阅读说明：本技术 一种基于无掩膜版工艺的快速曝光装置及其使用方法 (Rapid exposure device based on maskless process and using method thereof ) 是由 吴尚 张翔 熊宝星 袁孝 于 2021-08-02 设计创作，主要内容包括：本发明公开了一种基于无掩膜版工艺的快速曝光装置及其使用方法,涉及无掩膜版曝光机技术领域,包括曝光机构,用于与曝光作业生产线对接,所述曝光机构的顶部设置有硅片本体,所述曝光机构包括机体,所述机体的内部设置有直线模组一以及直线模组二,所述直线模组一的顶部通过电动推杆一设置有承载板一,所述直线模组二的顶部设置有承载板二。通过设置曝光机构、曝光组件、喷胶烘干组件、支撑组件以及胶箱,该装置将喷胶和烘干工序合二为一,减少硅片本体在工序之间转运的时间,同时也降低了硅片本体喷胶后粘附灰尘的风险,保证了曝光作业的整体效率以及成品质量,符合经济效益,具有广阔的应用前景。(The invention discloses a rapid exposure device based on a maskless process and a using method thereof, and relates to the technical field of maskless exposure machines. Through setting up exposure mechanism, exposure subassembly, spouting gluey stoving subassembly, supporting component and gluey case, the device will spout gluey and stoving process unites two into one, reduces the time that the silicon chip body transported between the process, has also reduced the silicon chip body simultaneously and has spouted the risk of gluey back adhesion dust, has guaranteed exposure operation's overall efficiency and finished product quality, accords with economic benefits, has wide application prospect.)

1. A rapid exposure device based on maskless technology is characterized by comprising:

the exposure device comprises an exposure mechanism (1) and a control system, wherein the exposure mechanism (1) is used for being in butt joint with an exposure operation production line, a silicon wafer body (5) is arranged at the top of the exposure mechanism (1), the exposure mechanism (1) comprises a machine body (11), a first linear module (12) and a second linear module (15) are arranged inside the machine body (11), a first bearing plate (14) is arranged at the top of the first linear module (12) through a first electric push rod (13), a second bearing plate (17) is arranged at the top of the second linear module (15), and suckers for adsorbing the silicon wafer body (5) are arranged inside the first bearing plate (14) and the second bearing plate (17);

the exposure assembly (2) is used for carrying out exposure operation on the silicon wafer body (5) after glue spraying, and the exposure assembly (2) comprises an exposure machine (22) arranged at the top of the machine body (11);

the glue spraying and drying assembly (3) is used for spraying glue and drying the cleaned silicon wafer body (5), the glue spraying and drying assembly (3) comprises a box body (31) arranged at the top of the machine body (11), a motor (311) is arranged inside the box body (31), a top cover (32) is arranged at the top of the box body (31), and a soft drying assembly (321) is arranged at the bottom of the top cover (32);

the soft drying component (321) comprises an air outlet plate (3211), an electric heating wire (3213) is arranged at the top of the air outlet plate (3211), a spring (324) is arranged at the bottom of the top cover (32), the bottom end of the spring (324) is fixedly connected with the top of the air outlet plate (3211), a fan (328) with the number not less than one is arranged in the top cover (32), a glue spraying head (327) is arranged in the top cover (32), a collecting cylinder (33) is arranged in the box (31) and is used for collecting glue overflowing in the glue spraying process, a converging cylinder (38) is arranged at the bottom of the collecting cylinder (33) through a collecting pipe (332), the output end of the motor (311) extends to the inside of the collecting cylinder (33) and is provided with a negative pressure cylinder (34), and a fixing plate (35) is arranged on the surface of the negative pressure cylinder (34) through a sealing bearing, an air pipe (36) communicated with the inside of the negative pressure cylinder (34) is arranged inside the fixing plate (35), one end, far away from the negative pressure cylinder (34), of the air pipe (36) penetrates through the outside of the box body (31), and the air pipe is connected with negative pressure equipment through the negative pressure cylinder (34) to maintain the negative pressure state inside the negative pressure cavity;

the supporting assembly (4) is used for feeding and discharging the silicon wafer body (5), the supporting assembly (4) comprises a second electric push rod (41) arranged inside the box body (31), and the top of the second electric push rod (41) is provided with a connecting rod (44) of which one end extends into the collecting cylinder (33);

the glue box (6) is used for storing and recovering photoresist, the glue box (6) is arranged at the top of the machine body (11), a pump (61) used for pumping the photoresist in the glue box (6) to a glue spraying head (327) is arranged at the top of the glue box (6), and a recovery pipe (63) with one end penetrating through the box body (31) and extending to the interior of the confluence cylinder (38) is arranged at the top of the glue box (6).

2. The rapid exposure apparatus based on maskless process according to claim 1, wherein: the top of the second straight line module (15) is provided with a third straight line module (16), the second bearing plate (17) is arranged at the top of the third straight line module (16), the second straight line module (15) and the third straight line module (16) are started to realize the displacement of the second bearing plate (17) all around, and the top of the exposure machine (22) is provided with a support frame (21) with one end fixedly connected with the top of the machine body (11).

3. The rapid exposure apparatus based on maskless process according to claim 1, wherein: the surface of a negative pressure section of thick bamboo (34) is seted up quantity and is no less than one negative pressure hole (341), the top of a negative pressure section of thick bamboo (34) is provided with rubber pad (342), silicon chip body (5) set up in the top of rubber pad (342), the surface of motor (311) output shaft is cup jointed through the inside activity of sealed bearing with a collection section of thick bamboo (33), the bottom that joins a section of thick bamboo (38) is provided with the bottom fixed connection of the bottom of branch and box (31) inner wall.

4. The rapid exposure apparatus based on maskless process according to claim 1, wherein: the top of the second electric push rod (41) is provided with two supporting plates (42), the number of the second electric push rods (41) is two, the two groups of supporting plates (42) are fixedly connected through a connecting plate (43), the connecting rod (44) is arranged at the top of the supporting plates (42), and a top plate (45) located below the silicon wafer body (5) is arranged at the top of the connecting rod (44).

5. The rapid exposure apparatus based on maskless process according to claim 1, wherein: smooth chamber (312) and spacing groove (313) have all been seted up in proper order to the both sides of box (31) inner wall, the inside in smooth chamber (312) is provided with movable rod (314), the top of movable rod (314) and the bottom fixed connection of top cap (32), the surface of movable rod (314) is provided with gangbar (315), the one end that movable rod (314) were kept away from in gangbar (315) runs through spacing groove (313) and with the one end fixed connection of connecting plate (43).

6. The rapid exposure apparatus based on maskless process according to claim 1, wherein: connecting cavity (322) have been seted up to the bottom of top cap (32), spring (324) set up in the inside of connecting cavity (322), the inside of connecting cavity (322) is provided with stabilizer bar (323), the bottom of stabilizer bar (323) and the top fixed connection of air-out board (3211), the top of air-out board (3211) is provided with encloses fender (3212), electric heating wire (3213) set up in the inside of enclosing fender (3212).

7. The rapid exposure apparatus based on maskless process according to claim 1, wherein: even wind chamber (3214) have been seted up to the inside of air-out board (3211), the exhaust vent that staggers each other has been seted up respectively to the top and the bottom of even wind chamber (3214) inner wall, the top of air-out board (3211) has set gradually rubber tube one (325) and rubber tube two (326), the diameter of rubber tube one (325) is greater than rubber tube two (326).

8. The rapid exposure apparatus based on maskless process according to claim 1, wherein: converge a section of thick bamboo (38) and be the slope setting, the output activity of pump machine (61) is provided with the hose, and the hose is kept away from the fixed conveyer pipe (62) that is provided with of one end of pump machine (61) delivery end, the one end that the hose was kept away from in conveyer pipe (62) and the top fixed connection of spouting gluey head (327).

9. The rapid exposure apparatus based on maskless process according to claim 1, wherein: a material guide cylinder (361) is arranged on one section of the surface of the air pipe (36) between the fixing plate (35) and the collecting cylinder (33), a material hole (331) is formed in the top of the collecting cylinder (33), the bottom surface of the inner wall of the collecting cylinder (33) is in a conical shape, and a material guide plate (37) is arranged at the bottom of the inner wall of the collecting cylinder (33).

10. A method for using the rapid exposure apparatus based on maskless technology of claims 1 to 9, comprising the following steps:

s1, butting with a production line, butting the left end of the machine body (11) with a silicon wafer cleaning process of an exposure operation production line, enabling the cleaned silicon wafer body (5) to flow onto a first bearing plate (14), starting a sucker to adsorb, and simultaneously starting a linear module I (12) to convey the cleaned silicon wafer body (5) to a glue spraying and drying assembly (3);

s2, the supporting component (4) is loaded, the electric push rod I (13) is started to lift the bearing plate I (14), simultaneously, the electric push rod II (41) is started, the electric push rod II (41) drives the linkage rod (315) and the movable rod (314) to ascend through the connecting plate (43), so that the movable rod (314) drives the top cover (32) to rise, the top cover (32) is separated from the box body (31), meanwhile, the connecting plate (43) drives the top plate (45) to rise, the height of the top plate (45) after being in place is lower than that of the first bearing plate (14), the first linear module (12) is started to move continuously, so that the first bearing plate (14) is inserted between the two groups of top plates (45), the first electric push rod (13) is started to descend, closing the sucker to enable the silicon wafer body (5) to fall on the top plate (45), starting the linear module I (12) to drive the bearing plate I (14) to be far away from the box body (31), and preparing to execute the next operation of transferring the silicon wafer body (5);

s3, spraying glue on the silicon wafer body (5), starting a second electric push rod (41) to reset, enabling the top cover (32) and the box body (31) to be closed, enabling the silicon wafer body (5) to be attached to the rubber pad (342), connecting negative pressure equipment through a negative pressure pipe, enabling the silicon wafer body (5) to be tightly adsorbed on the rubber pad (342), starting a pump machine (61) to pump photoresist in the glue box (6) and convey the photoresist to a glue spraying head (327), and enabling the photoresist to drip on the silicon wafer body (5) through the glue spraying head (327);

s4, recycling the overflowing photoresist, driving a negative pressure cylinder (34) to rotate by a starting motor (311), driving a silicon wafer body (5) to rotate by a rubber pad (342) when the negative pressure cylinder (34) rotates, extending the photoresist to the surface of the whole silicon wafer body (5) by virtue of centrifugal action, continuously and rotatably throwing off redundant photoresist to obtain a uniform photoresist film covering layer on the silicon wafer, throwing the redundant photoresist on the inner wall of a collecting cylinder (33) and sliding down, entering the collecting pipe (332) and the converging cylinder (38) through a guide plate (37), and finally re-washing the photoresist film into a photoresist box (6) through a recycling pipe (63);

s5, drying the silicon wafer body (5) after glue spraying, closing negative pressure equipment after glue spraying is finished, enabling a negative pressure cylinder (34) to be separated from adsorption of the silicon wafer body (5), starting a supporting component (4) again, enabling the silicon wafer body (5) to be lifted by a top plate (45), enabling a top cover (32) to rise, enabling a spring (324) to rebound and abut against a wind outlet plate (3211) when the top cover (32) rises, enabling the wind outlet plate (3211) to descend to be close to the silicon wafer body (5), meanwhile, keeping away from a glue spraying head (327), starting a fan (328) and an electric heating wire (3213), enabling the fan (328) to extract external air to enter the inside of a surrounding baffle (3212), and after the air is heated by the electric heating wire (3213), blowing hot air to the silicon wafer body (5) through a wind outlet, and enabling photoresist to be dried and adhered to the silicon wafer body (5);

s6, expose silicon chip body (5) after drying, after the stoving is accomplished, start two (15) of sharp module and drive two (17) of loading board and insert between two roof (45) through three (16) of sharp module, start two (41) descendants of electric putter, make silicon chip body (5) fall on two (17) of loading board, start the sucking disc and adsorb, and start two (15) of sharp module and remove two (17) of loading board to exposure machine (22) below, can carry out the exposure operation.

Technical Field

The invention relates to the technical field of maskless exposure machines, in particular to a rapid exposure device based on a maskless process and a using method thereof.

Background

Photoetching is one of the most critical technologies in the semiconductor manufacturing industry, the exposure technology is generally divided into two types of exposure with a mask and exposure without the mask, the exposure with the mask needs to manufacture a mask, and then the pattern is transferred to other photosensitive materials through the mask, and the method has the defects of long mask manufacturing period, high price, poor flexibility and the like, and limits the application development of the technology; at present, most of maskless exposure adopts an optical projection imaging method to project an image generated by an electronic device such as a spatial light modulator (DMD) and the like onto a workpiece to be exposed, the method has good flexibility and does not need a mask plate, but the exposure machine has the following defects when in use:

the silicon chip need wash and spout the flow of photoetching glue before exposing, it needs to dry after the photoetching glue to spout, the conventional mucilage binding that spouts puts single structure, and be two processes with the stoving, the transfer between influences machining efficiency, the silicon chip after also causing to spout gluey easily glues dust simultaneously, owing to spout mucilage binding and put single structure, lead to spouting the unable assurance of gluey thickness, the thickness homogeneity of spouting the photoetching glue can directly influence the efficiency of exposure operation, and the effect after the development.

Disclosure of Invention

In order to achieve the purpose, the invention provides the following technical scheme: a rapid exposure device based on a maskless technology and a using method thereof comprise the following steps:

the exposure mechanism is used for being in butt joint with an exposure operation production line, a silicon wafer body is arranged at the top of the exposure mechanism, the exposure mechanism comprises a machine body, a first linear module and a second linear module are arranged inside the machine body, a first bearing plate is arranged at the top of the first linear module through a first electric push rod, a second bearing plate is arranged at the top of the second linear module, and suckers for adsorbing the silicon wafer body are arranged inside the first bearing plate and the second bearing plate;

the exposure assembly is used for carrying out exposure operation on the silicon wafer body after glue spraying, and comprises an exposure machine arranged on the top of the machine body;

the glue spraying and drying assembly is used for spraying glue and drying the cleaned silicon wafer body, and comprises a box body arranged at the top of the machine body, a motor is arranged inside the box body, a top cover is arranged at the top of the box body, and a soft drying assembly is arranged at the bottom of the top cover;

the soft drying component comprises an air outlet plate, the top of the air outlet plate is provided with an electric heating wire, the bottom of the top cover is provided with a spring, the bottom end of the spring is fixedly connected with the top of the air outlet plate, at least one fan is arranged inside the top cover, the glue spraying head is arranged inside the top cover, the collecting barrel is arranged inside the box body, used for collecting the glue overflowing in the glue spraying process, the bottom of the collecting cylinder is provided with a converging cylinder through a collecting pipe, the output end of the motor extends into the collecting cylinder and is provided with a negative pressure cylinder, the surface of the negative pressure cylinder is provided with a fixing plate through a sealing bearing, an air pipe communicated with the inside of the negative pressure cylinder is arranged inside the fixing plate, one end of the air pipe, which is far away from the negative pressure cylinder, penetrates to the outside of the box body, and is connected with negative pressure equipment through the negative pressure cylinder to maintain the negative pressure state inside the negative pressure cavity;

the supporting assembly is used for carrying out loading and unloading operations on the silicon wafer body and comprises a second electric push rod arranged in the box body, and the top of the second electric push rod is provided with a connecting rod of which one end extends into the collecting cylinder;

the glue box is used for storing and recovering photoresist, the glue box is arranged at the top of the machine body, a pump used for pumping the photoresist inside the glue box to a glue spraying head is arranged at the top of the glue box, and one end of the top of the glue box penetrates through the box body and extends to a recovery pipe inside the confluence cylinder.

As a preferred technical scheme, a third linear module is arranged at the top of the second linear module, the second bearing plate is arranged at the top of the third linear module, the second linear module and the third linear module are started to realize the front-back left-right displacement of the second bearing plate, and a support frame with one end fixedly connected with the top of the machine body is arranged at the top of the exposure machine.

As a preferred technical scheme of the invention, at least one negative pressure hole is formed in the surface of the negative pressure cylinder, a rubber pad is arranged at the top of the negative pressure cylinder, the silicon wafer body is arranged at the top of the rubber pad, the surface of the output shaft of the motor is movably sleeved with the interior of the collecting cylinder through a sealing bearing, a support rod is arranged at the bottom of the converging cylinder, and the bottom of the support rod is fixedly connected with the bottom of the inner wall of the box body.

As a preferred technical scheme of the invention, the top of the second electric push rod is provided with two support plates, the two groups of support plates are fixedly connected through a connecting plate, the connecting rod is arranged at the top of the support plates, and the top of the connecting rod is provided with a top plate positioned below the silicon wafer body.

As a preferred technical scheme, both sides of the inner wall of the box body are sequentially provided with a sliding cavity and a limiting groove, a movable rod is arranged inside the sliding cavity, the top end of the movable rod is fixedly connected with the bottom of the top cover, a linkage rod is arranged on the surface of the movable rod, and one end, far away from the movable rod, of the linkage rod penetrates through the limiting groove and is fixedly connected with one end of the connecting plate.

As a preferred technical scheme of the invention, a connecting cavity is formed in the bottom of the top cover, the spring is arranged inside the connecting cavity, a stabilizer bar is arranged inside the connecting cavity, the bottom end of the stabilizer bar is fixedly connected with the top of the air outlet plate, a baffle is arranged on the top of the air outlet plate, and the electric heating wire is arranged inside the baffle.

As a preferred technical scheme, the air outlet plate is internally provided with an air homogenizing cavity, the top and the bottom of the inner wall of the air homogenizing cavity are respectively provided with air outlet holes which are staggered with each other, the top of the air outlet plate is sequentially provided with a first rubber cylinder and a second rubber cylinder, and the diameter of the first rubber cylinder is larger than that of the second rubber cylinder.

As a preferable technical scheme of the invention, the converging cylinder is obliquely arranged, the output end of the pump is movably provided with a hose, one end of the hose far away from the conveying end of the pump is fixedly provided with a conveying pipe, and one end of the conveying pipe far away from the hose is fixedly connected with the top of the glue spraying head.

As a preferred technical scheme of the invention, a material guide cylinder is arranged on one section of the surface of the air pipe between the fixing plate and the collecting cylinder, a material hole is formed in the top of the collecting cylinder, the bottom surface of the inner wall of the collecting cylinder is arranged in a conical shape, and a material guide plate is arranged at the bottom of the inner wall of the collecting cylinder.

A use method of a rapid exposure device based on a maskless process comprises the following steps:

s1, butting with a production line, butting the left end of the machine body with a silicon wafer cleaning process of an exposure operation production line, enabling the cleaned silicon wafer body to flow onto a first bearing plate, starting a sucker to adsorb, and simultaneously starting a first linear module to convey the cleaned silicon wafer body to a glue spraying and drying assembly;

s2, feeding the supporting component, starting the first electric push rod to lift the first bearing plate, simultaneously starting the second electric push rod, enabling the second electric push rod to drive the linkage rod and the movable rod to ascend through the connecting plate, enabling the movable rod to drive the top cover to ascend, enabling the top cover to be separated from the box body, enabling the connecting plate to drive the top plate to ascend, enabling the height of the top plate after the top plate is in place to be lower than that of the first bearing plate, continuously moving the first starting linear module, enabling the first bearing plate to be inserted between the two groups of top plates, starting the first electric push rod to descend, simultaneously closing the suckers, enabling the silicon wafer body to fall onto the top plate, enabling the first starting linear module to drive the first bearing plate to be away from the box body, and preparing to execute the next operation of transferring the silicon wafer body;

s3, spraying glue on the silicon wafer body, starting an electric push rod II to reset, enabling a top cover to be closed with a box body, enabling the silicon wafer body to be attached to a rubber pad, connecting a negative pressure device through a negative pressure pipe, enabling the silicon wafer body to be tightly adsorbed on the rubber pad, starting a pump machine to pump photoresist in a glue box and conveying the photoresist to a glue spraying head, and enabling the photoresist to drip on the silicon wafer body through the glue spraying head;

s4, recycling the overflowing photoresist, starting a motor to drive a negative pressure cylinder to rotate, driving a silicon wafer body to rotate through a rubber pad when the negative pressure cylinder rotates, stretching the photoresist to the surface of the whole silicon wafer body by virtue of centrifugal action, continuously and rotatably throwing off redundant photoresist to obtain a uniform photoresist film covering layer on the silicon wafer, throwing off the redundant photoresist on the inner wall of a collecting cylinder, sliding down, entering the collecting pipe and the converging cylinder through a guide plate, and finally re-washing through a recycling pipe to enter the inside of a photoresist box;

s5, drying the silicon wafer body after glue spraying, closing the negative pressure equipment after the glue spraying is finished, enabling the negative pressure cylinder to be separated from adsorption on the silicon wafer body, starting the supporting assembly again, enabling the silicon wafer body to be lifted by the top plate, enabling the top cover to rise simultaneously, enabling the spring to rebound and abut against the air outlet plate when the top cover rises, enabling the air outlet plate to descend to be close to the silicon wafer body and keep away from the glue spraying head simultaneously, starting the fan and the electric heating wire, enabling the fan to extract external air to enter the interior of the enclosure, and blowing hot air to the silicon wafer body through the air outlet after the air is heated by the electric heating wire, so that the photoresist is dried and adhered to the silicon wafer body;

s6, exposing the dried silicon wafer body, after drying is completed, starting the second linear module to drive the second bearing plate to be inserted between the two top plates through the third linear module, starting the electric push rod to descend, enabling the silicon wafer body to fall on the second bearing plate, starting the sucker to adsorb, and starting the second linear module to move the second bearing plate to the lower part of the exposure machine, so that exposure operation can be carried out.

Compared with the prior art, the invention provides a rapid exposure device based on a maskless process and a using method thereof, and the rapid exposure device has the following beneficial effects:

1. this quick exposure device based on maskless technology and application method thereof through setting up exposure mechanism, exposure subassembly, spouting gluey stoving subassembly, supporting component and gluey case, the device will spout gluey and dry the process and unite two into one, reduces the time that the silicon chip body transported between the process, has also reduced the silicon chip body simultaneously and has spouted the risk of gluing the back adhesion dust, has guaranteed exposure operation's overall efficiency and finished product quality, accords with economic benefits, has wide application prospect.

2. This quick exposure device based on maskless technology and application method thereof through setting up exposure mechanism, exposure subassembly, spouting gluey stoving subassembly, supporting component and gluey case, retrieves the photoresist that gets rid of through the collecting vessel, has reduced the consumption of photoresist, reduces extravagantly, has reduced the clearance frequency simultaneously, adopts the mode of rising stoving simultaneously, can effectively avoid the hot-blast condition of drying with the photoresist of collecting vessel inside to appear, has further guaranteed the recovery efficiency of photoresist.

3. This quick exposure device based on maskless technology and application method thereof, through setting up exposure mechanism, exposure subassembly, spout gluey stoving subassembly, supporting component and gluey case, when the top cap rises, the spring kick-backs and contradicts out the tuber plate for it is close to the silicon chip body to go out the tuber plate, keeps away from simultaneously and spouts the gluey head, has guaranteed again under the prerequisite to the drying efficiency of silicon chip body, has reduced the influence to spouting gluey head to hot-blast, and is rationally distributed, uses in a flexible way, has guaranteed the whole smoothness nature of exposure operation.

Drawings

FIG. 1 is a schematic structural diagram of a rapid exposure apparatus based on a maskless process and a method for using the same according to the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1;

FIG. 3 is an enlarged view of the structure at B in FIG. 1;

FIG. 4 is a cross-sectional view of a rapid exposure apparatus based on maskless process and a method for using the same according to the present invention;

FIG. 5 is an enlarged view of the structure at A in FIG. 4;

FIG. 6 is an enlarged view of the structure at B in FIG. 4;

FIG. 7 is a cross-sectional view of a linkage rod structure of a rapid exposure apparatus based on a maskless process and a method for using the same according to the present invention;

FIG. 8 is a cross-sectional view of a material guiding barrel structure of a rapid exposure apparatus based on a maskless process and a method for using the same according to the present invention;

fig. 9 is a schematic diagram of a top cover lifting of a rapid exposure apparatus based on a maskless process and a method for using the same according to the present invention;

FIG. 10 is a schematic structural diagram of a supporting assembly of a rapid exposure apparatus based on a maskless process and a method for using the same according to the present invention;

fig. 11 is a flow chart illustrating a rapid exposure apparatus based on a maskless process and a method for using the same according to the present invention.

In the figure: 1. an exposure mechanism; 11. a body; 12. a first linear module; 13. an electric push rod I; 14. a first bearing plate; 15. a second linear module; 16. a linear module III; 17. a second bearing plate; 2. an exposure component; 21. a support frame; 22. an exposure machine; 3. spraying glue and drying the assembly; 31. a box body; 311. a motor; 312. a slide chamber; 313. a limiting groove; 314. a movable rod; 315. a linkage rod; 32. a top cover; 321. a soft-baking component; 3211. an air outlet plate; 3212. fencing; 3213. an electric heating wire; 3214. a wind-homogenizing cavity; 322. a connecting cavity; 323. a stabilizer bar; 324. a spring; 325. a first rubber cylinder; 326. a second rubber cylinder; 327. spraying a glue head; 328. a fan; 33. a collection canister; 331. material holes; 332. a collection pipe; 34. a negative pressure cylinder; 341. a negative pressure hole; 342. a rubber pad; 35. a fixing plate; 36. an air tube; 361. a material guide cylinder; 37. a material guide plate; 38. a converging cylinder; 4. a support assembly; 41. a second electric push rod; 42. a support plate; 43. a connecting plate; 44. a connecting rod; 45. a top plate; 5. a silicon wafer body; 6. a glue box; 61. a pump machine; 62. a delivery pipe; 63. and (7) recovering the pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 11, a rapid exposure apparatus based on a maskless process includes: the exposure mechanism 1 is used for being in butt joint with an exposure operation production line, a silicon wafer body 5 is arranged at the top of the exposure mechanism 1, the exposure mechanism 1 comprises a machine body 11, a first linear module 12 and a second linear module 15 are arranged inside the machine body 11, a first bearing plate 14 is arranged at the top of the first linear module 12 through a first electric push rod 13, a second bearing plate 17 is arranged at the top of the second linear module 15, suckers for adsorbing the silicon wafer body 5 are arranged inside the first bearing plate 14 and the second bearing plate 17, the exposure assembly 2 is used for carrying out exposure operation on the silicon wafer body 5 after glue spraying, the exposure assembly 2 comprises an exposure machine 22 arranged at the top of the machine body 11, a glue spraying and drying assembly 3 is used for carrying out glue spraying and drying operation on the silicon wafer body 5 after cleaning, and the glue spraying and drying assembly 3 comprises a box body 31 arranged at the top of the machine body 11, the motor 311 is arranged in the box 31, the top cover 32 is arranged at the top of the box 31, and the soft drying component 321 is arranged at the bottom of the top cover 32.

The soft drying component 321 comprises an air outlet plate 3211, an electric heating wire 3213 is arranged at the top of the air outlet plate 3211, a spring 324 is arranged at the bottom of the top cover 32, the bottom end of the spring 324 is fixedly connected with the top of the air outlet plate 3211, at least one fan 328 is arranged inside the top cover 32, a glue spraying head 327 is arranged inside the top cover 32, a collecting cylinder 33 is arranged inside the box 31 and used for collecting glue overflowing in a glue spraying process, a converging cylinder 38 is arranged at the bottom of the collecting cylinder 33 through a collecting pipe 332, an output end of the motor 311 extends to the inside of the collecting cylinder 33 and is provided with a negative pressure cylinder 34, a fixing plate 35 is arranged on the surface of the negative pressure cylinder 34 through a sealing bearing, an air pipe 36 communicated with the inside of the negative pressure cylinder 34 is arranged inside the fixing plate 35, one end of the air pipe 36 far away from the negative pressure cylinder 34 penetrates through the outside of the box 31, connect negative pressure equipment through a negative pressure section of thick bamboo 34, maintain negative pressure state in the negative pressure intracavity portion, supporting component 4, it is right to be used for the operation that silicon chip body 5 carries out material loading and unloading, supporting component 4 is including setting up in the inside electric putter two 41 of box 31, the top of electric putter two 41 is provided with the connecting rod 44 that one end extends to the collecting vessel 33 inside, through setting up exposure mechanism 1, exposure component 2, spouting gluey stoving subassembly 3, supporting component 4 and gluey case 6, the device will spout gluey and stoving process and unite two into one, reduces the time that silicon chip body 5 transported between the process, has also reduced silicon chip body 5 simultaneously and has spouted the risk of gluey back adhesion dust, has guaranteed exposure operation's overall efficiency and finished product quality, accords with economic benefits, has wide application prospect, through setting up exposure mechanism 1, exposure component 2, spout gluey stoving subassembly 3, Supporting component 4 and glue case 6, retrieve the photoresist of getting rid of through collecting vessel 33, the consumption of photoresist has been reduced, reduce the waste, the clearance frequency has been reduced simultaneously, adopt the mode of rising stoving simultaneously, the hot-blast condition that weathers the inside photoresist of collecting vessel 33 that can have effectively been avoided appears, the recovery efficiency of photoresist has further been guaranteed, through setting up exposure mechanism 1, exposure subassembly 2, spout gluey stoving subassembly 3, supporting component 4 and glue case 6, when top cap 32 rose, spring 324 kick-backs and contradicts out aerofoil 3211, make out aerofoil 3211 to be close to silicon chip body 5, keep away from simultaneously and spout gluey head 327, under the prerequisite of having guaranteed the drying efficiency to silicon chip body 5 again, the influence to hot-blast to spouting gluey head 327 has been reduced, the overall arrangement is reasonable, the use is nimble, the whole smoothness nature of exposure operation has been guaranteed.

The glue box 6 is used for storing and recovering the photoresist, the glue box 6 is arranged at the top of the machine body 11, a pump 61 for pumping the photoresist in the glue box 6 to a glue spraying head 327 and conveying the photoresist is arranged at the top of the glue box 6, and a recovery pipe 63 with one end penetrating through the box body 31 and extending to the interior of the converging cylinder 38 is arranged at the top of the glue box 6.

As a specific technical scheme of this embodiment, a third linear module 16 is disposed on the top of the second linear module 15, the second loading plate 17 is disposed on the top of the third linear module 16, the second linear module 15 and the third linear module 16 are started to realize front-back, left-right and left-right displacement of the second loading plate 17, a support frame 21 with one end fixedly connected with the top of the machine body 11 is disposed on the top of the exposure machine 22, the left end of the machine body 11 is butted with a silicon wafer cleaning process of an exposure operation production line, the cleaned silicon wafer body 5 flows onto the first loading plate 14, suction cup adsorption is started, the first linear module 12 is started to convey the cleaned silicon wafer body 5 to the glue spraying and drying assembly 3, the second linear module 15 is matched with the linear module to move the silicon wafer body 5 after glue spraying and drying, and thereby facilitating the camera module in the exposure machine 22 to perform MARK alignment.

As a specific technical solution of this embodiment, the surface of the negative pressure cylinder 34 is provided with at least one negative pressure hole 341, the top of the negative pressure cylinder 34 is provided with a rubber pad 342, the silicon wafer body 5 is arranged on the top of the rubber pad 342, the surface of the output shaft of the motor 311 is movably sleeved with the inner part of the collecting cylinder 33 through a sealing bearing, the bottom of the converging cylinder 38 is provided with a support rod, the bottom of the support rod is fixedly connected with the bottom of the inner wall of the box body 31, the rubber pad 342 is arranged to ensure a sealed box between the negative pressure cylinder 34 and the silicon wafer body 5, the negative pressure pipe extracts air in the negative pressure cylinder 34 through the negative pressure hole 341, and the bearing is sealed, when the motor 311 drives the negative pressure cylinder 34 to rotate, the fixing plate 35 and the collecting cylinder 33 are not affected, the supporting rod is used for installing the converging cylinder 38, and the stability of the converging cylinder 38 and the collecting cylinder 33 is guaranteed.

As a specific technical scheme of this embodiment, the top of electric putter two 41 is provided with backup pad 42, the quantity of electric putter two 41 is two, and is two sets of through connecting plate 43 fixed connection between the backup pad 42, connecting rod 44 sets up the top of backup pad 42, the top of connecting rod 44 is provided with roof 45 that is located silicon chip body 5 below, the setting of two roof 45 for loading board one 14 and loading board two 17 can alternate between two roof 45, do benefit to and carry out material loading and unloading to silicon chip body 5, can not influence the rotation of silicon chip body 5 simultaneously, when getting rid of the glue, also can not adhere to on roof 45, and it is more convenient to use.

As a specific technical scheme of this embodiment, a sliding cavity 312 and a limiting groove 313 have all been seted up in proper order to the both sides of box 31 inner wall, the inside in sliding cavity 312 is provided with movable rod 314, the top of movable rod 314 and the bottom fixed connection of top cap 32, the surface of movable rod 314 is provided with gangbar 315, the one end that gangbar 315 kept away from movable rod 314 runs through limiting groove 313 and with the one end fixed connection of connecting plate 43, start electric putter two 41 and drive connecting plate 43 and rise, connecting plate 43 drives movable rod 314 through gangbar 315 and rises, the setting of movable rod 314 for when roof 45 rises, top cap 32 rises along with roof 45 together, need not to use extra power supply, uses energy-concerving and environment-protective more, and the setting of limiting groove 313 has restricted the rise height of roof 45, has guaranteed the stability of the device.

As a specific technical scheme of this embodiment, a connection cavity 322 is provided at the bottom of the top cover 32, the spring 324 is disposed inside the connection cavity 322, a stabilizer bar 323 is disposed inside the connection cavity 322, a bottom end of the stabilizer bar 323 is fixedly connected with a top of the air outlet plate 3211, a baffle 3212 is disposed at the top of the air outlet plate 3211, the electric heating wire 3213 is disposed inside the baffle 3212, when the top cover 32 rises, the spring 324 rebounds to abut against the air outlet plate 3211, see fig. 10, so that the air outlet plate 3211 is close to the silicon wafer body 5 and is away from the glue spraying head 327, and then the influence on the glue spraying head 327 by hot air is reduced on the premise of ensuring the drying efficiency of the silicon wafer body 5.

As a specific technical scheme of this embodiment, an air-homogenizing chamber 3214 is disposed inside the air-out plate 3211, air-out holes which are mutually staggered are respectively disposed at the top and the bottom of the inner wall of the air-homogenizing chamber 3214, a first rubber cylinder 325 and a second rubber cylinder 326 are sequentially disposed at the top of the air-out plate 3211, the first rubber cylinder 325 has a diameter larger than that of the second rubber cylinder 326, and air-out holes which are mutually staggered are respectively disposed at the top and the bottom of the inner wall of the air-homogenizing chamber 3214, so that hot air entering through the air-out holes at the top of the inner wall of the air-homogenizing chamber 3214 is not directly discharged through the air-out holes at the bottom of the inner wall of the air-homogenizing chamber 3214, the hot air is uniformly diffused inside the air-homogenizing chamber 3214, the air-out uniformity is ensured, and the drying efficiency is further ensured, the first rubber cylinder 325 and the second rubber cylinder 326 surround the space at the top of the air-out plate 3211, thereby avoiding the air leakage from affecting the air-out efficiency, while reducing the effect of air on the glue jet 327.

As a specific technical solution of this embodiment, the converging cylinder 38 is disposed in an inclined manner, a flexible pipe is movably disposed at the output end of the pump 61, a delivery pipe 62 is fixedly disposed at one end of the flexible pipe away from the delivery end of the pump 61, one end of the delivery pipe 62 far away from the hose is fixedly connected with the top of the glue spraying head 327, when the motor 311 drives the silicon wafer body 5 to rotate, the excess photoresist is thrown against the inner wall of the collection cylinder 33 and then enters the interior of the confluence cylinder 38 through the collection pipe 332, the obliquely arranged confluence cylinder 38 facilitating the photoresist inside the confluence cylinder 38 to enter the interior of the photoresist tank 6 through the recovery pipe 63, see fig. 1 and 3, the arrangement of the hose, when the top cover 32 drives the glue spraying head 327 to ascend, the hose cannot be separated from the pump 61, the joint of the recovery pipe 63 and the glue box 6 is also connected through the hose, the glue box 6 is convenient to detach, and later maintenance is facilitated.

As a specific technical scheme of this embodiment, a section of surface of the air pipe 36 located between the fixing plate 35 and the collecting cylinder 33 is provided with a material guiding cylinder 361, the top of the collecting cylinder 33 is provided with a material hole 331, the bottom surface of the inner wall of the collecting cylinder 33 is in a conical arrangement, the bottom of the inner wall of the collecting cylinder 33 is provided with a material guiding plate 37, the material guiding plate 37 is arranged, the thrown-off photoresist is prevented from being accumulated on the side of the inner wall of the collecting cylinder 33, the overflowed photoresist rapidly flows into the collecting pipe 332, the collecting efficiency is ensured, meanwhile, the rising drying mode is adopted, the occurrence of the condition that the photoresist inside the collecting cylinder 33 is dried by hot air is effectively avoided, and as shown in fig. 8, the material guiding cylinder 361 is in a triangular arrangement, the photoresist thrown off on the material guiding cylinder 361 can rapidly slide off and is prevented from being accumulated.

A use method of a rapid exposure device based on a maskless process comprises the following steps:

s1, butting with a production line, butting the left end of the machine body 11 with a silicon wafer cleaning process of an exposure operation production line, enabling the cleaned silicon wafer body 5 to flow onto the bearing plate I14, starting a sucking disc to adsorb, and simultaneously starting the linear module I12 to convey the cleaned silicon wafer body 5 to the glue spraying and drying assembly 3;

s2, the supporting component 4 carries out feeding, the electric push rod I13 is started to lift the bearing plate I14, the electric push rod II 41 is started simultaneously, the electric push rod II 41 drives the linkage rod 315 and the movable rod 314 to ascend through the connecting plate 43, the movable rod 314 drives the top cover 32 to ascend, the top cover 32 is separated from the box body 31, the connecting plate 43 drives the top plate 45 to ascend, the height of the top plate 45 after being in place is lower than that of the bearing plate I14, the starting linear module I12 continues to move, the bearing plate I14 is inserted between the two groups of top plates 45, the electric push rod I13 is started to descend, meanwhile, the suction disc is closed, the silicon wafer body 5 falls onto the top plate 45, the starting linear module I12 drives the bearing plate I14 to be far away from the box body 31, and operation of next time of transferring the silicon wafer body 5 is prepared to be carried out;

s3, spraying glue on the silicon wafer body 5, starting the electric push rod II 41 to reset, closing the top cover 32 and the box body 31, simultaneously attaching the silicon wafer body 5 and the rubber pad 342, connecting a negative pressure device through a negative pressure pipe, so that the silicon wafer body 5 is tightly adsorbed on the rubber pad 342, starting the pump 61 to pump the photoresist in the glue box 6 and convey the photoresist to the glue spraying head 327, and dropping the photoresist on the silicon wafer body 5 through the glue spraying head 327;

s4, recycling the overflowing photoresist, driving the negative pressure cylinder 34 to rotate by the starting motor 311, driving the silicon wafer body 5 to rotate by the rubber pad 342 when the negative pressure cylinder 34 rotates, extending the photoresist to the surface of the whole silicon wafer body 5 by centrifugal action, continuously rotating to remove the redundant photoresist, obtaining a uniform photoresist film covering layer on the silicon wafer, throwing the redundant photoresist on the inner wall of the collecting cylinder 33, sliding down, entering the collecting pipe 332 and the converging cylinder 38 through the guide plate 37, and finally re-washing the redundant photoresist film into the glue box 6 through the recycling pipe 63;

s5, drying the silicon wafer body 5 after glue spraying, closing a negative pressure device after the glue spraying is finished, enabling a negative pressure cylinder 34 to be separated from adsorption on the silicon wafer body 5, starting the supporting component 4 again, enabling the silicon wafer body 5 to be lifted by the top plate 45, simultaneously lifting the top cover 32, enabling the spring 324 to rebound and abut against the air outlet plate 3211 when the top cover 32 is lifted, enabling the air outlet plate 3211 to descend to be close to the silicon wafer body 5, simultaneously keeping away from the glue spraying head 327, starting the fan 328 and the electric heating wire 3213, enabling the fan 328 to extract external air to enter the inside of the enclosure 3212, and after the heating of the electric heating wire 3213, blowing the hot air to the silicon wafer body 5 through the air outlet holes to enable the photoresist to be dried and adhered to the silicon wafer body 5;

s6, expose the silicon wafer body 5 after drying, start two 15 of straight line modules and drive two 17 of loading board and insert between two roof plates 45 through three 16 of straight line modules, start two 41 decline of electric putter, make silicon wafer body 5 fall on two 17 of loading board, start the sucking disc and adsorb, and start two 15 of straight line modules and remove two 17 of loading board to exposure machine 22 below, can carry out the exposure operation, start two 41 of electric putter and drive roof plate 45 simultaneously and rise to target in place, cooperate loading board 14 to continue to carry out operations such as material loading, spout glue and stoving.

In conclusion, the rapid exposure device based on the maskless process and the use method thereof have the advantages that the exposure mechanism 1, the exposure component 2, the glue spraying and drying component 3, the supporting component 4 and the glue box 6 are arranged, the device integrates glue spraying and drying processes, the time for transferring the silicon wafer body 5 between the processes is reduced, meanwhile, the risk that dust is adhered to the silicon wafer body 5 after glue spraying is reduced, the overall efficiency and the finished product quality of exposure operation are guaranteed, economic benefits are met, and the rapid exposure device has a wide application prospect.

It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.