阅读说明：本技术 一种基于3d打印的热电制冷片及其制造方法 (thermoelectric refrigerating piece based on 3D printing and manufacturing method thereof ) 是由 熊新红 邓建恩 水贾鑫 曹立才 宗子凯 卢文良 朱子翰 于 2019-02-26 设计创作，主要内容包括：本发明公开了一种基于3D打印的热电制冷片及其制造方法,包括至少一对通过导电材料连接的热电偶对和基板,热电偶对分布于基板上,所组成的热电偶对包括两个热电臂,同一热电偶对中两个热电臂之间连接有第一导电薄膜,第一导电薄膜与热电臂的冷端贴合,热电臂的热端与基板连接；同一热电偶对中的一个热电臂为N型热电臂,另一个热电臂为P型热电臂；热电臂的冷端面积小于热电臂的热端面积。提高了制冷片的制冷效果,有利于半导体制冷片的应用,提高了制冷片的性能,可与任意规则形状贴合,与现有半导体制冷片相比,具有制冷效率好、控温精度高、成本低、材料利用率高、适用性广的优点。(the invention discloses a thermoelectric refrigerating piece based on 3D printing and a manufacturing method thereof, and the thermoelectric refrigerating piece comprises at least one pair of thermoelectric couple pairs and a substrate which are connected through conductive materials, wherein the thermoelectric couple pairs are distributed on the substrate, each formed thermoelectric couple pair comprises two thermoelectric arms, a first conductive film is connected between the two thermoelectric arms in the same thermoelectric couple pair, the first conductive film is attached to the cold ends of the thermoelectric arms, and the hot ends of the thermoelectric arms are connected with the substrate; one thermoelectric arm in the same thermocouple pair is an N-type thermoelectric arm, and the other thermoelectric arm is a P-type thermoelectric arm; the area of the cold end of the thermoelectric arm is smaller than that of the hot end of the thermoelectric arm. The refrigerating effect of the refrigerating piece is improved, the semiconductor refrigerating piece is favorably applied, the performance of the refrigerating piece is improved, the refrigerating piece can be attached to any regular shape, and compared with the existing semiconductor refrigerating piece, the refrigerating piece has the advantages of good refrigerating efficiency, high temperature control precision, low cost, high material utilization rate and wide applicability.)

1. a thermoelectric refrigerating piece based on 3D printing is characterized by comprising at least one pair of thermoelectric couple pairs and a substrate, wherein the thermoelectric couple pairs are connected through a conductive material and are distributed on the substrate, each formed thermoelectric couple pair comprises two thermoelectric arms, a first conductive thin film is connected between the two thermoelectric arms in the same thermoelectric couple pair, the first conductive thin film is attached to the cold ends of the thermoelectric arms, and the hot ends of the thermoelectric arms are connected with the substrate;

one thermoelectric arm in the same thermocouple pair is an N-type thermoelectric arm, and the other thermoelectric arm is a P-type thermoelectric arm;

The area of the cold end of the thermoelectric arm is smaller than that of the hot end of the thermoelectric arm.

2. The thermoelectric cooling plate based on 3D printing of claim 1, wherein the ratio of the hot end area to the cold end area of the thermoelectric arm is 1.2-1.4.

3. the 3D printing-based thermoelectric cooling plate of claim 1, wherein the thermoelectric materials of the N-type thermoelectric legs and the P-type thermoelectric legs comprise bismuth telluride-based, silicon or silicon-germanium alloy.

4. the thermoelectric cooling plate based on 3D printing of claim 1, wherein the P-type thermoelectric arms and the N-type thermoelectric arms are prepared on the same substrate by laser sintering.

5. The thermoelectric cooling plate based on 3D printing according to claim 1, wherein the outer side of the first conductive film is painted with heat-resistant insulating paint.

6. The thermoelectric cooling plate based on 3D printing as claimed in claim 1, wherein a second conductive film is laid on the substrate, and the hot end of the thermoelectric arm is connected with the substrate through the second conductive film.

7. Manufacturing method for manufacturing a thermoelectric cooling plate based on 3D printing according to claim 1, characterized in that it comprises the following steps:

1) Preparing thermoelectric material powder of a thermoelectric arm;

2) respectively carrying out modeling design on an N-type thermoelectric arm and a P-type thermoelectric arm of a refrigerating piece to be prepared, and simultaneously determining the shapes of the two thermoelectric arms;

3) Converting the model into a processing program code and guiding the processing program code into a system of a selective laser sintering rapid forming machine;

4) marking a positioning reference on the substrate, and simultaneously carrying out pretreatment;

5) Placing the substrate into a forming cylinder of a selective laser sintering forming machine, and positioning the substrate through the marked positioning reference;

6) putting the N-type powder and/or the P-type powder into a selective laser sintering forming machine, and performing laser sintering at corresponding positions on the substrate to form corresponding laminates;

7) when all the laminated layers in the forming cylinder are sintered and overlapped, slowly cooling to room temperature in the forming cylinder to form a thermoelectric arm;

8) repeating the steps 6) -7) until all the thermoelectric arms are manufactured at the corresponding positions of the substrate;

9) coating a conductive adhesive on the upper layer of each thermoelectric arm, and tightly attaching the conductive adhesive to the first conductive film;

10) and coating insulating heat-resistant paint on the first conductive film, and cutting and separating the first conductive film according to a drawing, so that all the thermocouple pairs are connected in series or in parallel to form a designed loop, and finally obtaining a finished product.

8. The manufacturing method according to claim 7, wherein in the step 4), the second conductive film is attached to the substrate by applying an insulating and high temperature resistant adhesive.

9. The method according to claim 6 or 7, wherein the second conductive film is a copper foil.

Technical Field

the invention relates to the technical field of semiconductor devices, in particular to a thermoelectric cooling plate based on 3D printing and a manufacturing method thereof.

Background

The semiconductor refrigeration is also called thermoelectric refrigeration, mainly is the application of the reverse effect Peltier effect of the Seebeck effect in the aspect of refrigeration technology, has the advantages of small volume, low noise, no moving parts, convenient regulation and control and the like, and is a novel refrigeration mode.

At present, the commercial Bi2Te 3-based alloy is mainly prepared by a zone-melting method, but the zone-melting method obtains anisotropic materials, the grain size is large, the mechanical property is poor, the processing stability and the use reliability of the Bi2Te 3-based thermoelectric device are influenced, and the alloy with complex geometric characteristics is difficult to process.

The adopted 3D printing technology is particularly suitable for forming complex parts, so that the structure of the semiconductor can be improved, and the transient super-cooling performance of the semiconductor is enhanced; and the use of semiconductor materials can be reduced, and the cross section area of the cold end is kept the same as that of the traditional semiconductor refrigerator, and meanwhile, the refrigeration effect of the semiconductor refrigerator is improved.

Disclosure of Invention

The invention aims to solve the technical problem that in order to overcome the defects in the prior art, the invention provides the thermoelectric refrigerating sheet based on 3D printing and the manufacturing method thereof, so that the refrigerating effect of the refrigerating sheet is improved, the application of the semiconductor refrigerating sheet is facilitated, and the performance of the refrigerating sheet is improved.

the technical scheme adopted by the invention for solving the technical problems is as follows:

A thermoelectric refrigeration piece based on 3D printing comprises at least one pair of thermoelectric couple pairs and a substrate, wherein the thermoelectric couple pairs are connected through a conductive material and are distributed on the substrate, each formed thermoelectric couple pair comprises two thermoelectric arms, a first conductive thin film is connected between the two thermoelectric arms in the same thermoelectric couple pair, the first conductive thin film is attached to the cold ends of the thermoelectric arms, and the hot ends of the thermoelectric arms are connected with the substrate;

One thermoelectric arm in the same thermocouple pair is an N-type thermoelectric arm, and the other thermoelectric arm is a P-type thermoelectric arm;

the area of the cold end of the thermoelectric arm is smaller than that of the hot end of the thermoelectric arm.

according to the technical scheme, the ratio of the area of the hot end of the thermoelectric arm to the area of the cold end of the thermoelectric arm is 1.2-1.4.

according to the technical scheme, the thermoelectric materials of the N-type thermoelectric arm and the P-type thermoelectric arm comprise bismuth telluride base, silicon or silicon-germanium alloy.

according to the technical scheme, the P-type thermoelectric arm and the N-type thermoelectric arm are prepared on the same substrate through laser sintering.

According to the technical scheme, the heat-resistant insulating paint is painted on the outer side of the first conductive film.

According to the technical scheme, the second conductive film is paved on the substrate, and the hot end of the thermoelectric arm is connected with the substrate through the second conductive film.

The manufacturing method for manufacturing the thermoelectric refrigerating sheet based on 3D printing comprises the following steps:

1) preparing thermoelectric material powder of a thermoelectric arm;

2) Respectively carrying out modeling design on an N-type thermoelectric arm and a P-type thermoelectric arm of a refrigerating piece to be prepared, and simultaneously determining the shapes of the two thermoelectric arms;

3) Converting the model into a processing program code and guiding the processing program code into a system of a selective laser sintering rapid forming machine;

4) Marking a positioning reference on the substrate, and simultaneously carrying out pretreatment;

5) placing the substrate into a forming cylinder of a selective laser sintering forming machine, and positioning the substrate through the marked positioning reference;

6) putting the N-type powder and/or the P-type powder into a selective laser sintering forming machine, and performing laser sintering at corresponding positions on the substrate to form corresponding laminates;

7) When all the laminated layers in the forming cylinder are sintered and overlapped, slowly cooling to room temperature in the forming cylinder to form a thermoelectric arm;

8) Repeating the steps 6) -7) until all the thermoelectric arms are manufactured at the corresponding positions of the substrate;

9) Coating a conductive adhesive on the upper layer of each thermoelectric arm, and tightly attaching the conductive adhesive to the first conductive film;

10) And coating insulating heat-resistant paint on the first conductive film, and cutting and separating the first conductive film according to a drawing, so that all the thermocouple pairs are connected in series or in parallel to form a designed loop, and finally obtaining a finished product.

according to the technical scheme, in the step 4), the second conductive film is paved and connected on the substrate through the insulating high-temperature-resistant adhesive.

according to the technical scheme, the second conductive film is copper foil paper.

the invention has the following beneficial effects:

1. The geometric characteristics of thermoelectric arm are variable cross-section structure, and hot junction area is great than cold junction area, and the improvement of cold junction area of contact has simultaneously improved the refrigeration effect of refrigeration piece, is favorable to the application of semiconductor refrigeration piece, has improved the performance of refrigeration piece, can laminate with arbitrary regular shape, compares with current semiconductor refrigeration piece, has that refrigeration efficiency is good, the temperature control precision is high, with low costs, material utilization is high, extensive applicability's advantage.

2. the thermoelectric arm is prepared by adopting a selective laser sintering technology, can be processed into a complex shape, improves the utilization rate of thermoelectric material raw materials, reduces the cost, improves the precision, is favorable for popularization and application of semiconductor refrigerating sheets, and overcomes the defects of the traditional thermoelectric material processing.

Drawings

Fig. 1 is a schematic structural diagram of a thermoelectric cooling plate based on 3D printing in an embodiment of the present invention;

FIG. 2 is a schematic diagram of a thermoelectric leg according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a substrate according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of the operation of a thermoelectric cooling plate based on 3D printing in the embodiment of the present invention;

FIG. 5 is a schematic flow chart of a manufacturing method of a thermoelectric cooling plate based on 3D printing in the embodiment of the invention;

In the figure, 1-N type thermoelectric arm, 2-P type thermoelectric arm, 3-substrate, 4-first conductive film, 5-hot end, 6-cold end, 7-positioning reference, 8-second conductive film, 9-refrigeration object.

Detailed Description

the present invention will be described in detail below with reference to the accompanying drawings and examples.

referring to fig. 1 to 5, a thermoelectric cooling plate based on 3D printing in an embodiment of the present invention includes at least one pair of thermocouple pairs and a substrate 3 connected by a conductive material, the thermocouple pairs are distributed on the substrate 3, the formed thermocouple pair includes two thermoelectric arms, a first conductive thin film 4 is connected between the two thermoelectric arms in the same thermocouple pair, the first conductive thin film 4 is attached to a cold end 6 of the thermoelectric arms, the cold end 6 of the thermoelectric arms is closely attached to a desired cooling object 9 by the first conductive thin film 4, and the hot end 5 of the thermoelectric arms is connected to the substrate 3;

One thermoelectric arm in the same thermocouple pair is an N-type thermoelectric arm 1, and the other thermoelectric arm is a P-type thermoelectric arm 2.

Further, the area of the cold side 6 of the thermoelectric legs is smaller than the area of the hot side 5 of the thermoelectric legs.

Furthermore, the ratio of the area of the hot end 5 of the thermoelectric arm to the area of the cold end 6 of the thermoelectric arm is 1.2-1.4.

Further, the ratio of the area of the hot end 5 of the thermoelectric arm to the area of the cold end 6 is about 1.304, and the geometry of the cold end 6 is consistent with the shape of the surface of the attached object.

Further, the thermoelectric materials of the N-type thermoelectric legs 1 and the P-type thermoelectric legs 2 include bismuth telluride base, silicon or silicon germanium alloy.

Further, the P-type thermoelectric arm 2 and the N-type thermoelectric arm 1 are prepared on the same substrate 3 by laser sintering.

furthermore, the P-type thermoelectric arm 2 and the N-type thermoelectric arm 1 are respectively prepared on the same substrate 3 by adopting a selective laser sintering technology, a conductive film with a certain thickness and a certain distribution rule is arranged on the substrate 3, the two thermoelectric arms are prepared by taking the substrate 3 as a reference position basis, the two prepared thermoelectric arms have certain position characteristics, and finally the two thermoelectric arms are connected with each other regularly.

Further, the outer side of the first conductive film 4 is painted with heat-resistant insulating paint; the unnecessary first conductive film 4 is disconnected as required, the unnecessary connection of the first conductive film 4 is separated, and the first conductive film is tightly attached to the desired refrigeration article 9.

Furthermore, a second conductive film 8 is laid on the substrate 3, and the hot end 5 of the thermoelectric arm is connected with the substrate 3 through the second conductive film 8.

Further, the substrate 3 is an insulating high-temperature-resistant substrate 3.

the manufacturing method for manufacturing the thermoelectric refrigerating sheet based on 3D printing comprises the following steps:

1) Preparing thermoelectric material powder of a thermoelectric arm;

2) Respectively carrying out modeling design on an N-type thermoelectric arm 1 and a P-type thermoelectric arm 2 of a refrigerating piece to be prepared, and simultaneously determining the geometric shapes of the two thermoelectric arms;

3) converting the model into a processing program code and guiding the processing program code into a system of a selective laser sintering rapid forming machine;

4) Marking a positioning benchmark 7 on the insulating high-temperature-resistant substrate 3, and simultaneously carrying out pretreatment;

5) Placing the substrate 3 into a forming cylinder of a selective laser sintering forming machine, and positioning the substrate 3 through a marked positioning benchmark 7;

6) Placing the N-type powder and/or the P-type powder into a selective laser sintering forming machine, and performing laser sintering on corresponding positions on the substrate 3 to form corresponding laminates;

7) when all the laminated layers in the forming cylinder are sintered and overlapped, slowly cooling to room temperature in the forming cylinder to form a thermoelectric arm;

8) Repeating the steps 6) -7) until all the thermoelectric arms are manufactured at the corresponding positions of the substrate 3;

9) Coating a conductive adhesive on the upper layer of each thermoelectric arm, and tightly attaching the conductive adhesive to the first conductive film 4;

10) And (3) coating insulating heat-resistant paint on the first conductive film 4, and cutting and separating the first conductive film 4 according to a drawing, so that all thermocouple pairs are connected in series or in parallel to form a designed loop, and finally obtaining a finished product.

further, the second conductive film 8 is connected to the substrate 3 by an insulating high-temperature adhesive.

Further, the second conductive film 8 is copper foil paper.

further, the format of the machining program code is STL format, which is an abbreviation of stereolithography, and a filename suffix of the machining program code.

the working principle of the invention is as follows:

The invention provides a thermoelectric refrigerating sheet based on 3D printing, which is shown as a basic structure of one embodiment shown in figure 1 and comprises a plurality of pairs of thermocouples connected through a conductive material. The N-type thermoelectric arm 1 and the P-type thermoelectric arm 2 are respectively prepared on a conductive film 4 of an insulating high-temperature-resistant substrate 3, the conductive film has a certain arrangement rule on the substrate 3, a hot end 5 of the thermoelectric arm is connected with the conductive film, a cold end 6 is attached to the conductive film, heat-resistant insulating paint is coated on the outer side of the conductive film of the cold end 6 after attachment, unnecessary connection of the conductive film is separated, thermocouples are connected in series, and a loop is formed.

as a further preferred embodiment, as shown in fig. 2, the thermoelectric arm has geometric features of large area of the hot end 5 and small area of the cold end 6, for example, a tube-like structure is used for refrigeration, the cold end 6 is arc-like, the cold end 6 can be tightly attached to the tube wall when in use, the ratio of the area of the hot end 5 to the area of the cold end 6 is about 1.304, and the geometric shape of the cold end 6 is consistent with the surface shape of the attached object.

as a further preferred embodiment, as shown in fig. 3, the P-type thermoelectric arm 2 and the N-type thermoelectric arm 1 are respectively prepared on the same substrate 3 by using a selective laser sintering technique, the substrate has a conductive thin film 8 with a certain thickness and a certain distribution rule, the conductive thin film is closely attached to the hot end 5 of the thermocouple pair, and three ends of the substrate 3 are marked with positioning references 7.

As a further preferred embodiment, as shown in fig. 4, the cold end 6 is attached to a sheet of first conductive film 4, which is coated with heat-resistant insulating coating on the outside, cut as desired to form unnecessary film connections, and attached to the desired refrigeration article 9.

Further, the P-type/N-type semiconductor thermoelectric material includes, but is not limited to, bismuth telluride, silicon, or a silicon-germanium alloy.

the invention also provides a manufacturing method of the novel thermoelectric refrigerating sheet, which is described in detail below with reference to the accompanying drawings:

as shown in fig. 5, a manufacturing method includes the steps of:

1. Preparing thermoelectric material powder;

2. respectively carrying out modeling design on N-type and P-type thermoelectric arms 2 of a refrigerating piece to be prepared, deriving drawings, and simultaneously determining the geometric shapes of the two thermoelectric arms;

3. converting the model into an STL format and introducing the STL format into a selective laser sintering rapid prototyping system;

4. cutting copper foil paper according to the requirement of a design drawing, marking on the insulating high-temperature-resistant substrate 3, and connecting the cut copper foil paper on the substrate 3 by using an insulating high-temperature-resistant adhesive according to the drawing;

5. Placing the substrate 3 into a forming cylinder of a selective laser sintering forming machine, positioning by marking, placing N/P type powder into the selective laser sintering forming machine for laser sintering, when all the laminated layers are sintered and overlapped, slowly cooling the laminated layers to room temperature in the forming cylinder, and then placing the laminated layers into the selective laser sintering forming machine with another type of powder to continuously form another type of thermoelectric arm;

6. after the heat treatment, cooling to room temperature;

7. and coating a conductive adhesive on the obtained upper layer, tightly attaching the conductive adhesive to a conductive film, coating a layer of insulating heat-resistant coating, cutting and separating the insulating heat-resistant coating according to a drawing, so that all thermocouple pairs are connected in series or in parallel to form a designed loop, and finally obtaining a finished product.

The above is only a preferred embodiment of the present invention, and certainly, the scope of the present invention should not be limited thereby, and therefore, the present invention is not limited by the scope of the claims.