Chemical mechanical planarization systems and pad freeing wheel
阅读说明：本技术 化学机械平坦化系统以及垫修整轮 (Chemical mechanical planarization systems and pad freeing wheel ) 是由 黄君席 于 2019-04-18 设计创作，主要内容包括：本公开描述一种化学机械平坦化系统以及垫修整轮,其中,化学机械平坦化系统包括在旋转平台上的垫、配置为将晶圆表面保持在垫上并向晶圆施加压力的晶圆承载座、配置成在垫上分配研磨浆的研磨浆分配器、以及配置为对垫进行修整的修整轮。修整轮还包括底座和附接到底座的一或多个可挠结构,每个可挠结构具有弹性体,弹性体配置为在垫的特征上施加下压力,其中下压力与特征的高度成正比。(The disclosure describes a kind of chemical mechanical planarization systems and pad freeing wheel, wherein, chemical mechanical planarization systems include pad on the rotating platform, to be configured to for crystal column surface to be maintained at pad upper and apply stressed wafer carrying seat to wafer, be configured to distribute the slurry distributor of slurry on pad and be configured to the freeing wheel modified to pad.Freeing wheel further includes pedestal and one or more flexible structures for being attached to pedestal, and each flexible structure has elastomer, and elastomer is configured to pressure under applying in the feature of pad, wherein lower pressure is directly proportional to the height of feature.)
1. a kind of chemical mechanical planarization systems, comprising:
One pad, is located on a rotating platform；
One wafer carrying seat is configured to for a crystal column surface being maintained on the pad, and applies pressure to the wafer；
One slurry distributor is configured to distribute slurry on the pad；And
One freeing wheel is configured to modify the pad, comprising:
One pedestal；And
One or more flexible structures are attached to the pedestal, and each of one or more flexible structures includes an elastomer, is matched It is set to and applies pressure in a feature of the pad, wherein the lower pressure is directly proportional to the height of this feature.
Technical field
This disclosure relates to a kind of chemical mechanical planarization systems and pad freeing wheel.
Background technique
Grinding mat trimmer by ensure chemical-mechanical planarization (chemical mechanical planarization, CMP) consistency of technique and stability come the surface " giving vigor again " (re-energize) to grinding pad and extend its longevity Life.The slurry and grinding pad of a new generation need to have the dresser of higher precision, trimming device and dressing method.
Summary of the invention
In some embodiments, chemical mechanical planarization systems include pad on the rotating platform, are configured to wafer table Face is maintained at pad and above and to wafer applies stressed wafer carrying seat, is configured to distribute the slurry distribution of slurry on pad It device and is configured to the freeing wheel modified of pad.Freeing wheel further include pedestal and be attached to pedestal one or more are flexible Structure, each flexible structure have elastomer, and elastomer is configured to pressure under applying in the feature of pad, wherein lower pressure and spy The height of sign is directly proportional.
In some embodiments, which includes steel spring, porous polymer or elastic material.
In some embodiments, which further includes a solid-state pedestal and a diamond film.
In some embodiments, which further includes a braced frame, is configured to prevent this one or more A flexible structure bending.
In some embodiments, which is partially disposed at a rear side surface of the pedestal.
In some embodiments, which is arranged to apply compared to the lower pressure for the lower feature for being applied to the pad Add a biggish lower pressure to a higher feature of the pad.
In some embodiments, pad freeing wheel includes rotating base and one or more the flexible knots for being attached to rotating base Structure, wherein each of one or more flexible structures includes: elastomer, and being configured to apply has different height in lower pressure to pad Surface characteristics, the solid-state pedestal on elastomer, the diamond film on solid-state pedestal, be configured to apply in response to elastomer The lower pressure that adds and engagement pad and braced frame, are configured to prevent the bending of one or more flexible structures.
In some embodiments, which includes steel spring, porous polymer or elastic material.
In some embodiments, which has between about 0.1mm to the height between about 30mm and between about 0.1mm is to the diameter between about 100mm.
In some embodiments, which has between about 0.1mm to the height between about 30mm and between about 0.1mm is to the diameter between about 100mm.
In some embodiments, which has the thickness between about 1 μm to about 1000 μm.
In some embodiments, which includes plastic cement, steel or metal.
In some embodiments, which surrounds at least part of side wall of the elastomer.
In some embodiments, pad freeing wheel includes rotating base and one or more the elasticity knots for being attached to rotating base Structure, wherein each of one or more elastic constructions includes: elastomer, is configured to apply the first lower pressure to the fisrt feature padded On, and apply in the second lower pressure a to second feature of pad, wherein the first lower pressure is different from the second lower pressure, is located at bullet Solid-state pedestal on property body and the diamond film on solid-state pedestal.
In some embodiments, pad freeing wheel a further include: braced frame surrounds the side of one or more flexible structures A part of wall is configured to prevent one or more flexible structures bending.
In some embodiments, which has between about 0.1mm to the height between about 60mm.
In some embodiments, which surrounds at least part of the elastomer.
In some embodiments, which has about 0.1mm to the height between about 30mm.
In some embodiments, which has about 0.1mm to the diameter between about 100mm.
In some embodiments, the difference in height of the fisrt feature and the second feature is less than about 1mm.
Detailed description of the invention
Embodiment of the disclosure is described in detail below in conjunction with Figure of description.It should be noted that being done according to standard in the industry cycle Method, various features are not shown to scale and are only to illustrate illustration.In fact, element may be zoomed in or out arbitrarily Size, clearly to show the feature of the disclosure.
Fig. 1 is the sectional view of milling tool in accordance with some embodiments.
Fig. 2 is the sectional view of grinding pad in accordance with some embodiments.
Fig. 3 is the sectional view of the exemplary pad freeing wheel in accordance with some embodiments with flexible structure.
Fig. 4 A~Fig. 4 D is the rear side table of the freeing wheel in accordance with some embodiments with different flexible structure arrangements The plan view in face.
Fig. 5 is the sectional view of example trim wheel in accordance with some embodiments, and wherein flexible structure, which is partially disposed at, repairs In the pedestal of whole wheel.
Fig. 6 is the sectional view of example trim wheel in accordance with some embodiments, and wherein flexible structure, which is partially disposed at, repairs In the pedestal of whole wheel.
Fig. 7 is the sectional view of the example trim wheel in accordance with some embodiments with flexible structure, it is characterized in that having Braced frame.
Fig. 8 is the isometric view of the exemplary flexible structure in accordance with some embodiments with braced frame.
Fig. 9 is the sectional view of the example trim wheel in accordance with some embodiments with flexible structure, it is characterized in that having Braced frame.
Figure 10 be it is in accordance with some embodiments during trim process on grinding pad have the exemplary of flexible structure repair The sectional view of whole wheel.
Figure 11 is the flow chart of the method in accordance with some embodiments that grinding pad is modified with freeing wheel, wherein on freeing wheel With one or more flexible structures.
Description of symbols:
100 chemical-mechanical planarization dismembyators (dismembyator)
102 grinding pads (pad)
104 platforms
106 wafer carrying seats
108 freeing wheels
110 slurry power supply units
112 wafers
114 slurries
200 pad areas
202 top surfaces
204 bottom surfaces
300,500,600,700,900 freeing wheel
302,502,602 pedestal
304 elastomers
306 solid-state pedestals
308 diamond films
310,720 flexible structure
710 braced frames
710H, 730, H, H1, H2,2H height
1100 methods
1110,1120,1130,1140 operation
P pressure
S spacing
Specific embodiment
It should be understood that following discloses many different implementation methods or example are come the difference of target provided by carrying out The embodiment of specific element and its arrangement is described below to illustrate the disclosure in feature.These certain embodiments only to illustrate, And the scope of the present disclosure should not be limited with this.For example, fisrt feature component is mentioned in the description be formed in second feature On component comprising fisrt feature component is the embodiment directly contacted with second feature component, is in addition also included in first In addition there is the embodiment of other features between feature and second feature component, also that is, fisrt feature component and second feature Component and non-direct contact.
In addition, may wherein use with space correlation word, such as " in ... lower section ", " lower section ", " lower ", " on Side ", " higher " and similar word, these space correlation words illustrate for ease of description in (a little) elements or features With the relationship between another (a little) elements or features, these space correlation words include in or operation in device not Orientation described in same orientation and attached drawing.When device is diverted different direction (be rotated by 90 ° or other orientation), then its Used in space correlation adjective will also be explained according to the orientation after steering.
Word used herein " nominally " refer to component set during the design phase of product or technique or The feature of technological operation or the desired value of parameter or target value and be higher than and/or lower than desired value numerical value.Above-mentioned numerical value Range is often as the minor change of production technology or tolerance and causes.
Numerical value in ± 5% range of " substantial " value for representing given quantity of word used herein.
Word " about " used herein indicates to become based on particular technology node relevant to target semiconductor device The certain amount of value changed.Based on particular technology node, word " about " can indicate the value in given quantity, such as numerical value Change (± 10%, ± 20% or ± the 30% of such as numerical value) in 10%~30%.
Word herein is " vertical " to represent the surface for being nominally orthogonal to substrate.
Chemical-mechanical planarization (Chemical mechanical planarization, CMP) is whole crystal column surface Planarization passes through the relative motion between wafer and grinding pad with slurry and while applying to wafer Plus-pressure (lower pressure) carrys out planarizing surface of wafer.Chemical mechanical planarization tool is referred to as " dismembyator ".It is brilliant in dismembyator Disc is located at downward on silicon wafer carrier or wafer carrying seat, and is held against grinding pad, and grinding pad is located at referred to as " platform (platen) " on flat surfaces.In grinding technics, rotation or track movement is can be used in dismembyator.Chemical machinery is flat Change through the feature (feature) on removal crystal column surface relative to recess feature protrusion so that wafer planarization.It slurry and grinds Mill pad is referred to as " consumables " because continuing on and replacing.Therefore, slurry and grinding pad are crucial components, and are needed Continuously monitor their situation.
Slurry is during CMP process for the finer abrasive from crystal column surface removal certain material The mixture of grain and chemicals.For realize wafer to wafer (wafer to wafer, WtW) and batch (lot to lot, LtL for the repeatability (such as consistent grinding rate, lapping uniformity of whole wafer and entire crystal grain etc.)) ground, It is crucial that accurate mixed grinding, which is starched and consistently mixes every batch of slurry,.The quality of slurry is important, to can avoid Occurs scratch on the wafer surface during CMP process.
Grinding pad is attached to the top surface of platform.Due to the mechanical property and porosity of polyurethane (polyurethane), Pad can be made of such as polyurethane.In addition, the feature of above-mentioned grinding pad is that can have aperture, to help the table along wafer Face conveys slurry and promotes uniform grinding.Above-mentioned pad also removes the product of reaction from crystal column surface.When pad is to more polycrystalline When circle is ground, the surface of pad becomes flat and smooth, leads to the state of referred to as " mirror-polishing (glazing) ".Mirror-polishing Pad cannot keep grinding slurry, and can be substantially reduced grinding rate.
Grinding pad needs periodically to be modified influence caused by postpone mirror-polishing.The purpose modified is to extend pad Service life, and the grinding performance for making to pad during its use is consistent.Pad can pass through abrasion (mechanical Abrasion) or deionization (deionized, DI) water spray is modified, and the above-mentioned surface that can stir (starting) pad by spraying is simultaneously Increase its roughness.Another method on starting pad surface is using freeing wheel (disk), and above-mentioned freeing wheel has in its rotation The diamond bottom surface contacted with pad.The material on trim process inevitably removal pad surface, and this is to will affect pad life An important factor for.Can in situ (in-situ) (inside) or ex situ (ex-situ) (outside) to chemical mechanical planarization tool into Row finishing.In situ in finishing, trim process is real-time perfoming, wherein a part that freeing wheel or disk are applied to pad will be padded, And the grinding crystal wafer on another part of pad.In the ex situ finishing of pad, without finishing during grinding, and only grinding It is just modified after the wafer of predetermined quantity.Grinding pad must finally be replaced.It for example, can be with before replacing grinding pad Handle 3,000 or more wafers.
However, carrying out finishing to pad has its challenge, and its not simple direct technique.For example, when When being modified during the service life of pad to pad, due to intrinsic mechanical restriction (such as size of wheel or disk), the surface of pad It can become more and more uneven (especially in the edge of pad).In addition, when grinding more and more wafers, the surface meeting of pad Become uneven.Therefore, during finishing, if under wheel is identical to all features (feature) application of uneven surface Pressure, the then surface uniformity padded will not improve at any time.For example, when the surface removal pad in trim process from pad When material, the uneven feature (such as surface profile) for padding surface will be broadcast by dig pass.As time go by, the wheel on the surface of pad Wide uneven situation may also gradually become worse.Therefore, when repeating to modify pad, grainding capacity (the removal speed of pad Rate) it can be deteriorated during service life.In other words, the service life of pad and performance will receive influence, this in turn again increasing It learns the cost of machinery planarization and causes the loss of yield.
This disclosure relates to which a kind of freeing wheel, has reinforcement (retrofitted) flexible structure for being attached to its bottom surface. In some embodiments, flexible structure provides different lower pressure " path " for the uneven feature on the surface of pad.Therefore, may be used The surface flatness of pad is maintained in the their entire life of grinding pad.In other words, the service life of pad can be extended.In some implementations In example, can be directly attached to the flexible structure below the pedestal of freeing wheel includes " elastomer (elastic body) ", such as Steel spring, porous body (poromeric) or elastic material (elastomer).In other embodiments, in addition to the bullet below freeing wheel Property body except, also prevent the working surface (such as with diamond film for contact of pad) of freeing wheel crooked using braced frame.According to Some embodiments, elastomer can be positioned partially in the pedestal of freeing wheel.
Fig. 1 is 100 (hereinafter referred to as " dismembyator of Exemplary chemical machinery planarization dismembyator in accordance with some embodiments 100 ") isometric view of component.Dismembyator 100 includes grinding pad 102 (hereinafter referred to as " pad 102 "), is loaded in rotation On platform (such as rotation tables) 104.Dismembyator 100 further include rotation wafer carrying seat 106, rotation freeing wheel (or " disk ") 108 and slurry power supply unit 110.In order to illustrate Fig. 1 includes the selected part of dismembyator 100, and may include other Part (not shown), such as chemical delivery pipeline, discharge pipe line, control unit, delivery module, pump etc..Wafer 112 to be ground It is mounted on the bottom of wafer carrying seat 106 down, so that the top surface of the top surface engagement pad 102 of wafer.Wafer carrying seat 106 revolves Turn wafer 112 and apply pressure (such as lower pressure) on it, so that wafer 112 is pushed to rotating pad 102.Including chemicals and The slurry 114 of abrasive grain is dispensed on the surface of pad.Chemical reaction between slurry 114, wafer 112 and pad 102 It can cause to remove material from the top surface of wafer 112 with mechanical wear.Meanwhile freeing wheel 108 can stir the top surface of pad 102 with extensive The roughness of multiple pad 102.However, this and it is unrestricted, and gone in grinding crystal wafer 112 and by wafer 112 from dismembyator 100 Except later, freeing wheel 108 can start to modify pad 102.
In some embodiments, platform 104, wafer carrying seat 106 and freeing wheel 108 (such as up time in the same direction Needle is counterclockwise) rotation, but there is different angular speed (such as rotation speed).Meanwhile wafer carrying seat 106 can pad It is swung between 102 center and peripheral.On the other hand, freeing wheel 108 can also between the center and peripheral of pad 102 or along Different paths is swung.However, the relative motion of above-mentioned various rotary parts (such as freeing wheel 108 and wafer carrying seat 106) It is without being limited thereto.
In some embodiments, Physical and mechanical properties of polyoropylene (such as the selection of roughness, material, porosity, rigidity of pad 102 Deng) depend on the material to remove from wafer 112.For example, copper grinding (copper polishing), copper stop grinding (copper barrier polishing), tungsten grind (tungsten polishing), shallow trench isolation grinds (shallow Trench isolation polishing), oxide grinding (oxide polishing) or buffering grinding (buff Polishing the pad for) needing that there is different materials, porosity and rigidity.It pads and needs used in dismembyator (such as dismembyator 100) With certain rigidity, so as to equably grinding crystal wafer surface.The stacking that (such as pad 102) can be soft material and hard material is padded, The local pattern of wafer 112 can be complied with to a certain extent.For example, pad 102 may include aperture at about 1 μm to about 500 μ Porous polymer material between m, but it is not limited to this.
According to some embodiments, Fig. 2 is exemplary the sectional view in the trimmed pad area 200 of pad 102 (also in Fig. 1 It shows).The continuous dressing movement that all features of the top surface 202 of 108 pairs of freeing wheel pads apply identical lower pressure can be formed Trimmed pad area 200.Therefore, the top surface 202 in trimmed pad area 200 is had evolved into as time go by entirely pad area There are the surface type looks (topography) (such as the heterogeneity of part) of the feature of local different height H1 and H2 in 200, Middle H2 is higher than H1 (such as H2 > H1).In some embodiments, the height (such as H2) on the top surface 202 of pad and low (such as H1) feature it Between difference in height can be up to 1mm (such as H2-H1≤1mm).The height of each feature is from 204 amount of bottom surface of pad to the top of pad The highest point of feature on surface 202, as shown in Figure 2.If above-mentioned freeing wheel continues with pad area 200, the table in the area Ze Dian 200 Face type looks will be apparent.For example, being respectively provided with the difference in height between the feature of height H1 and H2 will increase, and The uniformity in pad area 200 will further deteriorate.Because technique, pad 102 will lose its grainding capacity thus.
Fig. 3 is the sectional view of example trim wheel 300 in accordance with some embodiments.Freeing wheel 300 is about including diameter The pedestal 302 of 100mm.One or more elastomers 304 are attached to pedestal 302.According to some embodiments, each elastomer 304 Diameter can in the range of about 0.1mm to about 100mm (such as 10mm), and its height can about 1mm to about 30mm (such as In the range of 30mm).For example but not limited to this, each elastomer 304 may include steel spring, porous body (such as based on poly- The porous synthetic material of urethane or other polymers) or elastic material (such as elastomeric polymer).According to some embodiments, each Elastomer 304 is attached to side (such as bottom side or back side) of the pedestal 302 towards pad (pad 102 as shown in Figures 1 and 2).
With reference to Fig. 3, solid-state pedestal 306 is attached to each elastomer 304.Solid-state pedestal 306 can be by metal alloy, metal Or made by plastic cement.For example, solid-state pedestal 306 can be formed from steel.In addition, the height of solid-state pedestal 306 can be about 1mm to about 30mm (such as from about 30mm), and diameter can be about 0.1mm to about 100mm (such as from about 10mm).In some embodiments, The diameter of the diameter of solid-state pedestal 306 and following elastomer 304 matches.
Freeing wheel 300 further includes the diamond film 308 being arranged on each solid-state pedestal 306.For example but not limited to this, Diamond film 308 can be formed by chemical vapor deposition (chemical vapor deposition, CVD), and it is with a thickness of about 0.1mm to about 30mm (such as 30mm).In some embodiments, diamond film 308 defines " working region " of freeing wheel 300. It is exactly that freeing wheel 300 contacts the region for simultaneously " starting " top surface of (finishing) pad with pad.Therefore, diamond film 308 is in trim process In contact and be important with pad always.According to some embodiments, diamond film 308 can have nanocrystalline (nanocrystalline) Or the micro-structure of crystallite (microcrystalline).For example but not limited to this, it diamond crystallite in diamond film 308 or receives The size of meter Jing can be in the range of about 1 μm to about 1000 μm.
Each elastomer 304 with diamond film 308 and solid-state pedestal 306 can form flexible structure 310.According to some realities Example is applied, flexible structure 310 can be with the profile of the top surface of pad.In other words, in entire trim process, diamond film 308 Surface can keep contacting (as depicted in figs. 1 and 2) with the surface of each feature of pad 102.
With reference to Fig. 3, interval S between adjacent flexible structure 310 can in the range of about 1mm to less than about 100mm, This depends on the diameter of each flexible structure 310 of diameter, (ii) of (i) pedestal 302 and (iii) is attached to the rear side of pedestal 302 The quantity of the flexible structure 310 of surface or bottom surface.Fig. 4 A to Fig. 4 D is the plan view of the rear side surface of pedestal 302, is shown Illustrative arrangement of the flexible structure 310 on the rear side surface of pedestal 302.These arrangements are simultaneously unrestricted, And flexible structure 310 may also have other arrangements on the rear side surface of pedestal 302.In addition, flexible structure 310 It can be not limited to be of the same size, and they can have different sizes.The required trim rate of pad 102 can be passed through The quantity of flexible structure 310 is driven with the diameter of pedestal 302.
In some embodiments, and Fig. 5 is referred to, at least part side wall of the elastomer 340 of flexible structure 310 can quilt The rear side surface of pedestal 502 in freeing wheel 500 surrounds.In another embodiment, and Fig. 6 is referred to, flexible structure 310 The rear side surface for the pedestal 602 that the entire side wall of each elastomer 304 can be trimmed in wheel 600 surrounds.Therefore, flexible structure 310 elastomer 304, which can bury the depth in the rear side surface of freeing wheel pedestal, (to be attached at bottom as worked as between about 0mm (pedestal such as ought be partially or even wholly set to about 30mm when on the top of the rear side surface of seat 302, as shown in Figure 3) It is as shown in Figure 5 and Figure 6 respectively when in 502 and 602 rear side surface).
In some embodiments, such as with reference to Fig. 7 and freeing wheel 700, each flexible structure 720 may include around elasticity The braced frame 710 of the sidewall surfaces of body 304.Braced frame 710 prevents flexible structure 720 to be bent in trim process.Citing For, because the rotation of pedestal 302 and being applied to the lower pressure of flexible structure 720, some flexible structures 720 are on the surface of pad It may be easily bent when advancing in feature.Therefore, diamond film 308 may not reach the feature on pad surface.This is by shadow Ring the surface type looks of pad.For example, it can aggravate local inhomogeneities.
For example but not limited to this, according to some embodiments, Fig. 8 is the isometric view of Fig. 7, is shown in pedestal 302 Rear side surface on (such as on the surface of the top surface towards pad) flexible structure 720 and support around elastomer 304 Frame 710.However, the braced frame 710 described in Fig. 7 and Fig. 8 is only example, and it is not limited to this.For example, some In embodiment, as shown in figure 9, braced frame 710 surrounds one of elastomer 304 and solid-state pedestal 306 in freeing wheel 900 Point.In other words, the height 710 of braced frame 710HElastomer 304 can be less than and add the height 730 of solid-state pedestal 306 (such as 710H<730).This is for when needing to limit the motion range of flexible structure 310, (surface as worked as pad is very hard or in order to want When preventing flexible structure from shearing (shearing) occurs) it is advantageous.
According to some embodiments, Figure 10 describes flexible structure 310 and (suppressing) is inhibited to pad table in trim process The operation of local surfaces type looks on face.For example but not limited to this, when not applying pressure to pedestal 302, elastomer 304 Height can be 3H.When pressure P is equably applied to pedestal 302, elastomer 304 can be deformed (as compressed), and each may be used Scratch structure 310 can be pressurized and against the first and second features of pad 102, above-mentioned first and second feature be respectively provided with height H1 and H2, wherein H2 is greater than H1 (such as H1 < H2).According to some embodiments, (as having height H1) compared at lower feature, elasticity Body 304 at higher feature (as have height H2) on can be depressed it is more, as shown in Figure 10.For example, there is height It spends in the fisrt feature of H1 (such as flat surfaces of pad 102), the height of elastomer 304 will reduce (being such as reduced to 2H from 3H), and And H will be reduced to from 3H in the second feature with height H2.In other words, compared with feature shorter on pad 102, elasticity Body 304 can be more by compression at higher feature on pad 102.Moreover, it is assumed that the coefficient of elasticity of elastomer 304 is " k ", by can Scratch structure 310 be applied to the lower pressure of the first and second features with different height (respectively H1 and H2) will be due to elastomer The different decrements that are being subjected to and it is different.For example, the lower pressure F1 for being applied to the fisrt feature that height is H1 will Are as follows:
F1=k (3H -2H) or F1=kH
And the lower pressure F2 for being applied to the second feature that height is H2 will are as follows:
F2=k (3H-H) or F2=k2H
In other words, the lower pressure F2 for being applied to the second feature with height H2 will be greater than being applied to height H1's The lower pressure F1 (such as F1 < F2) of fisrt feature.In this particular example, the lower pressure F2 for being applied to the feature with height H2 is It is applied to twice of the lower pressure F1 of the feature with height H1.Therefore, that is, the pressure P of pedestal 302 is applied to for all Flexible structure 310 be it is identical, being applied to by each corresponding flexible structure and padding the lower pressure F of upper each feature is to depend on In the decrement of flexible structure, and this decrement is directly proportional to the height of the feature below flexible structure.In some embodiments In, it can be increased as the height of feature increases by the lower pressure that flexible structure 310 is applied to feature, and with the height of feature It reduces and reduces.Therefore, on pad 102 shorter feature or plane surface compared with, higher feature can be further processed.
In some embodiments, flexible structure 310 is to need to replace together with example trim wheel or disk 300 with the time Consumables.In some embodiments, it after grinding 1,000 to 6,000 wafers in dismembyator, needs replacing with flexible The freeing wheel of structure.
Figure 11 is the illustrative method 1100 of the pad in accordance with some embodiments modified in dismembyator using freeing wheel, Wherein there is on freeing wheel at least one flexible structure.Operation description that the present disclosure is not limited thereto.It should be appreciated that and additional behaviour can be performed Make.In addition, not all operations provided by the disclosure require to be performed.Furthermore it may be performed simultaneously some operations, or To be executed with order in a different order shown in Figure 11.In some embodiments, other than operate as described herein or To replace operate as described herein, one or more additional operations can be performed.In order to illustrate method 1100 is with reference to Fig. 1 Described by embodiment to Fig. 9.However, method 1100 is not limited to these examples.
Illustrative method 1100 is since operation 1110, wherein wafer is transmitted in dismembyator.With reference to Fig. 1, lift For example, wafer 112 can be transmitted in dismembyator 100 and be placed on wafer carrying seat 106 in the following, making the to be ground of wafer Side faces grinding pad 102.In other words, the top surface positioning of wafer 112 or the top surface against pad 102.Wafer 112 is for example It is transmitted in dismembyator 100 with the help of mechanical arm from transfer module, for sake of simplicity, transfer module is not shown in Fig. 1.
With reference to Figure 11, illustrative method 1100 proceeds to operation 1120.Wafer 112 is ground in operation 1120 Mill.With reference to Fig. 1, grinding operation includes distributing slurry 114 and then rotation by slurry power supply unit 110 on pad 102 Wafer carrying seat 106 and pad 102 (such as passing through platform 104).In some embodiments, wafer carrying seat 106 and pad 102 are along phase Equidirectional rotation, however, their own revolving speed or angular speed are different.During operation 1120, wafer carrying seat 106 exists From the pivot of pad 102 to the edge of pad 102 on the radial direction of pad.
In operation 1130, it can be then removed from dismembyator 100 after wafer 112 is ground.For example but it is unlimited In this, wafer 112 can be transferred to another module and grind and/or handle be cleaned, further.
In operation 1140, using the freeing wheel thereon at least one flexible structure to be carried out on the pad 102 of Fig. 1 Trim process.In some embodiments, this freeing wheel is similar to freeing wheel 300 shown in Fig. 3.Freeing wheel 300 includes at least One is attached at flexible structure 310 of the pedestal 302 towards (such as back surface) on the surface of top surface.In some embodiments, In In trim process, freeing wheel 300 and pad 102 rotate in the same direction but have different rotation speeds.In addition, in addition to rotation Except movement, freeing wheel 300 is swung in the radial direction from the center of pad 102 to edge, or is padding 102 tables in other paths It is swung on face.
In some embodiments, pad 102 comes including substantially planar region, compared with the substantially planar region of pad Say higher feature and compared with substantially planar region for lower feature.For example but not limited to this, pad The maximum height difference between two features on top surface is not greater than about 1mm.For example, in Figure 10, with height H1 Difference in height between flat site and higher feature with height H2 is about 1mm or less.According to some embodiments, due to can The flexure operation (as compressed) of the elastomer of structure 310 is scratched, the lower pressure for being applied to the feature with different height is different. For example, compared with the flat site of pad or shorter feature, higher feature is from flexible structure 310 by bigger pushing Power.Therefore, compared with the shorter feature of pad 102, the feature of recess or flat site, higher feature is by more energetically " place Reason ".
In some embodiments, the arrangement of the flexible structure 310 on the rear side of pedestal 302 or quantity are based on pedestal Expectation interval S (as shown in Figure 3) between 302 diameter, the diameter of flexible structure 310 and adjacent flexible structure 310.It lifts For example but not limited to this, Fig. 4 A to Fig. 4 D is the plan view of the rear side surface of pedestal 302, shows the rear side in pedestal 302 The exemplary arrangement mode of flexible structure 310 on surface.These arrangements are simultaneously unrestricted, and flexible structure 310 Can also have other arrangements on the rear side surface of pedestal 302.
As described above, each flexible structure 310 includes elastomer 304, the solid-state pedestal 306 above elastomer and solid-state bottom The diamond film 308 of seat top, as shown in Figure 3.According to some embodiments, the height of elastomer 304 is in about 0.1mm to about 30mm Between (such as 30mm), diameter and may include steel spring, porous material (such as based on poly- between about 100mm in about 0.1mm The porous synthetic material or other polymers of urethane) or elastic material (such as elastomeric polymer).Each of these materials can With with different coefficient of elasticity, or specific coefficient of elasticity can be manufactured with.These materials are simultaneously unrestricted, and And other materials can be used to substitute.In some embodiments, the height of solid-state pedestal 306 about 0.1mm and about 30mm it Between, diameter may include steel between about 0.1mm and about 30mm.Alternatively, solid-state pedestal 306 can by plastic material, metal or Made by metal alloy.In some embodiments, the diameter of solid-state pedestal 306 is consistent with the diameter of the elastomer 304 of lower section.In In some embodiments, the thickness of diamond film 308 (such as 30mm) between about 0.1mm and about 30mm.In addition, diamond film 308 connects Touch pad simultaneously " starts " top surface of (finishing) pad.According to some embodiments, diamond film 308 can have nanocrystalline or crystallite micro- knot Structure.For example, the diamond crystallite or nanocrystalline size in diamond film 308 can be in the range of about 1 μm to about 1000 μm, this is taken Certainly the material removed from crystal column surface is padded in needs.
In addition, flexible structure 310 can be attached to the rear side surface of pedestal 302 at different depth.For example, scheming In 3, flexible structure 310 is directly attached on the rear side surface of pedestal 302 of freeing wheel 300, and in fig. 5 and fig., flexible knot The pedestal 602 of pedestal 502 and freeing wheel 600 that structure 310 is trimmed wheel 500 respectively partly surrounds.In some embodiments, and And according to Fig. 5, flexible structure 310 be positioned such that the side wall of elastomer 304 be trimmed wheel 500 pedestal 502 partly wrap It encloses.In some embodiments, and Fig. 6 is referred to, flexible structure 310 is positioned such that the side wall of elastomer 304 is trimmed wheel 600 pedestal 602 surrounds completely.In other words, the top surface relative to the rear side of pedestal 302, the depth where elastomer 304 It can be in the range of 0mm to about 30mm.
In some embodiments, flexible structure 310 includes braced frame 710 as shown in Figure 7 to 9.In addition, support frame The height 710 of frame 710HIt can the short height 730 added up in elastomer 304 and solid-state pedestal 306.Therefore, the height of braced frame 710 Degree 710HIt can be in the range of about 0.1mm to about 60mm.In some embodiments, braced frame 710 prevents flexible structure 310 It is bent during trim process.For example, some due to being applied to the rotary force of flexible structure 310 and the combination of lower pressure Flexible structure 310 may become easy bending when advancing in the higher feature on the surface of pad.Therefore, braced frame 710 is true Protect each diamond film 308 of flexible structure 310 surface of engagement pad always during the trim process of the operation 1140 of Figure 11.
In some embodiments, sequentially execute operation 1120 and 1140 (operation 1130 between two operation between) and It may be performed simultaneously operation 1120 and 1140.For example, grinding technics and pad trim process can be carried out simultaneously.In some realities It applies in example, in some embodiments as described herein, can be extended after processing using the pad freeing wheel with flexible structure 310 The service life of pad about 30%.
In addition, the pad freeing wheel with flexible structure can be used for modifying the pad for being used for various CMP process, Including the CMP process for metal, dielectric medium and other materials.In addition, the pad freeing wheel with flexible structure It can be used as the pad of the CMP process in finishing manufacture chip different zones, such as producing line front end (front end Of the line, FEOL), producing line middle-end (middle of the line, MOL) and producing line rear end (back end of the Line, BEOL).It is put down in addition, the pad freeing wheel with flexible structure can be used for modifying in any technical field including chemical machinery The pad of smooth chemical industry skill.
This disclosure relates to a kind of pad freeing wheel with one or more flexible structures.Above-mentioned one or more flexible structures attachment To the surface of pad top surface of the freeing wheel towards pad.According to some embodiments, flexible structure includes elastomer, the flat region with pad Domain is compared with recess feature, and above-mentioned elastomer applies additional lower pressure to the higher feature of pad.It therefore, can be in the entire of pad The flatness that pad surface is kept during service life, to extend the service life of pad.In some embodiments, the service life of pad can prolong Long most 30%.In some embodiments, elastomer includes steel spring, porous body or elastomer, can be directly attached to modify Below the pedestal of wheel.In other embodiments, it other than the elastomer below freeing wheel, also prevents from repairing using braced frame The skew (diamond film such as contacted with pad) of whole wheel working surface.According to some embodiments, elastomer is located at freeing wheel pedestal On rear side surface or part is located in the rear side surface of freeing wheel pedestal.
In some embodiments, chemical mechanical planarization systems include pad on the rotating platform, are configured to wafer table Face is maintained at pad and above and to wafer applies stressed wafer carrying seat, is configured to distribute the slurry distribution of slurry on pad It device and is configured to the freeing wheel modified of pad.Freeing wheel further include pedestal and be attached to pedestal one or more are flexible Structure, each flexible structure have elastomer, and elastomer is configured to pressure under applying in the feature of pad, wherein lower pressure and spy The height of sign is directly proportional.
In some embodiments, pad freeing wheel includes rotating base and one or more the flexible knots for being attached to rotating base Structure, wherein each of one or more flexible structures includes: elastomer, and being configured to apply has different height in lower pressure to pad Surface characteristics, the solid-state pedestal on elastomer, the diamond film on solid-state pedestal, be configured to apply in response to elastomer The lower pressure that adds and engagement pad and braced frame, are configured to prevent the bending of one or more flexible structures.
In some embodiments, pad freeing wheel includes rotating base and one or more the elasticity knots for being attached to rotating base Structure, wherein each of one or more elastic constructions includes: elastomer, is configured to apply the first lower pressure to the fisrt feature padded On, and apply in the second lower pressure a to second feature of pad, wherein the first lower pressure is different from the second lower pressure, is located at bullet Solid-state pedestal on property body and the diamond film on solid-state pedestal.
Chemical mechanical planarization systems as described in some embodiments of the disclosure, elastomer include steel spring, porous polymeric Object or elastic material.One or more flexible structures further include solid-state pedestal and diamond film.One or more flexible structures further include support Frame is configured to prevent the bending of one or more flexible structures.One or more flexible structures are partially disposed at the rear side table of pedestal Face.Freeing wheel is arranged to apply a biggish lower pressure to the higher of pad compared to the lower pressure for the lower feature for being applied to pad Feature.
Pad freeing wheel as described in some embodiments of the disclosure, elastomer include steel spring, porous polymer or elasticity Object.Elastomer has between about 0.1mm to the height between about 30mm and between about 0.1mm to the diameter between about 100mm. Solid-state pedestal has between about 0.1mm to the height between about 30mm and between about 0.1mm to the diameter between about 100mm. Diamond film has the thickness between about 1 μm to about 1000 μm.Solid-state pedestal includes plastic cement, steel or metal.Braced frame is enclosed Around at least part of side wall of elastomer.
Pad freeing wheel as described in some embodiments of the disclosure, further includes: braced frame surrounds one or more flexible structures Side wall a part, be configured to prevent the bending of one or more flexible structures.Braced frame has between about 0.1mm to about 60mm Between height.At least part of rotating base encirclement elastomer.Elastomer has about 0.1mm to the height between about 30mm Degree.Elastomer has about 0.1mm to the diameter between about 100mm.The difference in height of fisrt feature and second feature is less than about 1mm.
It should be understood that embodiment of the present disclosure (rather than abstract) is to explain claim.The abstract of the disclosure Can illustrate one or more embodiments of the disclosure desired by inventor, rather than all possible embodiment, thus not with Any mode limits the protection scope of the application.
Above content summarizes the feature of many embodiments, therefore technical staff in any technical field, can more manage Solve the disclosure it is each towards.Technical staff in any technical field, may without difficulty based on the disclosure, design or Other techniques and structure are modified, to reach purpose identical with the embodiment of the present disclosure and/or obtain identical advantage.Belonging to any Technical staff in technical field it will also be appreciated that made in the conception and scope for not departing from the disclosure it is different change, replacement and modification, Design and range of the so equivalent creation not departing from the disclosure.