阅读说明：本技术 用于PCIe应用的集成连接器装置 (Integrated connector apparatus for PCIe application ) 是由 托马斯·拉斯孔 萨尹·丁恩 ***·萨博瑞 于 2018-03-14 设计创作，主要内容包括：本发明公开了一种集成连接器模块(ICM)。在一个实施方式中,所述ICM包括多个屏蔽部件,所述多个屏蔽部件包括端口-端口屏蔽件、插入件-插入件屏蔽件和主体屏蔽件。所述ICM还包括一个或多个壳体部件,所述一个或多个壳体部件包括多个端口,所述多个端口被布置成从所述一个或多个壳体部件的主信号调节部分偏移；以及电子组件,所述电子组件设置在所述一个或多个壳体部件内。还公开了用于利用和制造上述ICM的方法和装置。(The invention discloses a kind of integrated connector modules (ICM).In one embodiment, the ICM includes multiple shield members, and the multiple shield member includes port-portmask part, insertion piece-insertion piece shielding part and main shield part.The ICM further includes one or more housing parts, and one or more of housing parts include multiple ports, and the multiple port, which is arranged to from the main signal of one or more of housing parts, adjusts partial offset；And electronic building brick, the electronic building brick are arranged in one or more of housing parts.Also disclose the method and apparatus for utilizing and manufacturing above-mentioned ICM.)

1. a kind of integrated connector module (ICM), comprising:

Multiple shield members, the multiple shield member include port-portmask part, insertion piece-insertion piece shielding part and master Body shielding part；

One or more housing parts, one or more of housing parts include multiple ports, and the multiple port is arranged It is deviated at from the signal conditioning portions of one or more of housing parts；And

Electronic building brick, the electronic building brick are arranged in the signal conditioning portions of one or more of housing parts.

2. ICM according to claim 1, wherein the port-portmask part, the insertion piece-insertion piece shielding part It respectively include discrete shielding element with the main shield part.

3. ICM according to claim 2 further includes described in multiple plug inserts and upper substrate, electronic building brick is at least A part is co-located in the multiple plug inserts and the upper substrate.

4. ICM according to claim 3, wherein the upper substrate is arranged on the top of multiple plug inserts, it is described on Substrate includes global facility, so that the upper substrate is shared for each of the multiple plug inserts.

5. ICM according to claim 2, wherein the port-portmask part further includes port-portmask tab, The port-portmask tab is configured to engage the main shield part.

6. ICM according to claim 5, wherein the main shield part includes preceding shielding part and rear shielding part, the end Mouth-portmask part tab is configured to engage with the preceding shielding part.

7. ICM according to claim 6, wherein the insertion piece-insertion piece shielding part includes rear shield tab, it is described Rear shield tab is configured to engage with the rear shielding part.

8. ICM according to claim 1, wherein one or more of housing parts include at least two housing parts, At least two housing parts are configured to via using one or more mortise/joggles to be engaged with each other.

9. a kind of for standardizing the Printed Circuit Card of application, the Printed Circuit Card includes:

Printed circuit board, the printed circuit board have integrated connector module mounted thereto；And

Input/output (I/O) mounting bracket；

Wherein the integrated connector module includes:

Multiple shield members, the multiple shield member include port-portmask part, insertion piece-insertion piece shielding part and master Body shielding part；

One or more housing parts, one or more of housing parts include multiple ports, and the multiple port is arranged It is deviated at from the signal conditioning portions of one or more of housing parts；And

Electronic building brick, the electronic building brick are arranged in the signal conditioning portions of one or more of housing parts.

10. the printed circuit board 9 according to claim, wherein the standardization application program meets peripheral component interconnection height Fast (PCIe) application.

11. the printed circuit board 9 according to claim, wherein the main shield part includes mounting bracket engagement features, The mounting bracket engagement features include being configured to apply stressed elastic part to the I/O mounting bracket.

12. a kind of integrated connector module (ICM), comprising:

Main casing, the main casing, which has, is at least partially installed at multiple plug inserts therein, and the multiple plug is inserted Enter part with upper substrate mounted thereto；

Multiple shield members, the multiple shield member include:

Port-portmask part, the port-portmask part are arranged between the intracorporal adjacent port of the main casing；

Insertion piece-insertion piece shielding part, the insertion piece-insertion piece shielding part are arranged in adjacent slotting in multiple plug inserts Enter between part；And

Main shield part, the main shield part are arranged at least partly around the main casing；And electronic building brick, the electricity Sub-component is arranged in the signal conditioning portions of the main casing.

13. ICM according to claim 12, wherein compared with not including the similar ICM of the port-portmask part, It can inhibit Alien Next (ANEXT) using the port-portmask part.

14. ICM according to claim 12, wherein the port-portmask part further includes that port-portmask is prominent Piece, the port-portmask tab are configured to main shield part described in resilient engagement.

15. ICM according to claim 14, wherein the main shield part includes preceding shielding part and rear shielding part, it is described Port-portmask part tab is configured to and the preceding shielding part resilient engagement.

16. ICM according to claim 15, wherein the insertion piece-insertion piece shielding part includes rear shield tab, institute Rear shield tab is stated to be configured to and the rear shielding part resilient engagement.

17. ICM according to claim 16, wherein the insertion piece-insertion piece shielding part includes for the port-end The discrete mask element of mouth shielding part.

18. ICM according to claim 12, wherein the main casing includes port section and signal conditioning portions jointly, The port section is deviated from the signal conditioning portions.

19. ICM according to claim 18, wherein the main casing includes procapsid and back casing, the procapsid packet Include the port section and the signal conditioning portions.

20. ICM according to claim 19, wherein the back casing includes the port section and the Signal Regulation portion Point.

1. technical field

Present invention relates generally to electronic components, and are specifically related to its Curve guide impeller, and manufacture includes internal electron portion The method of the single port or multiport integrated connector module (ICM) of part.

2. description of related art

Registered jack (such as connector of " RJ " configuration) is well-known in the electronics industry.Such connector Suitable for receiving one or more different types of modular plugs (for example, RJ-45 or RJ-11), and in modular plug and The terminal of signal is transmitted between parent device associated with connector.In general, connector executes certain shape to the signal by it The Signal Regulation (for example, filtering, voltage transformation etc.) of formula.These connectors including circuit for signal conditioning are known as integrated connect recently Meet device module (ICM).

The feasible connector design of production efficient and cost-effective is related to many different consideration factors.Such Consideration packet It includes, such as: the available volume of (i) connector and " occupied area "；(ii) electric state indicator (for example, LED) is needed； (iii) cost associated with assembly and manufacturing equipment and complexity；(iv) various electric components and signal condition configuration are adapted to Ability；(v) the electrical and noise performance of equipment；(vi) reliability of equipment；(vii) modification design is to adapt to complementary technology Ability；(viii) with the compatibility of existing terminal and " pin " standard and application；(ix) by connector be configured to multiple ports it One ability may have the internal part of independent modification to configure, and (ix) may repair or replace defective component.

With using different standards, such as peripheral parts interconnected quick (PCIe), above-mentioned available volume and land occupation face Product becomes complicated.PCIe standard limits the available space of RJ type connector；Especially being that it limits can be used for using these The available space of the ICM solution of PCIe compatible printed circuit board (PCB).In addition, the continuous increasing to data connection and function More uses of these connectors in wider application range of long demand driving.Increased data rate requirement, it is all The data rate requirement being such as strictly required under so-called " gigabit Ethernet " (GBE) standard (for example, 1G, 5G, 10G), Increase the performance requirement to these connectors.As more abilities and component (such as discrete and integrated circuit) are disposed in In connector, it is also necessary to more efficiently use the volume available in connector, and for preventing harmful electromagnetic interference (EMI) Shielding.

Accordingly, it is desired to provide a kind of improved ICM, can be deployed in the high-performance and limited floor of such as above-mentioned PCIe In the application of area availability.Allow to be ready in connector signal path using a variety of different to this ICM design ideal Electronic signal regulating member, and use state indicator if necessary.Improved ICM design is also convenient for assembling, and It is readily integrated into complicated floor area requirement.The design can also be integrated into single port or multiport ICM, and being included in needs Change with each port of component when wanting to the ability of the configuration of associated internal component.

Summary of the invention

The disclosure meets the demand particularly by improved ICM component is provided, and the ICM component is particularly for PCIe Using and for manufacture and use PCIe application method.

In one aspect, a kind of integrated connector module (ICM) is disclosed.In one embodiment, ICM includes: more A shield member, the multiple shield member include port-portmask part, insertion piece-insertion piece shielding part and main shield Part；One or more housing parts, one or more of housing parts include multiple ports, and the multiple port is arranged to It is deviated from the signal conditioning portions of one or more of housing parts；And electronic building brick, the electronic building brick are arranged in institute It states in the signal conditioning portions of one or more housing parts.

In a variant, the port-portmask part, the insertion piece-insertion piece shielding part and the main body screen Shield respectively includes discrete shielding element.

In another modification, ICM further includes at least one of electronic building brick described in multiple plug inserts and upper substrate Divide and is co-located in the multiple plug inserts and the upper substrate.

In another modification, the upper substrate is arranged on the top of multiple plug inserts, and the upper substrate includes whole Body component, so that the upper substrate is shared for each of the multiple plug inserts.

In another modification, the port-portmask part further includes port-portmask tab, the port-end Mouth shielding tab is configured to engage the main shield part.

In another modification, the main shield part includes preceding shielding part and rear shielding part, the port-portmask Part tab is configured to engage with the preceding shielding part.

In another modification, the insertion piece-insertion piece shielding part includes rear shield tab, and the rear shield is prominent Piece is configured to engage with the rear shielding part.

In another modification, one or more of housing parts include at least two housing parts, described at least two A housing parts are configured to via using one or more mortise/joggles to be engaged with each other.

In another embodiment, ICM includes: main casing, and the main casing, which has, to be at least partially installed at wherein Multiple plug inserts, the multiple plug inserts have upper substrate mounted thereto；Multiple shield members are described more A shield member includes: port-portmask part, and the port-portmask part is arranged in the intracorporal phase of the main casing Between neighboring terminal mouth；Insertion piece-insertion piece shielding part, the insertion piece-insertion piece shielding part are arranged in multiple plug inserts Adjacent insert between；And main shield part, the main shield part are arranged at least partly around the main casing；With And electronic building brick, the electronic building brick are arranged in the signal conditioning portions of the main casing.

In a variant, compared with not including the similar ICM of the port-portmask part, the port-end is used Mouth shielding part can inhibit Alien Next (ANEXT).

In another modification, the port-portmask part further includes port-portmask tab, the port-end Mouth shielding tab is configured to main shield part described in resilient engagement.

In another modification, the main shield part includes preceding shielding part and rear shielding part, the port-portmask Part tab is configured to and the preceding shielding part resilient engagement.

In another modification, the insertion piece-insertion piece shielding part includes rear shield tab, and the rear shield is prominent Piece is configured to and the rear shielding part resilient engagement.

In another modification, the insertion piece-insertion piece shielding part is discrete for the port-portmask part Shielding element.

In another modification, the main casing includes port section and signal conditioning portions, the port section jointly It is deviated from the signal conditioning portions.

In another modification, the main casing includes procapsid and back casing, and the procapsid includes the port part Divide and the signal conditioning portions.

In another modification, the back casing includes the port section and the signal conditioning portions.

In another aspect, a kind of Printed Circuit Card is disclosed.In one embodiment, printed circuit board is for marking Standardization application, and including printed circuit board, the printed circuit board has integrated connector module mounted thereto；And it is defeated Enter/export (I/O) mounting bracket.Integrated connector module includes: multiple shield members, and the multiple shield member includes end Mouth-portmask part, insertion piece-insertion piece shielding part and main shield part；One or more housing parts, it is one or more A housing parts include multiple ports, and the multiple port is arranged to the Signal Regulation from one or more of housing parts Partial offset；And the Signal Regulation of one or more of housing parts is arranged in electronic building brick, the electronic building brick In part.

In a variant, the standardization application program meets peripheral component interconnection high speed (PCIe) application.

In a variant, the main shield part includes mounting bracket engagement features, the mounting bracket engagement features Including being configured to apply stressed elastic part to the I/O mounting bracket.

It yet still another aspect, disclosing a kind of communication device including above-mentioned Printed Circuit Card.In one embodiment, lead to T unit Printed Circuit Card includes printed circuit board, and integrated connector module is equipped on the printed circuit board；And input/defeated (I/O) mounting bracket out.Integrated connector module includes: multiple shield members, and the multiple shield member includes port-port Shielding part, insertion piece-insertion piece shielding part and main shield part；One or more housing parts, one or more of shells Component includes multiple ports, and the multiple port is arranged to inclined from the signal conditioning portions of one or more of housing parts It moves；And electronic building brick, the electronic building brick are arranged in the signal conditioning portions of one or more of housing parts.

In another aspect, the method for manufacturing above-mentioned ICM is disclosed.

In another aspect, the method for manufacturing above-mentioned Printed Circuit Card is disclosed.

In another aspect, the method for manufacture aforementioned communication device is disclosed.

In another aspect, the method using aforementioned ICM is disclosed.

From the detailed description and attached drawing of following preferred embodiment, the various purposes of present subject matter, feature, aspect and Advantage will be apparent.

Detailed description of the invention

Fig. 1 is the perspective view according to the illustrative embodiments for the ICM of disclosure principle being mounted in PCIe application.

Figure 1A is the perspective view according to the exemplary ICM of Fig. 1 of the principle of the disclosure.

Figure 1B is according to the perspective view of the exemplary ICM of Figure 1A of the principle of the disclosure, wherein external EMI shielding is moved It removes.

Fig. 1 C is the perspective view according to the rear side of the procapsid of the ICM for Figure 1A of the principle of the disclosure.

Fig. 1 D is the perspective view according to the back casing of the ICM for Figure 1A of the principle of the disclosure.

Fig. 1 E is the perspective view according to the insertion piece component of the ICM for Figure 1A of the principle of the disclosure.

Fig. 1 F is the perspective view according to the downside of the insertion piece component of Fig. 1 E of the principle of the disclosure.

Fig. 1 G is according to the perspective view of the insertion piece component of Fig. 1 E of the principle of the disclosure, and wherein upper substrate is moved from view It removes.

Fig. 1 H is the perspective view according to the plug inserts of the principle of the disclosure being used together with the ICM of Figure 1A.

Fig. 1 I is the insertion piece being used together with the ICM of Figure 1A-insertion piece shielding part component according to the principle of the disclosure Perspective view.

Fig. 1 J is the perspective view according to the rear shielding part of the principle of the disclosure being used together with the ICM of Figure 1A.

Fig. 1 K is the port being used together with the ICM of Figure 1A-portmask part perspective view according to the principle of the disclosure.

Fig. 1 L is the perspective view according to the rear side of the preceding shielding part of the ICM for Figure 1A of the principle of the disclosure.

Fig. 2 is showing for the exemplary electronic component encapsulation in accordance with the principles of the present invention for being used together with the ICM of Figure 1A It is intended to.

Fig. 3 is the logical flow chart according to the illustrative methods of the ICM of manufacture Figure 1A of the principle of the disclosure.

All attached drawings disclosed herein are2017-2018Pulse Electronics,Inc.It protects Stay all authority.

Specific embodiment

Referring now to the drawings, wherein identical label always shows identical component.

Although should be noted that following description is mainly related to type known in this field according to multiple RJ type connectors Modular plug is realized, but the disclosure can be used in combination with any amount of different connector types.Therefore, right below The discussion of rj connector and plug is only the example of more broad concept.

As used herein, term " electric component " and " electronic component " are used interchangeably, and are referred to and be adapted to provide for certain Electrical and/or signal conditioning functions components, including but not limited to inductive reactance device (" choking-winding "), transformer, filter, Transistor, gap iron core ring, inductor (coupling or other), capacitor, resistor, operational amplifier and diode, either Discrete parts or integrated circuit, either individually or combination.

As used herein, term " Signal Regulation " or " adjusting " should be read to include but be not limited to signal voltage change It changes, filter, current limit, sampling, processing and time delay.

As used herein, term " top ", " bottom ", " side ", " upward ", " downward ", " top ", " lower part ", "front", "rear" etc. merely means that the geometry of relative position or a component and another component and by no means implies that absolutely Pair reference system or any desired direction.For example, when component is installed to another equipment (for example, the downside for being installed to PCB) When, " top " of component partially may be actually located at " bottom " beneath portions.

Illustrative embodiments

It there is presently provided to the various embodiments of the device and method of the disclosure and the detailed description of modification.Although mainly existing The various device and method for discussing in the context of integrated connector module (ICM) for PCIe application, but being discussed herein It is without being limited thereto.In fact, many device and method described herein, which can be used for manufacturing, can benefit from ICM geometric form as described herein Any amount of electronics or Signal Regulation component of shape and feature, can be used for different application (in addition to PCIe) and/ Or provide different signal conditioning functions.

It will further be understood that in many cases, certain features relative to particular implementation discussion can be easily It is expected embodiment suitable for one or more other described herein.In view of present disclosure, ordinary skill people Member will readily recognize that many features described herein have more extensively except the particular example and realization for describing them Purposes, and in fact, about many features shown in an embodiment can it is associated with other embodiments or with Combined use.

Although will be readily understood that in addition, mainly being discussed in the context of uniline multiport ICM component, this The principle of text description can be readily applied to multirow multiport ICM component (for example, 2X4ICM is configured) and single port ICM Component.For example, in some embodiments, signal conditioning portions can be deviated from the port section of single port ICM component.In view of Content of this disclosure, these and other modifications will be apparent those of ordinary skill.

Exemplary ICM component-

Referring now to Fig. 1-1L, exemplary ICM connector assembly 100 and its various pieces are shown specifically and described.Fig. 1 It shows and the ICM 100 on the compatible printed circuit board 200 of PCIe for limiting shape is set.In brief, this design Shape before be suitable for the RJ type connector of the non-ICM prior art.In other words, the RJ type of these non-ICM prior arts connects Connecing device does not include Integrated Electronic Component (for example, magnetic part).On the contrary, circuit for signal conditioning is arranged in the existing skill of non-ICM In discrete parts outside art RJ type connector.Since the shape of this PCIe shape defined and this definition only considers The fact that non-ICM prior art RJ type connector, therefore the available occupied area of such as ICM 100 has from the end of ICM 100 The signal conditioning portions of the ICM of mouth accommodating portion offset, so that providing its for ICM 100 deviates (" zigzag ") exterior contour. Moreover, as shown in Figure 1, the compatible printed circuit board 200 of PCIe it may also be desirable to include compatible input/output (I/O) bracket of PCIe 202.In some embodiments, I/O bracket 202 can engage at interface position 204 with ICM 100, such as herein after will Description.

Referring now to Figure 1A, ICM 100 is shown before being mounted on the compatible printed circuit board 200 of PCIe shown in FIG. 1. In the embodiment shown, ICM 100 includes external screen shield.Specifically, external screen shield includes preceding shielding part 110 with after Shielding part 108, but it is to be understood that in some embodiments can to avoid the shielding part 108,110, wherein for example to/come It is less paid close attention to from the EMI of external electronic.Additionally, although showing two external screen shield 108,110 in figure 1A, It is those of ordinary skill it will be readily understood that in the case where providing present disclosure, those of ordinary skill in the art are by easy reason Solve the modification of single screen shield (for example, wherein shielding part 108,110 is combined into single shielding) or three or more shielding part modifications.Before Mechanical masking interface characteristics 114 can be used to be engaged with each other in shielding part 110 and rear shielding part 108.In some embodiments, It can be via enhancing shielding using eutectic solder at shield interface feature 114 (or in some embodiments, using eutectic Solder replaces shielding interface feature 114).

ICM 100 may include one or more ports 102, as shown, the port is configured by the port 1X4 (that is, uniline Four ports 102) composition, but it is to be understood that in the case where providing content of this disclosure, for those of ordinary skill come It says, other ports configuration (for example, multirow/multiport configuration, single port configuration etc.) will be apparent.Port 102 can be with It is separated from each other via the spacing interval of restriction.In some embodiments, such as aforementioned PCIe application, these ports can be with The restriction spacing of 13.40mm (0.528 inch) is separated from each other.In other embodiments, defined spacing may include The spacing of 13.97mm (0.550 inch), this is common in the application of many RJ type multiports.It is however quite easy to understand, In In substitute variants, other suitably limit spacing can be it is possible.

Shown in ICM 100 include multiple light emitting diodes (LED) 106 (eight (8) are a in total as shown in the figure, wherein each There are two LED) for the tool of port 102.Though it is shown that specific LED configuration, it is to be understood that, it is convenient to omit shown in specific configuration To support other configurations.For example, on June 28th, 2005 submits and entitled " Universal Connector Assembly The configuration of LED shown in the jointly owned United States Patent (USP) No.7,241,181 of and Method of Manufacturing " can It is used together with being easily modified with ICM 100, the content of the patent application is incorporated herein by reference in their entirety.It is shown The preceding shielding part 110 of ICM 100 can also include elastic mounting bracket shielding tab 112 and elastic mounting bracket engagement features 104, as will be described in the subsequent details herein with reference to Fig. 1 L.The mesh of these shielded joints 112 and engagement features 104 Be that additional grounding connection (and power) is provided between ICM 100 and I/O mounting bracket 202, as shown in Figure 1.

Referring now to Figure 1B, ICM 100 is shown, wherein external screen shield is removed from view.Specifically, can more hold It changes places and sees the arrangement of procapsid 118 and back casing 116.The signal conditioning portions of shell 118,116 are from the end of shell 118,116 Oral area point offsets by offset distance 126.Select the offset distance 126 to meet PCIe specification, it will be readily appreciated that can root Other offset distances are selected according to used specific application.In brief, many common existing ICM designs generally include list A shell.This mono-hull design is in submission on June 28th, 2005 and entitled " Universal Connector Assembly The jointly owned United States Patent (USP) No.7 of and Method of Manufacturing " is described in 241,181, the patent application Content it is previously passed reference be integrally incorporated herein.However, the offset design of the shell 116,118 due to shown ICM, this is existing Mono-hull design may be no longer feasible.Therefore, procapsid 118 and back casing 116 may need in combination with one another to adapt to This offset design.In the embodiment shown, procapsid 118 and back casing 116 include mortise/joggle 120, to incite somebody to action These shells 118,116 position (and fixed) securely relative to each other.Although using mortise/joggle in the illustrated embodiment First 120 are exemplary, it will be evident that these connectors 120 can be replaced (or combined use) other machinery sides Method, including but not limited to column/receiver, banjo fixing butt jointing (for example, basic and/or mitered etc.), half-lap joint, glossal canal connector, Biscuit connector, pocket connector, shield connector, notch connector, dovetail (for example, passing through, half-blindness, sliding etc.), box type joint And/or other kinds of joint method.In addition, these above-mentioned connectors can be with epoxy resin, clip, hot melt and/or other classes The material and/or technique of type are used in combination, and by these materials and/or technique, these shells 118,116 be can connect one It rises.

In some embodiments, such as embodiment shown in Figure 1B, port 102 can be via using conductive port-end Mouthful shielding part 122 and be isolated from each other, as by hereinafter then described in Fig. 1 K described by.As shown, these port-ports Shielding part 122 can also include port-portmask tab 124.The port-portmask tab 124 may be used as example The spring interface of preceding shielding part 110.In addition, in some embodiments, shielding part before which can be soldered to for example 110, or can be avoided by support other methods (or in connection), including for example preceding shielding part 110 and tab 124 Between through-hole connection.The use of port-portmask part 122 may be important in high data throughput application, such as But be not limited to above-mentioned gigabit Ethernet standard because they can be with, be especially eliminated or minimized adjacent port 102 (for example, Alien Near End Crosstalk (ANEXT) etc.) between crosstalk.

Referring now to Fig. 1 C, the rear perspective view of procapsid 118 shown in such as Figure 1B is shown and is described in detail.Now It can more easily find out mortise/tenon feature 120 global shape.Procapsid 118 may also include alignment post 130, such as connect Device is well known in the art.It should be noted, however, that including multiple insertion piece-insertion pieces on the top of shell 118 Shielding part receives feature 134.Insertion piece-insertion piece shielding part receives feature 134 and is configured to receive insertion piece-insertion piece shielding A part of part component 152, as shown in such as Fig. 1 E.These insertion pieces-insertion piece shielding part reception feature 134 one is significant It is characterized in ensuring FCC insertion piece (148, Fig. 1 E) when being arranged insertion piece component (142, Fig. 1 E) into corresponding port 102 Be correctly aligned.In the embodiment shown, insertion piece-insertion piece shielding part receives feature 134 in corresponding mortise/tenon Start at feature 120, although it will be appreciated that for example, can be received in insertion piece-insertion piece shielding part corresponding in feature 134 It include mortise/tenon feature 120 between insertion piece.It is also noteworthy that including insertion piece socket 132, which exists It is further helped in when being assembled with procapsid 118 and is directed at insertion piece component (142, Fig. 1 E).It is also noteworthy that including shielding Engagement features 128 are configured to a corresponding engagement in shell engagement features (178, Fig. 1 J and 1L).As depicted Shielding engagement features 128 are formed to have the shape of the cantilever beam of snap features.Current shielding part 110 (or rear shielding part 108) " buckle " on it when, the cantilever beam shape make shield engagement features 128 have a degree of elasticity.Although discribed Shape for shielding engagement features 128 is exemplary, but in the case where providing content of this disclosure, for ordinary skill Personnel are it is clear that other suitable forms can be replaced easily.For example, shielding engagement features 128 can be implemented in substitution It include non-cantilever beam opening features, hot melt feature etc. in mode.

Referring now to Fig. 1 D, it is shown specifically and describes the perspective view of back casing 116.Back casing 116 may include offset (" zigzag ") exterior contour is configured to exterior contour similar with procapsid 118 and is aligned.Procapsid 118 and back casing 116 can be by including that mortise/joggle 120 is connected to each other.As shown, back casing 116 may include a convex mortise/ Spill mortise/tenon connector 120 of tenon connector 120 and certain amount (for example, four (4) as depicted), but providing In the case where content of this disclosure, for those of ordinary skill it is clear that mortise/joggle 120 can be easily varied Type (and/or quantity).Back casing 116 may also include multiple insertion pieces and receive feature 136, be configured to receive on insert Individual features (for example, insertion column 168, Fig. 1 H).These insertion pieces receive feature 136 and are inserted into as one of column 168 Advantage is easy for the ability that insertion piece component (142, Fig. 1 E-1G) is aligned relative to back casing 116.Back casing 116 can also wrap Include rear shield tab apertures 138, make corresponding one in rear shield tab (174, Fig. 1 I) can be with rear shielding part part 108 engagements.Similarly, back casing 116 can also include shielding circuit board tab apertures 140, to be located at rear shielding part part 108 On printed circuit board engagement tab (180, Fig. 1 J) can be engaged with upper substrate (144, Fig. 1 E), this will be described later.

Referring now to Fig. 1 E, the perspective view of exemplary insertion piece component 142 is shown and is described in detail.As shown, inserting Entering part component 142 includes a plug inserts 150 of a FCC insertion piece 148 in four (4) and four (4), it is to be understood that, it is substituting Property embodiment in the plug inserts 150 and FCC insertion piece 148 of more (or less) can be used.Insertion piece component 142 is also Including upper substrate 144, as shown, the upper substrate is shared for each plug inserts 150 and each FCC insertion piece 148 , it is to be understood that, this general character is not required in the substitute variants of ICM 100.For example, in some embodiments, It including single upper substrate 144 or include going up base for the single of pairs of plug inserts 150 for each plug inserts 150 Plate 144 etc. may be advantageous.In view of content of this disclosure, these and other modifications will be aobvious and easy for those of ordinary skill See.Upper substrate 144 may include multiple upper shielding tab interfaces 146 (for example, each plug inserts 150 have one).One In a little embodiments, upper shielded joint interface 146 may be configured to be couple to high-voltage capacitor ground connection.As described above above, Tab interface 146 is shielded on these may be configured in an alternative embodiment via printed circuit board engagement tab (in Fig. 1 180) engagement after shielding part 108.Upper shielding tab interface 146 can be couple to the ground plane in upper substrate 144.Upper substrate 144 may include multiple slits, these slits are configured to accommodate insertion piece-insertion piece shielding part component 152 and accommodate port- Portmask part 122.Insertion piece-insertion piece shielding part component 152 and port-portmask part 122 are offset from one another.As schemed Show, FCC plug-in unit 148 is configured to connect via through-hole and connect with upper substrate 144.However, in substitute variants, FCC insertion piece 148 Upper substrate can be couple to via surface mount termination, such as in submission on June 28th, 2005 and entitled " Universal The jointly owned United States Patent (USP) No.7,241 of Connector Assembly and Method of Manufacturing ", Described in 181 those, the content of the patent application it is previously passed reference be integrally incorporated herein.Circuit board on upper substrate 144 Electric signal can be routed to FCC insertion piece 148 or guide electric signal from FCC insertion piece by trace.

Referring now to Fig. 1 F, the downside of the insertion piece component 142 of Fig. 1 E is shown and is described in detail.Particularly, insertion piece Component 142 further includes multiple lower substrates 156.These lower substrates 156 are configured to receive the lower terminal 160 of plug inserts 150. Depicted in an arrangement that multiple lower substrates 156, but for those of ordinary skill it is clear that provide content of this disclosure will be easy it is bright White, lower substrate 156 can be combined into the single common substrate for two or more plug inserts 150.In some implementations In mode, lower substrate 156 may include substrate shielding, such as in co-owning of submitting and entitled on June 28th, 2005 The U.S. Patent number 7,241 of " Universal Connector Assembly and Method of Manufacturing ", Disclosed in 181, the content of the patent is incorporated herein by reference in their entirety.Each plug inserts 150 may include that setting exists Multiple electronic components 154 therein.In some embodiments, electronic component may include coiling magnetic substance (for example, the ring of winding Shape coil)；But in the case where providing content of this disclosure, for those of ordinary skill it is clear that setting is inserted into plug The type of electronic component in part 150 is without being limited thereto.

G referring now to fig. 1 shows insertion piece component 142 again, and wherein upper substrate 144 is removed from view.As now may be used With what is seen, upper substrate 144 includes the multiple electronic components 154 for being configured to mount to the downside of upper substrate.It is retouched shown in In stating, these electronic components may include surface-mountable chip part (for example, resistor, capacitor etc.), but it should reason Solution, can use other kinds of electronic component in substitute variants.Each plug inserts 150 may include multiple upper terminals 162.These upper terminals, which can be configured as, to be engaged by using through-hole type interface with upper substrate 144.In some embodiments, Some (or whole) in these upper terminals be can be omitted to support the alternative interfaces technology including surface installation connection, or Those of be described below substitution termination types: on November 6th, 2013 submits and entitled " Apparatus for Terminating Wire Wound Electronic Components to an Insert Header Assembly's " Jointly owned U.S. Patent number on March 10th, 9,716,344 and 2014 submits and entitled " Methods And Apparatus For Terminating Wire Wound Electronic Components To A Header The jointly owned U.S. Patent number 9 of Assembly ", 401,561, the content of each of aforementioned application is whole by reference It is incorporated herein.

Referring now to Fig. 1 H, it is shown specifically and describes the perspective view of exemplary header insertion piece 150.Exemplary header is inserted Entering part 150 may include insertion protrusion 158, which is configured to be contained in the insertion piece socket of procapsid 118 (in Fig. 1 C 132) in.Insertion protrusion 158 is configured to be aligned convenient for head insert 150 relative to procapsid 118.It is inserted into shown in although Protrusion 158 has substantially rectangular shape, but substitute variants may include having including round (for example, one or more columns) Or other polygonal shapes (for example, one or more square columns, hexagon column, octagonal column etc.).In some variations, protruding portion 158 and socket (132, Fig. 1 C) can effectively be switched so that plug inserts 150 include socket, and corresponding protruding portion On procapsid 118.In view of content of this disclosure, these and other modifications will be apparent for those of ordinary skill 's.Plug inserts 150 may also include one or more electronic component receiving cavities 166.For example, plug inserts 150 may include One electronic component receiving cavity 166 is separated by the dividing wall and the second electronic component receiving cavity of plug inserts.When being included in Electronic component in electronic component receiving cavity 166 includes one or more coiling electronic components (for example, loop coil of winding) When, the wire termination of these electronic components can be routed to the respective terminal in upper terminal 162 and/or lower terminal 160.Some In embodiment, each in upper terminal 162 and/or lower terminal 160 may include flat part 164.These flat parts 164 can Convenient for wire ends coiling with the coiling electronic component for being arranged in electronic component accommodating chamber 166, and can also wrap It includes on two opposite sides of terminal 162 and/or 160.It is arranged near these terminals 160/162, plug inserts 150 may be used also To include the channel convenient for conducting wire wiring, and work as plug inserts 150, prevents when being in particular arranged in procapsid to these The top of 118. plug inserts 150 of damage of conducting wire may also include multiple abutment characteristics.Some in these abutment characteristics can Including the column in the corresponding aperture that is configured to be received on upper substrate 144, this is further helped in is aligned during assembly.

Referring now to Fig. 1 I, exemplary insertion piece-insertion piece shielding part component 152 perspective is shown specifically and described Figure.In the illustrated embodiment, insertion piece-insertion piece shielding part component 152 may include setting shielding part shell after non-conductive Conductive material in 172 (such as conductive tail portions shield tab 174).In some embodiments, which can be with It is formed by polymer-based material, and may further include first segment 172a and second segment 172b, once rear shield tab 174 are disposed there between, and the first segment and second segment are attached to each other.Shielding part shell 172 can also include bottom substrate afterwards Engagement features 170 are particularly conducive to alignment and the interval of lower basal plate 156.In some embodiments, it can completely avoid Shielding part shell 172 afterwards.For example, rear shielding part connector 174 can lengthen directly to engage upper substrate 144 and lower substrate 156. In view of content of this disclosure, these and other modifications will be apparent those of ordinary skill.

Referring now to Fig. 1 J, the perspective view of exemplary rear shielding part 108 is shown and is described in detail.Shown in after shielding part Including relative to offset (" zigzag ") profile shown in shell 116,118.Shielding part 108 may include multiple PCB tips afterwards 182 and multiple shell engagement features 178, as front is described above.Shown in PCB tip 182 be configured as being contained in it is final In through-hole on client's printed circuit board (such as PCB 200 shown in Fig. 1).In some variations, it is convenient to omit shown in PCB pointed tooth 182 is to be conducive to be press-fitted conjunction contact, such as in submission on March 12nd, 2013 and entitled " Shielded Integrated Connector Modules and Assemblies and Methods of Manufacturing and The jointly owned U.S. Patent number 9 of Use ", described in 178,318 those, content is hereby incorporated by entirely through reference.Afterwards Shielding part 108 may include rear shield tab engagement features 176, be configured to engagement rear shield tab (Fig. 1,174).One In a little embodiments (as shown in the figure), rear shield tab engagement features 176 can be stamped into rear shielding part 108, so that should Engagement features 176 are reinforced to ensure enough activating pressures with rear shielding part connector (Fig. 1,174).Shielding part 108 may be used also afterwards Including PCB engagement tab 180.In some embodiments, PCB engagement tab 180 is configured to neighbouring upper substrate and shields tab Interface 146 is located in 144 lower section of upper substrate.Therefore, PCB engagement tab 180 is configured as shielding to for example positioned at upper substrate prominent High-voltage capacitor application on piece interface 146 upwards pressure, so that the high-voltage capacitor and rear shielding part 108 and/or preceding screen Shield 110 directly contacts.

Referring now to Fig. 1 K, example port-portmask part 122 perspective view is disclosed.In some implementations, it holds Mouth-portmask part 122 may include port-portmask tab 124.The port-portmask tab 124 can be configured To be docked with the re-spective engagement feature (184, Fig. 1 L) being located on preceding shielding part 110, to provide additional ground connection for ICM 100 Point.Port-portmask part 122 can also include packed part 186, by non-conducting material (for example, Mylar band, polymer Deng) be made, help for port-portmask part 122 to be isolated with other circuits for including in ICM 100.In some realities It applies in mode, port-portmask part 122 can be by shielding with the entirety that insertion piece-insertion piece shielding part component 152 is formed together It covers material to be formed, to generate offset (" zigzag ") single shielding.In view of content of this disclosure, these and other modifications for Those of ordinary skill will be apparent.

Referring now to Fig. 1 L, the rear perspective view of shielding part 110 before being shown specifically and describing.Shown in preceding shielding part 110 Including relative to offset (" zigzag ") profile shown in shell 116,118.Preceding shielding part 110 may also include main PCB tip 182 And shell engagement features 178, similar to what is discussed above for Fig. 1 J.PCB pointed tooth 182 shown in for example, is configured as It is contained in the through-hole on End-Customer printed circuit board (such as PCB 200 shown in Fig. 1).It in some variations, can be with PCB pointed tooth 182 shown in omission be conducive to be press-fitted conjunction contact, such as on March 12nd, 2013 submit and it is entitled “Shielded Integrated Connector Modules and Assemblies and Methods of The jointly owned U.S. Patent number 9 of Manufacturing and Use ", described in 178,318 those, content is whole It is incorporated herein by reference.Preceding shielding part 110 may also include mounting bracket engagement features 186.These engagement features 186 can be from Following preceding shielding part material punching press, so that they are provided relative to the holding feature being located on mounting bracket (202, Fig. 1) The Elastic Contact of (204, Fig. 1).

Referring now to Figure 2, showing and the exemplary electronic being used together with ICM shown in such as Figure 1A being described in detail The schematic diagram of component encapsulation 200.Schematic diagram shown in as shown, is applied for so-called 10G, although for ordinary skill people For member it is readily apparent that shown in specific schematic diagram can use other suitable electronic component package generations in substitute variants It replaces.For example, electronic component package can be adapted for the electronic component packages such as so-called 1G, 2.5G, 5G of certain modifications.It reproduces Following describe the various electrical characteristic requirements of electronic component package 200 shown in Fig. 2 for table 1.Following describe show for the table 2 of reproduction The electric requirement of example property LED (106, Fig. 1 E).

Unless other are indicated, the electrical characteristic at+25 DEG C

Pay attention to；The frequency of f is MHz.

Table 1

Table 2

Manufacturing method-

Referring now to Figure 3, detailed description manufactures the method 300 of above-mentioned ICM component 100.Although should be noted that below to figure The description of 3 method 300 is carried out according to the ICM component of the multiport 102 of Fig. 1,

Wider method of the invention is equally applicable to other configurations (including such as single port embodiment, or above The rows and columns embodiment).

In the embodiment of fig. 3, method 300 generally includes to be initially formed procapsid 118 and back casing in step 302 116.The injection molding technique that type known in this field can be used in shell is formed, but other techniques can be used.Selection note Modeling technique is to be capable of the small details of accurate copy mold because of it, inexpensive and easy to process.

Next, providing FCC insertion piece 148 (for example, conductor group) in step 304.Conductor group may include metal (example Such as, copper or aluminium alloy) band, there is the substantially cross section of square or rectangle and be dimensioned to cooperation in procapsid In the slot of 118 port 102.FCC insertion piece 148 can also include injection molding polymer, be configured to especially keep Interval between each conductor.

Within step 306, conductor is formed as into desired shape using the shaping dies of type known in this field or machine.

In step 308, by plug moulded parts 150 and 160 insert-molding of corresponding upper terminal 162 and lower terminal, thus Form component shown in Fig. 1 H.

Next, in the step 310, forming upper substrate 144 and passing through multiple holes that the perforation of its thickness has predetermined size. The method for being used to form substrate is well known in electronic field, therefore is not described further herein.Also add specific set Any conductive trace on substrate needed for meter, so that necessary conductor is electrically connected with trace when receiving in hole.

Next, in step 312, forming lower substrate 156 and passing through multiple holes that the perforation of its thickness has predetermined size. Hole is arranged to perforation array, wherein receiving corresponding lower terminal 160, the hole of lower substrate is used to record and increase the machinery of lower terminal Stability.Alternatively, hole can be formed when forming substrate itself.

In a step 314, it is subsequently formed and prepares one or more electronic components, such as loop coil above-mentioned and table Face is installed by equipment (if use in the design).The manufacture and preparation of this electronic component are well known in the present art, Therefore it is not described further herein.

Then relevant electronic component is cooperated to upper substrate 144 in step 316.Note that if not using component, The conductive trace then formed on/within main substrate will form the conductive path between FCC plug-in unit 148 and corresponding upper terminal 162. Component is optionally: (i) receives in the corresponding aperture designed for the part of receiving part (for example, being used for mechanical stability), (ii) it is adhered on substrate by using adhesive or sealant, (iii) is mounted in " free space " (that is, working as the electricity of component When lead terminates to substrate conducting trace and/or conductor distal end, it is maintained at appropriate by the tension generated on the electrical lead of component Position), or (iv) otherwise remain stationary.In one embodiment, surface mounting assembly is located in main base first On plate, and magnetic part (for example, loop coil) is positioned later, but other sequences can be used.As known in the art , component is conductively coupled to PCB using eutectic solder reflux technique.

In step 318, remaining electric component is arranged in the cavity of plug inserts 150, and is electrically connected One appropriate be connected in upper and lower part terminal 162,160.The wiring may include winding, welding, welding or it is any its His suitable technique is to form required electrical connection.

In step 320, then the upper substrate with electronic component of assembling is matched with plug inserts 150 and its component It closes, upper terminal 162 is set in the corresponding aperture of substrate 144.Then substrate contacts, example are arrived into the engagement of terminal 162 Such as by welding or welding, to ensure the rigidity electrical connection of each contactor.If desired, can be to the plug inserts of completion 150 carry out electrical testing to ensure correct operation.

In step 322, port-portmask part 122 is located in procapsid 118, and by insertion piece-insertion piece Shielding part is located between adjacent plug inserts 150.

In step 324, the FCC insertion piece 148 being previously formed is inserted in and is formed in the port 102 of procapsid 118 In groove, and click into place together with the plug inserts of formation 150 and top 144 and lower basal plate 156.

In step 326, procapsid 118 is connect by for example above-mentioned mortise/tenon connector 120 of use with back casing 116.

Finally, in step 328, external noise shielding part 108,110 to be installed to the shell of assembling (if you are using) On body, and various counterpoise groundings and clip as described earlier in this article are positioned to provide the ground connection of noise shielding.

About other embodiments described herein, modification preceding method can according to need to adapt to add-on assemble.Mirror In disclosure provided herein, these modifications and changes will be apparent those of ordinary skill.

Although it will be recognized that according to specific design example describe the disclosure in some terms, still these descriptions be only The explanation of the more extensive method of the disclosure, and can be modified according to the needs of particular design.In some cases, certain Step may become unnecessary or optional.Furthermore it is possible to certain steps or function are added to disclosed embodiment, or Change two or more steps executes sequence.All these variations are contemplated as falling with sheet described and claimed herein In open.

Although being discussed in detail above it has been shown that being described and pointed out the novelty of the disclosure applied to various embodiments Feature, but it is to be understood that the various omissions of the form and details of shown equipment or process, replacement and variation can be and do not taking off In the case where principle from the disclosure, those skilled in the art can manufacture the principle of the present invention.The description of front is to set at present The optimal mode for the realization disclosure thought.The description is in no way meant to limit, but should be considered as the general original to the disclosure The explanation of reason.The scope of the present disclosure should be determined with reference to claim.