阅读说明：本技术 五面附金属包封封装结构及其制备方法 (Attached metal wrapping encapsulating structure in five faces and preparation method thereof ) 是由 姚兰忠 谭小春 于 2019-08-01 设计创作，主要内容包括：本发明提供一种五面附金属包封封装结构及其制备方法,利用半切、电镀、防氧化等工艺,所形成的封装结构五面被电镀的金属包封,可以使得封装结构实现内部信号的多向屏蔽及单向传输,并提高封装结构散热性、封装的气密性,进而提高产品性能。(The present invention provides attached metal wrapping encapsulating structure in a kind of five faces and preparation method thereof, utilize the techniques such as hemisection, plating, anti-oxidation, it is formed by the metal wrapping that five face of encapsulating structure is plated, encapsulating structure can be made to realize the multidirectional shielding and one-way transmission of internal signal, and the air-tightness of encapsulating structure thermal diffusivity, encapsulation is improved, and then enhance product performance.)

1. a kind of preparation method of the attached metal wrapping encapsulating structure in five faces, which comprises the steps of:

(1) plastic packaging product to be processed is provided, the plastic packaging product to be processed includes a carrier, is equipped with plastic packaging on the carrier Body, plastic packaging has an at least electronic building brick in the plastic-sealed body, and the one side close to the carrier of the electronic building brick has at least One pin；

(2) hemisection of X-direction and Y-direction is carried out to the plastic-sealed body respectively from the side far from the pin；

(3) plastic packaging product to be processed is electroplated, generates metal wall respectively with the notch two sides in all hemisections, And metal cap body is generated in the first surface of the plastic-sealed body, the first surface of the plastic-sealed body is the side far from the pin Surface；

(4) notch is filled using filler；

(5) carrier is removed, and the second surface of the plastic-sealed body is handled, the top of the pin is exposed to institute Plastic-sealed body is stated, the second surface is opposite with the first surface；

(6) filler is removed, the attached metal wrapping encapsulating structure at least one five face is obtained.

2. preparation method according to claim 1, which is characterized in that step (2) further comprises: along the outer of the pin Side respectively to the plastic-sealed body carry out x-direction and y-direction hemisection, depth be switched to the pin top and the carrier it Between.

3. preparation method according to claim 1, which is characterized in that further comprise before step (3): to described wait locate It manages plastic packaging product and carries out surface conductance processing, formed in the notch two sides of all hemisections and the first surface of the plastic-sealed body The step of conductive film.

4. preparation method according to claim 3, which is characterized in that surface conductanceization processing further using etc. from Sub- roughening, glass etching, the processing mode for changing copper, or the processing mode using sputter copper, tin or nickel billon.

5. preparation method according to claim 1, which is characterized in that the filler that filling uses in step (4) is water-setting Glue, pyrolysis glue or photodissociation glue.

6. preparation method according to claim 1, which is characterized in that step (5) further comprises: to the plastic-sealed body Second surface carries out surface mechanical attrition treatment, so that the top of the pin is exposed to the plastic-sealed body.

7. preparation method according to claim 1, which is characterized in that further comprise after step (6): to the metal The top of lid, the metal wall and the pin carries out surface anti-oxidation processing.

8. a kind of attached metal wrapping encapsulating structure in five faces characterized by comprising

One plastic-sealed body, first surface are coated with metal cap body, and four sides are coated with metal wall；

An at least electronic building brick, plastic packaging is in the plastic-sealed body, the mask far from the metal cap body of the electronic building brick There is an at least pin, the top of the pin is exposed to the second surface of the plastic-sealed body, the second surface and described first Surface is opposite.

9. the attached metal wrapping encapsulating structure in five faces according to claim 8, which is characterized in that the metal cap body and described Metal wall is prepared by way of carrying out hemisection to the plastic-sealed body from the side far from the pin and being electroplated.

10. the attached metal wrapping encapsulating structure in five faces according to claim 8, which is characterized in that the first of the plastic-sealed body There is conductive film between surface and the metal cap body, there is conduction between the side of the plastic-sealed body and the metal wall Film.

11. the attached metal wrapping encapsulating structure in five faces according to claim 8, which is characterized in that the metal cap body, described The top of metal wall and the pin is handled by surface anti-oxidation.

Technical field

The present invention relates to field of semiconductor package, more particularly to a kind of attached metal wrapping encapsulating structure in five faces and its preparation side Method.

Background technique

With the development of electronic product, semiconductor technologies be widely used in manufacture memory, central processing unit (CPU), Liquid crystal display device (LCD), light emitting diode (LED), laser diode and other devices or chipset etc..Due to semiconductor The electronic building bricks such as component, electric component of microcomputer (MEMS) or photoelectric subassembly have small fine circuit and construction, therefore to avoid Electronic building brick is corroded in the pollution such as dust, acid-base material, moisture and oxygen, and then influences its reliability and service life, needs in technique The related electric energy transmission (Power Distribution) of above-mentioned electronic building brick, signal transmission are provided by encapsulation technology (Signal Distribution), heat loss (Heat Dissipation), and protection and support (Protection And Support) etc. functions.

Semiconductor chip it is packed form encapsulating structure after, according to the difference of service condition, which is also wanted It connect or assembles with other electric elements.But existing encapsulating structure thermal diffusivity, the air-tightness of encapsulation are all poor, and can not be real The multidirectional shielding and one-way transmission of existing internal signal, and then influence the performance of product.

Therefore, the shortcomings that needing a kind of novel encapsulating structure, overcoming above-mentioned encapsulating structure.

Summary of the invention

The object of the present invention is to provide attached metal wrapping encapsulating structures in a kind of five faces and preparation method thereof, can mention High encapsulating structure thermal diffusivity, encapsulation air-tightness, and the multidirectional shielding and one-way transmission of internal signal may be implemented, improves product Performance.

To achieve the goals above, the present invention provides a kind of preparation method of the attached metal wrapping encapsulating structure in five faces, packets It includes following steps: a plastic packaging product to be processed (1) is provided, the plastic packaging product to be processed includes a carrier, on the carrier Equipped with plastic-sealed body, plastic packaging has an at least electronic building brick, the one side close to the carrier of the electronic building brick in the plastic-sealed body With an at least pin；(2) hemisection of X-direction and Y-direction is carried out to the plastic-sealed body respectively from the side far from the pin； (3) plastic packaging product to be processed is electroplated, generates metal wall respectively with the notch two sides in all hemisections, and The first surface of the plastic-sealed body generates metal cap body, and the first surface of the plastic-sealed body is the side table far from the pin Face；(4) notch is filled using filler；(5) remove the carrier, and to the second surface of the plastic-sealed body at Reason, is exposed to the plastic-sealed body for the top of the pin, the second surface is opposite with the first surface；(6) institute is removed Filler is stated, the attached metal wrapping encapsulating structure at least one five face is obtained.

To achieve the goals above, the present invention also provides a kind of attached metal wrapping encapsulating structures in five faces, comprising: a plastic packaging Body, first surface are coated with metal cap body, and four sides are coated with metal wall；An at least electronic building brick, plastic packaging in In the plastic-sealed body, the one side far from the metal cap body of the electronic building brick has an at least pin, the top of the pin End is exposed to the second surface of the plastic-sealed body, and the second surface is opposite with the first surface.

The present invention has the advantages that the attached metal wrapping encapsulating structure preparation method in five faces of the invention, using hemisection, plating, The techniques such as anti-oxidation are formed by the metal wrapping that five face of encapsulating structure is plated, and encapsulating structure can be made to realize internal letter Number multidirectional shielding and one-way transmission, and improve the air-tightness of encapsulating structure thermal diffusivity, encapsulation, and then enhance product performance.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical solution in embodiment of the present invention Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiment party of the invention Formula without creative efforts, can also be obtained according to these attached drawings it for those skilled in the art Its attached drawing.

Fig. 1, the step schematic diagram of the preparation method of the attached metal wrapping encapsulating structure in five faces of the invention；

Fig. 2~Fig. 8 B, the process flow of an embodiment of the attached metal wrapping encapsulating structure preparation method in five faces of the invention Figure；

Fig. 9 A-9B, the perspective view of attached one embodiment of metal wrapping encapsulating structure in five faces of the invention.

Specific embodiment

Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar component or component with the same or similar functions are indicated to same or similar label eventually.The present invention is mentioned The direction term arrived, such as: up, down, left, right, before and after, inside and outside, side etc. are only the directions with reference to attached drawing.Below by way of The embodiment being described with reference to the drawings and the direction term used are exemplary, and for explaining only the invention, and cannot be understood For limitation of the present invention.In addition, the present invention provides various specific techniques and material example, but this field is common Technical staff can be appreciated that the application of other techniques and/or the use of other materials.

Referring to Fig. 1, the step schematic diagram of the preparation method for the attached metal wrapping encapsulating structure in five faces of the invention.The system Preparation Method includes the following steps: S11: providing a plastic packaging product to be processed, the plastic packaging product to be processed includes a carrier, in institute It states carrier and is equipped with plastic-sealed body, plastic packaging has an at least electronic building brick, the close load of the electronic building brick in the plastic-sealed body The one side of body has an at least pin；S12: X-direction and Y are carried out to the plastic-sealed body respectively from the side far from the pin The hemisection in direction；S13: being electroplated the plastic packaging product to be processed, is generated respectively with the notch two sides in all hemisections Metal wall, and metal cap body is generated in the first surface of the plastic-sealed body；S14: the notch is filled using filler；S15: The carrier is removed, and the second surface of the plastic-sealed body is handled, the top of the pin is exposed to the plastic packaging Body；And S16: removing the filler, obtains the attached metal wrapping encapsulating structure at least one five face.Following connection with figures and reality Mode is applied above-mentioned steps are described in detail.

Also referring to Fig. 1 and Fig. 2~Fig. 8 B, wherein Fig. 2~Fig. 8 B is the attached metal wrapping encapsulating structure in five faces of the invention The process flow chart of one embodiment of preparation method.

About step S11: providing a plastic packaging product to be processed, the plastic packaging product to be processed includes a carrier, described Carrier is equipped with plastic-sealed body, and plastic packaging has an at least electronic building brick, the close carrier of the electronic building brick in the plastic-sealed body One side there is an at least pin, also referring to Fig. 1 and Fig. 2, wherein Fig. 2 is the plastic packaging to be processed that present embodiment provides The cross-sectional view of product.In present embodiment, the plastic packaging product to be processed includes a carrier 21, and modeling is equipped on the carrier 21 Seal body 22, in the plastic-sealed body 22 plastic packaging have 4 electronic building bricks 222 (two electronic building bricks therein are illustrated in figure, in addition two Two electronic building bricks that a electronic building brick is shown under the visual angle block)；The electronic building brick 222 can be chip or other Device, such as inductance, capacitor, resistance etc..The front (close to the one side of the carrier 21) of each electronic building brick 222 has 6 outer pins 223 (out lead) (illustrate that two outer pins therein, remaining outer pin are shown under the visual angle in figure Two outer pins block), the outer pin 223 is made of copper product, but which is not limited by the present invention.

The plastic packaging product to be processed can be for through patch rewiring layer (RDL) technology and outer pin (Out Lead) electricity Product after plating and plastic packaging.The plastic-sealed body 22 can be structure well known in the art.

In the present embodiment, in order to clearly illustrate technical solution of the present invention, 4 electricity are provided in the plastic-sealed body 22 Sub-component 222 can have one, two or more electronic building bricks in other embodiments with plastic packaging in the plastic-sealed body 22 222, each electronic building brick 222 has one or more outer pins 223 or general pin (pin), and the present invention is to plastic-sealed body Pin number and shape are not limited in electronic building brick quantity and electronic building brick in 22.

About step S12: carrying out the half of X-direction and Y-direction to the plastic-sealed body respectively from the side far from the pin It cuts, also referring to Fig. 1 and Fig. 3 A-3B, wherein Fig. 3 A is the section view that hemisection is carried out to plastic-sealed body that present embodiment provides Figure, Fig. 3 B are the corresponding top view of Fig. 3 A.Wherein, in the case where overlooking visual angle, the X-direction is that laterally, the Y-direction is longitudinal. Because the electronic building brick 222 and the outer pin 223 by capsulation material (such as resin) plastic packaging in the plastic-sealed body 22, It can't see in the case where overlooking visual angle, thus illustrated with dotted line.

In further embodiment, Fig. 3 B illustrates the first cutter 31 transversely to be cut, and cutting line is located at longitudinal Between two adjacent electronic building bricks 222；Second cutter 32 are cut along longitudinal direction, and cutting line is located at two laterally adjacent electronics groups Between part 222；Two cutter carry out cutting operation simultaneously in either direction.It in other embodiments, can be only with a cutting Knife carries out cutting operation in either direction respectively.

In further embodiment, to the plastic-sealed body 22 carry out hemisection 31 thickness of the first cutter with it is longitudinally adjacent The spacing of two electronic building bricks 222 be adapted, the spacing phase of 32 thickness of the second cutter and two laterally adjacent electronic building bricks 222 Adaptation, so as to an excision forming.Second cutter, 32 thickness can be identical or different with 31 thickness of the first cutter.

In further embodiment, longitudinal the can be located at along the outer pin 223 using the first cutter 31 One lateral surface (there is a distance away from the first lateral surface, in order to avoid damage outer pin) X-direction is carried out to the electronic building brick plastic-sealed body 22 Hemisection, depth is switched between the top and the carrier 21 of the outer pin 223；Drawn outside using the second cutter 32 along described Second lateral surface adjacent with first lateral surface in transverse direction of foot 223 (there is a distance away from the second lateral surface, in order to avoid damage Outer pin) to the plastic-sealed body 22 carry out Y-direction hemisection, depth be also cut to the outer pin 223 top and the load Between body 21.The thickness and quantity of cutter used by hemisection can be adjusted according to demand, and the present invention does not do special limit It is fixed.

Hemisection operation after, between two electronic building bricks 222 between two laterally adjacent electronic building bricks 222, longitudinally adjacent and The outside of electronic building brick 222 forms hemisection notch, thus convenient in subsequent carry out electroplating operations.Hemisection kerf bottom is located at described Between the top of outer pin 223 and the carrier 21, and half cutting depth is from the top of the outer pin 223 to the carrier 21 Extend a distance, thus in the top technique of subsequent removal carrier 21 and the exposure outer pin 223, kerf bottom plating Metal is also removed, so that adjacent electronics component is separated in incision.

Preferably, the preparation method further comprises: surface conductance processing is carried out to the plastic packaging product to be processed, In the step of notch two sides of all hemisections and the first surface of the plastic-sealed body form conductive film.About this step, ask Refering to Fig. 4, what present embodiment provided carries out surface conductanceization treated cross-sectional view to plastic packaging product to be processed.After hemisection Plastic packaging product to be processed carry out surface conductance processing, all hemisections notch two sides and the plastic-sealed body 22 first Surface forms conductive film 41, and the first surface of the notch two sides and the plastic-sealed body 22 that can make all hemisections, which has, leads Electrically, and conducive to the progress of subsequent plating operations.The surface conductanceization processing can be roughened by using plasma, glass loses The processing mode for carving, changing copper, can also be by using the processing mode of sputter (sputter) copper, tin or nickel billon, in institute The first surface of the notch two sides and the plastic-sealed body 22 that have hemisection forms conductive film 41.Plasma roughening, glass etching, Changing process for copper can be technique well known in the art, and used tool and material can be adjusted according to demand, this hair It is bright not do particular determination.Sputtering process can be technique well known in the art, and used tool and material can be according to need It asks and is adjusted, the present invention does not do particular determination.

About step S13: the plastic packaging product to be processed being electroplated, to distinguish in the notch two sides of all hemisections Metal wall is generated, and generates metal cap body in the first surface of the plastic-sealed body, also referring to Fig. 1 and Fig. 5 A-5B, Middle Fig. 5 A be present embodiment provide plastic packaging product to be processed is electroplated after cross-sectional view, Fig. 5 B is that Fig. 5 A is corresponding bows View.Wherein, the first surface of the plastic-sealed body 22 is the side surface far from the outer pin 223.In cutting for all hemisections The metal wall 51 that mouthful two sides generate respectively, and in the metal cap body 52 that generates of first surface of the plastic-sealed body 22, can be with So that subsequent manufactured encapsulating structure is realized the multidirectional shielding and one-way transmission of internal signal, and improves encapsulating structure thermal diffusivity, envelope The air-tightness of dress, and then enhance product performance.Electroplating technology can be technique well known in the art, used tool and material Material can be adjusted according to demand, and the present invention does not do particular determination.Preferably, the metal used is electroplated as copper.It is used in Fig. 5 B Dotted line illustrates the electronic building brick 222 and the outer pin 223, because of 223 quilt of the electronic building brick 222 and the outer pin Capsulation material (such as resin) plastic packaging is in the plastic-sealed body 22, the metal cover of the first surface plating generation of the plastic-sealed body 22 Body 52, thus be that can't see the electronic building brick 222, the outer pin 223 and the plastic-sealed body 22 in the case where overlooking visual angle 's.

About step S14: filling the notch using filler, also referring to Fig. 1 and Fig. 6, wherein Fig. 6 is this reality The filled cross-sectional view of the notch that the mode of applying provides.The notch after plating is filled and led up by filler 61, subsequent load can be made Body 21 removes in processing procedure and surface mechanical attrition processing procedure, connection is kept between electronic building brick 222, and play a supporting role.It is described Filler 61 is solable matter or meltability substance, to be removed in follow-up process by dissolving or melting processing procedure.

In further embodiment, the filler 61 is hydrogel (Hydrogel), is pyrolyzed glue or photodissociation glue.Water-setting Glue is that a part of hydrophobic grouping and hydrophilic residue, hydrophilic residue and water are introduced in the water soluble polymer for have cross-linked network Molecule, which is combined, is connected to netted inside for hydrone, and the cross-linked polymer of hydrophobic residue water-swellable.It is that dispersion is situated between with water Matter, property is soft, is able to maintain certain shape, can absorb a large amount of water；Hydrogel can be by the side that is placed in water and heats Formula removal.Pyrolysis glue is solvent-based adhesive, has certain bonding force at normal temperature, can play the role of positioning, support；Only Bonding force will disappear after temperature being heated to the temperature of setting, be able to achieve and simply strip off, residue is less, does not pollute and is glued Object.Photodissociation glue has certain bonding force, can play the role of positioning, support；Photolysis reactions can occur after illumination to be become Water solubility is able to achieve and simply strips off.

About step S15: removing the carrier, and handle the second surface of the plastic-sealed body, by the pin Top be exposed to the plastic-sealed body, also referring to Fig. 1 and Fig. 7 A-7B, wherein Fig. 7 A is the load that present embodiment provides Body removes and carries out treated cross-sectional view to the second surface of plastic-sealed body, and Fig. 7 B is the corresponding top view of Fig. 7 A.Wherein, described Second surface is opposite with the first surface.After removing the carrier 21, carried out by the second surface to the plastic-sealed body 22 Processing, so that the top of the outer pin 223 is exposed to the plastic-sealed body 22, the part that the outer pin 223 exposes can be with Contact surface when being fixedly connected as the encapsulating structure and external component being subsequently formed.Meanwhile all hemisection kerf bottoms Plating metal be also removed, expose internal filler 61.

In further embodiment, surface mechanical attrition treatment can be carried out to the second surface of the plastic-sealed body 22, The second surface grinding of the plastic-sealed body 22 is thinned, so that the top of the outer pin 223 is exposed to the plastic-sealed body 22 Second surface.The upper surface of copper outer pin is exposed to the second surface of the plastic-sealed body 22, using as being subsequently formed Contact surface when being fixedly connected of encapsulating structure and external component.

About step S16: about step S17: removing the filler, obtain the attached metal wrapping encapsulation at least one five face Structure, also referring to Fig. 1 and Fig. 8 A-8B, wherein Fig. 8 A is the plastic-sealed body after the removal filler that present embodiment provides Cross-sectional view, Fig. 8 B be the corresponding top view of Fig. 8 A.

For the plastic-sealed body 22 using hydrogel as filler, plastic-sealed body 22 can be placed in water and be heated, removed The hydrogel of filling, to obtain the product of the attached metal wrapping encapsulating structure in independent five face one by one.For using other The plastic-sealed body 22 of filler can remove filler using corresponding dissolution or melting process, for example, pyrolysis glue can be by adding The mode of heat removes, and photodissociation glue can be removed by way of illumination.

Preferably, further comprise after step S16: to the metal cap body, the metal wall and the pin Top carry out surface anti-oxidation processing.Shape can be prevented using changing tin or changing the surface anti-oxidations processing modes such as nickel billon At the attached metal wrapping encapsulating structure in five faces in the metal surface that exposes be oxidized.

The attached metal wrapping encapsulating structure preparation method in five faces of the invention, utilizes the techniques such as hemisection, plating, anti-oxidation, institute's shape At the metal wrapping that is plated of five face of encapsulating structure, encapsulating structure can be made to realize the multidirectional shielding of internal signal and unidirectional Transmission, and the air-tightness of encapsulating structure thermal diffusivity, encapsulation is improved, and then enhance product performance.

Please refer to Fig. 9 A-9B, the perspective view of attached one embodiment of metal wrapping encapsulating structure in five faces of the invention.Institute of the present invention Stating the attached metal wrapping encapsulating structure 90 in five faces includes: a plastic-sealed body 91 and an at least plastic packaging in the electronics in the plastic-sealed body 91 Component (internal structure is not illustrated on figure).The first surface of the plastic-sealed body 91 is coated with metal cap body 93, the plastic-sealed body 91 Four sides be coated with metal wall 94.The one side far from the metal cap body 93 of the electronic building brick has at least one Pin 92, the top of the pin 92 are exposed to the second surface of the plastic-sealed body 91；Wherein, the second surface and described the One surface is opposite.

In further embodiment, the metal cap body 93 and the metal wall 94 pass through from far from the pin 92 Side hemisection is carried out to the plastic-sealed body 91 and the mode that is electroplated is prepared.The metal cap body 93 and the metal The material of wall 94 can be copper or nickel billon etc..

In further embodiment, there is conduction between the first surface and the metal cap body 93 of the plastic-sealed body 91 Film (is not illustrated on figure), has conductive film between the side of the plastic-sealed body 91 and the metal wall 94.The i.e. described modeling The first surface of envelope body and four sides, by conductive treatment before plating forms metal cap body and metal wall.

In further embodiment, the top of the metal cap body 93, the metal wall 94 and the pin 92 It is handled by surface anti-oxidation.Five face can be prevented using changing tin or changing the surface anti-oxidations processing modes such as nickel billon The metal surface exposed in attached metal wrapping encapsulating structure 90 is oxidized.

In the present embodiment, in order to clearly illustrate technical solution of the present invention, there are 6 pins on the electronic building brick 92.The pin 92 is the outer pin (out lead) of the electronic building brick, for being connect with external component (being not shown in the drawing), The pin 92 is made of copper product.In other embodiments, it can have one, two or more on the electronic building brick A pin 92, the pin 92 can outer pin (out lead) for the electronic building brick or general pin (pin), the present invention Pin number, material and shape on electronic building brick are not limited.

The metal wrapping that attached five face of metal wrapping encapsulating structure in five faces of the invention is plated, can make encapsulating structure realize The multidirectional shielding of internal signal and one-way transmission, and the air-tightness of encapsulating structure thermal diffusivity, encapsulation is improved, and then improve product Energy.

The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as Protection scope of the present invention.