阅读说明：本技术 助焊剂组合物、焊膏组合物和焊点 (Solder flux composition, paste composition and solder joint ) 是由 野中朋子 永井智子 于 2018-04-12 设计创作，主要内容包括：本发明的目的在于提供助焊剂的飞散被抑制的助焊剂组合物和焊膏组合物。含有用下述式(1)表示的防飞散剂的助焊剂组合物。(式中,Z为任选取代的亚烷基,R<Sup>1</Sup>和R<Sup>2</Sup>各自独立地为任选取代的以下基团：烷基、芳烷基、芳基、杂芳基、环烷基或杂环烷基,R<Sup>3</Sup>和R<Sup>4</Sup>各自独立地为任选取代的烷基。)<Image he="206" wi="419" file="100004_DEST_PATH_IMAGE001.GIF" imgContent="drawing" imgFormat="GIF" orientation="portrait" inline="no"></Image>(The purpose of the present invention is to provide disperse repressed solder flux composition and the paste compositions of scaling powder.Solder flux composition containing the anti-agent of dispersing that useful following formula (1) indicates.(in formula, Z is the alkylidene optionally replaced, R 1 And R 2 It is each independently the following group optionally replaced: alkyl, aralkyl, aryl, heteroaryl, naphthenic base or Heterocyclylalkyl, R 3 And R 4 It is each independently the alkyl optionally replaced.))

1. solder flux composition, the anti-agent of dispersing indicated containing useful following formula (1):

[chemical formula 1]

In formula,

Z is the alkylidene optionally replaced,

R¹And R²It is each independently the following group optionally replaced: alkyl, aralkyl, aryl, heteroaryl, naphthenic base or heterocycle Alkyl,

R³And R⁴It is each independently the alkyl optionally replaced.

2. solder flux composition according to claim 1, wherein

Z is C₁~C₆Alkylidene,

R¹And R²It is each independently C₁~C₆Alkyl or alkyl-cycloalkyl,

R³And R⁴It is each independently C₁~C₆Alkyl.

3. solder flux composition according to claim 1 or 2, wherein the anti-agent of dispersing is 2,2 '-di-2-ethylhexylphosphine oxide [6- (1- methylcyclohexyl)-p-methyl phenol].

4. solder flux composition described according to claim 1 ~ any one of 3, wherein the weight ratio of the anti-agent of dispersing is 0.5 ~ 10 weight %.

5. solder flux composition described according to claim 1 ~ any one of 4, also contain rosin, activator, thixotropic agent and Solvent.

6. paste composition, contain according to claim 1 ~ any one of 5 described in solder flux composition and solder powder.

7. solder joint, wherein the solder joint is formed by paste composition according to claim 6.

Technical field

The present invention relates to solder flux composition, paste composition and solder joints (solder joint).

Background technique

For substrate from electronic component to electronic equipment engagement, assembling, be welded on into we using paste composition It is best in terms of face and reliability, and most generally carry out.Paste composition is by solder powder and rosin, activation Ingredient, that is, solder flux composition other than the solder powders such as agent, thixotropic agent, solvent is kneaded and mixture paste is made.

If scaling powder disperses on substrate when to base plate coating paste composition, cause to the electronic component on periphery Pollution, it is therefore desirable to inhibit dispersing for scaling powder.

In addition, coating of the paste composition to substrate is for example carried out by using the silk-screen printing of metal mask.Therefore, In order to ensure the printing of paste composition, the viscosity appropriateness of paste composition is needed.But the preservation of some paste compositions Stability is poor, and the viscosity of paste composition is sometimes through Shi Shenggao.

As current paste composition, for example, propose containing unleaded system's solder powder, rosin series resin, activator, The paste composition (patent document 1) of solvent and the antioxidant being made of the hindered phenolic compound that molecular weight is at least 500.

But the discovery when applicant studies paste composition described in patent document 1, it may occur that scaling powder It disperses.

As discussed above, it is desired to disperse repressed solder flux composition and the paste composition of scaling powder.

Summary of the invention

Problems to be solved by the invention

The object of the present invention is to provide disperse repressed paste composition and its contained scaling powder combinations of scaling powder Object.

In addition, the present invention also aims to, provide in addition to scaling powder disperse be suppressed other than, through when viscosity increase Also repressed paste composition and its contained solder flux composition.

The means to solve the problem

The present inventor furthers investigate in order to solve the above problems, as a result, it has been found that, the scaling powder group containing specific anti-agent of dispersing Close object and paste composition can inhibit paste composition using when scaling powder disperse and through when viscosity increase, to complete The present invention, concrete scheme of the invention are as described below.

[1] solder flux composition, the anti-agent of dispersing indicated containing useful following formula (1):

[chemical formula 1]

In formula,

Z is the alkylidene optionally replaced,

R¹And R²It is each independently the following group optionally replaced: alkyl, aralkyl, aryl, heteroaryl, naphthenic base or heterocycle Alkyl,

R³And R⁴It is each independently the alkyl optionally replaced.

[2] solder flux composition according to [1], wherein

Z is C₁~C₆Alkylidene,

R¹And R²It is each independently C₁~C₆Alkyl or alkyl-cycloalkyl,

R³And R⁴It is each independently C₁~C₆Alkyl.

[3] solder flux composition according to [1] or [2], wherein the anti-agent of dispersing is 2,2 '-di-2-ethylhexylphosphine oxides [6- (1- methylcyclohexyl)-p-methyl phenol].

[4] solder flux composition according to any one of [1] ~ [3], wherein the weight ratio of the anti-agent of dispersing For 0.5 ~ 10 weight %.

[5] solder flux composition according to any one of [1] ~ [4], also contains rosin, activator, thixotropic agent And solvent.

[6] paste composition, containing solder flux composition and solder powder described in any one of with good grounds [1] ~ [5].

[7] solder joint, wherein the solder joint is formed as the paste composition according to [6].

The effect of invention

Solder flux composition and paste composition of the invention can inhibit dispersing for scaling powder.

In addition, solder flux composition and paste composition of the invention can inhibit dispersing for scaling powder, also, can inhibit through When viscosity increase.

Detailed description of the invention

Fig. 1 is the figure of the schematic diagram of the Reflow Soldering curve (reflow profile) in the evaluation test for indicating to disperse.

Fig. 2 is the figure of the schematic diagram of the Reflow Soldering curve in the evaluation test for indicate weldability.

Specific embodiment

Solder flux composition and paste composition of the invention are illustrated below.

" solder flux composition " or " scaling powder " in the present invention refers to all other than the solder powder in paste composition Ingredient.In paste composition of the invention, the weight ratio (solder powder: scaling powder group of solder powder and solder flux composition Close object) preferably 80:20 ~ 90:10, more preferable 85:15 ~ 90:10.

The anti-agent of dispersing that solder flux composition of the invention is indicated containing useful above-mentioned formula (1).

In the anti-agent of dispersing indicated with formula (1), Z is the alkylidene optionally replaced, preferably C₁~C₆Alkylidene, more preferably For C₁~C₃Alkylidene, most preferably methylene.R¹And R²Be each independently the following group optionally replaced: alkyl, aralkyl, Aryl, heteroaryl, naphthenic base or Heterocyclylalkyl, preferably C₁~C₆Alkyl or alkyl-cycloalkyl, more preferably tert-butyl or 1- first Butylcyclohexyl, most preferably 1- methylcyclohexyl.R³And R⁴It is each independently C₁~C₆Alkyl, preferably C₁~C₃Alkyl, it is more excellent It is selected as ethyl or methyl, most preferably methyl.As the anti-agent of dispersing indicated with formula (1), such as it can be used 2,2 '-di-2-ethylhexylphosphine oxides (4- methyl-6-tert-butylphenol), 2,2 '-methylene-bis(4-ethyl-6-t-butyl phenol)s, 2,2 '-di-2-ethylhexylphosphine oxides [6- (1- Methylcyclohexyl)-p-methyl phenol], it is preferable to use 2 especially from the viewpoint of inhibiting the dispersing of scaling powder, 2 '-methylenes Base is bis- [6- (1- methylcyclohexyl)-p-methyl phenol].The anti-agent of dispersing indicated with above-mentioned formula (1) is relative to helping in the present invention The weight ratio of flux composition preferably 0.5 ~ 10 weight %, more preferable 1 ~ 6 weight %.

Paste composition of the invention contains solder powder.

As the composition of alloy of the solder powder in the present invention, Sn-Ag system alloy, Sn-Cu system alloy, Sn-Ag- can be used Cu system alloy, Sn-In system alloy, Sn-Bi system alloy, Sn-Sb system alloy, and in these alloys add Ag, Cu, Ni, Co, P, The alloy that Ge, Sb, In, Bi, Zn etc. are obtained.

Paste composition of the invention can also contain pine other than solder powder and the anti-agent of dispersing indicated with formula (1) Perfume, activator, thixotropic agent and solvent.

As rosin, hydrogenated rosin, sour modified rosin, newtrex, rosin ester etc. can be used.Rosin is relative to the present invention In solder flux composition weight ratio preferably 10 ~ 70 weight %, more preferable 30 ~ 60 weight %.

As activator, organic acid, amine halogen acid salt, organohalogen compound can be enumerated.These activators are desired for Water-soluble or alcohol is soluble.If example goes out the concrete example of activator, as follows.As organic acid, can enumerate stearic acid, Succinic acid, glutaric acid, adipic acid, azelaic acid, decanedioic acid, dimeric dibasic acid etc..As the amine compounds of amine halogen acid salt, can enumerate Ethamine, diethylamine, dibutyl amine, tri-n-butylamine, isopropylamine, diphenylguanidine, cyclohexylamine, aniline etc. can enumerate salt as halogen acids Acid, hydrobromic acid, hydroiodic acid.As organohalogen compound, the bromo- 2- butanol of 1-, the bromo- 2- propyl alcohol of 1-, the bromo- 1- third of 3- can be enumerated The bromo- 1,2- propylene glycol of alcohol, 3-, the bromo- 2- butanol of 1,4- bis-, the bromo- 2- propyl alcohol of 1,3- bis-, the bromo- 1- propyl alcohol of 2,3- bis-, 2,3- bis- are bromo- 1,4- butanediol, the bromo- 2- butylene-1,4-diol of 2,3- bis- etc..Weight of the activator relative to the solder flux composition in the present invention Amount ratio preferably 0.1 ~ 50 weight %, more preferable 1 ~ 40 weight %, most preferably 5 ~ 30 weight %.

As thixotropic agent, higher fatty acid amides, high-grade aliphatic ester, rilanit special etc. can be used.Thixotropic agent is opposite The weight ratio of solder flux composition in the present invention preferably 1 ~ 15 weight %.

As solvent, selected from the compound of commonly known glycol ethers system.If example goes out the concrete example of solvent, can arrange Enumerate diethylene glycol monobutyl ehter, diethylene glycol dibutyl ether, diethyleneglycol monohexylether, diglycol monotertiary -2- ethylhexyl ether, ethylene glycol Single phenyl ether, diethylene glycol monophenyl ether, dipropylene glycol monobutyl base ether, tripropylene glycol single-butyl ether etc..Solvent is opposite The weight ratio of solder flux composition in the present invention preferably 10 ~ 50 weight %, more preferable 20 ~ 40 weight %.

In the present invention, agent and contain rosin, activator, touching by modulating anti-disperse indicated containing useful above-mentioned formula (1) Become the solder flux composition of agent and solvent, and the solder flux composition and solder powder are kneaded, to prepare paste composition.

It, can be in the circuit of the fine structure of electronic equipment for the paste composition in the present invention modulated as described above On substrate, such as by using the print process of metal mask, by using the discharge method of distributor, or by utilizing transfer needle Transfer printing is coated on weld part, and carries out Reflow Soldering.

Welding temperature (Reflow Soldering temperature) is set as 20 ~ 30 DEG C of temperature higher than the fusing point of solder powder in the present invention.

In the present invention, by using above-mentioned paste composition, solder joint can be formed.

The present invention is concretely demonstrated by the following examples, but the present invention is not limited in described in embodiment Hold.