阅读说明：本技术 电介质波导管的连接结构 (The connection structure of dielectric-filled waveguide ) 是由 吉冈秀浩 森本康夫 米田尚史 广田明道 滨田伦一 羽立刚 于 2017-04-12 设计创作，主要内容包括：在将设置有沿多层电介质基板内的层叠方向由导体图案和通孔形成的电介质波导管的多层电介质基板之间电连接的结构中,在为了电连接波导管而设置有扼流结构的多层电介质基板侧,构成电介质波导管的管壁的一部分的通孔呈交错状排列。(In the structure being electrically connected between the multi-layer dielectric substrate for the dielectric-filled waveguide for forming the stacking direction being provided in multi-layer dielectric substrate by conductive pattern and through-hole, in the multi-layer dielectric substrate-side for being provided with choke structure in order to be electrically connected waveguide, the cross-shaped arrangement of through-hole of a part of the tube wall of dielectric-filled waveguide is constituted.)

1. a kind of connection structure of dielectric-filled waveguide, consists of and has:

1st multi-layer dielectric substrate has the 1st dielectric-filled waveguide for being formed with the 1st opening portion, and propagates high-frequency signal； And

2nd multi-layer dielectric substrate has the 2nd dielectric-filled waveguide for being formed with the 2nd opening portion, and with the 1st opening Portion with the 2nd opening portion is across the 1st space and mode opposite each other and the 1st multi-layer dielectric substrate are arranged opposite, And high-frequency signal is propagated,

The 1st multi-layer dielectric substrate includes:

1st skin conductor is disposed over the surface side opposed with the 2nd multi-layer dielectric substrate, and is formed with the described 1st Opening portion is clipping the 1st opening portion and from position shape at opposed two that the end of the 1st opening portion has left λ/4 1 notch of Cheng You；

1st inner conductor is oppositely disposed in the 1st multi-layer dielectric substrate with the 1st skin conductor, with institute It states the opposed position in the 1st opening portion and is formed with the 1st conductor removal portion；And

1st conductor pin, from the 1st skin conductor along the 1st multi-layer dielectric in a manner of surrounding the 1st opening portion The stacking direction of substrate extends, and is provided with through the 1st inner conductor multiple, and is arranged as forming the described 1st electric The tube wall of dielectric waveguide,

The 1st multi-layer dielectric substrate is clipping the 1st opening portion and position has choke structure at opposed two,

The choke structure includes: the 1st chokes road, the length with λ/4；With the 2nd chokes road, the length with λ e/4,

The 1st chokes road is formed as in the 1st space from the end of the 1st opening portion Space only,

The 2nd chokes road is formed as in the 2nd space between the 1st skin conductor and the 1st inner conductor by the 3rd Space that conductor pin and the 1st conductor pin surround, the 3rd conductor pin along in the edge of the 1st notch with it is described The edge of the opposite side in side locating for 1st dielectric-filled waveguide, to connect the 1st skin conductor and the 1st internal layer The mode of conductor be provided with it is multiple,

A part of 1st conductor pin is configured in the position for having left λ e/4 from the 1st notch towards the 1st opening portion,

Wherein, λ is the free space wavelength of signal wave, and λ e is the effective wavelength of dielectric base plate.

2. the connection structure of dielectric-filled waveguide according to claim 1, wherein

1st opening portion and the 2nd opening portion are formed as rectangular shape, and the bond length as short-axis direction is formed as making For the half length below of the long side length of long axis direction.

3. the connection structure of dielectric-filled waveguide according to claim 1, wherein

1st opening portion and the 2nd opening portion are formed as elliptical shape, and the minor axis length as short-axis direction is formed as making For the half length below of the long axis length of long axis direction.

4. according to claim 1 to the connection structure of dielectric-filled waveguide described in any one in 3, wherein

1st notch is at the opposite position in the center of the long axis direction with the 1st opening portion apart from the 1st opening End λ/4 in portion,

1st notch is at the position opposite with the end of long axis direction of the 1st opening portion apart from the 1st opening End λ/8 in portion hereinafter,

1st notch is formed as U-shaped and removing a part of the 1st skin conductor by certain width.

5. according to claim 1 to the connection structure of dielectric-filled waveguide described in any one in 4, wherein

Compared with the 2nd opening portion and the 1st conductor removal portion, opening area is big for 1st opening portion.

6. according to claim 1 to the connection structure of dielectric-filled waveguide described in any one in 5, wherein

The 2nd multi-layer dielectric substrate includes:

2nd skin conductor is disposed over the surface side opposed with the 1st multi-layer dielectric substrate；And

2nd inner conductor is oppositely disposed in the 2nd multi-layer dielectric substrate with the 2nd skin conductor, with institute It states the opposed position in the 2nd opening portion and is formed with the 2nd conductor removal portion,

Compared with the 2nd conductor removal portion and the 1st conductor removal portion, opening area is small for 2nd opening portion.

7. according to claim 1 to the connection structure of dielectric-filled waveguide described in any one in 6, wherein

The 1st multi-layer dielectric substrate further includes the 1st short-circuit conductor, the configuration of the 1st short-circuit conductor and the 1st inner conductor There is the opposing face in the face of the 1st skin conductor to configure oppositely,

Multiple 4th conductor pins are provided in a manner of surrounding the 1st conductor removal portion, the 4th conductor pin is out of described 1st Layer conductor extends through the 1st short-circuit conductor.

8. according to claim 1 to the connection structure of dielectric-filled waveguide described in any one in 7, wherein

In the 1st space, dielectric is configured with outside the region for being provided with the 1st opening portion and the 1st chokes road.

Technical field

The present invention relates to the electricity of the dielectric-filled waveguide for the high-frequency signal for constituting main propagation micron waveband and millimere-wave band Connection structure between medium substrate.

Background technique

In the past, known following such connection structure in the high frequency signal transmission between dielectric base plate, makes to respectively constitute It is close and opposed in the opening of the dielectric-filled waveguide of the dielectric base plate.In such connection structure, due to electromagnetic wave from Generate clearance leakage between the opening of dielectric-filled waveguide, thus frequency transfer characteristic between dielectric base plate and Isolation characteristic deterioration between adjacent high-frequency transmission line.

Therefore, in order to inhibit electromagnetic wave from generating clearance leakage between the opening of dielectric-filled waveguide, using it is following this The choke structure of sample: it consists of and has from the open end of dielectric-filled waveguide along the gap generated between dielectric base plate 1st chokes road and the 2nd chokes road (referring for example to patent document 1).

1st chokes road is equivalent to following such chokes road: it is from the open end of dielectric-filled waveguide along generation in electricity Gap between medium substrate, into the dielectric base plate surface conductor at the position of e '/4 λ until the notch that is arranged.This Place, λ e ' is the effective wavelength in gap.

In addition, the 2nd chokes road is equivalent to following such chokes road: it is from the notch, inside dielectric base plate Stacking direction has the length of λ e/4 to in-plane.Herein, λ e is the effective wavelength of dielectric base plate.

In addition, previous, known following such waveguide pipe connecting structure: consisting of includes: to be made of dielectric base plate Dielectric-filled waveguide or hollow waveguide；And the metallic waveguide of plate, the dielectric-filled waveguide or the hollow waveguide Opening approached with the opening of the metallic waveguide and arranged opposite.

In such waveguide pipe connecting structure, also for inhibition electromagnetic wave from generating in dielectric-filled waveguide or hollow wave Choke structure is set to dielectric base plate and (such as joined by the clearance leakage between the opening of conduit and the opening of metallic waveguide According to patent document 2).

Moreover, in previous metal waveguide pipe connecting structure, known following such choke structure: it is from waveguide Wide surface side open end is formed as including the 1st chokes road and the 2nd chokes road (referring for example to special along generating in intermetallic gap Sharp document 3).

1st chokes road is equivalent to following such chokes road: it is from the wide surface side open end of waveguide along generation in gold Gap between category, into the metal at the position of λ/4 until the borehole that is arranged.Herein, λ is free space wavelength.In addition, 2nd chokes road is equivalent to from the borehole in the depth direction with the chokes road of the length of λ/4.

Moreover, known following such connection structure: will be connect in previous metal hollow waveguide pipe connecting structure Size is set as respectively different value in length and breadth in the pipe of 2 close and opposed waveguides (referring for example to patent document 4).

Summary of the invention

Problems to be solved by the invention

But in the prior art, there are following such projects.

The connection structure for the dielectric-filled waveguide recorded in patent document 1 fills dielectric bonding agent between dielectric base plate, Fixed adjacent dielectric base plate.Therefore, dielectric base plate is difficult to separate again.

In addition, the influence that generates of the positional shift when thickness error or substrate sticking of dielectric adhesive layer and dielectric base The case where being air between plate, is compared, the subduplicate value for the relative dielectric constant for taking dielectric bonding agent that doubled.Therefore, in chokes In structure, electrical length until from the open end of dielectric-filled waveguide to the notch for being set to dielectric base plate surface conductor at For the value for deviateing λ e/4, lead to deterioration in characteristics.

Moreover, the waveguide pipe connecting structure recorded in patent document 1 inhibit the 2nd chokes curb in choke structure electricity The stacking direction of medium substrate realizes the slimming of the connection structure of dielectric-filled waveguide.However, will be in choke structure 2nd chokes curb dielectric base plate stacking direction be formed as relative to wavelength sufficiently it is thin in the case where, it is necessary to by the 2nd chokes Road is formed as the length for having equal to λ e/4 on the in-plane in dielectric base plate.

Therefore, become (λ from the open end of dielectric-filled waveguide to the in-plane of dielectric base plate as choke structure The length of e '+λ e)/4.Therefore, when being adjacent to the same waveguide pipe connecting structure of configuration, adjacent dielectric-filled waveguide is opened The interval of mouth end and open end is necessary for (λ e '+λ e)/2 or more.As a result, there are the areas of dielectric base plate for patent document 1 The problem of increase.

In addition, disclosing in the waveguide pipe connecting structure recorded in patent document 2 by the 1st chokes road and the 2nd chokes road Choke structure is formed, the 1st chokes road is from the open end of dielectric-filled waveguide along the gap generated between dielectric base plate to phase Until the notch being arranged in dielectric base plate surface conductor at position away from λ/4, the 2nd chokes road is from the notch from dielectric Stacking direction inside substrate has the length of λ e/4 to the in-plane of waveguide side.

However, in the case where sufficiently thinly forming the 2nd chokes road relative to wavelength on the stacking direction of dielectric base plate, The distance of end from the open end of dielectric-filled waveguide to the dielectric-filled waveguide side on the 2nd chokes road is only (λ-λ e)/4.Cause This, it is difficult to make in the end of the dielectric-filled waveguide side on through-hole used in the tube wall by dielectric-filled waveguide and the 2nd chokes road Through-hole is arranged respectively at most right position and sets.Therefore, patent document 2 has the problem of deterioration in characteristics of dielectric-filled waveguide.

In addition, disclosing the chokes knot with Qian font borehole in the waveguide pipe connecting structure recorded in patent document 3 Structure.However, the 2nd chokes are sufficiently thinly formed relative to wavelength on the stacking direction of dielectric base plate using dielectric base plate It is same as patent document 2 in the case where road, from the open end of dielectric-filled waveguide to the dielectric-filled waveguide side on the 2nd chokes road End distance be only (λ-λ e)/4.

Accordingly, it is difficult to the dielectric-filled waveguide side of through-hole and the 2nd chokes road used in tube wall by dielectric-filled waveguide End used in through-hole be arranged respectively at most right position and set.Therefore, also the characteristic with dielectric-filled waveguide is bad for patent document 3 The problem of change.

Moreover, disclosing close and 2 opposed waveguides in the waveguide pipe connecting structure recorded in patent document 4 In pipe in the respectively different connection structure of size in length and breadth.However, asperratio is different in the pipe in each waveguide In the case of, become the state for being connected with routes with certain electrical length, that impedance is different.Therefore, patent document 4 also has electricity The problem of deterioration in characteristics of dielectric waveguide.

In addition, positional shift when in order to allow waveguide to connect, considers the pipe inside dimension ratio for increasing 2 waveguides.So And if excessively increasing pipe inside dimension ratio, it problem arises that is, generating in the state of no positional shift all The loss of unallowable degree.

The present invention is completed to solve project as described above, it is therefore intended that obtains a kind of dielectric-filled waveguide Connection structure in the high frequency signal transmission between dielectric base plate, is suitble to small-sized and stacking structure, and reflection characteristic and It is good by characteristic.

Means for solving the problems

Dielectric waveguide pipe connecting structure of the invention is configured to have: the 1st multi-layer dielectric substrate, has and is formed with 1st dielectric-filled waveguide of the 1st opening portion, and propagate high-frequency signal；And the 2nd multi-layer dielectric substrate, have and is formed with 2nd dielectric-filled waveguide of the 2nd opening portion, and with the 1st opening portion and the 2nd opening portion across the 1st space side opposite each other Formula and the 1st multi-layer dielectric substrate are arranged opposite, and propagate high-frequency signal, and the 1st multi-layer dielectric substrate includes: that the 1st surface layer is led Body is disposed over the surface side opposed with the 2nd multi-layer dielectric substrate, and is formed with the 1st opening portion, is clipping the 1st opening Portion and position is formed with the 1st notch from having left opposed two of λ/4 from the end of the 1st opening portion；1st inner conductor, with 1st skin conductor is oppositely disposed in the 1st multi-layer dielectric substrate, is formed with the 1st in the position opposed with the 1st opening portion and is led Body removal portion；And the 1st conductor pin, from the 1st skin conductor along the 1st multi-layer dielectric base in a manner of surrounding the 1st opening portion The stacking direction of plate extends, and is provided with through the 1st inner conductor multiple, and is arranged as forming the 1st dielectric-filled waveguide Tube wall, the 1st multi-layer dielectric substrate clipping the 1st opening portion and position has choke structure, choke structure at opposed two It include: the 1st chokes road, the length with λ/4；With the 2nd chokes road, the length with λ e/4,1 sky of the 1st chokes Lu The interior space be formed as until the end to the 1st notch of the 1st opening portion, 1 skin conductor of the 2nd chokes Lu and the 1st Be formed as the space surrounded by the 3rd conductor pin and the 1st conductor pin in the 2nd space between inner conductor, the 3rd conductor pin along The edge of the side opposite with side locating for the 1st dielectric-filled waveguide in the edge of 1st notch is led with connecting the 1st surface layer The mode of body and the 1st inner conductor is provided with multiple, and a part configuration of the 1st conductor pin is from the 1st notch towards the 1st opening portion Have left the position of λ e/4.

Invention effect

According to the present invention, the more of the dielectric-filled waveguide formed in the stacking direction by conductive pattern and through-hole will be provided with In the structure that layer dielectric base plate is electrically connected to each other, has with flowering structure: the multi-layer dielectric for being provided with choke structure will be constituted The cross-shaped arrangement of the through-hole of a part of the tube wall of the dielectric-filled waveguide of substrate-side.It, can by having such structure The characteristic of dielectric-filled waveguide is maintained, while keeping the electrical length of choke structure best.As a result, a kind of electricity Jie can be obtained The connection structure of matter waveguide in the high frequency signal transmission between dielectric base plate, is suitble to small-sized and stacking structure, and Reflection characteristic and by characteristic it is good.

Detailed description of the invention

Fig. 1 is the longitudinal section view for showing the connection structure of dielectric-filled waveguide of embodiments of the present invention 1.

Fig. 2 is other longitudinal section views of the II-II ' line along Fig. 1 in embodiments of the present invention 1.

Fig. 3 is the conductor layer for showing Fig. 1 in embodiments of the present invention 1 and the exploded perspective view of conductor through-hole.

Fig. 4 A is the company for showing the previous dielectric-filled waveguide not in zigzag configuration about the through-hole of dielectric tube wall The simulation result of the reflection characteristic of the connection structure of the dielectric-filled waveguide of an example and embodiments of the present invention 1 of binding structure Figure.

Fig. 4 B is the company for showing the previous dielectric-filled waveguide not in zigzag configuration about the through-hole of dielectric tube wall The simulation result by characteristic of the connection structure of the dielectric-filled waveguide of an example and embodiments of the present invention 1 of binding structure Figure.

Fig. 5 A is the top view for illustrating the connection structure of the dielectric-filled waveguide with previous choke structure.

Fig. 5 B is the longitudinal section view along the I-I ' line of Fig. 5 A.

Fig. 5 C is other longitudinal section views along the III-III ' line of Fig. 5 A.

Fig. 5 D is other longitudinal section views along the II-II ' line of Fig. 5 A.

Fig. 6 A is the connection structure for illustrating the dielectric-filled waveguide of the choke structure with embodiments of the present invention 1 Top view.

Fig. 6 B is the longitudinal section view along the I-I ' line of Fig. 6 A.

Fig. 6 C is other longitudinal section views along the III-III ' line of Fig. 6 A.

Fig. 6 D is other longitudinal section views along the II-II ' line of Fig. 6 A.

Fig. 7 A is the connection structure for illustrating the dielectric-filled waveguide of the choke structure with embodiments of the present invention 1 Top view.

Fig. 7 B is the longitudinal section view along the I-I ' line of Fig. 7 A.

Fig. 7 C is other longitudinal section views along the III-III ' line of Fig. 7 A.

Fig. 7 D is other longitudinal section views along the II-II ' line of Fig. 7 A.

Fig. 8 A is the connection structure for illustrating the dielectric-filled waveguide of the choke structure with embodiments of the present invention 1 Top view.

Fig. 8 B is the longitudinal section view along the I-I ' line of Fig. 8 A.

Fig. 8 C is other longitudinal section views along the III-III ' line of Fig. 8 A.

Fig. 8 D is other longitudinal section views along the II-II ' line of Fig. 8 A.

Fig. 9 A is the connection structure for illustrating the dielectric-filled waveguide of the choke structure with embodiments of the present invention 1 Top view.

Fig. 9 B is the longitudinal section view along the I-I ' line of Fig. 9 A.

Fig. 9 C is other longitudinal section views along the III-III ' line of Fig. 9 A.

Fig. 9 D is other longitudinal section views along the II-II ' line of Fig. 9 A.

Figure 10 A is the connection knot for illustrating the dielectric-filled waveguide of the choke structure with embodiments of the present invention 1 The top view of structure.

Figure 10 B is the longitudinal section view along the I-I ' line of Figure 10 A.

Figure 10 C is other longitudinal section views along the III-III ' line of Figure 10 A.

Figure 10 D is other longitudinal section views along the II-II ' line of Figure 10 A.

Figure 11 is the longitudinal section view for showing the connection structure of dielectric-filled waveguide of embodiments of the present invention 2.

Figure 12 is other longitudinal section views of the II-II ' line along Figure 11 in embodiments of the present invention 2.

Figure 13 is the conductor layer for showing Figure 11 in embodiments of the present invention 2 and the exploded perspective view of conductor through-hole.

Figure 14 is the longitudinal section view for showing the connection structure of dielectric-filled waveguide of embodiments of the present invention 3.

Figure 15 is other longitudinal section views of the II-II ' line along Figure 14 in embodiments of the present invention 3.

Figure 16 is point of the conductor layer for showing Figure 14 in embodiments of the present invention 3, conductor through-hole and sheet dielectric Solve perspective view.

Specific embodiment

Hereinafter, being illustrated using attached drawing to the preferred embodiment of the connection structure of dielectric-filled waveguide of the invention.