A kind of method of batch machining scintillator crystal bar

文档序号:1763884 发布日期:2019-12-03 浏览:17次 中文

阅读说明:本技术 一种批量加工闪烁体晶条的方法 (A kind of method of batch machining scintillator crystal bar ) 是由 罗夏林 吴兆刚 胡吉海 王洪刚 李德辉 冉孟红 于 2019-09-12 设计创作,主要内容包括:本发明公开了一种批量加工闪烁体晶条的方法,包括以下步骤:对闪烁体晶段坯料的两端面进行磨抛,在闪烁体晶段两端面分别通过粘结胶各粘接固定一块玻璃片;沿闪烁体晶段的一端面向另一端面并平行于轴向闪烁体晶段得闪烁体晶片;对闪烁体晶片因切割产生的两切割面磨抛;按抛光面粘接固定在一起,所有闪烁体晶片粘接有玻璃片的两面朝向相同并对应组合在一起形成的两个面构成闪烁体晶块的两端面,然后由闪烁体晶块的一端面向另一端面切割闪烁体晶块,切割方向垂直于切割产生的切割面;对闪烁体晶片因切割产生的两切割面磨抛,除去粘结胶及遗留的玻璃片,即得到闪烁体晶条。该加工方法能有效避免闪烁体晶条崩缺,提高闪烁体晶条成品率和加工效率。(The invention discloses a kind of methods of batch machining scintillator crystal bar, comprising the following steps: carries out grinding and polishing to the both ends of the surface of scintillator crystalline substance section blank, passes through adhesive glue respectively in scintillator crystalline substance section both ends of the surface and be respectively adhesively fixed one block of sheet glass;It towards other end and is parallel to axial scintillator crystalline substance section along one end of scintillator crystalline substance section and obtains scintillator chip;The two cut surface grinding and polishings that scintillator chip is generated by cutting;It is adhesively fixed together by burnishing surface, all scintillator bonding wafers have the both ends of the surface of the two two faces composition scintillator crystal blocks being grouped together into facing towards identical and correspondence of sheet glass, then scintillator crystal block, the cut surface that cut direction is generated perpendicular to cutting are cut towards other end by one end of scintillator crystal block;To the two cut surface grinding and polishings that scintillator chip is generated by cutting, adhesive glue and the sheet glass left are removed to get scintillator crystal bar is arrived.It is scarce that the processing method can effectively avoid scintillator crystal bar from collapsing, and improves scintillator crystal bar yield rate and processing efficiency.)

1. a kind of method of batch machining scintillator crystal bar, which is characterized in that steps are as follows:

S1: grinding the both ends of the surface of scintillator crystalline substance section blank, polished, and the scintillator crystalline substance section of end face polishing is obtained;

S2: the scintillator crystalline substance section both ends of the surface that end face polishes are passed through into adhesive glue respectively and are adhesively fixed one block of sheet glass respectively to protect and throw The scintillator crystalline substance section both ends of the surface of light, the diameter of sheet glass are greater than the diameter of scintillator crystalline substance section so that the both ends of the surface of scintillator crystalline substance section are complete Covering;

S3: one end of the scintillator crystalline substance section obtained along step S2 is towards other end and is parallel to what axially cutting step S2 was obtained The scintillator crystalline substance section of end face polishing, if obtaining the identical scintillator chip of dry thickness;

S4: the grinding of two cut surfaces, the polishing generated to the scintillator chip that step S3 is cut by cutting obtains cut surface mill Throw into the scintillator chip of burnishing surface;

S5: the scintillator chip for the cut surface grinding and polishing that step S4 is obtained is adhesively fixed together by burnishing surface, forms scintillator Crystal block, all scintillator bonding wafers have the two two faces compositions being grouped together into facing towards identical and correspondence of sheet glass Then the both ends of the surface of scintillator crystal block cut scintillator crystal block, cut direction towards other end by one end of scintillator crystal block Perpendicular to the cut surface that step S3 cutting generates, if it is brilliant to obtain the identical scintillator generated from other direction cutting of dry thickness Piece;The cutting thickness of step S5 is identical as the cutting thickness of step S3;

S6: the grinding of two cut surfaces, the polishing generated to the scintillator chip that step S5 is cut by cutting obtains other direction Cut surface grinding and polishing at burnishing surface scintillator chip;

S7: the sheet glass for removing the adhesive glue on the scintillator chip that step S6 is obtained and leaving all is completed to get to six faces The scintillator crystal bar of grinding and polishing.

2. a kind of method of batch machining scintillator crystal bar according to claim 1, which is characterized in that used in step S1 Fixture carries out clamping to scintillator crystalline substance section, is then ground, is polished, the fixture to the both ends of the surface of scintillator crystalline substance section blank again Including fixing seat and fixing piece, the fixing seat is cylindrical, is axially arranged with the blind of opening upwards on the top of fixing seat edge Hole, blind hole successively include the first cylindrical cavity and the second cylindrical cavity from top to bottom, and it is straight that the first cylindrical cavity diameter is greater than the second cylindrical cavity Diameter simultaneously forms step in intersection;The fixing piece is cylindrical shape, and fixing piece is arranged in the first cylindrical cavity and fixing piece outer diameter Less than the first cylindrical cavity diameter, fixing piece internal diameter is more than or equal to the second cylindrical cavity diameter, and sets on the side wall of fixing piece There are several tapped through holes, all tapped through holes are uniformly distributed along fixing piece radial circumference, and scintillator crystalline substance section is placed in fixing seat And scintillator crystalline substance section lower end surface is abutted with the second cylindrical cavity bottom, is then inserted into corresponding spiral shell with the set screw of several rubber belt heads Scintillator crystalline substance section is fixed on fixing piece center by line through-hole;Second cylindrical cavity depth is the height of scintillator crystalline substance section blank The half of the difference of fixing piece height is subtracted, so that the distance phase of scintillator crystalline substance section blank both ends of the surface protrusion fixing piece corresponding end surface Deng.

3. a kind of method of batch machining scintillator crystal bar according to claim 2, which is characterized in that the second cylindrical cavity is deep Degree is 0.8 ~ 1.0 mm.

4. a kind of method of batch machining scintillator crystal bar according to claim 1, which is characterized in that step S2 is specifically grasped Make step are as follows: first in an end coating adhesive glue of scintillator crystalline substance section, sheet glass is then adhesively fixed on scintillator crystalline substance section On the end face, and guarantee it is Nian Jie with scintillator crystalline substance section after the glass sheet surface difference of height less than 0.01 mm;Scintillator crystalline substance section is turned over Turn, then another sheet glass is adhesively fixed on scintillator crystalline substance section by the brushing adhesive glue on the other end of scintillator crystalline substance section On the other end, and guarantee it is Nian Jie with scintillator crystalline substance section after another glass sheet surface difference of height less than 0.01 mm.

5. a kind of method of batch machining scintillator crystal bar according to claim 1, which is characterized in that step S5 bonding Before, first different scintillator crystalline substance section blanks are processed by step S1-S4, obtained all scintillator wafer thicknesses are all the same, then The identical several scintillator chips of length in scintillator chip are adhesively fixed on by burnishing surface and are formed together the scintillator crystalline substance Block, the scintillator crystal block are in cuboid.

6. a kind of method of batch machining scintillator crystal bar according to claim 5, which is characterized in that when bonding, first will Any two panels scintillator chip bonds together by burnishing surface combination of two, and composition is multiple to be glued by what two panels scintillator chip formed Junctor;Then the convered structure being made of two panels scintillator chip is bonded together again by burnishing surface combination of two, is constituted multiple The convered structure being made of four scintillator chips;And so on, the bonding until completing scintillator crystal block;If scintillator crystal block Above each level convered structure can not be matched, then the convered structure that by the above corresponding level there is the scintillator chip of different number to form It is bonded.

7. a kind of method of batch machining scintillator crystal bar according to claim 5, which is characterized in that scintillator crystal block Surface difference of height is less than 0.01 mm.

8. a kind of method of batch machining scintillator crystal bar according to claim 1, which is characterized in that in S5 step, cut Before cutting scintillator crystal block, the scintillator crystal block two sides parallel with burnishing surface pass through respectively adhesive glue be respectively adhesively fixed plastic sheet or Any one in person's sheet glass is to protect the two sides of scintillator crystal block.

Technical field

The invention belongs to scintillator processing technique fields, and in particular to a kind of method of batch machining scintillator crystal bar.

Background technique

Positron emission tomography (Positron emission tomography, PET) is as a kind of advanced Medicine imaging technique, have in terms of obtaining the functional information of certain organs or lesion of human body or animal unique excellent Point, the best diagnostic techniques being referred to as currently known.Scintillator crystal bar is the core component units of PET system detector, Performance largely determines the performance of PET.Scintillator crystal bar generallys use the side of scintillator crystal bar array when in use Formula, and the production of scintillator crystal bar array need to carry out corresponding technical indicator to each flashing crystal bar unit used in it and add Work.

Scintillator crystal bar usually is processed to obtain by scintillator crystalline substance section, and the brilliant section that scintillator crystals are grown all is cylinder Shape.It is processed to obtain scintillator crystal bar by scintillator crystalline substance section, then to the six face grinding and polishing of scintillator crystal bar.When the grinding and polishing of side, it is right in advance to need Scintillator crystal bar marking needs to put scintillator crystal bar before grinding and polishing to guarantee all to carry out grinding and polishing to all sides of scintillator crystal bar It is placed in erratic star wheel, but because scintillator crystal bar size and erratic star wheel gap are all smaller, mature worker puts generally every time It needs 30 ~ 40 minutes, and scintillator crystal bar size smaller the consumed time is longer, efficiency is lower, while putting scintillator crystal bar Scintillator crystal bar is easily caused to collapse in the process scarce, and during grinding and polishing, scintillator crystal bar is placed on meeting in erratic star wheel accommodating chamber It is subjected to displacement and collides, scintillator crystal bar is easily caused to occur collapsing scarce, scratch and other issues;When the grinding and polishing of end face, need first to sudden strain of a muscle Bright body crystal bar carries out clamping, then grinding and polishing is carried out to both ends of the surface, then dismantle, when clamping and disassembly process need to consume a large amount of Between, influence working efficiency.To 6 crystal bars need to be put on erratic star wheel during the six face grinding and polishing of scintillator crystal bar, seriously reduce Processing efficiency.

So solving scintillator crystal bar collapses scarce, scratch and other issues, and improving processing efficiency is those skilled in the art Member's technical problem urgently to be resolved.

Summary of the invention

In view of the above shortcomings of the prior art, the object of the invention is that providing a kind of batch machining scintillator crystalline substance The method of item, this method is easy to operate, can effectively avoid scintillator crystal bar from occurring collapsing scarce, scratch and other issues, improve flashing Body crystal bar yield rate;Labour output can also be effectively reduced simultaneously, reduce production cost, improve processing efficiency.

The technical scheme of the present invention is realized as follows:

A kind of method of batch machining scintillator crystal bar, steps are as follows:

S1: grinding the both ends of the surface of scintillator crystalline substance section blank, polished, and the scintillator crystalline substance section of end face polishing is obtained;

S2: the scintillator crystalline substance section both ends of the surface that end face polishes are passed through into adhesive glue respectively and are adhesively fixed one block of sheet glass respectively to protect and throw The scintillator crystalline substance section both ends of the surface of light, the diameter of sheet glass are greater than the diameter of scintillator crystalline substance section so that the both ends of the surface of scintillator crystalline substance section are complete Covering;

S3: one end of the scintillator crystalline substance section obtained along step S2 is towards other end and is parallel to what axially cutting step S2 was obtained The scintillator crystalline substance section of end face polishing, if obtaining the identical scintillator chip of dry thickness;

S4: the grinding of two cut surfaces, the polishing generated to the scintillator chip that step S3 is cut by cutting obtains cut surface mill Throw into the scintillator chip of burnishing surface;

S5: the scintillator chip for the cut surface grinding and polishing that step S4 is obtained is adhesively fixed together by burnishing surface, forms scintillator Crystal block, all scintillator bonding wafers have the two two faces compositions being grouped together into facing towards identical and correspondence of sheet glass Then the both ends of the surface of scintillator crystal block cut scintillator crystal block, cut direction towards other end by one end of scintillator crystal block Perpendicular to the cut surface that step S3 cutting generates, if it is brilliant to obtain the identical scintillator generated from other direction cutting of dry thickness Piece;The cutting thickness of step S5 is identical as the cutting thickness of step S3;

S6: the grinding of two cut surfaces, the polishing generated to the scintillator chip that step S5 is cut by cutting obtains other direction Cut surface grinding and polishing at burnishing surface scintillator chip;

S7: the sheet glass for removing the adhesive glue on the scintillator chip that step S6 is obtained and leaving all is completed to get to six faces The scintillator crystal bar of grinding and polishing.

Further, clamping is carried out to scintillator crystalline substance section using fixture in step S1, then again to scintillator crystalline substance section blank Both ends of the surface ground, polished, the fixture includes fixing seat and fixing piece, and the fixing seat is cylindrical, in fixation Along being axially arranged with the blind holes of opening upwards, blind hole successively includes the first cylindrical cavity and the second cylindrical cavity from top to bottom on the top of seat, First cylindrical cavity diameter is greater than the second cylindrical cavity diameter and forms step in intersection;The fixing piece is cylindrical shape, fixing piece It is arranged in the first cylindrical cavity and fixing piece outer diameter is less than the first cylindrical cavity diameter, fixing piece internal diameter is more than or equal to the second circle Column chamber diameter, and several tapped through holes are equipped on the side wall of fixing piece, all tapped through holes are uniform along fixing piece radial circumference Distribution, scintillator crystalline substance section is placed in fixing seat and scintillator crystalline substance section lower end surface is abutted with the second cylindrical cavity bottom, if then using The set screw of dry rubber belt head is inserted into corresponding tapped through hole and scintillator crystalline substance section is fixed on fixing piece center;Second circle Column chamber depth is the half that the height of scintillator crystalline substance section blank subtracts the difference of fixing piece height, so that scintillator crystalline substance section blank two End face protrusion fixing piece corresponding end surface is equidistant.

Further, the second cylindrical cavity depth is 0.8 ~ 1.0 mm.

Further, step S2 concrete operation step are as follows: first in an end coating adhesive glue of scintillator crystalline substance section, then will Sheet glass is adhesively fixed on the end face of scintillator crystalline substance section, and guarantees sheet glass rear surface height Nian Jie with scintillator crystalline substance section Difference is less than 0.01 mm;Scintillator crystalline substance section is overturn, the brushing adhesive glue on the other end of scintillator crystalline substance section then will be another Sheet glass is adhesively fixed on the other end of scintillator crystalline substance section, and guarantees another sheet glass and the glass sheet surface difference of height Less than 0.01 mm.

Further, before step S5 bonding, first different scintillator crystalline substance section blanks are processed by step S1-S4, obtained institute There is scintillator wafer thickness all the same, the identical several scintillator chips of length in scintillator chip are then pressed into burnishing surface bonding It is fixed together to form the scintillator crystal block, which is in cuboid.

Further, when bonding, first any two panels scintillator chip is bonded together by burnishing surface combination of two, is constituted Multiple convered structures being made of two panels scintillator chip;Then again the convered structure being made of two panels scintillator chip by burnishing surface Combination of two bonds together, and constitutes multiple convered structures being made of four scintillator chips;And so on, until completing to flash The bonding of body crystal block;If scintillator crystal block can not match above each level convered structure, there is difference by the above corresponding level The convered structure of the scintillator chip composition of quantity is bonded.

Further, the surface difference of height of scintillator crystal block is less than 0.01 mm.

Further, in S5 step, before cutting scintillator crystal block, the scintillator crystal block two sides difference parallel with burnishing surface Any one in plastic sheet or sheet glass that be respectively adhesively fixed by adhesive glue is to protect the two sides of scintillator crystal block.

Compared with prior art, the invention has the following beneficial effects:

1, the present invention is to carry out clamping to entire scintillator crystalline substance section in clamping, is then ground to scintillator crystalline substance section both ends of the surface Mill, polishing, it is easy to operate, the time is saved, processing efficiency is improved;Scintillator crystalline substance section of the present invention is in primary cutting, secondary cut After be scintillator chip, compared with the existing technology in the work steps such as ground, polish, clean, examining to scintillator crystal bar, dodge The size of bright body chip is larger, in grinding, polishing, cutting, cleaning and inspection and etc. can all save the plenty of time, to improve The processing efficiency of scintillator crystal bar.

2, the scintillator crystalline substance section both ends of the surface that end face polishes are protected using sheet glass, is once cut into scintillator chip Afterwards, protection of the two sides of scintillator chip by sheet glass, in the two cut surfaces progress generated to scintillator chip by cutting In grinding, polishing process, the two sides containing sheet glass are not in collapse scarce, scratch and other issues;In bonding scintillator chip The two sides setting sheet glass or plastic sheet of the scintillator crystal block of formation, after such secondary cut scintillator crystal block, to flashing For body chip because two cut surfaces that secondary cut generates are ground, in polishing process, the both ends of the surface of scintillator chip have sheet glass Or plastic sheet is protected simultaneously, there are sheet glass protection in the other two sides of scintillator chip, so being not in collapse scarce, scratch etc. Quality problems are grinding to solve processing scintillator by the above technological means and are occurring collapsing scarce, scratch etc. in polishing process Quality problems improve the yield rate of scintillator crystal bar.

Detailed description of the invention

Process flow chart Fig. 1-of the invention.

Fig. 2-present clip structural schematic diagram.

Scintillator chip schematic diagram after Fig. 3-is once cut.

Scintillator bonding wafer is at scintillator crystal block schematic diagram after Fig. 4-is once cut.

Fig. 5-secondary cut schematic diagram.

Scintillator chip schematic diagram after Fig. 6-secondary cut.

Wherein: 1- fixing seat;The first cylindrical cavity of 11-;The second cylindrical cavity of 12-;2- fixing piece;21- threaded hole;3- sheet glass Ⅰ;4- sheet glass II.

Specific embodiment

Invention is further described in detail with reference to the accompanying drawings and detailed description.

A kind of method of batch machining scintillator crystal bar, process flow chart as shown in Figure 1, specifically includes the following steps:

S1: grinding the both ends of the surface of scintillator crystalline substance section blank, polished, and the scintillator crystalline substance section of end face polishing is obtained;

Here, it for product scintillator crystal bar, is equivalent to complete the processing of two end faces of scintillator crystal bar in this way.It is right simultaneously Before the grinding of scintillator crystalline substance section blank, polishing, if scintillator crystalline substance section blank has problem of Cracking, it will first can be cracked part with adhesive glue It is stitched together, chamfered is then carried out to both ends of the surface edge using Buddha's warrior attendant sanding head, the matter of subsequent grinding, polishing can be improved Amount.

S2: by end face polish scintillator crystalline substance section both ends of the surface pass through respectively adhesive glue be respectively adhesively fixed one block of sheet glass I with Protect the scintillator crystalline substance section both ends of the surface of polishing, the diameter of sheet glass I is greater than the diameter of scintillator crystalline substance section with by scintillator crystalline substance section Both ends of the surface all standing;

Sheet glass I can protect the both ends of the surface of the scintillator crystalline substance section after the grinding and polishing of end face in this way, and flash to subsequent product The both ends of the surface of body crystal bar are protected.

S3: one end of the scintillator crystalline substance section obtained along step S2 is towards other end and is parallel to axially cutting step S2 and obtains The scintillator crystalline substance section for the end face polishing arrived, if obtaining the identical scintillator chip of dry thickness;(primary cutting)

Here, for product scintillator crystal bar, it is equivalent to cutting in this way and forms scintillator crystal bar two sides.Primary cutting end face The scintillator chip obtained after the scintillator crystalline substance section of polishing is as shown in figure 3, there is glass in the scintillator both sides of wafers face that S3 step obtains The protection of glass piece I 3.

S4: the grinding of two cut surfaces, the polishing generated to the scintillator chip that step S3 is cut by cutting is cut Face grinding and polishing at burnishing surface scintillator chip;

Here, two cut surfaces are equivalent to the two sides of scintillator crystal bar, for product scintillator crystal bar, are equivalent to complete in this way The processing of scintillator crystal bar two sides.When two cut surfaces generated by cutting are ground, polished, because of scintillator chip Other two sides have the protection of sheet glass I so that the two sides containing sheet glass I are not in collapse scarce, scratch and other issues.

S5: the scintillator chip for the cut surface grinding and polishing that step S4 is obtained is adhesively fixed together by burnishing surface, is formed and is dodged Bright body crystal block, all scintillator bonding wafers have two two faces being grouped together into facing towards identical and correspondence of sheet glass The both ends of the surface of scintillator crystal block are constituted, then cut scintillator crystal block, cutting towards other end by one end of scintillator crystal block The cut surface that direction is generated perpendicular to step S3 cutting, if obtaining the identical scintillator generated from other direction cutting of dry thickness Chip (secondary cut);The cutting thickness of step S5 is identical as the cutting thickness of step S3;

Here, for product scintillator crystal bar, it is equivalent to the cutting for completing other two side of scintillator crystal bar in this way.

S6: the grinding of two cut surfaces, the polishing generated to the scintillator chip that step S5 is cut by cutting obtains another Direction cut surface grinding and polishing at burnishing surface scintillator chip;

Here, scintillator chip ground because cutting two cut surfaces generated, polished, it is really last to scintillator crystal bar Two sides are ground, are polished, to complete the grinding in six faces of scintillator crystal bar, polishing.

S7: remove the adhesive glue on the obtained scintillator chip of step S6 and the sheet glass left to get to six faces all Complete the scintillator crystal bar of grinding and polishing.

It also needs to clean scintillator crystal bar in practical operation, then examine, product warehousing after the assay was approved is examined Underproof scintillator crystal bar is recyclable for waste product.

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