阅读说明：本技术 压力控制装置和半导体设备 (pressure control device and semiconductor device ) 是由 卢言晓 于 2019-06-11 设计创作，主要内容包括：一种压力控制装置和半导体设备,反应腔室与真空发生器相连接,压力控制装置包括：压力传感器,用于实时测量反应腔室的压力P；电控调压阀,连接于真空发生器的压缩空气入口端,用于调节真空发生器的负压口端的抽气压力；开度调节机构,设于连接反应腔室与真空发生器的负压口端的管道上,用于调节反应腔室的排气流量；以及控制器,根据压力P与目标压力P<Sub>0</Sub>之间的差值调节电控调压阀的压力设定值,从而调节真空发生器的负压口端的抽气压力,并根据反应腔室的进气流量控制开度调节机构的开度,从而调节反应腔室的排气流量,进而控制反应腔室的压力。即使在反应腔室的进气流量大范围变化时,也能够实现压力控制。(a pressure control device and a semiconductor apparatus, a reaction chamber is connected with a vacuum generator, the pressure control device includes: the pressure sensor is used for measuring the pressure P of the reaction chamber in real time; the electric control pressure regulating valve is connected to a compressed air inlet end of the vacuum generator and is used for regulating the air suction pressure of a negative pressure port end of the vacuum generator; the opening adjusting mechanism is arranged on a pipeline connecting the reaction chamber and the negative pressure port end of the vacuum generator and is used for adjusting the exhaust flow of the reaction chamber; and the controller is used for adjusting the pressure set value of the electrically-controlled pressure regulating valve according to the difference value between the pressure P and the target pressure P0 so as to adjust the pumping pressure of the negative pressure port end of the vacuum generator, and controlling the opening of the opening adjusting mechanism according to the air inlet flow of the reaction chamber so as to adjust the exhaust flow of the reaction chamber and further control the pressure of the reaction chamber. Pressure control can be achieved even when the flow rate of intake air to the reaction chamber is widely varied.)

1. A pressure control device for pressure controlling a reaction chamber, the reaction chamber being connected to a vacuum generator, the pressure control device comprising:

A pressure sensor for measuring the pressure P of the reaction chamber in real time;

The electric control pressure regulating valve is connected to a compressed air inlet end of the vacuum generator and is used for regulating the air suction pressure of a negative pressure port end of the vacuum generator;

The opening adjusting mechanism is arranged on a pipeline connecting the reaction chamber and the negative pressure port end of the vacuum generator and is used for adjusting the exhaust flow of the reaction chamber; and

And the controller adjusts the pressure set value of the electric control pressure regulating valve according to the difference value between the pressure P and the target pressure P0 so as to adjust the pumping pressure of the negative pressure port end of the vacuum generator, and controls the opening of the opening adjusting mechanism according to the air inlet flow of the reaction chamber so as to adjust the exhaust flow of the reaction chamber and further control the pressure of the reaction chamber.

2. The pressure control apparatus according to claim 1, wherein the controller controls the opening degree of the opening degree adjustment mechanism in accordance with an intake flow rate of the reaction chamber, thereby adjusting a flow cross-sectional area of the pipe to achieve a differential pressure boundary between upstream and downstream of the opening degree adjustment mechanism.

3. The pressure control device of claim 1 wherein the controller calculates a difference Δ P between the pressure P and a target pressure P0, where Δ P is P-P0, and increases the pressure set point of the electrically controlled pressure regulating valve when the difference Δ P is greater than zero and decreases the pressure set point of the electrically controlled pressure regulating valve when the difference Δ P is less than zero.

4. The pressure control apparatus according to claim 2, wherein the controller calculates a flow cross-sectional area of the pipe according to the following equation (1), and determines the opening degree of the opening degree adjustment mechanism according to the flow cross-sectional area:

Wherein qm represents the flow rate of the intake air to the reaction chamber,

A represents the flow cross-sectional area of the pipe,

P0 represents the target pressure and,

p1 represents the suction pressure at the negative port end of the vacuum generator,

k represents a specific heat ratio of the molten steel,

A represents a flow rate coefficient and a represents,

r represents a molar gas constant and represents a molar gas constant,

T0 represents the thermodynamic temperature within the pipe.

5. the pressure control device of claim 4, wherein the suction pressure P1 of the negative port end of the vacuum generator is determined by the pressure set value of the electrically controlled pressure regulating valve according to the specification parameters of the vacuum generator.

6. the pressure control device of claim 1, wherein the pressure sensor is a vacuum gauge and the pressure P is an absolute pressure.

7. the pressure control apparatus according to claim 1, further comprising a condenser disposed between the reaction chamber and the opening degree adjustment mechanism for cooling the gas discharged from the reaction chamber.

8. the pressure control device of claim 1, wherein the controller is a PLC controller.

9. a semiconductor apparatus comprising a reaction chamber and a vacuum generator, characterized by further comprising a pressure control device according to any one of claims 1 to 8, wherein the reaction chamber is connected to a negative pressure port end of the vacuum generator, and the pressure control device controls the pressure of the reaction chamber by adjusting a suction pressure at the negative pressure port end of the vacuum generator and an exhaust flow rate of the reaction chamber.

10. the semiconductor device of claim 9, wherein the exhaust port end of the reaction chamber is connected to a negative port end of a vacuum generator.

Technical Field

the present invention relates to the field of semiconductor devices, and more particularly, to a pressure control device and a semiconductor device including the same.

Background

The temperature, gas flow and pressure of the reaction chamber tend to affect the quality of the silicon wafer surface process. It is common to control the reaction chamber pressure using a relative pressure control method, i.e., the pressure in the reaction chamber is controlled based on a comparison of the pressure in the reaction chamber and the ambient pressure. The control method is greatly influenced by the fluctuation of the exhaust pressure, and the pressure of the reaction chamber is easy to fluctuate. Part of the process requires that the pressure in the reaction chamber is lower and exceeds the exhaust pressure of the plant service end.

According to the existing reaction chamber pressure control method, the pressure value of a reaction chamber is measured through a vacuum gauge, and the valve opening of an exhaust control valve of a vacuum generator is adjusted according to the difference value between the pressure value of the reaction chamber and a set pressure value, so that the exhaust flow of the reaction chamber is changed, and the internal pressure of the reaction chamber is adjusted. The vacuum generator can provide a stable power source, the power can be far higher than the supply air displacement of a plant service end, and the pressure fluctuation of a reaction chamber caused by the change of the air displacement of the plant service end is eliminated.

The problem with this method is that the control range of the evacuation control valve for the intake air flow rate is determined corresponding to the value of the evacuation pressure of the specified vacuum generator. When the process gas inlet flow rate is drastically changed, the control target cannot be achieved. Therefore, the existing control method is only suitable for occasions with small process gas flow range change and has limitation. In addition, even in the controllable flow rate range, when the gas flow rate changes, the control accuracy of the control valve fluctuates, and the control accuracy is not high.

disclosure of Invention

the invention aims to provide a pressure control device which can realize the pressure stabilization control of a reaction chamber when the gas flow is changed in a large range.

one aspect of the present invention provides a pressure control apparatus for controlling a pressure of a reaction chamber, the reaction chamber being connected to a vacuum generator, the pressure control apparatus comprising:

a pressure sensor for measuring the pressure P of the reaction chamber in real time;

the electric control pressure regulating valve is connected to a compressed air inlet end of the vacuum generator and is used for regulating the air suction pressure of a negative pressure port end of the vacuum generator;

the opening adjusting mechanism is arranged on a pipeline connecting the reaction chamber and the negative pressure port end of the vacuum generator and is used for adjusting the exhaust flow of the reaction chamber; and

And the controller adjusts the pressure set value of the electric control pressure regulating valve according to the difference value between the pressure P and the target pressure P0 so as to adjust the pumping pressure of the negative pressure port end of the vacuum generator, and controls the opening of the opening adjusting mechanism according to the air inlet flow of the reaction chamber so as to adjust the exhaust flow of the reaction chamber and further control the pressure of the reaction chamber.

Preferably, the controller controls the opening of the opening adjusting mechanism according to the air inlet flow of the reaction chamber, so as to adjust the flow cross-sectional area of the pipeline and realize the pressure difference boundary between the upstream and the downstream of the opening adjusting mechanism.

Preferably, the controller calculates a difference Δ P between the pressure P and a target pressure P0, where Δ P is P-P0, and increases the pressure set value of the electrically controlled pressure regulating valve when the difference Δ P is greater than zero and decreases the pressure set value of the electrically controlled pressure regulating valve when the difference Δ P is less than zero.

Preferably, the controller calculates a flow cross-sectional area of the pipe according to the following equation (1), and determines the opening degree of the opening degree adjustment mechanism according to the flow cross-sectional area:

Wherein qm represents the flow rate of the intake air to the reaction chamber,

A represents the flow cross-sectional area of the pipe,

P0 represents the target pressure and,

p1 represents the suction pressure at the negative port end of the vacuum generator,

k represents a specific heat ratio of the molten steel,

A represents a flow rate coefficient and a represents,

R represents a molar gas constant and represents a molar gas constant,

T0 represents the thermodynamic temperature within the pipe.

Preferably, according to the specification parameters of the vacuum generator, the suction pressure P1 of the negative pressure port end of the vacuum generator is determined by the pressure set value of the electrically controlled pressure regulating valve.

preferably, the pressure sensor is a vacuum gauge and the pressure P is an absolute pressure.

Preferably, the pressure control device further comprises a condenser, and the condenser is arranged between the reaction chamber and the opening degree adjusting mechanism and used for cooling the gas discharged from the reaction chamber.

Preferably, the controller is a PLC controller.

The invention also provides a semiconductor device, which comprises a reaction chamber, a vacuum generator and the pressure control device, wherein the reaction chamber is connected with the negative pressure port end of the vacuum generator, and the pressure control device controls the pressure of the reaction chamber by adjusting the pumping pressure of the negative pressure port end of the vacuum generator and the exhaust flow of the reaction chamber.

Preferably, the air outlet end of the reaction chamber is connected with the negative pressure port end of the vacuum generator.

the invention has the beneficial effects that: the pressure of the reaction chamber is gradually approached and reaches the target pressure through pressure feedback regulation. And when the air inflow of the reaction chamber is changed in a large range, the controller can control the opening of the opening adjusting mechanism according to the air inflow of the reaction chamber, so that the exhaust flow of the reaction chamber is adjusted, and the air inflow is adapted. In general, when the suction pressure at the negative pressure port end of the vacuum generator is substantially constant, if the flow rate of the intake air to the reaction chamber is increased, the opening degree of the opening degree adjustment mechanism is correspondingly increased to increase the flow rate of the exhaust gas, whereas if the flow rate of the intake air to the reaction chamber is decreased, the opening degree of the opening degree adjustment mechanism is correspondingly decreased to decrease the flow rate of the exhaust gas. Through the combined action of the electrically controlled pressure regulating valve and the opening degree regulating mechanism, the pressure of the reaction chamber can be stabilized at the target pressure even when the air inflow of the reaction chamber is changed in a large range, and the pressure control of the reaction chamber is realized.

the apparatus of the present invention has other features and advantages which will be apparent from or are set forth in detail in the accompanying drawings and the following detailed description, which are incorporated herein, and which together serve to explain certain principles of the invention.

drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail exemplary embodiments thereof with reference to the attached drawings, in which like reference numerals generally represent like parts.

FIG. 1 shows a schematic diagram of the operation of a vacuum generator;

fig. 2 shows a schematic configuration diagram of a reaction chamber pressure control apparatus according to an exemplary embodiment of the present invention.

Description of reference numerals:

The device comprises a vacuum generator 1, a negative pressure port 2, an exhaust port 3, a compressed air inlet 4, a reaction chamber 5, a pressure sensor 6, a controller 7, an electric control pressure regulating valve 8, an opening regulating mechanism 9 and a condenser 10.

Detailed Description

The invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

the embodiment of the invention provides a pressure control device, which is used for controlling the pressure of a reaction chamber, wherein the reaction chamber is connected with a vacuum generator, and the pressure control device comprises:

The pressure sensor is used for measuring the pressure P of the reaction chamber in real time;

The electric control pressure regulating valve is connected to a compressed air inlet end of the vacuum generator and is used for regulating the air exhaust pressure of a negative pressure port end of the vacuum generator;

the opening adjusting mechanism is arranged on a pipeline connecting the reaction chamber and the negative pressure port end of the vacuum generator and is used for adjusting the exhaust flow of the reaction chamber; and

and the controller adjusts the pressure set value of the electrically-controlled pressure regulating valve according to the difference between the pressure P and the target pressure P0 so as to adjust the pumping pressure of the negative pressure port end of the vacuum generator, and controls the opening of the opening adjusting mechanism according to the air inflow of the reaction chamber so as to adjust the exhaust flow of the reaction chamber and further control the pressure of the reaction chamber.

When the process is carried out, the vacuum generator vacuumizes the reaction chamber, the pressure sensor measures the pressure P of the reaction chamber, the pressure signal is fed back to the controller, and the controller adjusts the pressure set value of the electric control pressure regulating valve according to the difference value between the pressure P and the target pressure P0, so that the air exhaust pressure of the negative pressure port end of the vacuum generator can be changed. Through constant feedback regulation, the pressure P of the reaction chamber gradually approaches and reaches the target pressure P0. Further, when the air inflow of the reaction chamber is changed in a wide range, the controller can control the opening of the opening adjusting mechanism according to the air inflow qm of the reaction chamber, so that the exhaust flow of the reaction chamber can be adjusted, and the air inflow qm of the reaction chamber can be adapted. In general, when the suction pressure at the negative pressure port end of the vacuum generator is substantially constant, if the flow rate of the intake air to the reaction chamber is increased, the opening degree of the opening degree adjustment mechanism is correspondingly increased to increase the flow rate of the exhaust gas, whereas if the flow rate of the intake air to the reaction chamber is decreased, the opening degree of the opening degree adjustment mechanism is correspondingly decreased to decrease the flow rate of the exhaust gas. Through the combined action of the electrically controlled pressure regulating valve and the opening degree regulating mechanism, the pressure of the reaction chamber can be stabilized at the target pressure even when the air inflow of the reaction chamber is changed in a large range, and the pressure control of the reaction chamber is realized.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In describing the embodiments of the present invention in detail, the drawings are not to be taken as a general scale, and are partially enlarged for convenience of illustration, and the drawings are for illustrative purposes only, and should not be taken as limiting the scope of the present invention.

first, the operation principle of the vacuum generator will be explained with reference to fig. 1. Referring to fig. 1, a vacuum generator 1 is provided with a negative pressure port end 2, an exhaust port end 3, and a compressed air inlet end 4. A high flow rate of compressed air is supplied to the vacuum generator through the compressed air inlet port 4, and the air is discharged from the air outlet port 3, so that a negative pressure is obtained at the negative pressure port end 2 to form a suction pressure. The suction capacity of the vacuum generator negative pressure port end 2 can be adjusted by adjusting the compressed air supply pressure.

fig. 2 shows a schematic configuration diagram of a reaction chamber pressure control apparatus according to an exemplary embodiment of the present invention. Referring to fig. 2, an embodiment of the present invention provides a pressure control device for controlling a pressure of a reaction chamber, wherein the reaction chamber 5 is connected to a vacuum generator 1, the pressure control device comprising:

The pressure sensor 6 is used for measuring the pressure P of the reaction chamber 5 in real time;

The electronic control pressure regulating valve 8 is connected to the compressed air inlet end 4 of the vacuum generator, and is used for regulating the air inlet pressure of the vacuum generator and further regulating the air exhaust pressure of the negative pressure port end of the vacuum generator;

the opening adjusting mechanism 9 is arranged on a pipeline connecting the reaction chamber 5 and the negative pressure port end 2 of the vacuum generator 1, and is used for adjusting the exhaust flow of the reaction chamber; and

And the controller 7 is used for adjusting the pressure set value of the electric control pressure regulating valve according to the difference value between the pressure P and the target pressure P0, so that the pumping pressure of the negative pressure port end 2 of the vacuum generator is adjusted, and controlling the opening of the opening adjusting mechanism 9 according to the air inflow of the reaction chamber, so that the exhaust flow of the reaction chamber is adjusted, and the pressure of the reaction chamber is further controlled.

specifically, the exhaust port end 3 of the reaction chamber 5 is connected with the negative pressure port end 2 of the vacuum generator 1 through a pipe, and the opening degree adjusting mechanism 9 is arranged on the pipe. The controller controls the opening of the opening adjusting mechanism according to the air inflow of the reaction chamber, so that the flow cross section of the pipeline is adjusted to adapt to the air inflow of the reaction chamber. When the flow rate of the intake air of the reaction chamber increases, increasing the opening degree of the opening degree adjusting mechanism so as to correspondingly increase the flow rate of the exhaust air of the reaction chamber; conversely, when the flow rate of intake air to the reaction chamber is decreased, the opening degree of the opening degree adjustment mechanism is decreased to correspondingly decrease the flow rate of exhaust air to the reaction chamber. The opening degree adjusting mechanism 9 can also realize the obvious differential pressure boundary of the upstream and downstream of the gas, ensure the differential pressure between the upstream and downstream, and be beneficial to the smooth flow of the gas to the plant service end.

optionally, the pressure sensor 6 is a vacuum gauge capable of measuring the absolute pressure of the reaction chamber, that is, the pressure P is an absolute pressure, so that the absolute pressure control when the flow of the inlet gas is changed in a large range can be realized to achieve the pressure control target.

Optionally, the controller 7 is a PLC controller.

Alternatively, the controller 7 calculates a difference Δ P between the pressure P and the target pressure P0, Δ P being P-P, and increases the pressure set value of the electrically controlled pressure regulating valve when the difference Δ P is greater than zero and decreases the pressure set value of the electrically controlled pressure regulating valve when the difference Δ P is less than zero.

Specifically, when the difference Δ P is greater than zero, that is, the pressure P of the reaction chamber 5 is greater than the target pressure P0, and the pressure setting value of the electrically controlled pressure regulating valve is increased, the intake pressure of the vacuum generator 1 will be increased, and the exhaust pressure of the negative pressure port end 2 of the vacuum generator 1 will be increased accordingly, the exhaust flow rate of the reaction chamber 5 is increased, and the pressure P of the reaction chamber is decreased; conversely, when the difference Δ P is less than zero, i.e. the pressure P of the reaction chamber 5 is less than the target pressure P0, the pressure set value of the electrically controlled pressure regulating valve is decreased, the intake pressure of the vacuum generator 1 is decreased, the exhaust pressure of the negative pressure port end 2 of the vacuum generator 1 is decreased, accordingly, the exhaust flow rate of the reaction chamber 5 is decreased, and the pressure P of the reaction chamber is increased. Through the repeated adjustment of the controller, the target pressure P0 is finally reached, and the pressure stabilization control of the reaction chamber is realized.

Preferably, the controller 7 calculates a flow cross-sectional area of the pipe according to the following formula (1), and determines the opening degree of the opening degree adjusting mechanism 9 according to the flow cross-sectional area:

Wherein qm represents the flow rate of the intake air to the reaction chamber,

A represents the flow cross-sectional area of the pipe,

P0 represents the target pressure and,

p1 represents the suction pressure at the negative port end of the vacuum generator,

k represents a specific heat ratio, for example, the specific heat ratio k of air is 1.4,

alpha represents the flow coefficient, i.e. the ratio of the actual flow to the theoretical flow, which is generally determined experimentally or empirically,

r represents a molar gas constant, R is 8.314J/(mol. K),

T0 represents the thermodynamic temperature within the pipe.

The inlet flow qm of the reaction chamber is known and the target pressure P0 is set in advance, and according to the specification parameters of the vacuum generator, a functional relationship, such as a known linear relationship, between the suction pressure P1 at the negative pressure inlet end of the vacuum generator and the inlet pressure PJ (i.e., the pressure setting value) at the compressed air inlet end of the vacuum generator can be determined. Therefore, the suction pressure P1 can be determined from the intake pressure PJ (i.e., the pressure set value of the electrically controlled pressure regulating valve). According to the above formula (1), the flow cross-sectional area a of the pipe can be calculated, and the opening degree of the opening degree adjusting mechanism can be determined according to the flow cross-sectional area a. For example, if the flow cross-sectional area a is calculated to be 70% of the original cross-sectional area of the pipe connecting the reaction chamber and the vacuum generator, the opening degree of the opening degree adjustment mechanism can be determined to be 70%, which is easily understood by those skilled in the art.

preferably, the opening degree adjusting mechanism 9 may include a closed chamber and a piston reciprocating in the closed chamber, the closed chamber is provided with an air inlet and an air outlet, and the movement of the piston may change a flow cross-sectional area of an air passage between the air inlet and the air outlet, thereby changing the opening degree of the opening degree adjusting mechanism. Alternatively, the opening degree adjusting mechanism 9 may be of a diaphragm type, and the opening degree adjustment is realized by the rotation of the diaphragm. The specific structure of the opening degree adjustment mechanism is not limited by the above description, and opening degree adjustment mechanisms having other structures are easily understood and selected by those skilled in the art.

Preferably, the pressure control device further comprises a condenser, and the condenser is arranged between the reaction chamber and the opening degree adjusting mechanism. The pressure control device and the plant pipeline have a certain temperature resistance range, the temperature of the gas discharged from the reaction chamber is higher and is generally higher than 200 ℃, the condenser can cool the gas discharged from the reaction chamber, the temperature of the gas passing through the pressure control device and the plant pipeline is ensured to be in the temperature resistance range, and the safety of equipment is ensured.

the embodiment of the invention also provides semiconductor equipment which comprises a reaction chamber, a vacuum generator and the pressure control device, wherein the reaction chamber is connected with the negative pressure port end of the vacuum generator, and the pressure control device controls the pressure of the reaction chamber by adjusting the pumping pressure of the negative pressure port end of the vacuum generator and the exhaust flow of the reaction chamber.

In an exemplary embodiment, the exhaust port end of the reaction chamber is connected to the negative port end of the vacuum generator.

having described embodiments of the present invention, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.