阅读说明：本技术 一种fpc无孔导通的制作方法 (A kind of production method of the non-porous conducting of FPC ) 是由 金红 张士刚 于 2019-08-19 设计创作，主要内容包括：本发明公开了一种FPC无孔导通的制作方法,包括纯铜基材和纯胶膜,所述的纯铜基材分别粘贴设置在纯胶膜的两侧边,通过化锡管控实现双面导通,制作方法为以下具体步骤：a、准备原料；b、印刷锡膏；c、制成层叠组件；d、加压压紧；e、蚀刻制成线圈。通过上述方式,本发明结构简单,将玻璃分为多个小单元,能够通过简单的拼接简化玻璃隔断的安装工艺,改变传统双面的生产方式,节省了镀铜的工序,降低生产成本,减少生产流程,提高生产效率,并改善了生产良率。(The invention discloses a kind of production methods of the non-porous conducting of FPC, including fine copper substrate and pure glue film, the fine copper substrate pastes the two sides that pure glue film is arranged in respectively, realizes double-side conduction by changing tin-tube control, production method is step in detail below: a, preparing raw material；B, print solder paste；C, tinkertoy module is made；D, pressurization compresses；E, coil is made in etching.Through the above way, the configuration of the present invention is simple, glass is divided into multiple junior units, it can change the two-sided production method of tradition by simply splicing simplified glass partition mounting process, save copper-plated process, reduce production cost, production procedure is reduced, improves production efficiency, and improve production yield.)

1. a kind of production method of the non-porous conducting of FPC, which is characterized in that including fine copper substrate and pure glue film, the fine copper base Material pastes the two sides that pure glue film is arranged in respectively, realizes double-side conduction by changing tin-tube control, production method is to walk in detail below It is rapid:

A, prepare raw material, fine copper substrate 2 is opened, and pure glue film 1 is opened and tin cream；

B, print solder paste first gathers into folds the one side of pure glue film and a fine copper substrate, then prints in the glue film empty avoiding area of pure glue film Paint tin cream；

C, tinkertoy module is made, another Zhang Chuntong substrate is stacked in the another side of pure glue film, forms the stacking group of sandwich structure Part；

D, pressurization compresses, and tinkertoy module is put into fast press, is pressurizeed by fast press and compresses fine copper substrate and pure glue film；

E, coil is made in etching, is finally etched to fine copper substrate respectively, fine copper substrate is etched respectively, coil is made.

2. the production method of the non-porous conducting of FPC according to claim 1, which is characterized in that the fine copper substrate uses Pure copper foil.

3. the production method of the non-porous conducting of FPC according to claim 1, which is characterized in that set on the fine copper substrate It is equipped with multiple tin cream gas vents.

4. the production method of the non-porous conducting of FPC according to claim 1, which is characterized in that be arranged on the pure glue film There is the glue film empty avoiding area for accommodating tin cream.

5. the production method of the non-porous conducting of FPC according to claim 4, which is characterized in that the tin cream is low temperature tin Cream.

6. the production method of the non-porous conducting of FPC according to claim 1, which is characterized in that the fine copper substrate and pure Location hole is provided on four angles of glue film.

7. the production method of the non-porous conducting of FPC according to claim 1, which is characterized in that the thickness of the pure glue film For 25um.

Technical field

The present invention relates to the field manufactured FPC more particularly to a kind of production methods of the non-porous conducting of FPC.

Background technique

Currently, FPC manufacture conducting is produced using traditional two-sided copper material, production procedure is general are as follows: sawing sheet -- drilling --- plating Copper -- route, but it is more to produce defect:

(1) high production cost；

(2) production procedure is cumbersome, and process flow is complicated；

(3) copper facing production is difficult, and it is bad to easily lead to fold.

Summary of the invention

The invention mainly solves the technical problem of providing a kind of production methods of the non-porous conducting of FPC, and it is two-sided to change tradition Production method, save copper-plated process, reduce production cost, reduce production procedure, improve production efficiency, and improve life Produce yield.

In order to solve the above technical problems, one technical scheme adopted by the invention is that: provide a kind of non-porous conducting of FPC Production method, including fine copper substrate and pure glue film, the fine copper substrate are pasted the two sides that pure glue film is arranged in respectively, are passed through Change tin-tube control and realize double-side conduction, production method is step in detail below:

A, prepare raw material, fine copper substrate 2 is opened, and pure glue film 1 is opened and tin cream；

B, print solder paste first gathers into folds the one side of pure glue film and a fine copper substrate, then prints in the glue film empty avoiding area of pure glue film Paint tin cream；

C, tinkertoy module is made, another Zhang Chuntong substrate is stacked in the another side of pure glue film, forms the stacking group of sandwich structure Part；

D, pressurization compresses, and tinkertoy module is put into fast press, is pressurizeed by fast press and compresses fine copper substrate and pure glue film；

E, coil is made in etching, is finally etched to fine copper substrate respectively, fine copper substrate is etched respectively, coil is made.

In a preferred embodiment of the present invention, the fine copper substrate uses pure copper foil.

In a preferred embodiment of the present invention, multiple tin cream gas vents are provided on the fine copper substrate.

In a preferred embodiment of the present invention, the glue film empty avoiding area for accommodating tin cream is provided on the pure glue film.

In a preferred embodiment of the present invention, the tin cream is low temperature tin cream.

In a preferred embodiment of the present invention, positioning is provided on four angles of the fine copper substrate and pure glue film Hole.

In a preferred embodiment of the present invention, the pure glue film with a thickness of 25um.

The beneficial effects of the present invention are: the production method of the non-porous conducting of FPC of the invention, changes the two-sided producer of tradition Formula saves copper-plated process, reduces production cost, reduces production procedure, improves production efficiency, and improve production yield.

Detailed description of the invention

To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other Attached drawing, in which:

Fig. 1 is the structural schematic diagram of a preferred embodiment of the non-porous conducting of FPC of the present invention；

Fig. 2 is the structural schematic diagram of fine copper substrate in Fig. 1；

Fig. 3 is the structural schematic diagram of pure glue film in Fig. 1；

Fig. 4 is structural schematic diagram of the Fig. 1 after overetch；

The label in accompanying drawing is: 1, fine copper substrate, 2, pure glue film, 3, glue film empty avoiding area, 4, coil, 5, tin cream gas vent, 6, fixed Position hole.

Specific embodiment

The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation Example is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects It encloses.

As shown in Figures 1 to 4, the embodiment of the present invention includes:

A kind of production method of the non-porous conducting of FPC, including fine copper substrate 1 and pure glue film 2, the fine copper substrate 1 are pasted respectively The two sides of pure glue film 2 are set, realize double-side conduction by changing tin-tube control, production method is step in detail below:

A, prepare raw material, fine copper substrate 2 is opened, and pure glue film 1 is opened and tin cream；

B, print solder paste first gathers into folds the one side of pure glue film and a fine copper substrate, then prints in the glue film empty avoiding area 3 of pure glue film Paint tin cream；

C, tinkertoy module is made, another Zhang Chuntong substrate is stacked in the another side of pure glue film, forms the stacking group of sandwich structure Part；

D, pressurization compresses, and tinkertoy module is put into fast press, is pressurizeed by fast press and compresses fine copper substrate and pure glue film；

E, coil is made in etching, is finally etched to fine copper substrate respectively, fine copper substrate is etched respectively, coil is made 4。

In the present embodiment, the fine copper substrate 1 uses pure copper foil；It is provided on the pure glue film 2 and accommodates tin cream Glue film empty avoiding area 3.Wherein, the pure glue film 2 with a thickness of 25um；The tin cream is low temperature tin cream.

Further, multiple tin cream gas vents 5 are provided on the fine copper substrate 1, tin cream has reached exhaust when melting Function；It is provided with location hole 6 on four angles of the fine copper substrate 1 and pure glue film 2, in fine copper substrate 1 and pure glue film 2 When gathering into folds, position is accurate, prevents dislocation from pasting.

Among the above, when print solder paste, usually in 3 print solder paste of glue film empty avoiding area, naturally it is also possible to which print solder paste is in pure On the inner surface of Copper base material 1 and position corresponding with glue film empty avoiding area 3.Meanwhile the tin cream after melting is etched, only retains Part between two coil interlayers, realizes realization double-side conduction.

The production method of the non-porous conducting of FPC provided by the invention has the advantages that compared with prior art

1. reducing production cost, production procedure is reduced；

2. improving production efficiency, improve production yield；

3. changing the two-sided production method of tradition；

4. the production procedure (sawing sheet ----drilling --- route) after improving.

The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks Domain is included within the scope of the present invention.