阅读说明：本技术 一种制冷组件 (A kind of cooling assembly ) 是由 朱惜惜 于 2019-08-30 设计创作，主要内容包括：本发明公开了一种制冷组件,涉及制冷技术领域。本发明包括固定壳体和用于制冷的半导体制冷片,壳体内设置有制冷区,包括用于气流降温的导流组件；吸热区,包括位于固定壳体和导流组件之间的罩体；以及位于罩体与导流组件之间的盖板；通过罩体与盖板以及导流组件形成吸热腔体；以及导流组件与半导体制冷片形成的制冷区,并与功能端配合产生冷风的目的。本发明通过设置的导流组件将气流均布的吸收冷源,产生冷风；通过将多个该制冷组件进行串联形成组合式制冷设备,提升制冷功率；通过罩体与盖板以及导流组件形成吸热腔体,在该吸热腔体内设有吸热液,通过吸热液带走半导体制冷片发热的端面产生的热量。(The invention discloses a kind of cooling assemblies, are related to refrigeration technology field.The present invention includes fixed shell and the semiconductor chilling plate for refrigeration, is provided with refrigeration area in shell, including the guiding subassembly to cool down for air-flow；Heat absorption area, including the cover being located between fixed shell and guiding subassembly；And the cover board between cover and guiding subassembly；Heat absorption cavity is formed by cover and cover board and guiding subassembly；And the refrigeration area that guiding subassembly and semiconductor chilling plate are formed, and cooperate the purpose for generating cold wind with function end.The present invention, by the absorption cold source of airflow uniform distribution, generates cold wind by the guiding subassembly of setting；Combined refrigeration plant is formed by the way that multiple cooling assemblies are carried out series connection, promotes refrigeration work consumption；Heat absorption cavity is formed by cover and cover board and guiding subassembly, heat absorption liquid is equipped in the heat-absorbing chamber body, the heat generated by the end face that heat absorption liquid takes away semiconductor chilling plate fever.)

1. a kind of cooling assembly, including fixed shell (1) and for the semiconductor chilling plate (5) of refrigeration, it is characterised in that: described It is provided in shell (1)

Refrigeration area, including the guiding subassembly (2) to cool down for air-flow；

Wherein, the guiding subassembly (2) includes the gengon frame (201) being made of several rectangle frames, the gengon frame (201) inner face has been uniformly arranged the first distributing fin (202) and/or the second distributing fin (203)；

In the rectangle frame of end face insertion gengon frame (201) of semiconductor chilling plate (5) refrigeration；Also, it is described partly to lead The end face of body cooling piece (5) fever is located at outside the rectangle frame of gengon frame (201)；

Heat absorption area, including the cover (3) being located between fixed shell (1) and guiding subassembly (2)；And it is located at cover (3) and leads Flow the cover board (4) between component (2)；

Wherein, the cover (3) includes the inner cavity shell (302) with fixed shell (1) inner surface cooperation；The inner cavity shell (302) a end face is provided with end cap (301)；The end cap (301) is provided with more than first matched with gengon frame (201) Side shape notch (303)；

Wherein, the side of the cover board (4) is provided with the connecting plate (407) of one with the cooperation of inner cavity shell (302) inner surface；It is described The end face of cover board (4) is provided with a second polygon notch (404) matched with gengon frame (201)；The cover board (4) End face is also provided with liquid inlet/outlet (403)；

The cover (3) and cover board (4) and guiding subassembly (2) form heat absorption cavity, and heat absorption liquid is equipped in the heat-absorbing chamber body； The end face of semiconductor chilling plate (5) fever is located in the heat-absorbing chamber body.

2. cooling assembly as described in claim 1, which is characterized in that the cross section of first distributing fin (202) is angle Shape is respectively perpendicular to the interior of adjacent two rectangle frame in gengon frame (201) at the both sides of angular the first distributing fin (202) End face is vertical；First distributing fin (202) inner face of adjacent two rectangle frame along gengon frame (201) is set side by side It sets.

3. cooling assembly as described in claim 1, which is characterized in that second distributing fin (203) is hardened structure always, Second distributing fin (203) is uniformly arranged between inner surface symmetrical in gengon frame (201)；Described second leads Stream fin (203) is vertical with the rectangle frame inner face in gengon frame (201), the table of second distributing fin (203) The end face angle of face and gengon frame (201) is at 0 ° -45 ° of range.

4. cooling assembly as claimed in claim 2 or claim 3, which is characterized in that the fever end face of the semiconductor chilling plate (5) is equal Cloth is provided with several heat transmission fins (501)；The both ends of the heat transmission fin (501) are provided with water conservancy diversion cutter block (502)；The water conservancy diversion Cutter block (502) is range of the both ends of the surface angle at 0 ° -5 °.

5. cooling assembly as claimed in claim 4, which is characterized in that the first polygon notch (303) on the cover (3) It seals and cooperates with gengon frame (201)；End cap (301) end face of the cover (3) and gengon frame (201) end face are total Face.

6. cooling assembly as claimed in claim 1 or 5, which is characterized in that the end face of the cover board (4) is further fixed on several foldings Flowing plate (405), also, the end face is provided with several groups cable-through hole to (402)；Cover board (4) the opposite other end face is provided with several Blind hole (401)；Baffle plate (405) end is provided with flow-disturbing mouth (406).

7. cooling assembly as described in claim 1, which is characterized in that be respectively cooperating with connector on the liquid inlet/outlet (403) Or plug.

8. cooling assembly as claimed in claim 4, which is characterized in that the fever end face of the semiconductor chilling plate (5) is uniformly distributed There is heat-conducting silica gel sheet.

9. cooling assembly as described in claim 1, which is characterized in that the guiding subassembly (2) is made of metallic copper, aluminium.

10. cooling assembly as described in claim 1, which is characterized in that the heat absorption liquid uses water or recirculated water.

Technical field

The invention belongs to technical field of refrigeration equipment, specially a kind of to be used for gas more particularly to a kind of cooling assembly Stream carries out the component that cooling generates cold wind.

Background technique

Existing refrigeration equipment includes refrigerator and air-conditioning, is all to need individual equipment to be grasped by compressor refrigeration Work is just able to achieve refrigeration effect, and device structure is commonly large scale equipment, larger to space requirement.Moreover, structure is also more Complexity, higher cost.

And the application is designed by way of carrying out cooling heat accumulation to the air in environment, it will be in certain environment Air-flow generates cold airflow by this cooling assembly, then can generate heat storage within a certain period of time into heat sink Cold environment, it is easy to operate.

Summary of the invention

The purpose of the present invention is to provide a kind of cooling assemblies, form heat-absorbing chamber by cover and cover board and guiding subassembly Body；And the refrigeration area that guiding subassembly and semiconductor chilling plate are formed, and cooperate the purpose for generating cold wind with function end.

In order to solve the above technical problems, the present invention is achieved by the following technical solutions:

The present invention is a kind of cooling assembly, including fixed shell and for the semiconductor chilling plate of refrigeration, in the shell It is provided with refrigeration area, including the guiding subassembly to cool down for air-flow；Wherein, the guiding subassembly includes being made of several rectangle frames Gengon frame, the gengon frame inner face has been uniformly arranged the first distributing fin and/or the second distributing fin；It is described In the rectangle frame of the end face insertion gengon frame of semiconductor chilling plate refrigeration；Also, the end of the semiconductor chilling plate fever Face is located at outside the rectangle frame of gengon frame；

Heat absorption area, including the cover being located between fixed shell and guiding subassembly；And be located at cover and guiding subassembly it Between cover board；Wherein, the cover includes the inner cavity shell with surface engagement in set casing body；One end face of the inner cavity shell It is provided with end cap；The end cap is provided with the first polygon notch matched with gengon frame；Wherein, the side of the cover board It is provided with the connecting plate of one with surface engagement in inner cavity body；The end face of the cover board is provided with one and matches with gengon frame Second polygon notch；The end face of the cover board is also provided with liquid inlet/outlet；The cover and cover board and guiding subassembly, which are formed, to be inhaled Hot cavity is equipped with heat absorption liquid in the heat-absorbing chamber body；The end face of the semiconductor chilling plate fever is located in the heat-absorbing chamber body.

Further, the cross section of first distributing fin is angular, at the both sides point of the first angular distributing fin It is not vertical perpendicular to the inner face of two rectangle frame adjacent in gengon frame；First distributing fin phase along gengon frame The inner face of adjacent two rectangle frames is arranged side by side.

Further, second distributing fin is that hardened structure, second distributing fin are uniformly arranged polygon always In body frame between symmetrical inner surface；A rectangle frame inner face in second distributing fin and gengon frame hangs down Directly, the end face angle of the surface of second distributing fin and gengon frame is at 0 ° -45 ° of range.

Further, the fever end face of the semiconductor chilling plate has been uniformly arranged several heat transmission fins；The thermally conductive wing The both ends of piece are provided with water conservancy diversion cutter block；The water conservancy diversion cutter block is range of the both ends of the surface angle at 0 ° -5 °.

Further, the first polygon notch on the cover and gengon frame seal cooperate；The end of the cover Lid end face is coplanar with gengon frame end face.

Further, the end face of the cover board is further fixed on several baffle plates, also, the end face is provided with several groups cable-through hole It is right；Cover board opposite other end face is provided with several blind holes；The baffle plate end is provided with flow-disturbing mouth.

Further, connector or plug have been respectively cooperating on the liquid inlet/outlet.

Further, the fever end face of the semiconductor chilling plate is evenly equipped with heat-conducting silica gel sheet.

Further, the guiding subassembly is made of metallic copper, aluminium, and conductibility is good.

Further, the heat absorption liquid uses water or recirculated water.

The invention has the following advantages:

1, the present invention is the one air feed component of one end fits in cooling assembly；Pass through cover and cover board and guiding subassembly shape At heat absorption cavity, it is equipped with heat absorption liquid in the heat-absorbing chamber body, is generated by the end face that heat absorption liquid takes away semiconductor chilling plate fever Heat；The end face of semiconductor chilling plate fever is located in the heat-absorbing chamber body；And pass through the guiding subassembly to cool down for air-flow Semiconductor chilling plate is generated into cold airflow.

2, the present invention generates cold wind by the guiding subassembly of setting by the absorption cold source of airflow uniform distribution.

3, the present invention forms Combined refrigeration plant by the way that multiple cooling assemblies are carried out series connection, promotes refrigeration work consumption.

Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.

Detailed description of the invention

In order to illustrate the technical solution of the embodiments of the present invention more clearly, will be described below to embodiment required Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.

Fig. 1 is the structural schematic diagram at the vertical view visual angle of the cooling assembly of the application；

Fig. 2 is the structure top view of Fig. 1；

Fig. 3 is that the structure at the vertical view visual angle of the cooling assembly of the application faces upward intention；

Fig. 4 is the structural schematic diagram of fixed shell；

Fig. 5 is the structural front view of Fig. 4；

Fig. 6 is the structural schematic diagram of guiding subassembly；

Fig. 7 is the structure top view of Fig. 6；

Fig. 8 is the structural schematic diagram of semiconductor chilling plate；

Fig. 9 is the structural front view of Fig. 8；

Figure 10 is the structural schematic diagram of refrigeration area；

Figure 11 is the structure top view of Figure 10；

Figure 12 is the structural schematic diagram of cover board；

Figure 13 is the structure top view of Figure 12；

Figure 14 is the structural schematic diagram of cover；

Figure 15 is the structure top view of Figure 14；

Figure 16 is the knockdown structural schematic diagram of multiple cooling assemblies of example IV；

In attached drawing, parts list represented by the reference numerals are as follows:

1- fixes shell, 2- guiding subassembly, 3- cover, 4- cover board, 5- semiconductor chilling plate, 101- through hole, the end 102- Plate, 201- gengon frame, the first distributing fin of 202-, the second distributing fin of 203-, 301- end cap, the inner cavity 302- shell, 303- the first polygon notch, 401-, 402- cable-through hole pair, 403- liquid inlet/outlet, 404- the second polygon notch, 405- baffling Plate, 406- flow-disturbing mouth, 407- connecting plate, 501- heat transmission fin, 502- water conservancy diversion cutter block.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other Embodiment shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that, term " aperture ", "upper", "lower", " angle ", "inner", " hang down Directly ", indicating positions or the positional relationship such as " end face ", "inner", " side ", is merely for convenience of description of the present invention and simplification of the description, Rather than the component or element of indication or suggestion meaning must have a particular orientation, and be constructed and operated in a specific orientation, because This is not considered as limiting the invention.