阅读说明：本技术 基于嵌入式系统的测试装置 (Test device based on embedded system ) 是由 陈新泉 宋阳 于 2019-07-10 设计创作，主要内容包括：本发明公开了基于嵌入式系统的测试装置,包括主控板、底板和若干测试板卡,底板与主控板电连接,底板上安装有若干连接件,每一个测试板卡与其中一连接件对应插接、实现底板与测试板卡之间的电连接。本发明通过测试板卡与底板之间插接继而实现测试板卡与底板之间的灵活安装与拆卸,提高测试装置的灵活性；通过单个测试板卡或者测试板卡与测试板卡之间的配合,实现测试板卡功能的可选择性,提高了测试板卡选择的多样化。(The invention discloses the test devices based on embedded system, including master control borad, bottom plate and several test boards, bottom plate is electrically connected with master control borad, and several connectors are equipped on bottom plate, and being electrically connected between bottom plate and test board is realized in the grafting corresponding with wherein a connection piece of each test board.The present invention passes through grafting between test board and bottom plate and then realizes the flexible installation and removal between test board and bottom plate, improves the flexibility of test device；By the cooperation between single test board or test board and test board, the alternative of test board function is realized, improve the diversification of test board selection.)

1. a kind of test device based on embedded system, which is characterized in that including master control borad, bottom plate and several test boards, The bottom plate is electrically connected with the master control borad, and several connectors are equipped on the bottom plate, each described test board and its In a connector correspond to grafting, realize being electrically connected between the bottom plate and the test board, several test boards Card is electrically connected by the bottom plate with the master control borad.

2. as described in claim 1 based on the test device of embedded system, which is characterized in that pacify in each test board Equipped with a plug-in unit, each plug-in unit grafting corresponding with a connector, several test boards are inserted by plug-in unit and connector Connect the assembly or disassembly for realizing test board and bottom plate.

3. as described in claim 1 based on the test device of embedded system, which is characterized in that master control borad includes mutually being electrically connected Single-chip microcontroller, multimeter chip, display touch screen module and several serial ports, the display touch screen module and the single-chip microcontroller connect It is bi-directionally connected, the single-chip microcontroller is electrically connected by several serial ports with the test board.

4. as described in claim 1 based on the test device of embedded system, which is characterized in that the test device further includes Assembly, the assembly include the first buck plate and the second buck plate, phase between first buck plate and the second buck plate It is mutually fixedly connected, the bottom plate is fixed on first buck plate.

5. as claimed in claim 4 based on the test device of embedded system, which is characterized in that first buck plate and institute Stating the second buck plate, to be mutually perpendicular to shape at L-shaped, does not contact between the bottom plate and first buck plate, second buck plate Several openings are equipped with, the output end of each test board exposes from a corresponding opening for connecting with equipment to be measured It connects.

6. as claimed in claim 4 based on the test device of embedded system, which is characterized in that the test device further includes First limit plate, first limit plate is installed on one end on first buck plate far from second buck plate, described Master control borad and several test boards are equipped with the first groove close to one end of first limit plate, on first limit plate Equipped with the first card slot cooperated with first groove, first groove and first card slot are coupled and for limiting It makes the master control borad and several test board opposed bottoms is subjected to displacement, one end of first limit plate and described first Buck plate is pivotally connected, and the other end of first limit plate is detachably connected with first buck plate.

7. as claimed in claim 4 based on the test device of embedded system, which is characterized in that the test device further includes Second limit plate, second limit plate is installed on one end on second buck plate far from first buck plate, described Master control borad and several test boards are equipped with the second groove close to one end of second limit plate, on second limit plate Equipped with the second card slot cooperated with second groove, second groove and second card slot are coupled and for limiting It makes the master control borad and several test board opposed bottoms is subjected to displacement, one end of second limit plate and described second Buck plate is pivotally connected, and the other end of second limit plate is detachably connected with second buck plate.

Technical field

The present invention relates to software system test engineering device technique fields, more particularly to the test device based on embedded system.

Background technique

The test function of the test device of embedded system is fixed at present, to the voltage and current of embedded system The device tested, the device are only capable of testing the electric current and voltage of embedded system, and cannot to other parameters into Row test, it is low to use flexibility.

Summary of the invention

The main purpose of the present invention is to provide the test devices based on embedded system, can be realized to embedded system Increasing or deleting for test function, improves the flexibility of test device.

To achieve the above object, the present invention provides the test device based on embedded system, including master control borad, bottom plate and Several test boards, the bottom plate are electrically connected with the master control borad, and several connectors are equipped on the bottom plate, described in each Being electrically connected between the bottom plate and the test board is realized in test board grafting corresponding with wherein one connector, if The test board is done to be electrically connected by the bottom plate with the master control borad.

As an improvement being equipped with a plug-in unit in each test board, each plug-in unit is corresponding with a connector Grafting, several test boards realize the assembly or disassembly of test board and bottom plate by plug-in unit and connector grafting.

As an improvement master control borad include the single-chip microcontroller being electrically connected to each other, multimeter chip, display touch screen module and Several serial ports, the display touch screen module are bi-directionally connected with the single-chip microcontroller, the single-chip microcontroller by several serial ports with The test board electrical connection.

As an improvement the test device further includes assembly, the assembly includes the first buck plate and second Buck plate is mutually permanently connected between first buck plate and the second buck plate, and the bottom plate is fixed on first assembly Plate.

As an improvement to be mutually perpendicular to shape at L-shaped for first buck plate and second buck plate, the bottom plate with It is not contacted between first buck plate, second buck plate is equipped with several openings, the output end of each test board Expose from a corresponding opening for being connect with equipment to be measured.

As an improvement the test device further includes the first limit plate, first limit plate is installed on described Far from one end of second buck plate, the master control borad and several test boards close to first limit on one buck plate One end of position plate is equipped with the first groove, and first limit plate is equipped with the first card slot cooperated with first groove, described First groove and first card slot are coupled and for limiting the master control borad and several test board opposed bottoms It is subjected to displacement, one end of first limit plate and first buck plate are pivotally connected, the other end of first limit plate It is detachably connected with first buck plate.

As an improvement the test device further includes the second limit plate, second limit plate is installed on described Far from one end of first buck plate, the master control borad and several test boards close to second limit on two buck plates One end of position plate is equipped with the second groove, and second limit plate is equipped with the second card slot cooperated with second groove, described Second groove and second card slot are coupled and for limiting the master control borad and several test board opposed bottoms It is subjected to displacement, one end of second limit plate and second buck plate are pivotally connected, the other end of second limit plate It is detachably connected with second buck plate.

Test device provided by the invention based on embedded system, it is then real by grafting between test board and bottom plate Flexible installation and removal between existing test board and bottom plate, improve the dismounting flexibility of test device；Pass through single test board Card or the cooperation between test board and test board realize the alternative of test board function, improve test board The diversification of selection；By setting assembly and the first limit plate and the second limit plate, test board can be improved and using When stability and disassembly when agility.

Detailed description of the invention

Fig. 1 is the overall structure diagram of first embodiment of the invention device.

Fig. 2 is the structure enlargement diagram of A in first embodiment of the invention Fig. 1.

Fig. 3 is the system block diagram of first embodiment of the invention master control borad.

Fig. 4 is the left view of first embodiment of the invention assembly.

Fig. 5 is the system block diagram of first embodiment of the invention relay board.

The system block diagram of the position Fig. 6 first embodiment of the invention data acquisition and control card.

In figure: 1, master control borad；2, bottom plate；21, connector；3, test board；31, plug-in unit；32, the first card slot；33, second Card slot；34, output end needle stand；4, assembly；41, the first buck plate；42, the second buck plate；421, it is open；43, the first limit Plate；431, the first groove；44, the second limit plate；441, the second groove.

Specific embodiment

In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not For limiting the present invention.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work Every other embodiment obtained is put, shall fall within the protection scope of the present invention.

Fig. 1-2 is please referred to, the present invention provides the test devices based on embedded system, including master control borad 1,2 and of bottom plate Test board 3, master control borad 1 include single-chip microcontroller, multimeter chip and several serial ports being electrically connected to each other, and bottom plate 2 includes power supply mould Block and data conversion module, power module are used for for providing stable power supply, data conversion module for device to 1 He of master control borad Signal transmission between test board 3；In master control borad 1, touch screen module is two-way is electrically connected with display by several serial ports for single-chip microcontroller Connect, single-chip microcontroller by relay control multimeter chip power switch, multimeter chip with the external world device under test connect, from It and is that the test of device under test is prepared.It should be pointed out that in the present embodiment, single-chip microcontroller is used but is not limited to Using STM32F103 model；Multimeter chip is used but is not limited to using FS9922 model, multimeter chip for pair Extraneous device under test measures, other have the chip of this function that can also be replaced to be applied in the present embodiment.

Fig. 3 is please referred to, several connectors 21 are installed on bottom plate 2, a plug-in unit is installed in each test board 3 31, a plug-in unit 31 and 21 grafting of connector are installed, each test board 3 passes through plug-in unit 31 and corresponding connector 21 are coupled the grafting for realizing test board 3 and bottom plate 2, it is noted that test board 3 here can be single Test board 3 is also possible to the combination of two or more test boards 3；Pass through the grafting energy of plug-in unit 31 and connector 21 Enough realize the assembly or disassembly of test board 3 and bottom plate 2, such test board 3 very easily can dismantle or be mounted on bottom On plate 2, the dismounting flexibility of test device is improved, when one of several test boards 3 pass through plug-in unit 31 and any one After 21 grafting of connector installation, corresponding test board 3 is just logical to be electrically connected with bottom plate 2, then makes test board 3 and master control It is electrically connected between plate 1；Test board 3 includes power supply, ARM microprocessor, several serial line interfaces, test circuit board, and power supply is it His module provides electric energy, and ARM microprocessor and test circuit board electrical connection, test board 3 are electrically connected by bottom plate 2 with master control borad 1 Connect, be then electrically connected the output end of test board 3 with device under test, whole device can be connect with device under test into The set test function of row (for example test board is relay board, then relay board card passes through the electricity of bottom plate 2 and master control borad 1 The realization of the switching function of relay board is realized in connection), it is noted that test board 3 and master control borad 1 will draw a design, Then rewiring not only facilitates the installation of plug-in unit 31 and the output end needle stand 34 of test board 3 and the second buck plate in this way The cooperation of 42 opening 421 connect with the external world convenient for test board 3 and is tested, and the pin of connector 21 also passes through to be arranged again Sequence facilitates the signal between test board 3 and master control borad 1 and bottom plate 2 to transmit.In the present embodiment, test board 3 can be But it is not limited to relay board, data acquisition and control card, millivolt voltage measurement card, precision resistance measurement card therein one Kind, the cooperation of one or more test boards 3 and bottom plate 2 and master control borad 1 (for example grafting relay board and data acquire When with control card, can be realized relay board and data acquisition and the function of Control card), building one have it is expansible, Modularization, a multi-functional general test module can support computer system and monolithic using the form of board simultaneously Machine system, it is noted that the subsequent board that can also extend different function as needed, realize to the accumulation of technical resource with Integration.

Please together referring to Fig. 1 and Fig. 4, the test device based on embedded system further includes assembly 4, and assembly 4 includes First buck plate 41 and the second buck plate 42, are fixedly mounted, the first buck plate between the first buck plate 41 and the second buck plate 42 41 with the second buck plate 42 to be mutually perpendicular to shape at L-shaped, and bottom plate 2 is fixed on the first buck plate 41 and bottom plate 2 and the first buck plate It does not contact between 41, convenient for improving the heat-sinking capability of bottom plate 2, convenient for device long lasting for work, is set on the second buck plate 42 There are several openings 421, the output end of test board 3 exposes from opening 421, for connecting with equipment to be measured.

In the present embodiment, the first limit plate 43 is installed on one end on the first buck plate 41 far from the second buck plate 42, Master control borad 1 and several test boards 3 are equipped with the first groove 431 close to one end of the first limit plate 43, set on the first limit plate 43 There is the first card slot 32 with the cooperation of the first groove 431, the first groove 431 and the first card slot 32 are coupled and for limiting master Control plate 1 and 3 opposed bottom 2 of several test boards are subjected to displacement, and one end of the first limit plate 43 and 41 pivot of the first buck plate connect It connects, the other end of the first limit plate 43 is detachably connected with the first buck plate 41, the installation of the second limit plate 44 and the second buck plate Far from one end of the first buck plate 41 on 42, master control borad 1 and several test boards 3 are equipped with the close to one end of the second limit plate 44 Two grooves 441, the second limit plate 44 are equipped with the second card slot 33 cooperated with the second groove 441, the second groove 441 and the second card Slot 33 is coupled and for limiting master control borad 1 and 3 opposed bottom 2 of several test boards is subjected to displacement, the second limit plate 44 One end and the second buck plate 42 be pivotally connected, the other end of the second limit plate 44 is detachably connected with the second buck plate 42, makes With this structure, when mounting and dismounting limit plate, it is only necessary to remove then rotate on one side can release to master control borad 1 with And the displacement limitation of test board 3, use risk that is more convenient, and avoiding limit plate loss.

Fig. 5 is please referred to, more particularly, test board 3 is relay board, and relay board includes that power supply, 2 roads are serial Interface (RS-485, RS232 respectively all the way), ARM, No. 12 general-purpose relay circuits, 8 tunnels have voltage and current acquisition function Relay circuit, power supply are made of non-isolated DC/DC and linear regulator chip, the former is used for externally input 8~32V's DC power supply becomes the DC output of the 5V of pressure stabilizing；The DC of 3.3V needed for the latter is used to the DC of 5V becoming ARM, they are jointly Entire board power supply.Serial interface circuit include RS-485 and RS232 interface respectively all the way, when use, can be selected according to actual needs With.No. 20 relays are divided into two ways in total: wherein 12 tunnels be common miniature relay, every road have it is normally opened, normally closed and The interface of common end three, the signal that these accesses can be born are DC, 0.5A-125V of DC, 0.3A-60V of 1.0A-20V AC；Another No. 8 relay only mentions the normally opened and interface of common end two, but is furnished with real-time voltage and current detection function, can be real-time The voltage and current for monitoring each access is limited by voltage/current detection circuit, these accesses can only meet -32~32V DC within the scope of direct current signal, maximum can bear electric current be 10A.

Fig. 6 is please referred to, more particularly, test board 3 is that data acquire and control card, data acquisition include with control card Power supply, 2 road serial line interfaces (RS-485, RS232 respectively all the way), ARM, simulation input interface, 2 road DA circuits, 16 road output interfaces Circuit, power supply are made of non-isolated DC/DC and linear regulator chip, the former is used for the electricity of the DC of externally input 8~32V Source becomes the DC output of the 5V of pressure stabilizing；The DC of 3.3V needed for the latter is used to the DC of 5V becoming ARM, they are entire jointly Board power supply.Serial interface circuit include RS-485 and RS232 interface respectively all the way, user can select according to actual needs.32 Road analog input circuit is divided into two kinds of structures, wherein preceding 24 tunnel is subjected to 0~32V analog input voltage, rear 8 tunnel acceptable -32 The analog input circuit of~32V range.D/A chip and corresponding fortune of the 2 road DA circuits using two-way 16Bit current-output type It puts, the composition such as high-precision reference power circuit, -10~10V analog output voltage can be provided.

The above are merely embodiments of the present invention, it should be noted here that for those of ordinary skill in the art, Without departing from the concept of the premise of the invention, improvement can also be made, but these are all belonged to the scope of protection of the present invention.