阅读说明：本技术 防止电子器件过热损坏的腔体装置 (Prevent electronic device from crossing the cavity device of cause thermal damage ) 是由 眭书剑 于 2018-05-23 设计创作，主要内容包括：本发明公开了防止电子器件过热损坏的腔体装置,包括腔体本体,腔体本体的上表面设置有一个凹腔,所述腔体本体为一体化结构,所述凹腔的深度为1cm-2cm,腔体本体的左外侧面和右外侧面分别设置有一个第一凹槽,所述第一凹槽内设置有多片散热片；腔体本体的左外侧面和右外侧面还分别设置有多个第二凹槽,第二凹槽与第一凹槽不相交,所述腔体本体的下表面为弧形,所述腔体本体的下表面设置有多个第二凹槽,所述凹腔上设置有盖板,所述盖板与凹腔右侧面铰链连接,所述盖板上设置有多个通风口,所述通风口均匀分布。本发明通过自带散热槽的一体化腔体,不仅可以实现微波电路的一次性封装成型,减少生产工序,还可以增加散热面积,提高电子元件工作的可靠性。(The invention discloses the cavity devices for preventing electronic device from crossing cause thermal damage, including cavity body, the upper surface of cavity body is provided with a cavity, the cavity body is integrated, the depth of the cavity is 1cm-2cm, the left outside side of cavity body and right lateral surface are respectively arranged with first groove, are provided with multi-disc cooling fin in first groove；The left outside side of cavity body and right lateral surface are also respectively provided with multiple second grooves, second groove and the first groove are non-intersecting, the lower surface of the cavity body is arc, the lower surface of the cavity body is provided with multiple second grooves, cover board is provided on the cavity, the cover board is connect with cavity right side hinge, and multiple ventilation openings are provided on the cover board, and the ventilation opening is uniformly distributed.The disposable encapsulated moulding of microwave circuit not only may be implemented by the integrated cavity of included radiating groove in the present invention, reduces production process, can also increase heat dissipation area, improves the reliability of electronic component work.)

1. preventing electronic device from crossing the cavity device of cause thermal damage, including cavity body, the upper surface of cavity body is provided with one Cavity (1), which is characterized in that the cavity body is integrated, and the depth of the cavity (1) is 1cm-2cm, cavity sheet The left outside side of body and right lateral surface are respectively arranged with first groove (2), and multi-disc is provided in first groove (2) and is dissipated Backing (3)；The left outside side of cavity body and right lateral surface are also respectively provided with multiple second grooves (4), the second groove (4) with First groove (2) is non-intersecting, and the lower surface of the cavity body is arc, and the lower surface of the cavity body is provided with multiple the Two grooves (4) are provided with cover board on the cavity (1), and the cover board is connect with cavity right side hinge, is arranged on the cover board There are multiple ventilation openings, the ventilation opening is uniformly distributed.

2. preventing electronic device from crossing the cavity device of cause thermal damage described in any one according to claim 1, which is characterized in that institute The surface for stating the first groove (2), cooling fin (3) and the second groove (4) is coated with heat radiation coating.

3. the cavity device according to claim 1 for preventing electronic device from crossing cause thermal damage, which is characterized in that the cavity sheet The leading flank of body is provided with the first circular hole (5), and the central axis of first circular hole (5) is in the leading flank of cavity body, and One circular hole (5) is through-hole, and one end of the first circular hole (5) is located at the side of cavity (1).

4. the cavity device according to claim 3 for preventing electronic device from crossing cause thermal damage, which is characterized in that first circle Radio frequency connector is provided in hole (5).

5. the cavity device according to claim 1 for preventing electronic device from crossing cause thermal damage, which is characterized in that the cavity sheet The leading flank of body is additionally provided with square hole (6), and the central axis of the square hole (6) is rectangular in the leading flank of cavity body Hole (6) is through-hole, and one end of square hole (6) is located at the side of cavity (1).

6. the cavity device according to claim 5 for preventing electronic device from crossing cause thermal damage, which is characterized in that the square hole (6) micro- rectangular connector is provided in.

7. the cavity device according to claim 1 for preventing electronic device from crossing cause thermal damage, which is characterized in that the cavity sheet The trailing flank of body is provided with the second circular hole (7), and the central axis of second circular hole (7) is in the trailing flank of cavity body, and Two circular holes (7) are through-hole, and one end of the second circular hole (7) is located at the side of cavity (1).

8. the cavity device according to claim 1 for preventing electronic device from crossing cause thermal damage, which is characterized in that second circle Glass insulator is provided in hole (7).

Technical field

The present invention relates to a kind of cavity equipments, and in particular to prevents electronic device from crossing the cavity device of cause thermal damage.

Background technique

Existing shell is mostly package assembly, is not only not easy to assemble, but also the stress of component seam crossing is bad, cannot be played Sealing, mechanical support and physical protection effect well；In addition, the bad, surface of the existing generally existing heat dissipation of metal-packaged shell The excessively high problem of temperature, and lasting high temperature can cause irreversible damage to the electronic component encapsulated in it.

Summary of the invention

The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide to prevent electronic device from crossing cause thermal damage Cavity device, which is the integrated cavity of included radiating groove, and the disposable envelope of microwave circuit not only may be implemented Type is dressed up, production process is reduced, heat dissipation area can also be increased, improves the reliability of electronic component work.

The present invention solves the above problems by the following technical programs:

Prevent electronic device from crossing the cavity device of cause thermal damage, including cavity body, the upper surface of cavity body is provided with one A cavity, the cavity body are integrated, and the depth of the cavity is 1cm-2cm, the left outside side of cavity body and Right lateral surface is respectively arranged with first groove, is provided with multi-disc cooling fin in first groove；Cavity body it is left outside Side and right lateral surface are also respectively provided with multiple second grooves, and the second groove and the first groove are non-intersecting, the cavity body Lower surface be arc, the lower surface of the cavity body is provided with multiple second grooves, is provided with cover board on the cavity, institute It states cover board to connect with cavity right side hinge, multiple ventilation openings is provided on the cover board, the ventilation opening is uniformly distributed.This hair It is bright to reduce production process by the way that the disposable encapsulated moulding of microwave circuit by cavity body integrated molding, may be implemented, and set The heat dissipation area of cavity body can be increased by setting the first groove and the second groove, accelerated radiating rate, be arranged in the second groove The heat dissipation area help that cooling fin can not only increase cavity body is radiated, and can also be played a supporting role, be enhanced cavity body Structural strength, increase service life.

Further, the surface of first groove, cooling fin and the second groove is coated with heat radiation coating.Heat radiation coating can To improve the radiating efficiency of body surface, reducing object system temperature can be according to the microwave circuit of encapsulation when using the present invention Watt level and it is expected that issuable heat, selects different heat radiation coating: low form heat radiation coating (body surface temperature Degree: 200 degree or less), middle warm type heat radiation coating (body surface temperature: 200~600 degree or less) or high temperature modification heat radiation coating (object Body surface temperature: 600 degree or more).

Further, the leading flank of the cavity body is provided with the first circular hole, the central axis of first circular hole In the leading flank of cavity body, the first circular hole is through-hole, and one end of the first circular hole is located at the side of cavity.

Further, radio frequency connector is provided in first circular hole.First circular hole is used for will by radio frequency connector Corresponding pin is drawn.

Further, the leading flank of the cavity body is additionally provided with square hole, the central axis of the square hole in The leading flank of cavity body, square hole is through-hole, and one end of square hole is located at the side of cavity.

Further, micro- rectangular connector is provided in the square hole.Square hole is used for will by micro- rectangular connector Corresponding pin is drawn.

Further, the trailing flank of the cavity body is provided with the second circular hole, the central axis of second circular hole In the trailing flank of cavity body, the second circular hole is through-hole, and one end of the second circular hole is located at the side of cavity.

Further, glass insulator is provided in second circular hole.Glass insulator is used to support across the second circle The conducting wire in hole simultaneously makes its insulation, can be used for transmitting high frequency, low frequency signal.

Compared with prior art, the present invention having the following advantages and benefits: 1, the present invention is by by cavity body The disposable encapsulated moulding of microwave circuit may be implemented in integrated molding, reduces production process；2, the first groove and second is set Groove can increase the heat dissipation area of cavity body, accelerate radiating rate；3, cooling fin is arranged in the second groove not only can be with The heat dissipation area help for increasing cavity body is radiated, and can also be played a supporting role, be enhanced the structural strength of cavity body, increase Service life；4, the radiating efficiency of body surface can be improved in heat radiation coating, reduces object system temperature.

Detailed description of the invention

Attached drawing described herein is used to provide to further understand the embodiment of the present invention, constitutes one of the application Point, do not constitute the restriction to the embodiment of the present invention.In the accompanying drawings:

Fig. 1 is the structural diagram of the present invention.

Fig. 2 is the structural schematic diagram after Fig. 1 is inverted.

Label and corresponding parts title in attached drawing:

1-cavity, the 2-the first groove, 3-cooling fins, the 4-the second groove, the 5-the first circular hole, 6-square holes, 7-the Two circular holes.

Specific embodiment

To make the objectives, technical solutions, and advantages of the present invention clearer, below with reference to embodiment and attached drawing, to this Invention is described in further detail, and exemplary embodiment of the invention and its explanation for explaining only the invention, are not made For limitation of the invention.