阅读说明：本技术 一种基于切削过程仿真的单晶铜微铣削力预测方法 (Single crystal copper micro-milling force prediction method based on cutting process simulation ) 是由 卢晓红 栾贻函 贾振元 侯鹏荣 薛靓 任宗金 于 2019-09-10 设计创作，主要内容包括：本发明属于微小零件精密高效加工领域,特别涉及一种基于切削过程仿真的单晶铜微铣削力预测方法。由于单晶铜材料的特殊性,本发明首先综合考虑了晶体变形运动学、晶体塑性本构关系,率相关晶体的硬化规律等因素对于微铣削单晶铜的影响；然后对本构方程的增量形式进行了推导,采用Fortran语言编写了单晶铜VUMAT用户材料子程序,将晶体塑性本构引入到有限元仿真中；最后采用ABAQUS软件对单晶铜微铣削过程进行仿真建模,实现了单晶铜微铣削力预测。本发明以有限元切削仿真为基础,实现单晶铜微铣削力的准确预测,为研究单晶铜微铣削过程提供技术支撑,提高单晶铜微铣削加工精度与效率,具有实际应用价值。(The invention belongs to the field of precise and efficient machining of micro parts, and particularly relates to a method for predicting micro milling force of single crystal copper based on cutting process simulation. Due to the particularity of the single crystal copper material, the influence of factors such as crystal deformation kinematics, crystal plasticity constitutive relation, hardening rule of rate-related crystals and the like on micro-milling single crystal copper is comprehensively considered; deducing the incremental form of the constitutive equation, compiling a single crystal copper VUMAT user material subprogram by adopting Fortran language, and introducing the crystal plasticity constitutive equation into finite element simulation; and finally, performing simulation modeling on the micro-milling process of the single crystal copper by using ABAQUS software, so as to realize the prediction of the micro-milling force of the single crystal copper. The method is based on finite element cutting simulation, realizes accurate prediction of the micro-milling force of the single crystal copper, provides technical support for researching the micro-milling process of the single crystal copper, improves the micro-milling processing precision and efficiency of the single crystal copper, and has practical application value.)

1. A single crystal copper micro-milling force prediction method based on cutting process simulation is characterized by comprising the following specific steps:

step 1: construction of a crystal deformation kinematics model

The overall deformation gradient F of the crystal is decomposed into:

F＝F_e·F_p (1)

wherein, F_eFor elastic deformation gradient, F_pA deformation gradient that is plastic;

the sliding direction is as follows:

m*^(α)＝F_em^(α) (2)

wherein m is^(α)And m^(α)Respectively is a unit vector of an alpha slip system slip direction before the crystal lattice of the crystal is distorted and a unit vector of the alpha slip system slip direction after the crystal lattice of the crystal is distorted;

normal direction of the slip plane:

n*^(α)＝(F_e ^-1)^Tn^(α) (3)

wherein n is^(α)And n^(α)Respectively is a unit normal vector of the alpha slip plane slip direction before the crystal lattice of the crystal is distorted and a unit normal vector of the alpha slip plane slip direction after the crystal lattice of the crystal is distorted;

the velocity gradient tensor L for the current state is:

wherein the content of the first and second substances,andare respectively F, F_eAnd F_pA derivative of (a); l is_eAnd L_pElastic velocity gradient tensor and plastic velocity gradient tensor, respectively;

establishing a relation between the slip shear strain and the crystal plastic deformation of each slip system:

wherein the content of the first and second substances,summing all activated slip systems for the slip shear strain rate on slip system α;

in addition, the velocity gradient tensor L can be decomposed into a symmetric part D and an asymmetric part W, D is a deformation rate tensor, and W is a rotation rate tensor; the deformation ratio tensor D and rotation ratio tensor W may be expressed in terms of elastic and plastic portions, i.e.:

L＝D+W，D＝D_e+D_p，W＝W_e+W_p (6)

wherein D is_eIs the tensor of elastic deformation ratio, D_pIs the plastic deformation rate tensor, W_eIs the elastic rotation tensor, W_pIs the plastic rotation tensor;

and satisfies the following conditions:

therefore, the expression of the deformation ratio tensor D and the rotation tensor W is as follows:

step 2: establishment of crystal plasticity constitutive relation

Determining the elastic deformation rate tensor D of the crystal lattice due to the existence of the elastic potential_eJolman rate of Couchy stressThe following relationship exists between:

wherein σ is the current Cauchy stress; i represents a unit second order tensor; l represents a set of elastic modulus tensors comprising: l is_ijkl，L_jikl，L_ijlk，L_klijHas completely symmetrical characteristics;the co-rotational stress rate on the lattice rotation axis and the co-rotational stress rate on the material rotation axisThe following relationships are provided:

wherein:

and step 3: hardening law analysis of rate-dependent crystals

Slip shear strain rate of crystal on slip system alphaBy breaking down shear stress tau_αDetermining:

wherein, willSimplified to Reference strain rate, g, representing slip system alpha_αStrength of slip system, f_αThe method is a dimensionless general function and describes the dependence relationship between strain rate and stress;

using power distribution to describe polycrystalline creep f_α(x)：

f_α(x)＝x|x|^n-1 (14)

Wherein n is a rate sensitivity index; x is a function argument;

strength g of sliding system_αThe evolution equation is determined by the following formula:

wherein the content of the first and second substances,is g_αA derivative of (a); h is_αβThe slip hardening modulus represents the hardening of the slip system by the slip shear strain in the slip system; when α ═ β, h_ααThe self-hardening modulus is the self-deformation of the same sliding system and the self-hardening; when α ≠ β, h_αβLatent hardening modulus, i.e., hardening occurring between different slip systems;is the slip shear strain rate of the crystal on the slip system beta;

description of the self-hardening modulus h by a power function_αα：

Wherein h is₀For initial hardening modulus, τ₀To initial yield stress, τ_sFor shear yield strength, γ is the slip system cumulative shear strain, where γ is expressed as follows:

wherein t is a time variable;

the latent hardening modulus was:

h_αβ＝qh(γ)(α≠β) (18)

wherein q is a constant;

slip hardening modulus in crystalline materials at three strengthening stages:

h_αβ＝qh_αα(β≠α) (20)

wherein h is_sThe hardening modulus when the material is easy to slip; gamma ray_αIs the cumulative shear strain on slip system α; gamma ray_βIs the cumulative shear strain over the slip system β; the function G is related to interactive hardening:

wherein, γ₀For the amount of slip after the interaction between slip systems reaches the peak intensity, each component f_αβIndicating a particular slip actionThe intensity value used;

and 4, step 4: incremental form derivation of constitutive models

Defining the shear strain increment delta gamma on the alpha slip system according to the rate-dependent tangent coefficient method^(α)Comprises the following steps:

wherein the content of the first and second substances,andrespectively is the shear strain at the t + delta t moment and the shear strain at the t moment;

written as a linear interpolation method:

wherein theta is an integral parameter and has a value range of [0,1 ]]；Andrespectively the shear rate at the time of t + delta t and the shear rate at the time of t;

the slip shear strain rate is a function of the resolved shear stress and the current strength, and equation (23) is subjected to a taylor expansion as follows:

as can be inferred from equations (22-24):

schmidt factor for introduction of slip systemsSum tensor

From the hardening equation of the crystal slip, the strength increment deltag of the current slip system can be known_αComprises the following steps:

then, the increase Δ τ of the shear stress_αComprises the following steps:

wherein the content of the first and second substances,andthe Schmitt tensor of each slippage system;

obtaining the co-rotation stress increment delta sigma_ijComprises the following steps:

wherein the content of the first and second substances,andthe displacement component vector on the base vector is referred to by each slip system; sigma_jk、σ_ijAnd σ_ikThe Cauchy component stress on the reference base vector of each slip system; delta epsilon_kkAnd Δ ε_ijEach slip system refers to a strain increment on the basis vector;

the shear strain increase is derived from the given strain increase:

wherein, delta_αβIs a crohnok notation;

and 5: compiling the ABAQUS/VUMAT user material subprogram, inputting the parameters obtained in the step 1-4, and constructing a crystal elastoplasticity constitutive model

A first step of reading a material parameter PROPS (n) from ABAQUS, defining an integral point serial number I and making I equal to 1; secondly, defining the number of slip coefficient groups, integral coefficients and rotation increments; calculating the normal direction of a slip plane, the slip deformation tensor, the state variable, the shear strain and the accumulated shear strain in the slip direction; calculating a slip rotation tensor, a shear strain rate and derivatives thereof; obtaining a self-latent hardening modulus; updating stress and strain; judging whether I is the serial number of the last integration point, if not, executing I +1, circulating the second step, and if so, continuously outputting downwards; finally, outputting the updated stress and strain to ABAQUS, and ending the program;

step 6: single crystal copper micro-milling force prediction obtained based on finite element method

Surveying and mapping the geometric structure of the micro milling cutter, establishing a micro milling cutter model, importing the micro milling cutter model into ABAQUS software, and setting the micro milling cutter model as a rigid body; establishing a three-dimensional processing workpiece model which is set as an elastic-plastic body; carrying out grid division on the model, wherein the grid type of the cutter model adopts R3D3 type grid, the grid type of the workpiece model adopts C3D8R, and the grids of the cutting area at the contact part of the cutter and the workpiece are locally encrypted;

in the micro-milling process, two friction types are arranged in the contact area of the chips and the front tool face, namely a bonding area and a sliding area;

the friction characteristics are expressed as follows:

τ_f＝τ_s(τ_f≥τ_s) (31)

τ_f＝μσ_n(τ_f<τ_s) (32)

wherein formula (31) represents a bonding region, formula (32) represents a sliding region, wherein τ_fIs the frictional shear force, τ_sIs the shear yield strength of the workpiece, mu is the coefficient of friction, σ_nIs the positive stress of the contact area;

judging the friction area in which the friction shear force is currently positioned according to the comparison between the friction shear force and the shear yield strength of the material;

simulating material removal by adopting a unit deletion modeling technology; to achieve cell deletion, a criterion for material removal needs to be set, and a shear strain-based criterion is used to account for anisotropy in the material removal process:

max(γ-γ_cr,γ_sl,min-γ_sl,cr)≥0，γ_sl,min＝min(γ_α)，α＝1,2...N (33)

wherein, γ_sl,crAnd gamma_crRespectively, the critical value of the shear strain on the single slip system and the accumulated shear strain on all slip systems, and monitoring the shear on the single slip system and the integral slip caused by the slip system; deleting the unit if a single system threshold or a cumulative slip threshold is reached; gamma ray_sl，minThe minimum value of the accumulated shear strain on the slip system alpha is obtained;

and (3) setting the spindle rotation speed, the feed amount of each tooth and the axial cutting depth parameters to predict the micro-milling force of the single crystal copper.

Technical Field

The invention belongs to the field of precise and efficient machining of micro parts, and particularly relates to a method for predicting micro milling force of single crystal copper based on cutting process simulation.

Technical Field

With the progress of science and technology, micro structures/parts in the fields of aerospace and the like need to meet the requirements of processing technology and special requirements, such as high-quality conductive performance. The single crystal copper has consistent crystal orientation, only one crystal grain and no crystal boundary inside, has electrical conductivity exceeding that of common metals and has good thermal, fatigue and creep properties, so that the single crystal copper can be widely applied in the fields of aerospace and the like. The micro-milling technology is an effective means for processing single crystal copper micro parts. The micro-milling technology for the micro-parts is researched, and the micro-milling technology has important significance for improving the machining precision and efficiency of the micro-parts. In the micro-milling process, micro-milling force is an important process physical parameter, and the research on the micro-milling force modeling method has an important guiding function for optimizing the micro-milling processing technology of the micro-parts and improving the processing quality.

At present, the micro-milling force modeling method mainly comprises a mechanics analysis method, a finite element simulation method, an intelligent algorithm modeling method and the like. The mechanical analysis method considers the influence of factors such as tool parameters, workpiece material yield strength and cutting conditions, but the assumption and simplification made in the modeling process can reduce the prediction precision and complicate the modeling process. The finite element simulation method saves cost, can comprehensively consider the influence of the materials of the cutter and the workpiece, but has high calculation cost and poor prediction precision. The intelligent algorithm modeling method needs a large number of test samples, and the actual machining process condition cannot be considered, so that the micro-milling force prediction precision is low. Although a plurality of micro-milling force modeling methods are available, due to the anisotropy of the single crystal copper material, the micro-milling processing mechanism of the single crystal copper with different crystal orientations is different, and a single crystal copper micro-milling force prediction method for simulating the cutting process is still lacked at present.

Ruxiahong et al propose a micro-milling force modeling method based on a tool wear effect in a micro-milling force modeling method based on a tool wear effect. And (3) establishing a micro-milling three-dimensional simulation model by using DEFORM finite element software. A Johnson-Cook material constitutive model is adopted to represent material properties, and a cutter abrasion effect is introduced into a micro-milling force modeling process, so that accurate prediction of the model on the micro-milling force is achieved, and the robustness of the model is improved. However, the literature has not conducted any studies on anisotropic materials such as single crystal copper.

Although a plurality of micro-milling force modeling methods are available, due to the anisotropy of the single crystal copper material, the micro-milling processing mechanism of the single crystal copper with different crystal orientations is different, and a single crystal copper micro-milling force prediction method for simulating the cutting process is still lacked at present.

Disclosure of Invention

In order to solve the problems, the invention provides a single crystal copper micro-milling force prediction method based on cutting process simulation. Based on finite element cutting simulation, accurate prediction of the micro-milling force of the single crystal copper is realized, technical support is provided for the micro-milling process of the single crystal copper, the micro-milling precision and efficiency of the single crystal copper are improved, and the method has practical application value.

The technical scheme adopted by the invention is as follows:

a single crystal copper micro-milling force prediction method based on cutting process simulation firstly comprehensively considers the influence of factors such as crystal deformation kinematics, crystal plasticity constitutive relation and rate-related crystal hardening rule on micro-milling single crystal copper due to the particularity of a single crystal copper material; deducing the incremental form of the constitutive equation, compiling a single crystal copper VUMAT user material subprogram by adopting Fortran language, and introducing the crystal plasticity constitutive equation into finite element simulation; finally, performing simulation modeling on the micro-milling process of the single crystal copper by adopting ABAQUS software to realize the prediction of the micro-milling force of the single crystal copper, wherein the method comprises the following specific steps:

step 1: construction of a crystal deformation kinematics model

The theory of crystal plasticity states that the deformation of a crystal is composed of lattice distortion and dislocation slip. Where lattice distortion can be described by the elastic part of continuous media mechanics, dislocation glide can be represented by continuous media mechanics. As shown in fig. 1, the overall deformation gradient F of the crystal is decomposed into:

F＝F_e·F_p (1)

wherein, F_eFor elastic deformation gradient, F_pIs a plastic deformation gradient.

The sliding direction is as follows:

m*^(α)＝F_em^(α) (2)

wherein m is^(α)And m^(α)The unit vector of the alpha-slip system slip direction before the crystal lattice is distorted and the unit vector of the alpha-slip system slip direction after the crystal lattice is distorted are respectively provided.

Normal direction of the slip plane:

n*^(α)＝(F_e ^-1)^Tn^(α) (3)

wherein n is^(α)And n^(α)The unit normal vector of the alpha-th slip plane slip direction before the crystal lattice is distorted and the unit normal vector of the alpha-th slip plane slip direction after the crystal lattice is distorted are provided.

The velocity gradient tensor L for the current state is:

wherein the content of the first and second substances,andare respectively F, F_eAnd F_pA derivative of (a); l is_eAnd L_pRespectively an elastic velocity gradient tensor and a plastic velocity gradient tensor.

Establishing a relation between the slip shear strain and the crystal plastic deformation of each slip system:

wherein the content of the first and second substances,for the slip shear strain rate on slip series α, all activated slip series are summed.

In addition, the velocity gradient tensor L can be decomposed into a symmetrical part D and an asymmetrical part W, wherein D is a deformation rate tensor, and W is a rotation rate tensor; the deformation ratio tensor D and rotation ratio tensor W may also be expressed in terms of elastic and plastic portions, i.e.:

L＝D+W，D＝D_e+D_p，W＝W_e+W_p (6)

wherein D is_eIs the tensor of elastic deformation ratio, D_pIs the plastic deformation rate tensor, W_eIs the elastic rotation tensor, W_pIs the plastic rotation tensor.

And satisfies the following conditions:

therefore, the expression of the deformation ratio tensor D and the rotation tensor W is as follows:

these formulas of crystal deformation relate the slip shear rate in crystal deformation to the macroscopic deformation rate.

Step 2: establishment of crystal plasticity constitutive relation

Due to the existence of the elastic potential, the tensor D of the elastic deformation rate of the crystal lattice is determined_eJolman rate of Couchy stressThe following relationship exists between:

wherein σ is the current Cauchy stress; i represents a unit second order tensor; l represents a set of elastic modulus tensors comprising: l is_ijkl，L_jikl，L_ijlk，L_klij(ii) a They have a completely symmetrical character;the co-rotational stress rate on the lattice rotation axis and the co-rotational stress rate on the material rotation axisThe following relationships are provided:

wherein:

therefore, the relation among the stress rate, the deformation rate and the slip shear strain rate is established, the shear strain rate of each slip system is firstly obtained by obtaining the strain rate, and the shear strain rate is calculated according to the hardening rule.

And step 3: hardening law analysis of rate-dependent crystals

The degree of slip of the single crystal body depends on the magnitude of the shear stress generated by the applied load, the type of crystal structure, and the orientation of the slip plane of the opening with respect to the shear stress. The tensile loads required to produce slippage are different for differently oriented single crystals. It is believed that this value is comparable to the yield stress on the typical stress-strain curve of a single crystal at the onset of slip.

When critical shear stress (CRSS) exists on the slip surface, the slip phenomenon occurs when the shear stress in the slip direction reaches a critical value. The critical cutting stress is the inherent property of the crystal, is determined by the crystal configuration, the material composition and the temperature, and is independent of the external force. Slippage shear for crystal on slippage system alphaRate of shear strainBy breaking down shear stress tau_αDetermining:

wherein, for the sake of simplicityThe expression form isSimplified to Reference strain rate, g, representing slip system alpha_αStrength of slip system, f_αThe method is a dimensionless general function and describes the dependence of strain rate and stress.

Using power distribution to describe polycrystalline creep f_α(x)：

f_α(x)＝x|x|^n-1 (14)

Wherein n is a rate sensitivity index; x is a function argument.

Further, as shown in formula (13), the strength g of the sliding system is obtained_αThe evolution equation of (c) can be determined by:

wherein the content of the first and second substances,is g_αA derivative of (a); h is_αβThe slip hardening modulus represents the hardening of a slip system by a slip shear strain in the slip system. When α ═ β, h_ααIs self-hardeningThe chemical modulus is the hardening of the same slip system by self deformation; when α ≠ β, h_αβLatent hardening modulus, i.e., hardening occurring between different slip systems;is the slip shear strain rate of the crystal in the slip system beta.

Description of the self-hardening modulus h by a power function_αα：

Wherein h is₀For initial hardening modulus, τ₀To initial yield stress, τ_sFor shear yield strength, γ is the slip system cumulative shear strain, where γ is expressed as follows:

where t is a time variable.

The latent hardening modulus was:

h_αβ＝qh(γ)(α≠β) (18)

wherein q is a constant.

Slip hardening modulus in crystalline materials at three strengthening stages:

h_αβ＝qh_αα(β≠α) (20)

wherein h is_sThe hardening modulus when the material is easy to slip; gamma ray_αIs the cumulative shear strain on slip system α; gamma ray_βIs the cumulative shear strain over the slip system β; the function G is related to interactive hardening:

wherein the content of the first and second substances,γ₀for the amount of slip after the interaction between slip systems reaches the peak intensity, each component f_αβThe intensity value representing a particular slip effect.

And 4, step 4: incremental form derivation of constitutive models

Finite element calculations use incremental methods, so the constitutive relation should first be written in incremental form.

Defining the shear strain increment delta gamma on the alpha slip system according to the rate-dependent tangent coefficient method^(α)Comprises the following steps:

wherein the content of the first and second substances,andrespectively, the shear strain at the time t + Δ t and the shear strain at the time t.

Written as a linear interpolation method:

wherein theta is an integral parameter and has a value range of [0,1 ]]When θ is zero, it corresponds to a simple euler time integration format, and is generally recommended to be [0.5,1 ] for ensuring higher precision and stability]Is taken within the range of (1);andrespectively, the shear rate at time t + Δ t and the shear rate at time t.

The slip shear strain rate is a function of the resolved shear stress and the current strength, and equation (23) is subjected to a taylor expansion as follows:

as can be inferred from equations (22-24):

schmidt factor for introduction of slip systemsSum tensor

From the hardening equation of the crystal slip, the strength increment deltag of the current slip system can be known_αComprises the following steps:

from this, the increase Δ τ of the shear stress_αComprises the following steps:

wherein the content of the first and second substances,andthe Schmitt tensor of each slip system.

The obtainable co-rotation stress increment delta sigma_ijComprises the following steps:

wherein the content of the first and second substances,andthe displacement component vector on the base vector is referred to by each slip system; sigma_jk、σ_ijAnd σ_ikThe Cauchy component stress on the reference base vector of each slip system; delta epsilon_kkAnd Δ ε_ijEach slip is referenced to a strain increment on the basis vector.

The shear strain increase is derived from the given strain increase:

wherein, delta_αβIs a crohnok notation.

The increment of the slip shear stress in the increment step which can be solved by the equation system (30) is carried into equations (27), (28) and (29), and other unknowns can be obtained.

And 5: compiling the ABAQUS/VUMAT user material subprogram, inputting the parameters obtained in the step 1-4, and constructing a crystal elastoplasticity constitutive model

The single crystal copper VUMAT user material subprogram is written by adopting Fortran language, and the flow of the VUMAT user material subprogram is shown in figure 2. In a first step, the material parameter props (n) is read from ABAQUS, the integration point number I is defined and I is 1. Secondly, defining the number of slip coefficient groups, integral coefficients and rotation increments; calculating the normal direction of a slip plane, the slip deformation tensor, the state variable, the shear strain and the accumulated shear strain in the slip direction; calculating a slip rotation tensor, a shear strain rate and derivatives thereof; obtaining a self-latent hardening modulus; updating stress and strain; judging whether I is the serial number of the last integration point, if not, executing I +1, circulating the second step, and if so, continuously outputting downwards; finally, the updated stress and strain are output to ABAQUS, and the procedure is ended.

Step 6: single crystal copper micro-milling force prediction obtained based on finite element method

And (3) surveying and mapping the geometric structure of the micro milling cutter, establishing a micro milling cutter model, importing the micro milling cutter model into ABAQUS software, and setting the micro milling cutter model as a rigid body. And establishing a three-dimensional processing workpiece model which is set as an elastic plastic body. And (3) carrying out mesh division on the model, wherein the type of the tool model mesh adopts R3D3 type mesh, the type of the workpiece model mesh adopts C3D8R, and the meshes of the cutting area at the contact part of the tool and the workpiece are locally encrypted.

In the finite element simulation, in order to ensure the accuracy of the simulation result, a proper friction model needs to be selected to reflect the friction in the actual machining. The contact area of the chip and the front tool face in the micro-milling process has two friction types, namely a bonding area and a sliding area.

The friction characteristics are expressed as follows:

τ_f＝τ_s(τ_f≥τ_s) (31)

τ_f＝μσ_n(τ_f<τ_s) (32)

wherein formula (31) represents a bonding region, formula (32) represents a sliding region, wherein τ_fIs the frictional shear force, τ_sIs the shear yield strength of the workpiece, mu is the coefficient of friction, σ_nIs the positive stress of the contact area. And judging the friction area currently located according to the comparison between the friction shearing force and the shearing yield strength of the material.

Material removal was simulated using a cell-deletion modeling technique. To achieve cell deletion, criteria for material removal need to be set. A shear strain based criterion is used to explain the anisotropy in the material removal process:

max(γ-γ_cr,γ_sl,min-γ_sl,cr)≥0， γ_sl,min＝min(γ_α)，α＝1,2...N (33)

wherein, γ_sl,crAnd gamma_crRespectively, the critical value of the shear strain on the single slip system and the accumulated shear strain on all slip systems, and monitoring the shear on the single slip system and the integral slip caused by the slip system; deleting the unit if a single system threshold or a cumulative slip threshold is reached; gamma ray_sl，minCumulative shearing of alpha for slip systemsA minimum value of strain.

The micro-milling force of the single crystal copper can be predicted by setting parameters such as the rotating speed of the main shaft, the feed amount of each tooth, the axial cutting depth and the like.

The simulation process of micro-milling of the single crystal copper is shown in fig. 3, the three-way cutting force output by the ABAQUS software under the parameters is shown in fig. 4, and the result in the figure is the result after filtering by the ABAQUS post-processing software.

The invention has the beneficial effects that: the method for predicting the micro-milling force of the single crystal copper based on the cutting process simulation does not need a large amount of experiments, has strong adaptability to the anisotropic material of the single crystal copper, can realize the prediction of the micro-milling force of the single crystal copper, improves the prediction precision and efficiency of the micro-milling force, and has practical application value.

Drawings

FIG. 1 is a schematic diagram of crystal deformation motion.

FIG. 2 is a flow diagram of the VUMAT subroutine.

FIG. 3 is a single crystal copper micro-milling simulation process.

Figure 4 is the cutting force output by the ABAQUS software.

Fig. 5(a) is a graph comparing the Fx-direction simulated value and the experimental value of the micro-milling of single crystal copper in the <100> crystal orientation.

Fig. 5(b) is a graph comparing the experimental value with the Fy-direction simulated value of the micro-milling of single crystal copper in the <100> crystal orientation.

Fig. 5(c) is a graph comparing the Fz direction simulated value and the experimental value of the micro milling of single crystal copper in the <100> crystal orientation.

Fig. 6(a) is a graph comparing the Fx-direction simulated value and the experimental value of the micro-milling of single crystal copper in the <110> crystal orientation.

Fig. 6(b) is a graph comparing the Fy-direction simulated value and the experimental value of the micro-milling of single crystal copper in the <110> crystal orientation.

Fig. 6(c) is a graph comparing the Fz direction simulated value and the experimental value of the micro milling of single crystal copper of <110> crystal orientation.

Fig. 7(a) is a graph comparing the Fx-direction simulated value and the experimental value of the micro-milling of single crystal copper in the <111> crystal orientation.

Fig. 7(b) is a graph comparing the experimental value with the Fy-direction simulated value of the micro-milling of single crystal copper in the <111> crystal orientation.

Fig. 7(c) is a graph comparing the Fz direction simulated value and the experimental value of the micro milling of single crystal copper in the <111> crystal orientation.

Detailed Description

The following detailed description of the embodiments of the invention refers to the accompanying drawings and claims.

Considering that the micro milling force is an important process parameter in the micro milling process of the micro single crystal copper part, the research on the micro single crystal copper milling force modeling method has an important guiding function on optimizing the micro milling processing technology of the micro part and improving the processing quality. In addition, the anisotropy of the single crystal copper material has certain influence on the change of cutting force in the micro milling process. Therefore, the method for predicting the micro-milling force of the single crystal copper based on the cutting process simulation is invented for solving the problem of the micro-milling predicting force of the micro single crystal copper parts.

Taking a two-edge flat-head milling cutter for micro milling of straight grooves as an example, the adopted cutter is a CrN-coated ultra-fine particle tungsten carbide two-edge flat-head end mill, the diameter of the cutter is 0.4mm, the length of the cutter edge is 1.2mm, the arc radius of the cutting edge is 1.9 mu m, the helix angle is 20 degrees, the peripheral edge front angle is 9 degrees, the peripheral edge rear angle is 12 degrees, simulation is carried out by means of ABAQUS software, and the implementation process of the invention is explained in detail.

Firstly, determining that the selected workpiece material is single crystal copper, and the material parameter performance is as follows: 8,960kg/m³(ii) a Spring constant C₁₁168,150 MPa; spring constant C₁₂121,400 MPa; spring constant C₄₄75,400 MPa; specific heat capacity 8,960J/kg DEG C; coefficient of thermal expansion 0.000016/deg.C; coefficient of thermal conductivity: 385W/m.K; melting temperature 1,356K.

The method comprises the steps of guiding a picture obtained through a scanning electron microscope into AutoCAD for accurate tracing to obtain a bottom surface outline, guiding the bottom surface outline into Creo software, establishing a three-dimensional geometric model of the micro milling cutter, carrying out grid division on the micro milling cutter model by using finite element analysis pretreatment software Hypermesh, adopting R3D3 type grids in the grid type, dividing relatively dense grids on a cutting edge part of the micro milling cutter in order to ensure the shape accuracy of the micro milling cutter, dividing 23967 cutter grids, and finally guiding the grids into ABAQUS software to be set as rigid bodies. The model workpiece is steppedA semi-annular body configured as an elastoplastic material. The grid type uses C3D8R, and the cutting area in contact with the tool is partially encrypted with grids 180540 in number, and the minimum size of the grids is 1.5 μm. A single crystal copper VUMAT user material subprogram is compiled by using a Fortran language, and a crystal plasticity constitutive is introduced into finite element simulation. When defining the material parameters, the material parameters and the rate sensitivity index n is 50, and the initial hardening modulus h₀180MPa, hardening modulus h in the case of easy slip_s24MPa, shear yield strength τ_s52MPa, initial yield stress τ₀4MPa, and the constant q is 1.

In the ABAQUS software: in the Property module, the shear coefficient of friction is set to 0.48, the criteria for material removal are set, and the threshold value γ for shear strain on a single slip system in equation (33)_sl,crValue 6.0, cumulative shear strain γ on all slip systems_crThe value of (A) is 0.068. In the Assembly module, a workpiece and a tool model are called in. In the model, the cutting depth and the feed distance are determined by adjusting the relative positions of the milling cutter and the workpiece. And defining boundary conditions, and strictly restricting the degrees of freedom of the side surface and the bottom surface of the workpiece. In the Step module, after an initial Step is established, a micro-milling analysis Step, a tool withdrawal analysis Step and a constraint conversion analysis Step are sequentially inserted, wherein the process types are selected from Dynamics and exploitit, and the field variable output is used for checking force so as to read the cutting force value. Three kinds of single crystal copper (are selected: (A), (B), (C) and (C)<100>,<110>,<111>) The upper surfaces are respectively the (100), (110) and (111) crystal planes, and the feeding directions are respectively<001>，<001>，Creating data in a Job module, checking a task, and setting the rotating speed of a tool spindle to be 40,000 rpm; setting the feed amount of each tooth to be 3 mu m/z; the axial depth of cut was 40 μm. And after the data are checked to be correct, submitting a task and carrying out finite element analysis. After the simulation is completed, the cutting forces in three directions are output X, Y, Z.

TABLE 1 comparison of <100> crystal orientation single crystal copper micro-milling experiment and simulated cutting force

As can be seen from fig. 5(a), 5(b), and 5(c), the micro milling force obtained by the <100> crystal orientation single crystal copper simulation substantially matches the micro milling force obtained by the experiment, but there is still a deviation, as shown in table 1, which is a comparison of the experimental value and the simulated value of the <100> crystal orientation single crystal copper micro milling force, and it can be seen from the table that the maximum relative error is 28.6%, and the average relative error is 14.8%. Therefore, the accuracy of the established monocrystalline copper micro-milling simulation model with the <100> crystal orientation is verified.

TABLE 2 comparison of <110> crystal orientation single crystal copper micro-milling experiment and simulated cutting force

As shown in fig. 6(a), 6(b), and 6(c), simulated values of <110> crystal orientation single crystal copper in three directions of force Fx, radial force Fy, and axial force Fz are compared with experimental values. The results show that the micro milling force obtained by simulation is basically consistent with the micro milling force obtained by experiment, but the deviation still exists, as shown in table 2, the comparison between the experimental value and the simulation value of the micro milling force of the <110> crystal orientation single crystal copper is shown, and the maximum relative error is 29.4% and the average relative error is 19.5%. Therefore, the accuracy of the established monocrystalline copper micro-milling simulation model with the <110> crystal orientation is verified.

TABLE 3 comparison of cutting force of <111> crystal orientation single crystal copper micro-milling experiment and simulation

As shown in fig. 7(a), 7(b), and 7(c), simulated values of <111> crystal orientation single crystal copper in three directions of force Fx, radial force Fy, and axial force Fz are compared with experimental values. The results show that the micro milling force obtained by simulation is basically consistent with the micro milling force obtained by experiment, but the deviation still exists, as shown in table 3, the comparison between the experimental value and the simulation value of the micro milling force of the <111> crystal orientation single crystal copper is shown, and the maximum relative error is 28.0%, and the average relative error is 15.8%. Therefore, the accuracy of the established monocrystalline copper micro-milling simulation model with the <111> crystal orientation is verified.

In conclusion, the accuracy of the established monocrystalline copper micro-milling simulation model with the crystal orientations of <100>, <110>, <111> is verified.