阅读说明：本技术 一种igbt模块安装结构 (A kind of IGBT module mounting structure ) 是由 陈祖善 曾华全 张振宏 于 2019-07-29 设计创作，主要内容包括：本发明公开了一种IGBT模块安装结构,本发明通过设计一块带齿片的散热板,当需要更换IGBT模块时,不需要重新设计机箱,只需根据需求是否装上散热板即可,大大节约了开发周期和设计成本,原有设计方案,则无法兼容两种IGBT模块,现有方案则可随意更换两种不同封装的IGBT模块,得出两款机型,加快了产品开发周期。(The invention discloses a kind of IGBT module mounting structures, the present invention passes through one block of heat sink with gear piece of design, when needing replacing IGBT module, does not need to redesign cabinet, only need whether load onto heat sink according to demand, development cycle and design cost is greatly saved, original design scheme, then can not be compatible with two kinds of IGBT modules, and existing scheme then can arbitrarily replace the IGBT module of two kinds of different encapsulation, it obtains two type, accelerates product development cycle.)

1. a kind of IGBT module mounting structure, it is characterised in that: including cabinet (1), sealing ring (2), heat sink (3) and fixed spiral shell The bottom surface of silk (4), cabinet (1) inner cavity is equipped with heat dissipation water tank (10), and the heat dissipation water tank (10) is open upper end formula structure, In being surrounded by seal groove (12) for heat dissipation water tank (10), sealing ring (2) is placed in seal groove (12), and heat sink (3) passes through solid Determine screw (4) to be fixed in the inner chamber bottom surface of cabinet (1), and heat sink (3) closes the open upper end mouth of heat dissipation water tank (10), Water nozzle (11) are equipped on the outer wall of cabinet (1), the water nozzle (11) is connected with heat dissipation water tank (10)；

The upper surface of heat sink (3) is smooth flat structure, and the lower end surface of heat sink (3) is equipped with several radiation tooths, heat dissipation After plate (3) is fixed on cabinet (1), the radiation tooth is stretched in heat dissipation water tank (10).

2. IGBT module mounting structure as described in claim 1, it is characterised in that: the heat dissipation water tank (10) is rectangle knot Structure, heat sink (3) are rectangular block architecture.

3. IGBT module mounting structure as described in claim 1, it is characterised in that: heat dissipation water tank (10) are surrounded by Several threaded holes (13).

Technical field:

The present invention relates to a kind of IGBT module mounting structures.

Background technique:

IGBT module used in inside motor controller of new energy automobile, with advances in technology, power density is more next It is higher, it is desirable that the heat-sinking capability of cabinet also increases accordingly.Till now, there are two types of common mounting means for IGBT module, and first Kind mounting means is that conventional IGBT module is directly installed on case radiation substrate by the copper base of bottom, and water channel is completely set up Inside case radiation substrate, one layer of heat-conducting silicone grease is coated between module and heat-radiating substrate.Second of mounting means is IGBT mould The included heat dissipation gear piece of the bottom copper base of block, needs out an open type water channel groove, recessed circumferential is on case radiation substrate One sealing ring, module bottom plate and case radiation substrate are made up of the radiation water channel of a sealing sealing ring, and such mode dissipates The thermal efficiency is higher, and the power density of module is also higher.In general, being needed to install the IGBT module of both different encapsulation The different cabinet of two structure of heat dissipation substrate is designed, design time is increased, increases development cost.

Summary of the invention:

The present invention is to provide a kind of IGBT module mounting structure to solve the above-mentioned problems of the prior art.

The technical solution adopted in the present invention has: a kind of IGBT module mounting structure, including cabinet, sealing ring, heat sink And fixed screw, the bottom surface of the cabinet inner cavity are equipped with heat dissipation water tank, the heat dissipation water tank is open upper end formula structure, is being radiated Sink is surrounded by seal groove, and sealing ring is placed in seal groove, and heat sink is fixed on the interior bottom of chamber of cabinet by fixed screw On face, and heat sink closes the open upper end mouth of heat dissipation water tank, and water nozzle, the water nozzle and heat dissipation are equipped on the outer wall of cabinet Sink is connected；

The upper surface of heat sink is smooth flat structure, and the lower end surface of heat sink is equipped with several radiation tooths, heat sink After being fixed on cabinet, the radiation tooth is stretched in heat dissipation water tank.

Further, the heat dissipation water tank is rectangular configuration, and heat sink is rectangular block architecture.

Further, the heat dissipation water tank is surrounded by several threaded holes.

The invention has the following beneficial effects: the present invention by one block of heat sink with gear piece of design, when needing replacing When IGBT module, does not need to redesign cabinet, only need whether load onto heat sink according to demand, exploitation week is greatly saved Phase and design cost, original design scheme can not then be compatible with two kinds of IGBT modules, and existing scheme then can arbitrarily replace two kinds of differences The IGBT module of encapsulation obtains two type, accelerates product development cycle.

Detailed description of the invention:

Fig. 1 and Fig. 2 is installation diagram of the present invention in the IGBT module of the included heat dissipation gear piece of installation.

Fig. 3 and Fig. 4 is the present invention in the installation diagram for installing conventional IGBT module.

Fig. 5 and Fig. 6 is the structure chart of heat sink in the present invention.

Specific embodiment:

The present invention will be further described below with reference to the drawings.

Such as Fig. 1 to Fig. 6, a kind of IGBT module mounting structure of the present invention, including cabinet 1, sealing ring 2, heat sink 3 and fixation Screw 4, the bottom surface of 1 inner cavity of cabinet are equipped with heat dissipation water tank 10, and heat dissipation water tank 10 is open upper end formula structure, heat dissipation water tank's 10 It is surrounded by seal groove 12, sealing ring 2 is placed in seal groove 12, and heat sink 3 is fixed on the inner cavity of cabinet 1 by fixed screw 4 On bottom surface, and heat sink 3 closes the open upper end mouth of heat dissipation water tank 10, and water nozzle 11, water nozzle 11 are equipped on the outer wall of cabinet 1 It is connected with heat dissipation water tank 10.

Heat sink 3 in the present invention is rectangular block architecture, and heat dissipation water tank 10 is rectangular configuration, in the upper surface of heat sink 3 Lower end surface for smooth flat structure, heat sink 3 is equipped with several radiation tooths, described to dissipate after heat sink 3 is fixed on cabinet 1 Hot tooth stretches in heat dissipation water tank 10.Heat dissipation water tank's 10 is surrounded by several threaded holes 13.

The IGBT module of cabinet compatible installation two kind different encapsulation of the present invention with a structure of heat dissipation substrate.It is specific real Apply is to increase the heat sink of included radiation tooth on the structure of heat dissipation substrate cabinet for being provided with open type water channel groove, do so It can be on same cabinet, by increasing or removing this block heat sink, so that it may the IGBT mould of two kinds of Matching installation different encapsulation Block.

The present invention can install the IGBT module of two kinds of different encapsulation on a cabinet, reduce a cabinet, phase When can but be adapted to two type in only devising a cabinet for having open type water channel groove, reduce development cost and exploitation Period.

The IGBT module that two kinds of different encapsulation can be assembled on a cabinet, is assembled from the IGBT mould with heat dissipation gear piece When block:

Step 1: cabinet does not need dress heat sink.

Step 2: sealing ring is attached on the seal groove by cabinet groove.

Step 3: included heat dissipation gear piece IGBT module is attached on cabinet, fixed with corresponding screw.

When assembly routine IGBT module:

Step 1: sealing ring is attached on the seal groove by cabinet groove.

Step 2: the heat sink with gear piece is attached on cabinet, fixed with corresponding screw.

Step 3: being uniformly coated with thermal grease at the conventional IGBT module back side.

Step 4: conventional IGBT module is attached on heat sink again, fixed with corresponding screw.

The present invention does not need to redesign by designing one block of heat sink with gear piece when needing replacing IGBT module Cabinet only needs whether load onto heat sink according to demand, development cycle and design cost, original design side is greatly saved Case, then can not be compatible with two kinds of IGBT modules, and existing scheme then can arbitrarily replace the IGBT module of two kinds of different encapsulation, obtain two Type accelerates product development cycle.

The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art It for member, can also make several improvements without departing from the principle of the present invention, these improvement also should be regarded as of the invention Protection scope.