阅读说明：本技术 一种通孔的制造方法 (A kind of manufacturing method of through-hole ) 是由 徐世明 王健 金慧贞 孙彬 沈洪 李晓华 于 2019-08-27 设计创作，主要内容包括：本发明涉及一种通孔的制造方法,属于印刷电路板技术领域。包括：在绝缘薄膜的两面涂布光刻胶,对涂布光刻胶的绝缘薄膜进行两面曝光、显影,对显影后的绝缘薄膜进行两面蚀刻,形成凹型槽,对蚀刻后的绝缘薄膜两面涂布光刻胶,对涂布光刻胶的薄膜进行曝光、显影,对经过二次曝光显影的绝缘薄膜进行两面蚀刻,形成阶梯状的通孔,对两面涂布有光刻胶且具有阶梯状的通孔的绝缘薄膜进行去膜处理,对去膜的绝缘薄膜进行镀铜,完成电镀,形成阶梯通孔。本发明的有益效果是：避免出现的断针、钻偏等现象；减少钻孔会产生的残胶或铜渣；两面同时进行蚀刻,保证孔的质量；阶梯孔的形成,有利于后续镀铜时电镀液的循环,从而能够更好的保证孔铜的质量。(The present invention relates to a kind of manufacturing methods of through-hole, belong to printed-board technology field.It include: the two sides coating photoresist in insulation film, two sides exposure is carried out to the insulation film of coating photoresist, development, two facet etches are carried out to the insulation film after development, form concave groove, to the insulation film two sides coating photoresist after etching, the film of coating photoresist is exposed, development, two facet etches are carried out to the insulation film by re-expose development, form stair-stepping through-hole, photoresist is coated with to two sides and there is the insulation film of stair-stepping through-hole to carry out film process, copper facing is carried out to the insulation film of striping, complete plating, form ladder hole.The beneficial effects of the present invention are: the broken needle avoided the occurrence of, bore it is inclined phenomena such as；Reduce residue glue or copper ashes that drilling can generate；Two sides is etched simultaneously, guarantees the quality in hole；The formation of stepped hole is conducive to the circulation of electroplate liquid when subsequent copper facing, so as to preferably guarantee the quality of hole copper.)

1. a kind of manufacturing method of through-hole characterized by comprising

Step 1: in the two sides coating photoresist I (2) of insulation film (1)；

Step 2: two sides exposure, development are carried out to the insulation film (1) of coating photoresist I (2)；

Step 3: two facet etches being carried out to the insulation film (1) after development, are formed concave groove (3)；

Step 4: to insulation film (1) two sides coating photoresist II (4) after etching；

Step 5: the film of coating photoresist II (4) being exposed, is developed；

Step 6: two facet etches being carried out to the insulation film (1) by re-expose development, form stair-stepping through-hole (5)；

Step 7: photoresist being coated with to two sides and there is the insulation film (1) of stair-stepping through-hole (5) to carry out film process；

Step 8: copper facing being carried out to the insulation film (1) of striping, plating is completed, is formed ladder hole (6).

2. a kind of manufacturing method of through-hole according to claim 1, it is characterised in that: the insulation film (1) is poly- Acid imide material or epoxy resin material or polyurethane material.

3. a kind of manufacturing method of through-hole according to claim 1, it is characterised in that: the ladder hole (6) is round Hole or square hole or circular hole add square hole.

4. a kind of manufacturing method of through-hole according to claim 1, it is characterised in that: the rank of the ladder hole (6) Series is two ranks or multistage.

Technical field

The present invention relates to a kind of manufacturing methods of through-hole, belong to printed-board technology field.

Background technique

As the continuous development of electronic product and technology is innovated, the design concept of electronic product gradually moves towards frivolous, short and small, The design of printed circuit board (PCB) also develops to the direction of small-bore, high density, multilayer number, fine rule road.And with wiring board The reduction in the increased aperture of number of plies thickness, product through-hole radius-thickness ratio increase obviously, and PTH difficulty of processing is gradually increased, and is easy to cause In hole metal foil phenomenon or without metal phenomenon occur.

The step of the manufacturing method key of through-hole is aperture and electro-coppering.Hole opening technology is different according to the radius-thickness ratio in hole, effect Fruit also can be different, equally heavy process for copper also can cost and environmental protection aspect there is very big deficiency, main disadvantage is as follows:

1, with the reduction in aperture, remaining colloid and copper ashes processing are more difficult in device to hole, and it is duplicate mechanically and chemically Processing, the size for being not only easy device to hole affects, but also is easy to deform plate.Possibly even cause to scrap, increase manufacture at This.

2, in the case where drilling deep hole, machine drilling is unable to satisfy quality requirements, while can also it is possible that broken needle problem Increase processing cost

3, after drilling finishes, since what is be connected between copper foil is PI substrate, it cannot achieve conducting, so needing through chemistry Mode deposits upper one layer of copper in through-hole surfaces, and electroless copper plating liquid medicine, which contains a large amount of formaldehyde, can also impact environment.

4, when electro-coppering, the copper in hole is very thin, simultaneously because the too small limitation of liquid medicine covering power and aperture, had been electroplated Cheng Zhong, the deposition rate in hole is relatively low, so printed circuit plate surface can deposit more copper, also indirectly increases in this way Manufacturing cost.

5, similarly in Deep hole electroplating, since radius-thickness ratio is big, electroplate liquid circulation is uneven in the process, and it is copper to will cause hole Measure low, the problem of reliability difference.

Summary of the invention

Place, the present invention provide a kind of manufacturing method of through-hole in order to overcome the above-mentioned deficiencies of the prior art, thin insulating Film two sides obtains stepped hole by etching method, then does full copper to stepped hole and fills, forms through-hole.It can be realized by this method The uniform circulation of electroplate liquid can be good at the quality for guaranteeing hole copper.

The present invention is achieved through the following technical solutions: a kind of manufacturing method of through-hole characterized by comprising

Step 1: in the two sides coating photoresist I of insulation film；

Step 2: two sides exposure, development are carried out to the insulation film of coating photoresist I；

Step 3: two facet etches being carried out to the insulation film after development, form concave groove；

Step 4: to the insulation film two sides coating photoresist II after etching；

Step 5: the film of coating photoresist II being exposed, is developed；

Step 6: two facet etches being carried out to the insulation film by re-expose development, form stair-stepping through-hole；

Step 7: photoresist being coated with to two sides and there is the insulation film of stair-stepping through-hole to carry out film process；

Step 8: copper facing being carried out to the insulation film of striping, plating is completed, forms ladder hole.

The insulation film is polyimides material or epoxy resin material or polyurethane material.

The ladder hole is that circular hole or square hole or circular hole add square hole.

The class number of the ladder hole is two ranks or multistage.

The beneficial effects of the present invention are: 1, lead to the formation that overetched method realizes stepped hole on insulation film, in this way Avoid tradition machinery drilling it is possible that broken needle, bore it is inclined phenomena such as.

2, reduce the residue glue or copper ashes that traditional machine drilling can generate, caused by the low problem of hole copper mass.

3, two sides is etched simultaneously, more convenient time saving for traditional technique to drill from single side, It can guarantee the quality in hole simultaneously.

4, the formation of stepped hole is conducive to the circulation of electroplate liquid when subsequent copper facing, so as to preferably guarantee hole copper Quality.

Detailed description of the invention

Below according to drawings and examples, the present invention is further described.

Fig. 1 is step 1 schematic diagram of the invention；

Fig. 2 is step 2 schematic diagram of the invention；

Fig. 3 is step 3 schematic diagram of the invention；

Fig. 4 is step 4 schematic diagram of the invention；

Fig. 5 is step 5 schematic diagram of the invention；

Fig. 6 is step 6 schematic diagram of the invention；

Fig. 7 is step 7 schematic diagram of the invention；

Fig. 8 is step 8 schematic diagram of the invention.

In figure: 1, insulation film, 2, photoresist I, 3, concave groove, 4, photoresist II, 5, through-hole, 6, ladder hole.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other Embodiment shall fall within the protection scope of the present invention.

In conjunction with shown in Fig. 1 to Fig. 8, a kind of manufacturing method of through-hole characterized by comprising

Step 1: in the two sides coating photoresist I 2 of insulation film 1；

Step 2: two sides exposure, development being carried out to the insulation film 1 of coating photoresist I 2, expose the part for needing to etch；

Step 3: two facet etches being carried out to the insulation film 1 after development, etch the concave groove 3 of two similar blind holes；

Step 4: to the 1 two sides coating photoresist II 4 of insulation film after etching；

Step 5: the film of coating photoresist II 4 being exposed, is developed, and exposes the part for needing to etch on concave groove 3；

Step 6: two facet etches being carried out to the part exposed on 1 concave groove 3 of insulation film by re-expose development, form rank The through-hole 5 of scalariform；

Step 7: photoresist being coated with to two sides and there is the insulation film 1 of stair-stepping through-hole 5 to carry out film process；

Step 8: copper facing being carried out to the insulation film 1 of striping, completes plating, coating blocks stair-stepping through-hole 5, and it is logical to form ladder Hole 6.

The insulation film 1 is polyimides material or epoxy resin material or polyurethane material.

The ladder hole 6 is that circular hole or square hole or circular hole add square hole.

The class number of the ladder hole 6 is two ranks or multistage.

The present embodiment beneficial effect is:

Firstly, leading to the formation that overetched method realizes stepped hole on insulation film 1, this avoid tradition machinery drillings can The broken needle that can will appear bores phenomena such as inclined.

Secondly, reduce the residue glue or copper ashes that traditional machine drilling can generate, caused by hole copper mass is low asks Topic.

Thirdly, 1 two sides of insulation film is etched simultaneously, compared to traditional technique to drill from single side Speech, it is more convenient time saving, while can guarantee the quality in hole.

Finally, the formation of stair-stepping through-hole 5, is conducive to the circulation of electroplate liquid when subsequent copper facing, so as to better Guarantee the quality of hole copper.