阅读说明：本技术 一种电路板及电子设备 (A kind of circuit board and electronic equipment ) 是由 范兵兵 于 2019-09-11 设计创作，主要内容包括：本发明实施例公开了一种电路板及电子设备,电路板中包括主电路板,所述主电路板上包括第一区域,所述第一区域设置有N个焊点,所述N个焊点至少包括第一组焊点和第二组焊点；其中,所述第一组焊点连接所述主电路板内的第一电路结构,所述第二组焊点连接所述主电路板内的第二电路结构；所述第一组焊点包括第一焊点,所述第二组焊点包括第二焊点,所述第一焊点不同于所述第二焊点。通过在主电路板第一区域设置多组焊点,连接多组焊点分别对应的副电路板,可以在一块主电路板上实现多种技术方案,从而解决技术研发人员在研发电路过程中的设计电路图和实验周期长成本高的技术问题。(Include main circuit board in circuit board the embodiment of the invention discloses a kind of circuit board and electronic equipment, include first area on the main circuit board, the first area is provided with N number of solder joint, and N number of solder joint includes at least first group of solder joint and second group of solder joint；Wherein, first group of solder joint connects the first circuit structure in the main circuit board, and second group of solder joint connects the second circuit structure in the main circuit board；First group of solder joint includes the first solder joint, and second group of solder joint includes the second solder joint, and first solder joint is different from second solder joint.By the way that multiple groups solder joint is arranged in main circuit board first area, connect the corresponding secondary circuit board of multiple groups solder joint, multiple technologies scheme can be realized on one piece of main circuit board, to solve design circuit diagram and experimental period long at high cost technical problem of the R&D personnel in research and development circuitry processes.)

1. a kind of circuit board, which is characterized in that the circuit board includes main circuit board；

It include first area on the main circuit board, the first area is provided with N number of solder joint, and N number of solder joint includes at least First group of solder joint and second group of solder joint；

Wherein, first group of solder joint connects the first circuit structure in the main circuit board, and second group of solder joint connects institute State the second circuit structure in main circuit board；

First group of solder joint includes the first solder joint, and second group of solder joint includes the second solder joint, and first solder joint is different from Second solder joint.

2. circuit board according to claim 1, which is characterized in that the circuit board further includes secondary circuit board；

If the solder joint on the pair circuit board is matched with first group of solder joint, the circuit structure in the pair circuit board passes through Solder joint and first group of solder joint on the pair circuit board are connected to first circuit structure；

If the solder joint on the pair circuit board is matched with second group of solder joint, the circuit structure in the pair circuit board passes through Solder joint and second group of solder joint and the second circuit fabric connectivity on the pair circuit board.

3. circuit board according to claim 2, which is characterized in that if the solder joint on the pair circuit board and described first group Solder joint matching, then the solder joint on the secondary circuit board is connected with first group of solder joint by surface installation technique SMT scolding tin；

If the solder joint on the pair circuit board is matched with second group of solder joint, solder joint on the secondary circuit board and described the Two groups of solder joints are connected by SMT scolding tin.

4. circuit board according to claim 1, it is characterised in that:

First circuit structure and the second circuit structure stack on the direction perpendicular to the main circuit board.

5. circuit board according to claim 1, which is characterized in that first circuit structure includes being deployed in the first insulation The first metal layer in layer；

The second circuit structure includes the second metal layer being deployed in second insulating layer.

6. circuit board according to claim 5, it is characterised in that:

The first metal layer and the second metal layer are made of copper product.

7. circuit board according to any one of claim 1 to 6, it is characterised in that:

The main circuit board is printing board PCB；The pair circuit board is land grid array LGA plate.

8. a kind of electronic equipment, which is characterized in that the electronic equipment includes the electricity as described in any one of claims 1 to 7 Road plate.

This application involves the printed circuit board field (printed circuit board, PCB) more particularly to a kind of circuits Plate and electronic equipment.

With the development of electronic equipment and universal, the function of various electronic equipments is further perfect, and therefore electronic equipment Volume increases also with the complexity of internal circuit and is increased, between the volume and reduction electronic component in order to reduce electronic equipment Wiring, printed circuit board is born under the continuously attempting to and improve of engineers.

The appearance of printed circuit board is so that the development of electronic equipment becomes more rapidly.Printed circuit board is by multilayer dielectric layer And more metal layers are made, and by the way that sheet metal is fabricated to reticulation circuit, separates metal mesh by insulating layer and insulation is used to bond Gap filling between agent and filler will be netted, realizes the cabling inside circuit board.Therefore, it can be by inside circuit board and table Face cabling, and the mode of electronic component welding on circuit boards is replaced directly being interconnected between electronic component with electric wire.By It determines circuits all in circuit board can be fixed when producing printed circuit board in the structure of printed circuit board, as technical research people Member, which needs replacing some in circuit board or multiple electronic components, will redesign circuit diagram in circuit board, and make corresponding Circuit board, increase design circuit diagram and experiment period and cost.

Based on this, a kind of circuit board and electronic equipment are needed at present, for solving the R&D personnel in research and development circuit board The long technical problem at high cost of design circuit diagram and experimental period in the process.

The embodiment of the present invention provides a kind of circuit board and electronic equipment, exists for solving the R&D personnel in the prior art Research and develop the design circuit diagram and long technical problem at high cost experimental period in circuitry processes.

In a first aspect, institute's embodiment of the present invention provides a kind of circuit board, which includes main circuit board；The main circuit It include first area on plate, the first area is provided with N number of solder joint, and N number of solder joint includes at least first group of solder joint and the Two groups of solder joints；Wherein, first group of solder joint connects the first circuit structure in the main circuit board, and second group of solder joint connects Connect the second circuit structure in the main circuit board；First group of solder joint includes the first solder joint, and second group of solder joint includes Second solder joint, first solder joint are different from second solder joint.

According to above content it is found that the first area due to circuit board provided by the embodiments of the present application includes simultaneously two groups of welderings Point, first group of solder joint and second group of solder joint are respectively communicated with the first circuit structure and second circuit structure, and first group of solder joint and Two groups of solder joints can be connect with matched secondary circuit board respectively；It therefore, can be secondary by replacement when the R&D personnel is tested Circuit board realizes the reliability etc. for testing different technical solutions, and then avoids needs when replacing electronic component in the prior art The phenomenon that remaking circuit board shortens the period of the R&D personnel circuit design and experiment, reduces experimental cost.

In a kind of possible design, the circuit board further includes secondary circuit board；If it is described pair circuit board on solder joint with First group of solder joint matching, then the circuit structure in the secondary circuit board passes through solder joint on the secondary circuit board and described the One group of solder joint is connected to first circuit structure；If the solder joint on the pair circuit board is matched with second group of solder joint, Circuit structure in the pair circuit board passes through the solder joint and second group of solder joint and second electricity on the secondary circuit board Line structure connection.

It is described if the solder joint on the pair circuit board is matched with first group of solder joint in a kind of possible design Solder joint on secondary circuit board is connected with first group of solder joint by surface installation technique SMT scolding tin；

Solder joint and institute if the solder joint on the pair circuit board is matched with second group of solder joint, on the pair circuit board Second group of solder joint is stated to connect by surface installation technique SMT scolding tin.

In a kind of possible design, first circuit structure and the second circuit structure are perpendicular to the main electricity It is stacked on the direction of road plate.

In a kind of possible design, first circuit structure includes the first metal being deployed in the first insulating layer Layer；The second circuit structure includes the second metal layer being deployed in second insulating layer.

According to above content it is found that since circuit board provided by the embodiments of the present application may include the first metal layer and Two metal layers；It therefore, can be by the first circuit structure and second circuit when making the first circuit structure and second circuit structure Structure stacks on the direction perpendicular to main circuit board, can reduce the tiling area of main circuit board, and then reduce corresponding electronics The volume of equipment.

In a kind of possible design, the first metal layer and the second metal layer are made of copper product.

In a kind of possible design, the main circuit board is printing board PCB；The pair circuit board is contact array Encapsulate LGA plate.

Second aspect, the embodiment of the present invention provide a kind of electronic equipment, which includes appointing for above-mentioned first aspect A kind of circuit board in possible design.

In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in invention description will be made below Briefly introduce, it should be apparent that, drawings in the following description are only some embodiments of the invention, for the common of this field For technical staff, without any creative labor, it is also possible to obtain other drawings based on these drawings.

Fig. 1 is a kind of structural schematic diagram of circuit board provided in an embodiment of the present invention；

Fig. 2 is a kind of welding spot structure schematic diagram of main circuit board provided in an embodiment of the present invention；

Fig. 3 is a kind of structural schematic diagram of circuit board provided in an embodiment of the present invention；

Fig. 4 is the welding spot structure schematic diagram of another main circuit board provided in an embodiment of the present invention.

Specific embodiment

To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into It is described in detail to one step, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole implementation Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts All other embodiment, shall fall within the protection scope of the present invention.

In the prior art, when the R&D personnel designs circuit diagram, the circuit production in circuit diagram that needs to design It at circuit board and is tested, different technical solutions needs to make different circuit boards and tested, therefore makes different Circuit board and tested so that the period for designing circuit diagram and experiment lengthens, increase cost.

Based on this, the present invention provides a kind of circuit board, for solving the R&D personnel in research and development circuit boards Design circuit diagram and long technical problem at high cost experimental period.

Fig. 1 and Fig. 3 is a kind of structural schematic diagram of circuit board provided in an embodiment of the present invention, as shown in figures 1 and 3, main It include first area on circuit board, first area has multiple groups solder joint, and each group in multiple groups solder joint can connect corresponding electricity Subcomponent or secondary circuit board, the circuit structure connection for connecting electronic component or secondary circuit board with the solder joint of its respective sets.The The electronic component or secondary circuit board connecting in one region with multiple groups solder joint can be replaced according to actual needs.On main circuit board It can also include other regions, for example electronic component region, electronic component region may include connecting with an electronic component One or more solder joints, the circuit structure connection that electronic component solder joint connected to it is connected；In electronic component region One or more solder joints can be to be fixedly connected with the electronic component.

Illustratively, N number of solder joint is provided in the first area on main circuit board, N number of solder joint includes at least first group of weldering Point and second group of solder joint；Wherein, the first circuit structure in first group of solder joint connection main circuit board, second group of solder joint connect main electricity Second circuit structure in the plate of road.Circuit board further includes secondary circuit board；If the solder joint on secondary circuit board is matched with first group of solder joint, Then the circuit structure in secondary circuit board passes through solder joint on secondary circuit board and first group of solder joint is connected to the first circuit structure, if secondary Solder joint on circuit board is matched with second group of solder joint, then the circuit structure in secondary circuit board passes through solder joint on secondary circuit board and the Two groups of solder joints and second circuit fabric connectivity.

Herein, when the solder joint number that N is equal to first group of solder joint solder joint number for including and second group of solder joint includes and when, Main circuit board as shown in Figure 1, secondary circuit board 1 and secondary circuit board 2 have first group of weldering in matching main circuit board in secondary circuit board 1 The solder joint of point, first group of solder joint include 12 solder joints, there is the solder joint of second group of solder joint in matching main circuit board in secondary circuit board 2, Second group of solder joint includes 9 solder joints, then N=21, i.e., have 21 solder joints in first area.Due to being provided with two groups on main circuit board Solder joint, i.e. first group of solder joint and second group of solder joint therefore, will when the R&D personnel needs to test the first technical solution Secondary circuit board 1 is welded on the first area of main circuit board, is connected in main circuit board by first group of solder joint in first area First circuit structure；When the R&D personnel needs to test second of technical solution, secondary circuit board 2 is welded on main circuit board First area, the second circuit structure in main circuit board is connected by second group of solder joint in first area.Fig. 2 is the present invention Embodiment provide a kind of main circuit board welding spot structure schematic diagram, as shown in Figure 2, wherein first group of solder joint include solder joint 1, 2,3,4,5,6,7,8,9,10,11,12, second group of solder joint includes solder joint 13,14,15,16,17,18,19,20,21, and first group Solder joint and second group of solder joint be not completely be overlapped, and the first circuit structure that first group of solder joint is connected is connect with second group of solder joint Second circuit structure is also not to be overlapped completely.

The solder joint number included by less than first group solder joint of N and solder joint number included by second group of solder joint and, and In solder joint number included by solder joint number included by greater than first group solder joint and second group of solder joint when maximum solder joint number, such as Main circuit board shown in Fig. 3, secondary circuit board 1 and secondary circuit board 2 have first group of solder joint in matching main circuit board in secondary circuit board 1 Solder joint, first group of solder joint includes 21 solder joints, have the solder joint of second group of solder joint in matching main circuit board in secondary circuit board 2, the Two groups of solder joints include 12 solder joints, then 21≤N < 33；When the R&D personnel needs to test the first technical solution, by secondary electricity Road plate 1 is welded on the first area of main circuit board, connects first in main circuit board by first group of solder joint in first area Secondary circuit board 2 is welded on the of main circuit board when the R&D personnel needs to test second of technical solution by circuit structure One region connects the second circuit structure in main circuit board by second group of solder joint in first area.Fig. 4 is that the present invention is implemented A kind of welding spot structure schematic diagram for main circuit board that example provides, as shown in Figure 4, wherein first group of solder joint include solder joint 1,2,3, 4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21, second group of solder joint include solder joint 13,14,15, 16,17,18,19,20,21, first group of solder joint and second group of solder joint have 13,14,15,16,17,18,19,20,21 this 9 solder joints Overlapping, therefore, 9 solder joints being overlapped in first group of solder joint are overlapped in the circuit-line and second group of solder joint in the first circuit structure Circuit-line of 9 solder joints in second circuit structure share some or all of this 9 solder joints connection circuit-lines route.

Wherein, solder joint and first group of weldering if the solder joint on secondary circuit board is matched with first group of solder joint, on secondary circuit board Point is connected by surface installation technique (surface mount technology, SMT) scolding tin；If solder joint on secondary circuit board with Second group of solder joint matching, then the solder joint on secondary circuit board and second group of solder joint are connected by SMT scolding tin.

That is, as depicted in figs. 1 and 2, when the solder joint on secondary circuit board 1 and first in main circuit board first area When group solder joint matching, secondary circuit board 1 can be connect with first group of solder joint in main circuit board first area by SMT scolding tin The connection of first circuit structure, can when the solder joint on secondary circuit board 2 is matched with second group of solder joint in main circuit board first area Secondary circuit board two to be connected with the second circuit structure that second group of solder joint is connect in main circuit board first area by SMT scolding tin It connects；So that the electronic component and circuit structure in secondary circuit board 1 and the first circuit structure and first on main circuit board Circuit structure connection other than circuit structure, forms the first set technical solution of the R&D personnel design, and carry out correlative measurement Examination；So that the electronic component in secondary circuit board 2 and second circuit structure and second circuit on circuit structure and main circuit board Circuit structure connection other than structure, forms second set of technical solution of the R&D personnel design, and carry out dependence test.

If main circuit board is PCB, above first circuit structure and second circuit structure are in the direction perpendicular to main circuit board Upper stacking；First circuit structure includes the first metal layer being deployed in the first insulating layer, and second circuit structure includes being deployed in Second metal layer in second insulating layer.The first metal layer and second metal layer are made of copper product.

For example, if in the example above in PCB including two metal layers, i.e. the first metal layer and second metal layer, gold Belong to layer metal and form required circuit structure through techniques such as over etching fillings, and will be needed in circuit structure by corresponding technique It wants the route of connecting electronic component or secondary circuit board to be drawn out to PCB surface and forms solder joint, wherein the on opposite main circuit board The circuit structure that N number of solder joint is connected in one region includes the first circuit structure of first group of solder joint connection, and second group of solder joint connects The second circuit structure connect.For example, the first circuit structure can be set in the first metal layer, second circuit structure may exist In second metal layer；For another example, the first circuit structure can be set in the first metal layer and second metal layer, second circuit Structure also can be set in the first metal layer and second metal layer, specifically with no restrictions.

It should be noted that secondary circuit board may include the PCB of one or more electronic components, it is also possible to contact array LGA plate etc. is encapsulated, specifically without limitation.Main circuit board can be ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics Circuit board, wiring board, PCB, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..The main circuit board can be produced in batches with secondary circuit board, produce in order to control different model The shipment of product.Such as when needing producer to make the circuit board of two kinds of different models, the main electricity in the embodiment of the present application can be designed Road plate and pair circuit board 1 and secondary circuit board 2, the distribution according to need of shipment later assembling main circuit board auxiliary connection circuit board 1 and master The electronic equipment of circuit board auxiliary connection circuit board 2.Alternatively, it is also possible to by setting independent replaceable module for secondary circuit board, If the card slot mode of SIM cards of mobile phones can replace SIM card at any time, realize the equipment of corresponding main circuit board by inserting in this way Enter different replaceable secondary circuit board modules and reduces corresponding main electricity so that an equipment be made to possess the corresponding function of different model The volume of the equipment of road plate, and increase the function of the equipment of corresponding main circuit board.

It should be understood by those skilled in the art that, embodiments herein can provide as method, system or computer program Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the application Apply the form of example.Moreover, it wherein includes the computer of computer usable program code that the application, which can be used in one or more, The computer program implemented in usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.) produces The form of product.

The application be referring to according to the present processes, equipment (system) and computer program product flow chart and/or Block diagram describes.It should be understood that each process that can be realized by computer program instructions in flowchart and/or the block diagram and/or The combination of process and/or box in box and flowchart and/or the block diagram.It can provide these computer program instructions to arrive General purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices processor to generate one Machine, so that being generated by the instruction that computer or the processor of other programmable data processing devices execute for realizing flowing The device for the function of being specified in journey figure one process or multiple processes and/or block diagrams one box or multiple boxes.

These computer program instructions, which may also be stored in, is able to guide computer or other programmable data processing devices with spy Determine in the computer-readable memory that mode works, so that it includes referring to that instruction stored in the computer readable memory, which generates, Enable the manufacture of device, the command device realize in one box of one or more flows of the flowchart and/or block diagram or The function of being specified in multiple boxes.

These computer program instructions also can be loaded onto a computer or other programmable data processing device, so that counting Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, thus in computer or The instruction executed on other programmable devices is provided for realizing in one or more flows of the flowchart and/or block diagram one The step of function of being specified in a box or multiple boxes.

Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies Within, then the application is also intended to include these modifications and variations.