阅读说明：本技术 一种散热连接器及电子设备 (Heat dissipation connector and electronic equipment ) 是由 王磊 周舒婷 谢鑫 于 2019-09-26 设计创作，主要内容包括：本发明涉及一种散热连接器及电子设备,属于卫星热控技术领域。该散热连接器包括：导热连接体和锁紧结构,所述导热连接体内部中空,形成两端开口的容纳腔,所述导热连接体的一端开口用于接收待散热器件的导热端子,另一端开口用于接收散热器件的导热端子；所述锁紧结构,包括压板和弹性件,所述压板由导热材料制成,设置于所述容纳腔之中,通过所述弹性件连接至所述导热连接体的内壁。本申请实施例中,通过两端开口的导热连接体将待散热器件的导热端子和散热器件的导热端子连接起来,同时利用锁紧结构将导热端子固定在导热连接体内,使得不用再为了适应不同待散热器件内部结构而定制热管或铜片,提高了适用性,减少了热管定制化成本。(The invention relates to a heat dissipation connector and electronic equipment, and belongs to the technical field of satellite thermal control. The heat dissipation connector includes: the heat conduction connector is hollow, an accommodating cavity with openings at two ends is formed, one end of the heat conduction connector is provided with an opening for receiving a heat conduction terminal of a device to be cooled, and the other end of the heat conduction connector is provided with an opening for receiving the heat conduction terminal of the heat dissipation device; the locking structure comprises a pressing plate and an elastic piece, wherein the pressing plate is made of a heat conduction material, is arranged in the accommodating cavity and is connected to the inner wall of the heat conduction connecting body through the elastic piece. In the embodiment of the application, the heat conduction terminal of the heat dissipation device and the heat conduction terminal of the heat dissipation device are connected through the heat conduction connector with the two ends open, and the heat conduction terminal is fixed in the heat conduction connector by utilizing the locking structure, so that the heat pipe or the copper sheet is not needed to be customized for adapting to different internal structures of the heat dissipation device, the applicability is improved, and the customizing cost of the heat pipe is reduced.)

1. A heat dissipating connector, comprising:

the heat conduction connector is hollow and forms an accommodating cavity with two open ends, one open end of the heat conduction connector is used for receiving a heat conduction terminal of a device to be cooled, and the other open end of the heat conduction connector is used for receiving the heat conduction terminal of the heat dissipation device;

the locking structure comprises a pressing plate and an elastic piece, wherein the pressing plate is made of a heat conduction material, is arranged in the accommodating cavity and is connected to the inner wall of the heat conduction connecting body through the elastic piece.

2. The heat dissipating connector of claim 1, wherein the surface of the pressure plate for contacting the heat conductive terminal is serrated or wavy.

3. The heat dissipating connector of claim 1, wherein the resilient member is in a compressed state pressing the pressure plate against an inner wall of the thermally conductive connector.

4. The heat dissipating connector of claim 1, wherein the thermally conductive connecting body is provided with an adjustment member that is movable when adjusted to apply a force to the pressure plate toward the thermally conductive terminal.

5. The heat dissipating connector of claim 1, wherein at least a portion of the thermally conductive connector is removable.

6. The heat dissipating connector of claim 1, further comprising a removable thermal conductor disposed within the receiving cavity and positioned along an inner wall of the thermally conductive connector.

7. The heat dissipating connector of claim 1, further comprising a fixing member, wherein the fixing member is a plate extending outward from an outer wall of the heat conductive connecting body, and the plate has at least one hole.

8. The heat dissipating connector of claim 1, wherein the pressing plate comprises a first pressing plate and a second pressing plate, the first pressing plate is located in the half of the receiving cavity close to the opening at one end, the second pressing plate is located in the half of the receiving cavity close to the opening at the other end, and the first pressing plate and the second pressing plate are respectively connected to the inner wall of the heat conductive connecting body through respective elastic members.

9. The heat dissipating connector of claim 8, further comprising a spacer located between the first pressure plate and the second pressure plate, wherein a limiting sliding groove is provided on a surface of the spacer, and each of the first pressure plate and the second pressure plate is provided with a protrusion located in the limiting sliding groove and capable of sliding along the limiting sliding groove.

10. An electronic device, comprising:

an apparatus body having a connection port and having a heat conductive terminal;

and the heat dissipating connector as set forth in any one of claims 1 to 9, which protrudes into the apparatus body through the connection port, and has one end opening into which the heat conductive terminal of the apparatus body is inserted and the other end opening for receiving the heat conductive terminal of the heat dissipating device.

Technical Field

The invention belongs to the technical field of satellite thermal control, and particularly relates to a heat dissipation connector and electronic equipment.

Background

With the development of scientific technology, the functions of the satellite have become more and more powerful, and the power consumption of the satellite is increased. If the temperature of the electronic components in the satellite is too high, the operation efficiency of the electronic components is influenced, the reliability is reduced, and the service life of the satellite is shortened. Therefore, the satellite thermal control system is one of the most important subsystems, and the main task is to control the temperature of the equipment and the structure in the satellite within a required range, and especially for the satellite with a high life requirement, the satellite thermal control system is very important.

The existing satellite thermal control system mainly takes a heat pipe and a copper sheet as carriers, and is connected with other subsystems of a satellite to be radiated, such as a communication subsystem for communication and a load subsystem for photographing, the heat in the subsystems is guided to the thermal control system along the inserted heat pipe, and then the heat is radiated by the thermal control system. The different subsystems differ in structure, and therefore the length, shape of the heat pipe required to be inserted inside the subsystem also differ, and in order to accommodate the configuration inside different systems, the heat pipe extending inside its system needs to be customized, for example to a curved shape. On one hand, the heat pipe needs to be customized to adapt to the internal structures of different systems, so that the utilization rate is not high, the manufacturing industry is not facilitated in batch production, and on the other hand, the overlong heat pipe or copper sheet is not beneficial to heat conduction.

Disclosure of Invention

In view of the above, embodiments of the present invention provide a heat dissipation connector and an electronic device, so as to solve the problem that the heat pipe of the existing thermal control system needs to be customized to adapt to the internal structure of different devices to be dissipated.

The embodiment of the invention is realized by the following steps:

in a first aspect, an embodiment of the present invention provides a heat dissipation connector, including: a heat conducting connector and a locking structure; the heat conduction connector is hollow to form an accommodating cavity with openings at two ends, one end of the heat conduction connector is provided with an opening for receiving a heat conduction terminal of a device to be cooled, and the other end of the heat conduction connector is provided with an opening for receiving a heat conduction terminal of a heat dissipation device; the locking structure comprises a pressing plate and an elastic piece, wherein the pressing plate is made of a heat conduction material, is arranged in the accommodating cavity and is connected to the inner wall of the heat conduction connecting body through the elastic piece.

The heat conduction connector with the two open ends is used for connecting the heat conduction terminal of the to-be-cooled device with the heat conduction terminal of the to-be-cooled device, the locking structure is used for fixing the heat conduction terminal of the to-be-cooled device and the heat conduction terminal of the to-be-cooled device in the heat conduction connector, heat in the to-be-cooled device can be led into the to-be-cooled device through the heat dissipation connector, and then the heat can be dissipated, so that a heat pipe or a copper sheet does not need to be customized for adapting to different internal structures of the to-be-cooled device, the applicability is improved, and the.

With reference to a possible implementation manner of the embodiment of the first aspect, a surface of the pressure plate, which is used for contacting the heat conducting terminal, is in a zigzag or wavy shape.

The pressing plate is used for being in a sawtooth shape or a wavy shape with the surface contacted with the heat conduction terminal, so that the friction force contacted with the heat conduction terminal can be increased, and the looseness of the heat pipe is prevented.

With reference to one possible implementation manner of the embodiment of the first aspect, the elastic member is in a compressed state, and presses the pressing plate against the inner wall of the heat conducting connecting body.

By such an arrangement, the heat dissipating connector can be adapted to more sized heat conductive terminals, such as copper sheets or small sized copper tubes.

With reference to one possible implementation manner of the embodiment of the first aspect, the heat conducting connecting body is provided with an adjusting piece, and the adjusting piece can move when being adjusted to apply a force to the pressure plate towards the heat conducting terminal.

Through setting up the regulating part, further guarantee that the clamp plate can sticis the heat conduction terminal.

With reference to one possible implementation manner of the embodiment of the first aspect, at least a portion of the thermally conductive connector is detachable.

Through such setting, the clamp plate is convenient to install and adjust.

With reference to a possible implementation manner of the embodiment of the first aspect, the heat dissipation connector further includes a detachable heat conductor, and the heat conductor is disposed in the accommodating cavity and is placed along an inner wall of the heat conductive connector.

Through setting up the detachable heat conductor, can increase open-ended size through dismantling the heat conductor to make the heat dissipation connector can hold bigger size's heat pipe, have better suitability. In addition, when there is the heat conductor in the heat conduction connector, heat conduction is mainly accomplished by the heat conductor, and the volume of heat conductor is less than the heat conduction connector, consequently only select the material that the thermal conductivity is better to the heat conductor and promote holistic to the thermal efficiency and compare in the method with whole heat conduction connector all with the material that the thermal conductivity is better, can save the cost. In addition, in the scheme, the heat conduction connector can be made of non-heat-conducting materials so as to meet other performance requirements of the heat conduction connector.

With reference to one possible implementation manner of the embodiment of the first aspect, the heat dissipation connector further includes a fixing member, where the fixing member is a flat plate extending outward from an outer wall of the heat conductive connecting body, and the flat plate is provided with at least one hole.

With such an arrangement, it is convenient to fix the heat radiation connector on the object to be fixed. The hole is used for fixing the heat dissipation connector on the object to be fixed through connecting pieces such as nails and screws, and when the object to be fixed is not suitable for being connected through the hole, the heat dissipation connector can be fixed on the object to be fixed in a mode of directly coating glue on the flat plate surface of the fixing piece.

With reference to a possible implementation manner of the embodiment of the first aspect, the pressing plate includes a first pressing plate and a second pressing plate, the first pressing plate is located in the half of the accommodating cavity close to the opening at one end, the second pressing plate is located in the half of the accommodating cavity close to the opening at the other end, and the first pressing plate and the second pressing plate are respectively connected to the inner wall of the heat conducting connecting body through respective elastic members.

Through setting up two clamp plates, can be used for sticising the heat conduction terminal of treating heat conduction device and the heat conduction terminal of heat conduction device respectively, consequently can be applicable to the heat conduction terminal of treating heat conduction device and the heat conduction terminal's of heat conduction device the different condition of size, type.

With reference to one possible implementation manner of the embodiment of the first aspect, the heat dissipation connector further includes a partition plate, the partition plate is located between the first pressing plate and the second pressing plate, a limiting sliding groove is formed in a surface of the partition plate, the first pressing plate and the second pressing plate are both provided with protrusions, and the protrusions are located in the limiting sliding groove and can slide along the limiting sliding groove.

Through setting up the baffle, can keep apart the heat conduction terminal of treating the heat abstractor and the heat conduction terminal of heat abstractor, reduce the mutual interference of the two. In addition, the positions of the first pressing plate and the second pressing plate can be better limited by arranging the limiting sliding grooves.

In a second aspect, an embodiment of the present invention further provides an electronic device, including: a device body and a heat dissipating connector as claimed in any one of the preceding claims; the equipment body is provided with a connecting port and a heat conducting terminal; the heat dissipation connector extends into the equipment body through the connecting port, a heat conduction terminal of the equipment body is inserted into an opening at one end of the heat dissipation connector, and an opening at the other end of the heat dissipation connector is used for receiving the heat conduction terminal of a heat dissipation device.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings. Like reference numerals refer to like parts throughout the drawings. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 is a schematic structural diagram illustrating a heat dissipation connector according to an embodiment of the present invention.

Fig. 2 is a schematic structural view illustrating a heat dissipating connector in which a pressure plate is connected to an inner top wall through an elastic member according to an embodiment of the present invention.

Fig. 3 is a schematic structural view illustrating still another heat dissipation connector in which a pressure plate is connected to an inner top wall through an elastic member according to an embodiment of the present invention.

Fig. 4 is a schematic structural view illustrating a heat dissipation connector in which a pressure plate is connected to an inner left wall through an elastic member according to an embodiment of the present invention.

Fig. 5 is a schematic structural view illustrating a heat dissipating connector in which a pressure plate is connected to an inner bottom wall through an elastic member according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram illustrating a heat dissipating connector having an adjusting member according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram illustrating a heat dissipating connector having two pressure plates and corresponding adjusting members according to an embodiment of the present invention.

Fig. 8 is a schematic structural view illustrating a heat dissipating connector in which a top plate is detachable according to an embodiment of the present invention.

Fig. 9 is a schematic structural view illustrating still another heat dissipation connector with a detachable top plate according to an embodiment of the present invention.

Fig. 10 is a schematic structural view illustrating a heat dissipating connector having a heat conductive member according to an embodiment of the present invention.

Fig. 11 is a schematic structural diagram illustrating a heat dissipating connector having a connecting member according to an embodiment of the present invention.

Fig. 12 is a schematic structural diagram illustrating an electronic device according to an embodiment of the present invention.

Fig. 13 is a schematic top view illustrating a heat dissipating connector having a spacer according to an embodiment of the present invention.

Fig. 14 is a sectional view showing a heat dissipating connector having a spacer according to an embodiment of the present invention.

Icon: 10-heat dissipating connector; 11-a thermally conductive connector; 112-a separator; 1121-limit sliding groove; 113-a thermal conductor; 114-a first fixture; 115-a second fixture; 13-a locking structure; 131-a first elastic member; 132-a second elastic member; 133-a platen; 133 a-a first platen; 134-a first adjustment member; 135-a second adjustment member; 14 a-front opening; 14 b-rear end opening; 20-an electronic device; 21-the device body.

Detailed Description

The technical solutions in the embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are usually placed in when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed in specific orientations, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

Furthermore, the term "vertical" or the like does not imply that the components are required to be absolutely pendulous, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In view of the internal structure of different systems of present satellite thermal control system, need to go on customizing to the heat pipe that stretches into its system inside, lead to the suitability rate not high, be unfavorable for automated production and cost also high, simultaneously, because the required heat pipe structure of different subsystems is different for satellite thermal control system's heat pipe is long and complicated, and then leads to overall stability to reduce to and heat-conducting capacity reduces scheduling problem. The embodiment of the application provides a heat dissipation connector, which is used for connecting a heat dissipation device (a satellite thermal control system) with a device to be dissipated (other subsystems of a satellite to be dissipated, such as an AI module for photographing), so that heat in the device to be dissipated is guided into the heat dissipation device through the heat dissipation connector and then dissipated, and the heat dissipation device does not need to customize a heat pipe or a copper sheet for adapting to different internal structures of the device to be dissipated.

It should be noted that the defects existing in the prior art are the results obtained after the inventor has practiced and studied carefully, and therefore, the discovery process of the above problems and the solution proposed by the following embodiments of the present invention to the above problems should be the contribution of the inventor to the present invention in the process of the present invention.

As shown in fig. 1, a heat dissipating connector 10 provided in the embodiment of the present application includes: a thermally conductive interface 11 and a locking structure 13.

The heat conductive connector 11 is hollow to form a cavity with two open ends. The shape of the thermally conductive connector 11 may be various, for example, a rectangular parallelepiped, a cylinder, an elliptic cylinder, a prism, or the like as shown in fig. 1.

In the orientation shown in fig. 1, the two openings are respectively denoted as a front opening 14a and a rear opening 14b, where the front opening 14a is used for receiving a heat conducting terminal of a device to be cooled (e.g. a load subsystem in a satellite system, such as an AI module), and the rear opening 14b is used for receiving a heat conducting terminal of a heat dissipating device (e.g. a thermal control subsystem in the satellite system).

Referring to fig. 2, fig. 2 is a schematic cross-sectional view of the heat dissipating connector 10 shown in fig. 1 cut in the left-right direction. As shown, the locking structure 13 includes: a pressing plate 133, a first elastic member 131, and a second elastic member 132. The first elastic member 131 and the second elastic member 132 are, for example, springs. The pressing plate 133 is disposed in the accommodating cavity and connected to the inner top wall of the heat conductive connecting body 11 through the first elastic member 131 and the second elastic member 132.

In use, a thermally conductive terminal of a device to be heat dissipated, such as a heat pipe, is inserted into the heat dissipating connector 10 from the front end opening 14a, and a thermally conductive terminal of a heat dissipating device, such as a heat pipe, is inserted into the heat dissipating connector 10 from the rear end opening 14 b. The heat of the device to be heat-dissipated is transferred to the heat-dissipating connector 10 through the heat-conducting terminal thereof, and then transferred from the heat-dissipating connector 10 to the heat-conducting terminal of the heat-dissipating device, thereby completing the heat-dissipating process. In order to ensure good thermal conductivity, the thermal conductive connecting body 11 and the locking structure 13 of the heat dissipating connector 10 may be made of a material having good thermal conductivity, such as copper, silver, gold, aluminum, and the like, and copper is preferred in view of cost.

In one embodiment, when the heat conductive terminal is not inserted into the heat dissipating connector 10, the first elastic member 131 and the second elastic member 132 are in a stretched state by the weight of the pressing plate 133, as shown in fig. 2. When a heat conduction terminal, such as a copper tube, is inserted into the heat dissipation connector, the pressing plate 133 is pushed up by the heat conduction terminal, so that the first elastic member 131 and the second elastic member 132 are in a compressed state, and the compressed first elastic member 131 and the second elastic member 132 provide a downward force to the pressing plate 133, so that the pressing plate 133 presses the heat conduction terminal, thereby locking the heat conduction terminal in the heat conduction connector 11, on one hand, the heat conduction terminal can be prevented from shifting and falling off, and on the other hand, the contact surface between the heat conduction terminal and the heat conduction connector 11 can be increased as much as possible, so that the copper tube can be well transferred between the heat conduction terminal and the heat conduction connector 11.

Preferably, in order to lock the heat dissipating device and the heat conducting terminal of the device to be dissipated, the surface of the pressing plate 133 contacting the heat conducting terminal is in a saw-tooth shape or a wave shape, so as to increase the friction force during locking and prevent the heat pipe from loosening.

The heat conductive terminal of this embodiment is adapted to have a size at least enough to jack up the pressing plate 133 to a state where the first elastic member 131 and the second elastic member 132 are compressed after the heat conductive terminal is inserted into the heat dissipation connector 10. Otherwise, the pressure plate 133 will not be able to effectively compress the thermally conductive terminal.

To solve this problem, in another embodiment, referring to fig. 3, the first elastic member 131 and the second elastic member 132 are in a compressed state when the heat conductive terminal is not inserted into the heat dissipation connector 10, and press the pressing plate 133 against the inner bottom wall of the heat conductive connection body 11. In this embodiment, when the heat-conducting terminal needs to be inserted, the pressure plate 133 needs to be pulled upward by hand or by other tools before the heat-conducting terminal is inserted. With this arrangement, the heat radiation connector 10 can be adapted to more size heat conductive terminals, such as copper sheets or small size copper tubes.

It should be noted that, although in the illustrated example, the locking structure 13 includes two elastic members, the present invention is not limited to this, and the locking structure 13 may have only 1 elastic member or 3 and 3 or more elastic members, as long as the elastic members can apply a force to the pressing plate 133 in an appropriate direction. In the illustrated example, the first elastic member 131 and the second elastic member 132 are disposed at the left and right ends of the pressing plate 133, respectively, but the present invention is not limited thereto as long as a force in an appropriate direction can be applied to the pressing plate 133.

Although the pressing plate 133 is connected to the inner top wall of the heat conductive connecting body 11 by the elastic member in the foregoing embodiment, the present invention is not limited thereto, and the pressing plate 133 may be connected to the inner left wall, the inner right wall, and the inner bottom wall of the heat conductive connecting body 11 by the elastic member. When the heat conductive connection body 11 is in other shapes, the pressing plate 133 may also be connected to a suitable inner wall of the heat conductive connection body 11 by an elastic member.

Referring to fig. 4, in the example shown in fig. 4, a pressing plate 133 is connected to the inner left wall of the thermally conductive connecting body 11 through a first elastic member 131 and a second elastic member 132. Although the initial state of the first and second elastic members 131 and 132 is a compressed state in the example shown in fig. 4, such that the pressing plate 133 presses against the inner right wall of the heat conductive connection body 11 when the heat conductive terminal is not inserted, it should be understood that the present invention is not limited thereto, and the initial state of the first and second elastic members 131 and 132 may be a natural state, and the pressing plate 133 may not press against the inner right wall of the heat conductive connection body 11 but may be located at a position in the middle of the heat conductive connection body 11.

The embodiment in which the pressing plate 133 is connected to the inner right wall of the heat conductive connection body 11 through the first elastic member 131 and the second elastic member 132 is similar to the embodiment in which the pressing plate is connected to the inner left wall of the heat conductive connection body 11, and thus, the detailed description thereof is omitted.

Fig. 5 and 6 show an example in which the pressing plate 133 is connected to the inner bottom wall of the heat conductive connection body 11 through the first elastic member 131 and the second elastic member 132. In the example shown in fig. 5, the first elastic member 131 and the second elastic member 132 are in a compressed state when the heat conductive terminal is not inserted. When the heat-conductive terminal is inserted between the pressing plate 133 and the inner top wall of the heat-conductive connecting body 11, the spring is further compressed, providing an upward force to the pressing plate 133, so that the pressing plate 133 presses the heat-conductive terminal. In this embodiment, since the heat conductive terminal is inserted between the pressure plate 133 and the inner top wall of the heat conductive connection body 11, it is preferable that the upper surface of the pressure plate 133 has a zigzag or wavy shape.

In the example shown in fig. 6, the heat conductive terminal is inserted from between the pressure plate 133 and the inner bottom wall of the heat conductive connection body 11. In this embodiment, the top plate of the heat conductive connector 11 is further provided with a first adjusting member 134 and a second adjusting member 135, such as screws, bolts, etc., and the first adjusting member 134 and the second adjusting member 135 can move in the up-down direction when adjusted, so as to apply a downward force to the pressing plate 133. In this embodiment, when the heat conductive terminal is not inserted, the first and second elastic members 131 and 132 are in a compressed state to support the pressing plate 133, so that the heat conductive terminal can be inserted easily. After the heat-conductive terminal is inserted between the pressing plate 133 and the inner bottom wall of the heat-conductive connection body 11, the positions of the first and second regulating members 134 and 135 may be adjusted downward to provide a downward force to the pressing plate 133, thereby enabling the pressing plate 133 to press the heat-conductive terminal. In this embodiment, since the heat conductive terminal is inserted between the pressing plate 133 and the inner bottom wall of the heat conductive connection body 11, it is preferable that the lower surface of the pressing plate 133 has a zigzag or wavy shape. Of course, the present invention is not limited thereto, and the pressing plate 133 may be provided with both surfaces in a zigzag or wave shape.

It should be noted that, although in the example shown in fig. 6, only the case that the pressing plate 133 is connected to the inner bottom wall of the heat-conducting connecting body 11 is taken as an example, the adjusting member may be provided to provide a force to the pressing plate 133 towards the heat-conducting terminal, so as to further ensure that the pressing plate 133 can press the heat-conducting terminal. However, the present invention is not limited thereto, and the provision of the adjusting member may assist the supply of the force to the pressing plate 133 in a manner that the elastic member of the pressing plate 133 is connected to the inner top wall, the inner left wall, and the inner right wall of the heat conductive connection body 11. Furthermore, it should be understood that when the thermally conductive connector 11 is of other shapes, the pressure plate 133 may be provided with a force towards the thermally conductive terminal by providing a corresponding adjustment member at a suitable location.

In the foregoing embodiment, the locking structure 13 includes only one integral pressing plate 133, which is suitable for the case where the heat-conducting terminals of the device to be heat-dissipated and the heat-conducting terminals of the heat-dissipating device have substantially the same height. If the heights of the heat conduction terminal of the device to be heat-dissipated and the heat conduction terminal of the heat-dissipating device are not uniform, there may be a problem in that the pressing plate 133 cannot effectively press the heat conduction terminal.

To solve this problem, in one embodiment, the locking structure 13 includes a first pressing plate 133a, a second pressing plate (not shown), a first elastic member 131, a second elastic member 132, a third elastic member (not shown), and a fourth elastic member (not shown). Referring to fig. 7, the first pressing plate 133a is connected to a half of the inner top wall of the heat conductive connecting body 11 near the rear end opening 14b by the first elastic member 131 and the second elastic member 132, and the second pressing plate (not shown) is connected to a half of the inner top wall of the heat conductive connecting body 11 near the front end opening 14a by the third elastic member (not shown) and the fourth elastic member (not shown), in the example of fig. 7, the heat dissipation connector 10 is provided with the adjusting member, and since there are two pressing plates 133 (the first pressing plate 133a and the second pressing plate) in the heat dissipation connector 10, and each pressing plate 133 is provided with two adjusting members, the example shown in the figure has four adjusting members in total. In this embodiment, since the locking structure 13 includes two pressing plates 133 for pressing the heat conduction terminal of the device to be heat-conducted and the heat conduction terminal of the heat dissipation device, respectively, it can be applied to the case where the heat conduction terminal of the device to be heat-dissipated and the heat conduction terminal of the heat dissipation device are different in size and type.

As an embodiment, at least a portion of the thermally conductive connector 11 may be detachable for facilitating the installation of the locking structure 13, as shown in fig. 8 and 9. In the example shown in fig. 8 and 9, the left side plate, the bottom plate and the right side plate of the heat conductive connecting body 11 are integrally formed, and the top plate of the heat conductive connecting body 11 is a separate and detachable structure, and the top plate can be fixed on other parts of the heat conductive connecting body 11 by a connecting member such as a screw, a bolt and the like. Although the top plate is detachably provided in the examples of fig. 8 and 9, the present invention is not limited thereto as long as the locking structure 13 can be easily provided. Furthermore, it should be understood that when the thermally conductive interface 11 is of other shapes, the locking structure 13 may also be conveniently provided by providing at least a portion of the thermally conductive interface 11 to be removable.

Referring to fig. 10, in one embodiment, the heat dissipating connector 10 further includes: the heat conductor 113 is disposed in the accommodating cavity and disposed along the inner bottom wall of the heat conducting connecting body 11, in the illustrated example, the heat conductor 113 extends from the front end opening 14a to the rear end opening 14b and is tiled to fill the entire inner bottom wall, although the invention is not limited thereto, and the area and position of the heat conductor 113 may be set according to actual requirements as long as the heat conductor 113 can contact the heat conducting terminal of the heat dissipating device and the heat conducting terminal of the device to be heat dissipated when the heat conducting terminal is inserted.

In this embodiment, the heat of the device to be heat-dissipated is transferred to the heat conductor 113 through the heat conductive terminal thereof, and then transferred to the heat conductive terminal of the heat-dissipating device through the heat conductor 113. The heat conductor 113 is smaller in volume than the heat conductive connector 11, and therefore, by selecting a material having a better heat conductivity only for the heat conductor 113, the overall heat efficiency is improved, and the cost can be saved compared with a method in which the entire heat conductive connector 11 is made of a material having a better heat conductivity. In addition, in this embodiment, the heat conductive connector 11 may be made of a non-heat conductive material to meet other performance requirements of the heat conductive connector 11.

In a preferred embodiment, the thermal conductor 113 is detachably disposed on the inner bottom wall of the thermal conductor 11. In this embodiment, by detaching the thermal conductor 113 from the thermally conductive connecting body 11, the sizes of the front end opening 14a and the rear end opening 14b can be increased, so that the heat dissipation connector 10 can accommodate a heat pipe of a larger size, thereby providing the heat dissipation connector 10 with better applicability. Further, preferably, the heat conductor 113 may be customized according to the shape of the external heat pipe, so that it can be more closely attached to the external heat pipe to increase heat dissipation efficiency.

Referring to fig. 11 and 12, as an embodiment, in order to facilitate fixing the heat radiating connector 10 on an object to be fixed, for example, on a device to be radiated, for example, on an AI (artificial intelligence) module of a satellite. The heat dissipating connector 10 further includes: and a first fixing member 114 and a second fixing member 115 respectively disposed on the outer left wall and the outer right wall of the thermal connection body 11. The first fixing member 114 and the second fixing member 115 are flat plates extending outward from the outer wall of the thermally conductive connecting body 11, and each flat plate has at least one hole. The holes are used to fix the heat dissipation connector 10 to the object to be fixed by means of a connector such as a nail or a screw, and when the object to be fixed is not suitable for connection by means of a connector such as a nail or a screw, the heat dissipation connector 10 may be fixed to the object to be fixed by directly applying glue to the flat plates of the first fixing member 114 and the second fixing member 115.

The shape of the first fixing member 114 and the second fixing member 115 may be various, and may be, for example, rectangular, triangular, semicircular, U-shaped, or the like. And the first fixing member 114 and the second fixing member 115 may have the same or different shapes and sizes, for example, one may have a U-shape and the other may have a rectangular shape. In addition, the first fixing member 114 and the second fixing member 115 may not be aligned, that is, a connection line between the two is not necessarily perpendicular to the left/right side plates, and may be designed according to actual situations.

Although two fixing members are shown in the illustrated example, the present invention is not limited to this, and 1 or 3 or more fixing members may be provided as necessary as long as the heat radiation connector 10 can be fixed to an object to be fixed.

Referring to fig. 13 and 14, fig. 13 is a plan view of the heat dissipating connector 10, and fig. 14 is a cross-sectional view of the heat dissipating connector 10 in the left-right direction. As an embodiment, when the heat dissipation connector 10 includes two pressing plates 133 (a first pressing plate 133a and a second pressing plate), the heat dissipation connector 10 may further include: and the partition plate 112 is arranged in the accommodating cavity of the heat conduction connecting body 11, is positioned between the first pressing plate 133a and the second pressing plate, and divides the accommodating cavity into a front sub-accommodating cavity and a rear sub-accommodating cavity which are respectively used for accommodating a heat conduction terminal of a device to be cooled and a heat conduction terminal of a heat dissipation device. By providing the partition plate 112, the heat conduction terminal of the device to be heat-dissipated and the heat conduction terminal of the heat-dissipating device can be isolated, and the mutual interference between the two can be reduced. In one embodiment, the partition 112 is disposed at the middle position of the accommodating cavity to divide the accommodating cavity into two sub-accommodating cavities with the same size and shape, and it should be noted that the partition 112 may not be disposed at the middle position of the accommodating cavity, but may be close to the front end opening 14a or the rear end opening 14b, and although the partition 112 is perpendicular to the side plate in the figure, the invention is not limited thereto, and the partition 112 may be disposed not perpendicular to the side plate, but at a certain angle with the side plate, and the angle may be an acute angle or an obtuse angle.

Alternatively, in order to better limit the positions of the first pressing plate 133a and the second pressing plate, a limiting sliding groove 1121 for limiting may be respectively provided on the front and rear surfaces of the partition 112, and accordingly, the first pressing plate 133a and the second pressing plate are respectively provided with a protrusion which is engaged with the limiting sliding groove 1121 of the partition 112, is located in the limiting sliding groove 1121, and is movable within the limiting sliding groove 1121.

The embodiment of the present application further provides an electronic device 20, as shown in fig. 12, the electronic device 20 includes a device body 21 (for example, an AI module) that needs heat dissipation and the above-mentioned heat dissipation connector 10, the device body 21 has a connection port and a heat conduction terminal, the heat conduction terminal is, for example, a heat pipe or a copper sheet, the heat dissipation connector 10 extends into the device body 21 through the connection port, the heat conduction terminal of the device body 21 is inserted into the front end opening 14a of the heat dissipation connector 10, the heat conduction terminal of the device body 21 can be fixed in the receiving cavity of the heat dissipation connector 10 by adjusting the corresponding locking structure 13, and the rear end opening 14b of the heat dissipation connector 10 is used for connecting the heat conduction terminal of a heat dissipation device, so that the heat in the device body 21 is transferred to the heat dissipation device through the heat dissipation connector 10 and dissipated by the heat dissipation device.

It should be noted that, in the description of the present invention, terms for indicating the orientation or positional relationship, such as "center", "upper", "lower", "left", "right", "inner", "outer", etc., are described based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which the product of the present invention is conventionally placed in use, but are only for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present invention.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.