阅读说明：本技术 陶瓷波导滤波器通孔电容结构 (Ceramic waveguide filter through hole capacitor structure ) 是由 王常春 丁超超 陈卫平 于 2019-11-05 设计创作，主要内容包括：一种陶瓷波导滤波器通孔电容结构,包括陶瓷介质块及设置于陶瓷介质块的周向外表面上的第一导电层；陶瓷介质块的底面开设有至少两个谐振槽；谐振槽的内侧壁上设置有第二导电层；陶瓷介质块于两个谐振槽之间开设有通孔；通孔包括开设于陶瓷介质块的底面的第一负耦合槽、开设于陶瓷介质块的顶面且与第一负耦合槽相对的第二负耦合槽及连通第一负耦合槽与第二负耦合槽的中间过孔；第一负耦合槽的内侧壁上设置有第三导电层,中间过孔的周向侧壁上设置有与第三导电层连接的第四导电层,第二负耦合槽的底壁上设置有与第四导电层连接的第五导电层。如此能够减少重量、减少材料且方便调节电容大小及频率。(A through hole capacitor structure of a ceramic waveguide filter comprises a ceramic dielectric block and a first conducting layer arranged on the circumferential outer surface of the ceramic dielectric block; the bottom surface of the ceramic dielectric block is provided with at least two resonance grooves; a second conductive layer is arranged on the inner side wall of the resonance groove; the ceramic dielectric block is provided with a through hole between the two resonance grooves; the through hole comprises a first negative coupling groove arranged on the bottom surface of the ceramic dielectric block, a second negative coupling groove arranged on the top surface of the ceramic dielectric block and opposite to the first negative coupling groove, and a middle through hole communicated with the first negative coupling groove and the second negative coupling groove; the inner side wall of the first negative coupling groove is provided with a third conducting layer, the circumferential side wall of the middle through hole is provided with a fourth conducting layer connected with the third conducting layer, and the bottom wall of the second negative coupling groove is provided with a fifth conducting layer connected with the fourth conducting layer. Therefore, the weight and the material can be reduced, and the size and the frequency of the capacitor can be conveniently adjusted.)

1. A ceramic waveguide filter through-hole capacitor structure is characterized in that: the ceramic dielectric block comprises a ceramic dielectric block and a first conducting layer arranged on the circumferential outer surface of the ceramic dielectric block; the bottom surface of the ceramic dielectric block is provided with at least two resonance grooves; a second conductive layer is arranged on the inner side wall of the resonance groove; the ceramic dielectric block is provided with a through hole between the two resonance grooves; the through hole comprises a first negative coupling groove arranged on the bottom surface of the ceramic dielectric block, a second negative coupling groove arranged on the top surface of the ceramic dielectric block and opposite to the first negative coupling groove, and a middle through hole communicated with the first negative coupling groove and the second negative coupling groove; the inner side wall of the first negative coupling groove is provided with a third conducting layer, the circumferential side wall of the middle through hole is provided with a fourth conducting layer connected with the third conducting layer, and the bottom wall of the second negative coupling groove is provided with a fifth conducting layer connected with the fourth conducting layer.

2. The ceramic waveguide filter via capacitor structure of claim 1, wherein: the depth of the first negative coupling groove is greater than that of the resonant groove.

3. The ceramic waveguide filter via capacitor structure of claim 2, wherein: the depth of the first negative coupling groove is twice the depth of the resonant groove.

4. The ceramic waveguide filter via capacitor structure of claim 1, wherein: the width of the first negative coupling groove is smaller than that of the resonance groove, the width of the second negative coupling groove is larger than that of the first negative coupling groove, and the width of the middle via hole is smaller than that of the first negative coupling groove and that of the second negative coupling groove.

5. The ceramic waveguide filter via capacitor structure of claim 4, wherein: the width of the first negative coupling slot is the resonant slot width 1/2.

6. The ceramic waveguide filter via capacitor structure of claim 4, wherein: the resonant groove, the first negative coupling groove and the second negative coupling groove are all cylindrical in shape.

Technical Field

The invention relates to the technical field of 5G communication antennas, in particular to a through hole capacitor structure of a ceramic waveguide filter.

Background

With the development of communication technology, the 5 th generation communication system is going to be commercially available. The characteristics of low time delay and high bandwidth of the 5G communication system provide a better platform for people's life and the application of the Internet of things. The 5G communication system improves signal coverage by introducing an active antenna array (the number of cooperative antennas on the base station side can support up to 128), and 128 filters are connected behind each antenna, which puts requirements on miniaturization of the filters. The high dielectric and low loss characteristics of the dielectric ceramic filter are very suitable for being applied to a 5G communication system. Compared with the traditional metal filter, the volume of the dielectric ceramic filter can be reduced to about 1/5.

Except that the part of the resonator of the existing dielectric ceramic filter is provided with the groove, the rest parts are all solid bodies, or blind holes are additionally arranged for improving the performance, the whole weight is heavier, and more materials are consumed during the manufacturing; meanwhile, the conventional dielectric ceramic filter is inconvenient for adjusting the size of the capacitor and frequency.

Disclosure of Invention

Accordingly, the present invention is directed to a through-hole capacitor structure of a ceramic waveguide filter, which has reduced weight and material consumption and is convenient for adjusting the size and frequency of the capacitor, so as to solve the above-mentioned problems.

A through hole capacitor structure of a ceramic waveguide filter comprises a ceramic dielectric block and a first conducting layer arranged on the circumferential outer surface of the ceramic dielectric block; the bottom surface of the ceramic dielectric block is provided with at least two resonance grooves; a second conductive layer is arranged on the inner side wall of the resonance groove; the ceramic dielectric block is provided with a through hole between the two resonance grooves; the through hole comprises a first negative coupling groove arranged on the bottom surface of the ceramic dielectric block, a second negative coupling groove arranged on the top surface of the ceramic dielectric block and opposite to the first negative coupling groove, and a middle through hole communicated with the first negative coupling groove and the second negative coupling groove; the inner side wall of the first negative coupling groove is provided with a third conducting layer, the circumferential side wall of the middle through hole is provided with a fourth conducting layer connected with the third conducting layer, and the bottom wall of the second negative coupling groove is provided with a fifth conducting layer connected with the fourth conducting layer.

Further, the depth of the first negative coupling groove is larger than that of the resonant groove.

Further, the depth of the first negative coupling groove is twice the depth of the resonant groove.

Further, the width of the first negative coupling groove is smaller than that of the resonance groove, the width of the second negative coupling groove is larger than that of the first negative coupling groove, and the width of the middle via hole is smaller than that of the first negative coupling groove and that of the second negative coupling groove.

Further, the width of the first negative coupling slot is the resonant slot width 1/2.

Further, the resonant groove, the first negative coupling groove and the second negative coupling groove are all cylindrical in shape.

Compared with the prior art, the through hole capacitor structure of the ceramic waveguide filter comprises a ceramic dielectric block and a first conducting layer arranged on the circumferential outer surface of the ceramic dielectric block; the bottom surface of the ceramic dielectric block is provided with at least two resonance grooves; a second conductive layer is arranged on the inner side wall of the resonance groove; the ceramic dielectric block is provided with a through hole between the two resonance grooves; the through hole comprises a first negative coupling groove arranged on the bottom surface of the ceramic dielectric block, a second negative coupling groove arranged on the top surface of the ceramic dielectric block and opposite to the first negative coupling groove, and a middle through hole communicated with the first negative coupling groove and the second negative coupling groove; the inner side wall of the first negative coupling groove is provided with a third conducting layer, the circumferential side wall of the middle through hole is provided with a fourth conducting layer connected with the third conducting layer, and the bottom wall of the second negative coupling groove is provided with a fifth conducting layer connected with the fourth conducting layer. Therefore, the weight and the material can be reduced, and the size and the frequency of the capacitor can be conveniently adjusted.

Drawings

Embodiments of the invention are described below with reference to the accompanying drawings, in which:

fig. 1 is a side cross-sectional view of a via capacitor structure of a ceramic waveguide filter according to the present invention.

Fig. 2 is a partially enlarged schematic view of fig. 1.

Fig. 3 is a schematic top view of a ceramic waveguide filter via capacitor structure provided with four resonant slots.

Detailed Description

Specific embodiments of the present invention will be described in further detail below based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.

Referring to fig. 1, the via capacitor structure of the ceramic waveguide filter according to the present invention includes a ceramic dielectric block 100 and a first conductive layer 110 disposed on a circumferential outer surface of the ceramic dielectric block 100.

The bottom surface of the ceramic dielectric block 100 is formed with at least two resonant grooves, such as a first resonant groove 11 and a second resonant groove 21, which are spaced apart from each other. The first resonance groove 11 and the second resonance groove 21 have the same depth.

A second conductive layer 111 is provided on the inner side wall of the first resonance groove 11 and on the inner side wall of the second resonance groove 21.

The ceramic dielectric block 100 has a through hole 30 between the two resonant slots. The through holes 30 are used to create nulls on both sides of the dominant frequency.

Referring to fig. 2, the through hole 30 includes a first negative coupling groove 31 formed on the bottom surface of the ceramic dielectric block 100, a second negative coupling groove 32 formed on the top surface of the ceramic dielectric block 100 and opposite to the first negative coupling groove 31, and a middle via hole 33 communicating the first negative coupling groove 31 and the second negative coupling groove 32.

The depth of the first negative coupling groove 31 is greater than the depths of the first resonance groove 11 and the second resonance groove 21. Preferably, the depth of the first negative coupling groove 31 is twice the depth of the first resonance groove 11 or the second resonance groove 21.

The width of the first negative coupling groove 31 is smaller than the width of the first resonance groove 11 or the second resonance groove 21. Preferably, the width of the first negative coupling groove 31 is the width 1/2 of the first resonance groove 11 or the second resonance groove 21.

The width of the second negative coupling groove 32 is greater than the width of the first negative coupling groove 31.

The width of the intermediate via 33 is smaller than the widths of the first and second negative coupling grooves 31 and 32.

In the present embodiment, the first resonance groove 11, the second resonance groove 21, the first negative coupling groove 31, the second negative coupling groove 32, and the intermediate via hole 33 are all cylindrical in shape, and the widths thereof are all diameters.

A third conductive layer 311 is disposed on an inner sidewall (including a circumferential sidewall and a bottom wall) of the first negative coupling groove 31, a fourth conductive layer 331 connected to the third conductive layer 311 is disposed on a circumferential sidewall of the middle via hole 33, a fifth conductive layer 321 connected to the fourth conductive layer 331 is disposed on a bottom wall of the second negative coupling groove 32, and no conductive layer is disposed on a circumferential inner sidewall of the second negative coupling groove 32. This makes the air dielectric above the fifth conductive layer 321.

A left side portion of the through hole 30, integrally forming the first dielectric resonator 10; on the right side portion, the second dielectric resonator 20 is integrally formed.

And a capacitor is formed between the fifth conductive layer 321 and the second conductive layer 111, the capacitor can weaken inductive coupling, and the redundant resonance frequency of the capacitor with the structure is far from both sides of the main frequency and is not in the size range of the ceramic dielectric block 100, so that the redundant resonance is avoided from being generated at the near position of both sides of the main frequency, and the interference to the main frequency is reduced.

If the capacitance or frequency needs to be adjusted, a hanging plate may be used to scrape off the portion at the edge of the fifth conductive layer 321 or the portion at the bottom edge of the third conductive layer 311. After the fifth conductive layer 321 is partially scraped, the capacitance is reduced, and the frequency is increased; after the third conductive layer 311 is stripped, the capacitance increases and the frequency decreases. This facilitates adjustment of the capacitance size and frequency.

Referring to fig. 3, when the through-hole capacitor structure of the ceramic waveguide filter is provided with four resonant grooves 11 on the ceramic dielectric block 100, and the four resonant grooves 11 are respectively close to four corners of the ceramic dielectric block 100, the through-hole 30 is disposed between any two resonant grooves 11.

Compared with the prior art, the through hole capacitor structure of the ceramic waveguide filter comprises a ceramic dielectric block 100 and a first conducting layer 110 arranged on the circumferential outer surface of the ceramic dielectric block 100; the bottom surface of the ceramic dielectric block 100 is provided with at least two resonance grooves; a second conductive layer 111 is provided on the inner side wall of the resonance groove; the ceramic dielectric block 100 is provided with a through hole 30 between the two resonance grooves; the through hole 30 comprises a first negative coupling groove 31 arranged on the bottom surface of the ceramic dielectric block 100, a second negative coupling groove 32 arranged on the top surface of the ceramic dielectric block 100 and opposite to the first negative coupling groove 31, and a middle through hole 33 communicating the first negative coupling groove 31 and the second negative coupling groove 32; a third conductive layer 311 is disposed on an inner sidewall of the first negative coupling groove 31, a fourth conductive layer 331 connected to the third conductive layer 311 is disposed on a circumferential sidewall of the intermediate via hole 33, and a fifth conductive layer 321 connected to the fourth conductive layer 331 is disposed on a bottom wall of the second negative coupling groove 32. Therefore, the weight and the material can be reduced, and the size and the frequency of the capacitor can be conveniently adjusted.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.