thermal adhesive layer 240 is the same as the material of the adhesive layer, referring to fig. 8, the first thermal adhesive layer 240 of the first surface 211 may be understood to be formed by extending the adhesive layer 230 in the groove 2111.

In one embodiment, referring to fig. 9, the first thermal adhesive layer 240 extends toward the side where the groove 2111 is located and covers the thermal insulation layer 220. In this way, the contact area of the composite film 200 with the case may be further increased, so that the heat transferred from the heat dissipation layer 210 to the first thermal adhesive layer 240 can be uniformly spread on the case.

In an embodiment, the composite film 200 further includes a second thermal adhesive layer 250, and the second thermal adhesive layer 250 is disposed on the second surface 212. With this configuration, the second surface 212 of the heat dissipation layer 210 can be bonded to a heat generating component (e.g., the chip 141) through the second thermal adhesive layer 250, and can transfer heat generated by the chip 141 to the heat dissipation layer 210 through the second thermal adhesive layer 250. The second heat conductive adhesive layer 250 may be any one of an organic silicon heat conductive adhesive, an epoxy resin AB adhesive, a polyurethane adhesive, and a polyurethane heat conductive adhesive. The second thermal adhesive layer 250 may be the same as or different from the first adhesive layer 240.

In an embodiment, the inner surface of the middle frame 110 or the rear cover 130 (i.e., the inner surface of the receiving cavity C) is provided with a heat radiation layer, and the heat radiation layer can radiate heat inside the electronic device 10 to the middle frame 110 or the rear cover 130, so as to accelerate the heat transfer inside the electronic device 10 by the middle frame 110 or the rear cover 130, and achieve rapid heat dissipation. The thermal radiation layer can be a nano carbon coating, the nano carbon coating has strong radiation capability, heat transmitted to the thermal radiation layer can be effectively transmitted to the middle frame 110 or the rear cover 130, the heat is prevented from being accumulated on the middle frame 110 or the rear cover 130, the heat radiation efficiency is improved, and the temperature of the middle frame 110 or the rear cover 130 is reduced.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.