阅读说明：本技术 在高腐蚀性或侵蚀性半导体加工应用中使用的陶瓷材料组件 (Ceramic material components for use in highly corrosive or erosive semiconductor processing applications ) 是由 B·埃利奥特 D·雷克斯 于 2018-03-21 设计创作，主要内容包括：相对廉价陶瓷例如氧化铝与高磨损陶瓷例如蓝宝石的表皮或覆盖物的复合组件适合于在经受高腐蚀和/或侵蚀水平的半导体加工环境中使用。复合组件的设计寿命可比以前使用的部件显著更长。复合组件可具有与铝连接在一起的陶瓷件,使得接头不易受到复合组件可能暴露的腐蚀状况的损害。(A composite assembly of a relatively inexpensive ceramic, such as alumina, and a skin or covering of a high wear ceramic, such as sapphire, is suitable for use in semiconductor processing environments that are subject to high levels of corrosion and/or erosion. The design life of the composite assembly may be significantly longer than previously used components. The composite component may have ceramic pieces joined together with aluminum so that the joint is less susceptible to corrosion conditions to which the composite component may be exposed.)