阅读说明：本技术 一种太阳能电池组件的封装方法及制得的太阳能电池组件 (Packaging method of solar cell module and prepared solar cell module ) 是由 王尉 朱文凯 白云强 蔺晓东 于 2018-05-14 设计创作，主要内容包括：一种太阳能电池组件的封装方法及制得的太阳能电池组件,所述方法包括：对太阳能电池组件的面板、电池模组芯片和背板进行固定,向所述电池模组芯片与所述面板之间、所述电池模组芯片与所述背板之间注入熔融的胶粘材料,并且在所述电池模组芯片与所述面板之间、所述电池模组芯片与所述背板之间形成封装胶膜,所述封装胶膜将所述面板、所述电池模组芯片和所述背板粘结在一起。本申请的封装方法的工艺步骤简单、生产成本低、生产效率、封装合格率和自动化程度均较高,并且适用于任意形状的太阳能组件的封装。(A packaging method of a solar cell module and the prepared solar cell module are provided, the method comprises the following steps: fixing a panel, a battery module chip and a back plate of a solar battery assembly, injecting molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate, forming packaging adhesive films between the battery module chip and the panel and between the battery module chip and the back plate, and bonding the panel, the battery module chip and the back plate together through the packaging adhesive films. The packaging method is simple in process steps, low in production cost, high in production efficiency, packaging qualification rate and automation degree, and suitable for packaging of solar modules in any shapes.)

1. A method of encapsulating a solar cell module, the method comprising: fixing a panel, a battery module chip and a back plate of a solar battery assembly, injecting molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate, forming packaging adhesive films between the battery module chip and the panel and between the battery module chip and the back plate, and bonding the panel, the battery module chip and the back plate together through the packaging adhesive films.

2. The method according to claim 1, wherein the panel, the battery module chip and the back plate of the solar cell module are fixed by a fixing tool, the fixing tool is an injection mold, and the shape of one side of the injection mold is matched with the shape of the corresponding side of the panel, the battery module chip or the back plate; the method for fixing the panel, the battery module chip and the back plate of the solar battery component comprises the following steps: and attaching the injection mold to the panel, the battery module chip or the back plate.

3. the method as claimed in claim 2, wherein the thermal conductivity of the injection mold is 121-.

4. the method according to claim 1, wherein the injection molding method is used to inject the melted adhesive material between the battery module chip and the face plate and between the battery module chip and the back plate.

5. The method of claim 1, further comprising: and (3) when the molten adhesive material is injected, adopting a nondestructive detector to detect whether the package is qualified on line.

6. The method of any of claims 1-5, wherein the step of injecting the molten tacky material is: and applying pressure to the molten adhesive material to enable the molten adhesive material to be injected between the battery module chip and the panel and between the battery module chip and the back plate.

7. The method of claim 6, wherein the molten tacky material is injected by an injection molding machine having an injection pressure of 0.5-10 Mpa.

8. The method according to any one of claims 1-5, wherein the step of injecting the molten mastic material is performed at a temperature of 25-200 ℃.

9. The method according to claim 8, wherein the melted adhesive material is injected on a heating stage having a heating function, and the heating stage is heated to 25-200 ℃.

10. The method according to any one of claims 1-5, wherein the glueing material is melted and the melted glueing material is injected using a heatable injection moulding machine.

11. A solar cell module prepared according to the method of any one of claims 1-10.

Technical Field

The present application relates to, but not limited to, the field of solar technologies, and in particular, but not limited to, a method for encapsulating a solar cell module and a solar cell module manufactured by the same.

Background

At present, the conventional solar cell module is a planar module, which is mainly applied to a planar region, and thus the application range is limited. Along with the popularization of the application of the solar cell module, the market puts forward a demand on the solar cell module with the special-shaped curved surface, and the solar cell module with the special-shaped curved surface can be particularly applied to automobile roofs, photovoltaic roof tiles and various curved surface building curtain walls.

The packaging quality directly affects the service life of the solar cell module, so that the packaging process of the solar cell module is strictly controlled. At present, a plane component is generally packaged by adopting a plane heating plate and a vacuum laminating mode, and the packaging process cannot be applied to a curved surface component; the lamination packaging process of the curved solar cell module comprises the steps of curved heating plate lamination packaging, vacuum bag-high pressure kettle lamination packaging and peripheral glue sealing-high pressure kettle lamination packaging. The laminating and packaging process of the curved surface heating plate comprises the following steps of placing a curved surface assembly in a specific curved surface heating plate mold for laminating and packaging; the vacuum bag-high pressure kettle lamination packaging process comprises the steps of firstly placing different curved surface components in a vacuum bag, and then placing the vacuum bag which is vacuumized in a high pressure kettle for lamination packaging; the periphery gluing and sealing-high-pressure kettle laminating and packaging process glues and seals the peripheries of the curved surface panel glass and the back plate glass through the vacuum rubber ring, vacuumizes the closed space, and then places the closed space in a high-pressure kettle for laminating and packaging.

The lamination packaging process of the curved surface heating plate has the defects that the curved surface heating plate can only laminate curved surface components with specific curvature radius, and other special-shaped curved surface components cannot be processed. Although the lamination problem of the solar cell module with multiple curvature radiuses is solved by the vacuum bag-autoclave lamination packaging and peripheral glue sealing-autoclave lamination packaging process, the process is complex, most of the process steps are manual, the automation degree is low, and the production cost is high. In addition, the existing lamination packaging process has the problem that whether the package is qualified or not cannot be judged in real time.

Disclosure of Invention

the following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

The application provides a solar cell module packaging method which is suitable for various different solar cell modules and has the advantages of simple process, high automation degree and high production efficiency, and a solar cell module manufactured by the packaging method.

Specifically, the application provides a packaging method of a solar cell module, which comprises the following steps: fixing a panel, a battery module chip and a back plate of a solar battery assembly, injecting molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate, forming packaging adhesive films between the battery module chip and the panel and between the battery module chip and the back plate, and bonding the panel, the battery module chip and the back plate together through the packaging adhesive films.

In some embodiments, a fixing tool may be used to fix the panel, the battery module chip, and the back plate of the solar battery module, and the fixing tool may be an injection mold, and a shape of one side of the injection mold matches a shape of a corresponding side of the panel, the battery module chip, or the back plate; the method for fixing the panel, the battery module chip and the back plate of the solar battery component comprises the following steps: and attaching the injection mold to the panel, the battery module chip or the back plate.

In some embodiments, the thermal conductivity of the injection mold may be 121-.

In some embodiments, the injection mold may be made of any one or more materials selected from the group consisting of aluminum alloy, pure aluminum, cast aluminum, copper alloy, and pure copper.

in some embodiments, an injection molding method may be used to inject a molten adhesive material between the battery module chip and the face plate and between the battery module chip and the back plate.

In some embodiments, the step of injecting the melted adhesive material between the battery module chip and the face plate and between the battery module chip and the back plate may be:

injecting a molten adhesive material between the battery module chip and the panel, and then injecting a molten adhesive material between the battery module chip and the back plate; or

Injecting a molten adhesive material between the battery module chip and the back plate, and then injecting a molten adhesive material between the battery module chip and the panel; or

and simultaneously injecting molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate.

In some embodiments, the method may further comprise: and (3) when the molten adhesive material is injected, adopting a nondestructive detector to detect whether the package is qualified on line.

In some embodiments, the step of injecting the molten tacky material may be: and applying pressure to the molten adhesive material to enable the molten adhesive material to be injected between the battery module chip and the panel and between the battery module chip and the back plate.

in some embodiments, the molten mastic material may be injected through an injection molding machine, which may have an injection pressure of 0.5 to 10Mpa, so that a pressure of 0.5 to 10Mpa may be applied to the molten mastic material.

In some embodiments, the step of injecting the molten tacky material may be performed at a temperature of 25-200 ℃.

In some embodiments, the melted adhesive material may be injected on a heating stage having a heating function, and the heating stage is heated to 25-200 ℃.

in some embodiments, the tacky material may be melted and injected using a heatable injection molding machine.

In some embodiments, the heating temperature of the heatable injection molding machine may be 25 to 500 ℃.

In some embodiments, the distance between the battery module chip and the panel may be 0.05-1mm, thereby forming a packaging adhesive film having a thickness of 0.05-1mm between the battery module chip and the panel.

In some embodiments, the distance between the battery module chip and the back plate may be 0.05-1mm, thereby forming an encapsulation adhesive film having a thickness of 0.05-1mm between the battery module chip and the back plate.

In some embodiments, the battery module chip may be selected from any one of an amorphous silicon chip, an amorphous silicon/amorphous silicon laminate, an amorphous silicon/amorphous silicon germanium laminate, an amorphous silicon/microcrystalline silicon laminate, a cadmium sulfide chip, a cadmium telluride chip, a copper indium selenide chip, a copper indium sulfide chip, a copper indium gallium selenide chip, a copper zinc tin sulfide chip, a gallium arsenide chip, a polymer solar cell chip, a dye sensitized thin film solar cell chip, and a perovskite solar cell chip.

in some embodiments, the panel may be selected from any one or more of a tempered glass, an ethylene-tetrafluoroethylene copolymer (ETFE) water-blocking front film, an ethylene chlorotrifluoroethylene copolymer (ECTFE) water-blocking front film, and a 3M flexible water-blocking front film.

In some embodiments, the back sheet may be selected from any one or more of a tempered glass, a polyethylene terephthalate (PET) back sheet, a polyvinyl fluoride composite film TPT (structure of polyvinyl fluoride PVF + PET + polyvinyl fluoride PVF) back sheet, a polyvinyl fluoride composite film TPE (structure of PVF + PET + EVA/PE) back sheet, and an aluminum-containing back sheet.

In some embodiments, the adhesive material may be selected from any one or more of a copolymer of ethylene-octene (POE), ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), and a copolymer of ethylene and octene (TPO), among others.

It should be understood that the packaging methods provided herein are not only applicable to the specific battery module chips, face plates, back plates, and adhesive materials listed above. The battery module chip, the face plate, the back plate and the adhesive material known in the art can be packaged by the packaging method of the present application, and the specific materials listed above do not limit the present application in any form or substantially.

In some embodiments, the solar cell module may be a planar module, a curved module, or a profiled module.

the application also provides a solar cell module prepared by the packaging method of the solar cell module.

The packaging method of the solar module obtains the following beneficial effects:

1. the injection molding of the adhesive material replaces the steps of laying and laminating the packaging adhesive film of the existing method, thereby not only reducing the production cost of the packaging adhesive film, but also simplifying the process steps and improving the production efficiency and the automation degree.

2. The product is subjected to online detection by adopting a nondestructive testing technology, whether the product is qualified after injection molding can be observed in real time, and the injection molding process is improved according to a detection result, so that the qualification rate of the product is greatly improved, and the production efficiency is improved to a certain extent.

3. The packaging method of the solar module is suitable for packaging the solar module with any shape, comprises the plane module, the curved surface module and the special-shaped module, is not limited by the curvature of the module, and is wide in application range.

4. The packaging method of the solar module is suitable for packaging any battery module chip, panel, back plate and adhesive material, and specific packaging process parameters can be adjusted according to specific selection of the battery module chip, the panel, the back plate and the adhesive material.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.

fig. 1 is a sectional view of a structure in which a panel and a battery module chip are fixed using an injection mold according to example 1 of the present application.

fig. 2 is a sectional view of a structure in which a back plate and a module formed of a battery module chip and a face plate are fixed using an injection mold according to example 1 of the present application.

Fig. 3 is a diagram showing the positional relationship between the injection port and the corresponding overflow port.

Fig. 4 is a process flow diagram of a packaging method according to embodiment 2 of the present application.

In the figure: 1. a first injection mold; 2. a battery module chip; 3. a second injection mold; 4. a panel; 5. a first injection port; 6. a third injection mold; 7. a back plate; 8. a fourth injection mold; 9. a module formed by a battery module chip and a panel; 10. a second injection port; 11. a first overflow port.

Detailed Description

To make the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

The embodiment of the application provides a packaging method of a solar cell module, which comprises the following steps: fixing a panel, a battery module chip and a back plate of a solar battery assembly, injecting molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate, forming packaging adhesive films between the battery module chip and the panel and between the battery module chip and the back plate, and bonding the panel, the battery module chip and the back plate together through the packaging adhesive films.

In the packaging method of the embodiment, a packaging adhesive film is formed between the battery module chip and the panel and the back plate by injecting a molten adhesive material. The packaging method is suitable for packaging curved surface components, special-shaped components or plane components. When the packaging method is used for a curved surface assembly or a special-shaped assembly, the packaging method replaces the steps of packaging adhesive film laying and laminating of the existing method by injecting the adhesive material, so that the production cost of the packaging adhesive film is reduced, the process steps are simplified, the production efficiency is improved, and the automatic production can be realized. When the packaging method is used for the planar assembly, the process steps can be simplified, and the production efficiency can be improved.

The panel, the battery module chip and the back plate of the solar battery assembly can be fixed by a fixing tool, the fixing tool can be an injection mold, and the shape of one side of the injection mold is matched with the shape of the corresponding side of the panel, the battery module chip or the back plate; the method for fixing the panel, the battery module chip and the back plate of the solar battery component comprises the following steps: and attaching the injection mold to the panel, the battery module chip or the back plate. During packaging, the injection mold is attached to the panel, the battery module chip or the back plate, so that the panel, the battery module chip or the back plate can be clamped and fixed at a desired position.

Wherein, the thermal conductivity coefficient of the injection mold is relatively large and can be 121-; the injection mold may be made of any one or more materials selected from the group consisting of aluminum alloy, pure aluminum, cast aluminum, copper alloy, and pure copper.

the injection molding method can be adopted to inject molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate.

The step of injecting the molten adhesive material between the battery module chip and the panel and between the battery module chip and the back plate may be:

Injecting a molten adhesive material between the battery module chip and the panel, and then injecting a molten adhesive material between the battery module chip and the back plate; alternatively, the first and second electrodes may be,

Injecting a molten adhesive material between the battery module chip and the back plate, and then injecting a molten adhesive material between the battery module chip and the panel; alternatively, the first and second electrodes may be,

And simultaneously injecting molten adhesive materials between the battery module chip and the panel and between the battery module chip and the back plate.

When molten adhesive material is injected between the battery module chip and the panel and between the battery module chip and the back plate, the packaging speed can be increased, but a fixing tool is required to firmly fix the battery module chip, so that the battery module chip is prevented from moving between the panel and the back plate.

The method of the embodiment of the application may further include: and (3) when the molten adhesive material is injected, adopting a nondestructive detector to detect whether the package is qualified on line. For example, whether the adhesive material covers the entire surface of the battery module chip, whether the adhesive material is uniformly distributed between the battery module chip and the face plate or between the battery module chip and the back plate, whether air bubbles are present in the injection-molded adhesive material, the number and size of the air bubbles, and the like. When a packaging failure is detected, the injection molding process in the packaging method can be improved in real time according to the detection result, for example, when air bubbles exist in the injected adhesive material, the air bubbles existing in the adhesive material can be discharged by adjusting the injection pressure of the injection molding machine in real time. By adopting the scheme, the qualified rate of injection molding can be improved, and compared with a mode of detecting the qualified rate after the encapsulation is finished, the online detection scheme of the embodiment of the application improves the production efficiency.

And the step of injecting the molten adhesive material is to apply pressure to the molten adhesive material so that the molten adhesive material is injected between the battery module chip and the face plate and between the battery module chip and the back plate. When pressure is applied to the molten adhesive material, the molten adhesive material may be caused to flow between the battery module chip and the face plate, and between the battery module chip and the back plate, thereby increasing the packaging rate.

Wherein the molten mastic material may be injected through an injection molding machine, the injection pressure of which may be 0.5-10 Mpa.

Wherein the step of injecting the melted adhesive material may be performed at a temperature of 25-200 ℃. Although the adhesive material is in a molten state before being injected, if the temperature of the battery module core, the panel and the back plate is low, the fluidity of the molten adhesive material is affected, and therefore, the embodiment of the application selects to inject the molten adhesive material at the temperature of 25-200 ℃ to ensure the fluidity of the molten adhesive material, so that a uniform packaging adhesive film is formed.

Wherein the melted adhesive material can be injected on a heating table with a heating function and the heating table is heated to 25-200 ℃.

Wherein the melting of the adhesive material may be performed in a heatable injection molding machine, the heating temperature of which may be 25-500 ℃. When the adhesive material is melted in the heatable injection molding machine, the steps of melting the adhesive material and transferring the adhesive material to the injection molding machine are omitted, extra equipment for melting the adhesive material is omitted, and the packaging process and equipment investment are simplified.

the distance between the battery module chip and the panel can be 0.05-1mm, so that a packaging adhesive film with the thickness of 0.05-1mm is formed between the battery module chip and the panel; the distance between the battery module chip and the back plate can be 0.05-1mm, so that a packaging adhesive film with the thickness of 0.05-1mm is formed between the battery module chip and the back plate. The thickness of the packaging adhesive film adopted by the existing packaging method is 0.2-2mm, so that the thickness of the packaging adhesive film can be reduced by the packaging method provided by the embodiment of the application, and the using amount of adhesive materials is reduced.

The battery module chip can be selected from any one of an amorphous silicon chip, an amorphous silicon/amorphous silicon lamination, an amorphous silicon/amorphous silicon germanium lamination, an amorphous silicon/microcrystalline silicon lamination, a cadmium sulfide chip, a cadmium telluride chip, a copper indium selenide chip, a copper indium sulfide chip, a copper indium gallium selenide chip, a copper zinc tin sulfide chip, a gallium arsenide chip, a polymer solar battery chip, a dye sensitized thin-film solar battery chip and a perovskite solar battery chip.

Wherein the panel may be selected from any one or more of tempered glass, ETFE water-blocking front film, ECTFE water-blocking front film, and 3M flexible water-blocking film.

Wherein the back sheet can be selected from any one or more of toughened glass, a PET back sheet, a TPT back sheet, a TPE back sheet and an aluminum-containing back sheet.

Wherein the adhesive material may be selected from any one or more of POE, EVA, PVB and TPO.

The following are specific examples of the method for encapsulating a solar cell module of the present application.