阅读说明：本技术 一种运用铜艺对超薄型花、叶类植物进行仿真的方法 (Method for simulating ultrathin flower and leaf plants by using copper process ) 是由 赵敏 赵晨 于 2019-09-25 设计创作，主要内容包括：本发明公开了一种运用铜艺对超薄型花、叶类植物进行仿真的方法,它包括以下步骤：(1)、选取植物的花或叶,将其洗净；(2)、在花或叶的背面涂覆一层定型物质；(3)、用耐火泥将涂覆了定型物质的花、叶进行包裹；(4)向耐火泥内倒入铜液,花或叶以及定型物质被蒸发从耐火泥的排气孔内排出；(5)、待铜液冷却成型后形成仿真花、叶。本发明的有益效果是采用定型物质来对薄型花或叶进行固定,并用耐火泥包裹,利用铜液的热量直接将花、叶和定型物质直接挥发,得到厚度可控的超薄的花、叶仿真产品,其特点是清晰,形状逼真,艺术表现力强。(The invention discloses a method for simulating ultrathin flower and leaf plants by using a copper process, which comprises the following steps: (1) selecting flowers or leaves of plants, and cleaning the flowers or leaves; (2) coating a layer of setting material on the back of the flower or the leaf; (3) coating the flowers and leaves coated with the shaping substances with refractory mortar; (4) pouring copper liquid into the refractory mortar, evaporating the flowers or leaves and the shaped substances, and discharging the evaporated flowers or leaves and the shaped substances from the exhaust holes of the refractory mortar; (5) and forming simulated flowers and leaves after the copper liquid is cooled and formed. The invention has the advantages that the thin flower or leaf is fixed by adopting the shaping substance, and is wrapped by the refractory clay, the flower, leaf and the shaping substance are directly volatilized by utilizing the heat of the copper liquid, and the ultrathin flower and leaf simulation product with controllable thickness is obtained, and the product has the characteristics of clearness, vivid shape and strong artistic expressive force.)

1. A method for simulating ultra-thin flower and leaf plants by using a copper process is characterized by comprising the following steps: it comprises the following steps: (1) selecting flowers or leaves of plants, and cleaning the flowers or leaves; (2) coating a layer of setting material on the back of the flower or the leaf, (3) wrapping the flower or the leaf by using refractory mortar; (4) pouring copper liquid into the refractory mortar, evaporating the flowers or leaves and the shaped substances, and discharging the evaporated flowers or leaves and the shaped substances from the exhaust holes of the refractory mortar; (5) and forming simulated flowers and leaves after the copper liquid is cooled and formed.

2. The method for simulating ultra-thin flower and leaf plants by using the copper process as claimed in claim 1, wherein the method comprises the following steps: the copper liquid comprises 59-78 wt% of copper, 2-3 wt% of lead and 19-39 wt% of zinc.

3. The method for simulating ultra-thin flower and leaf plants by using the copper process as claimed in claim 1, wherein the method comprises the following steps: the setting substance is grease/resin glue.

Technical Field

The invention relates to a method for manufacturing metal craft products, in particular to a method for simulating ultrathin flower and leaf plants by using a copper process.

Background

The copper handicraft is short for copper handicraft. The simulation of the copper artware refers to the fact that the casting process is utilized to simulate various flowers and leaves in nature and in different sizes like writing, such as various copper flowers, copper lotus leaves, copper dragonflies, copper cicadas and the like. In the prior art, copper flowers and copper leaves are generally manufactured by manual clay sculpture, and the labor cost of mould turnover and casting is higher, but the copper flowers and the copper leaves cannot be vivid, the surface texture is fuzzy, and the expressive force is not strong enough. The Chinese patent publication No. CN102845889B discloses an artistic flower with a gold and silver layer and a preparation method thereof, wherein a carrier standard sample is made of metal and non-metal materials or fresh flowers, and then a resin adhesive layer, a silver layer, a gold layer and a protective layer are sequentially made to obtain the artistic flower with the gold and silver layer. If the Chinese patent publication No. CN104757726B discloses a method for manufacturing a metal peony bud, the method for manufacturing the bud comprises the following steps: a metal plate is made into a conical cover which is placed in the petals, the conical cover is connected with the petals, and then the petals wrap the conical cover. The top of the metal peony bud shows in a cone shape in the manufacturing method of the metal peony bud, and as the Chinese patent publication No. CN101491377B discloses a simulation plant and a manufacturing method thereof, the simulation plant comprises the following components in percentage by weight: 30-70% of forming substance, 10-50% of oxidized starch, 2-10% of silicon dioxide, a proper amount of mold release agent, a proper amount of supporting framework, a proper amount of paint, 5-20% of polyurethane and 1-5% of catalyst, and the preparation method comprises the following steps: a. covering a layer of molding substance on the trunk, branch, bark, flower and leaf of natural plant or carved and copied simulation plant to manufacture a corresponding mold, and dividing the mold into two symmetrical halves after the mold is solidified; b. injecting a molding substance into one side of the mold and adding a reinforcing material; c. repeating the step b until a certain thickness is formed on the mould; d. adding a supporting framework, and repeating the step b until a preset thickness is formed; e. connecting the two sides of the mould together for curing and forming; f. spraying or smearing for coloring after demolding; g. and connecting and fixing the prefabricated leaves at preset positions. The simulation degree of the metal plant flower leaves in the patents is not high enough, the surface textures and shapes of the flower leaves are not vivid enough, and the metal plant flower leaves do not belong to the category of copper art simulation.

Disclosure of Invention

The invention aims to solve the technical problems that the existing copper art simulates flowers and leaves with thicker thickness (generally not less than 2.2 mm) and has unclear and unrealistic textures, and provides a method for simulating ultra-thin flowers and leaves by applying an innovative copper art and a formula.

The technical scheme of the invention is as follows: a method for simulating ultra-thin flower and leaf plants by using a copper process comprises the following steps: (1) selecting flowers or leaves of plants, and cleaning the flowers or leaves; (2) coating a layer of setting material on the back of the flower or the leaf; (3) wrapping the flowers and leaves coated with the shaped substances with refractory clay, and drying; (4) injecting the copper liquid into the refractory mortar, and evaporating the flowers or leaves and the shaped substances to discharge the flowers or leaves and the shaped substances from the exhaust holes on the refractory mortar; (5) and forming simulated flowers and leaves after the copper liquid is cooled and formed.

In the scheme, the copper liquid comprises 59-78 wt% of copper, 2-3 wt% of lead and 19-39 wt% of zinc.

In the above scheme, the molding substance is grease/resin glue.

The invention has the advantages that the flower and leaf are fixed or shaped by adopting the shaping substance, the flower, leaf and the shaping substance are directly volatilized by utilizing the heat of the copper liquid, and the ultrathin flower and leaf simulation model with controllable thickness is obtained, the surface texture of the ultrathin flower and leaf simulation model is very vivid, and the artistic expressive force is strong.

Detailed Description

The technical scheme in the embodiment of the invention is clearly and completely described below by combining the embodiment. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments based on the embodiments in the present invention, without any inventive work, will be apparent to those skilled in the art from the following description.