阅读说明：本技术 压接方法以及压接装置 (pressure bonding method and pressure bonding apparatus ) 是由 辻泽孝文 山田真五 松尾畅也 于 2019-04-23 设计创作，主要内容包括：提供一种容易使多个基板的生产条件相等的压接方法。该压接方法包括：第一支承工序(S11),由第一支承部(53A)支承第一基板(7A)的下表面；吸附工序(S12),以维持第一基板(7A)由第一支承部(53A)支承的状态的方式,使第一吸引部(53C)吸附第一基板(7A)；第二支承工序(S13),通过第一吸引部(53C)的吸附,第一基板(7A)由第一支承部(53A)支承时,由第二支承部(53B)支承被第二保持部(54B)保持的第二基板(7B)的下表面；压接工序(S14),将压接对象物压接到第一基板(7A),将压接对象物压接到第二基板(7B)。(Provided is a pressure bonding method which can easily equalize production conditions of a plurality of substrates. The crimping method comprises the following steps: a first supporting step (S11) in which the lower surface of the first substrate (7A) is supported by the first supporting section (53A); an adsorption step (S12) in which the first substrate (7A) is adsorbed by the first adsorption part (53C) in a manner that maintains the state in which the first substrate (7A) is supported by the first support part (53A); a second supporting step (S13) in which, when the first substrate (7A) is supported by the first supporting section (53A) by the suction of the first suction section (53C), the lower surface of the second substrate (7B) held by the second holding section (54B) is supported by the second supporting section (53B); and a pressure bonding step (S14) for pressure bonding the object to be pressure bonded to the first substrate (7A) and for pressure bonding the object to be pressure bonded to the second substrate (7B).)

1. A pressure bonding method for pressure bonding an object to be pressure bonded to a first substrate and a second substrate by a pressure bonding apparatus, the pressure bonding apparatus including a first holding portion for holding the first substrate by being in contact with a part of a lower surface of the first substrate and a second holding portion for holding the second substrate by being in contact with a part of a lower surface of the second substrate,

The crimping method comprises the following steps:

A first supporting step of moving a holding mechanism including the first holding portion and the second holding portion to support the lower surface of the first substrate held by the first holding portion by a first supporting portion;

A first suction step of causing a first suction unit to suck the first substrate and releasing the first substrate from being held by the first holding unit, so as to maintain a state in which the lower surface of the first substrate is supported by the first support unit;

A second supporting step of moving the holding mechanism by suction of the first suction portion when the lower surface of the first substrate is supported by the first supporting portion, and supporting the lower surface of the second substrate held by the second holding portion by a second supporting portion; and

And a pressure bonding step of pressure-bonding a first object to be pressure-bonded to an upper surface of the first substrate, the first substrate being sucked by the first suction portion and supported by the first support portion, and pressure-bonding a second object to be pressure-bonded to an upper surface of the second substrate, the second substrate being held by the second holding portion and supported by the second support portion.

2. A crimping method as claimed in claim 1,

In the pressure bonding step, a timing at which the pressure bonding of the first pressure bonding object is started on the upper surface of the first substrate is the same as a timing at which the pressure bonding of the second pressure bonding object is started on the upper surface of the second substrate.

3. a crimping method as claimed in claim 1,

In the pressure bonding step, a timing at which the pressure bonding of the first pressure bonding object is completed on the upper surface of the first substrate is the same as a timing at which the pressure bonding of the second pressure bonding object is completed on the upper surface of the second substrate.

4. The crimping method according to any one of claims 1 to 3,

The pressure bonding apparatus further includes a third holding portion for holding the third substrate by abutting against a part of a lower surface of the third substrate when the third holding portion is provided as a holding portion included in the holding mechanism,

The crimping method further comprises the following steps:

a third supporting step of moving the holding mechanism after the first suction step is started, and supporting the lower surface of the third substrate held by the third holding portion by a third supporting portion; and

A second suction step of causing a second suction unit to suck the third substrate and releasing the third substrate from being held by the third holding unit while maintaining the state in which the lower surface of the third substrate is supported by the third support unit,

In the second supporting step, the first supporting step is performed,

when the lower surface of the first substrate is supported by the first support portion and the lower surface of the third substrate is supported by the third support portion by suction of the first suction portion and the second suction portion, the holding mechanism is moved to support the lower surface of the second substrate held by the second holding portion by the second support portion,

In the pressure bonding step, further,

And a third pressure-bonding object is pressure-bonded to an upper surface of the third substrate, and the third substrate is sucked by the second suction unit and supported by the third support unit.

5. A pressure bonding device is provided with:

A first holding portion that abuts against a part of a lower surface of a first substrate and holds the first substrate;

A second holding portion that abuts against a part of a lower surface of a second substrate and holds the second substrate;

A moving mechanism that moves a holding mechanism including the first holding portion and the second holding portion;

A first suction part for sucking the first substrate;

A first support part and a second support part;

a first crimping tool and a second crimping tool; and

A control part for controlling the operation of the display device,

The control unit performs the following steps:

a first supporting step of moving the holding mechanism by the moving mechanism to support the lower surface of the first substrate held by the first holding portion by the first supporting portion;

a first suction step of causing a first suction unit to suck the first substrate and releasing the first substrate from being held by the first holding unit so as to maintain a state in which the lower surface of the first substrate is supported by the first support unit;

A second supporting step of moving the moving mechanism to move the holding mechanism and supporting the lower surface of the second substrate held by the second holding portion by a second support portion when the lower surface of the first substrate is supported by the first support portion by suction of the first suction portion; and

And a pressure bonding step of causing the first pressure bonding tool to perform pressure bonding of a first object to be pressure bonded to an upper surface of the first substrate, the first substrate being sucked by the first suction portion and supported by the first support portion, and causing the second pressure bonding tool to perform pressure bonding of a second object to be pressure bonded to an upper surface of the second substrate, the second substrate being held by the second holding portion and supported by the second support portion.

6. A crimping apparatus as claimed in claim 5,

In the pressing step, a timing at which pressing of the first object to be pressed is started on the upper surface of the first substrate is the same as a timing at which pressing of the second object to be pressed is started on the upper surface of the second substrate.

7. A crimping apparatus as claimed in claim 5,

The timing when the pressure of the first object to be pressure-bonded is completed on the upper surface of the first substrate is the same as the timing when the pressure of the second object to be pressure-bonded is completed on the upper surface of the second substrate.

8. The crimping device as claimed in any one of claims 5 to 7,

the pressure bonding device further includes:

a third holding portion, which is included in the holding mechanism, abuts against a part of a lower surface of a third substrate, and holds the third substrate;

A second suction unit for sucking the third substrate;

A third support portion; and

A third crimping tool for use in crimping a workpiece,

The control unit further performs the steps of:

a third supporting step of moving the moving mechanism to the holding mechanism after the first suction step is started, and supporting the lower surface of the third substrate held by the third holding portion by the third supporting portion; and

A second suction step of causing the second suction unit to suck the third substrate and releasing the third substrate from being held by the third holding unit while maintaining the state in which the lower surface of the third substrate is supported by the third support unit,

in the second supporting step, in the first supporting step,

When the lower surface of the first substrate is supported by the first support portion and the lower surface of the third substrate is supported by the third support portion by suction of the first suction portion and the second suction portion, the moving mechanism is caused to move the holding mechanism, and the lower surface of the second substrate held by the second holding portion is supported by the second support portion,

In the pressing step, the third pressing tool is further caused to press a third object to be pressed against an upper surface of the third substrate, the third substrate being supported by the third support unit.

9. A pressure bonding device is provided with:

n holding portions which are brought into contact with a part of the lower surfaces of N substrates and hold the N substrates, respectively, wherein N is an integer of 2 or more;

N support portions;

A moving mechanism that moves a holding mechanism including the N holding portions, and supports, by the N support portions, lower surfaces of the N substrates held by the N holding portions, respectively;

(N-1) suction units configured to respectively suck (N-1) substrates corresponding to the (N-1) holding units when the (N-1) holding units of the N holding units release their holding; and

N pressure welding tools for respectively pressure welding the objects to be pressure welded to the upper surfaces of the N substrates,

(N-1) substrates out of the N substrates to be pressure bonded by the N pressure bonding tools are respectively adsorbed by the (N-1) suction parts and respectively supported by the (N-1) support parts out of the N support parts,

The remaining one of the N substrates to be pressure-bonded by the N pressure-bonding tools is held by the remaining one of the N holding portions and is supported by the remaining one of the N supporting portions.

Technical Field

The present invention relates to a pressure bonding method and a pressure bonding apparatus for pressure bonding an object to be bonded such as an electronic component to a substrate to produce a display panel.

Background

In a process of mounting a display panel used for a mobile phone or the like, electronic components for driving are mounted on a glass substrate constituting a panel body. The mounting operation is completed by a step of mounting an electronic component on a mounting position of an edge portion of the substrate via an adhesive tape, and pressing the electronic component against the substrate. In recent years, in order to improve production efficiency, a pressure bonding apparatus has been used in which a plurality of substrates are simultaneously handled at respective stations for performing the above-described operations (see, for example, patent document 1). By using the pressure bonding apparatus having such a configuration, it is possible to efficiently perform mounting of the electronic component on the substrate and a transfer operation of the substrate.

(Prior art document)

(patent document)

Patent document 1: japanese patent laid-open publication No. 2005-129753

however, there is a problem that it is difficult to equalize the production conditions of a plurality of substrates.

Disclosure of Invention

Thus, the present disclosure provides a crimping method and the like that simply equalizes production conditions of a plurality of substrates.

These general or specific aspects can be realized by a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or any combination of the system, the method, the integrated circuit, the computer program, and the recording medium.

A pressure bonding method according to an aspect of the present disclosure is a method of pressure bonding an object to be pressure bonded to a first substrate and a second substrate, respectively, by a pressure bonding apparatus including a first holding portion that is in contact with a part of a lower surface of the first substrate and holds the first substrate, and a second holding portion that is in contact with a part of a lower surface of the second substrate and holds the second substrate, the pressure bonding method including: a first supporting step of moving a holding mechanism including the first holding portion and the second holding portion to support the lower surface of the first substrate held by the first holding portion by a first supporting portion; a first suction step of causing a first suction unit to suck the first substrate and releasing the first substrate from being held by the first holding unit, so as to maintain a state in which the lower surface of the first substrate is supported by the first support unit; a second supporting step of moving the holding mechanism by suction of the first suction portion when the lower surface of the first substrate is supported by the first supporting portion, and supporting the lower surface of the second substrate held by the second holding portion by a second supporting portion; and a pressure bonding step of pressure-bonding a first pressure bonding object to the upper surface of the first substrate, the first substrate being sucked by the first suction portion and supported by the first support portion, and pressure-bonding a second pressure bonding object to the upper surface of the second substrate, the second substrate being held by the second holding portion and supported by the second support portion.

by the crimping method of the present disclosure, the production conditions of the plurality of substrates can be easily equalized.

Drawings

Fig. 1 is a plan view of a display panel mounting apparatus in an embodiment.

fig. 2 is a plan view of a display panel to be operated in the display panel mounting apparatus according to the embodiment.

Fig. 3 is an oblique view of a main press contact part included in the display panel assembling apparatus in the embodiment.

Fig. 4 is a diagram illustrating a configuration of a horizontal rotation driving mechanism provided in the main pressure-bonding section in the embodiment.

fig. 5 is a perspective view of the support portion and the suction portion in the embodiment.

Fig. 6 is a block diagram showing a configuration of a control system in the main pressure contact portion of the embodiment.

fig. 7A is a flowchart illustrating an example of a crimping operation performed by the pressure-bonding section according to the embodiment.

Fig. 7B is a flowchart illustrating an example of the crimping operation performed by the crimping section according to the embodiment.

Fig. 8 is a diagram for explaining an example of a pressure bonding operation performed by the pressure bonding section according to the embodiment.

Fig. 9 is a diagram for explaining an example of a pressure bonding operation performed by the pressure bonding section according to the embodiment.

Fig. 10 is a diagram for explaining an example of a pressure bonding operation performed by the pressure bonding section according to the embodiment.

Fig. 11 is a flowchart illustrating an example of a processing operation of the pressure bonding apparatus according to the embodiment.

Fig. 12 is a diagram illustrating another configuration example of a part of the pressure-bonding section according to the embodiment.

Fig. 13 is a plan view showing another example of the display panel mounting apparatus.

Detailed Description

(knowledge forming the basis of the present invention)

in the pressure bonding apparatus of patent document 1 described in the background section, the present inventors have found that the following problems occur.

the pressure bonding apparatus of patent document 1 is configured to perform production by conveying 2 display panels (hereinafter, simply referred to as panels) at the same time in a pseudo manner in a small-sized liquid crystal panel mounting facility in order to improve productivity. The pseudo simultaneous timings do not mean exactly the same timing, and mean that the timings of the processes such as conveyance and production of 2 panels are different, but the timings are almost the same. Further, 2 substrates each constituting a display panel are simultaneously pressure-bonded to a bonding object such as an electronic component, which will be hereinafter referred to as pseudo-simultaneous pressure-bonding.

in the pressure bonding apparatus of patent document 1, 2 substrates are pressure bonded virtually simultaneously, and pressure bonding is performed efficiently and accurately.

However, even in the pressure bonding by the pressure bonding device of patent document 1, since the pressure bonding is performed virtually simultaneously, the pressure bonding of the 1 st substrate is started first, and then the pressure bonding of the 2 nd substrate is started. Specifically, in the pressure bonding apparatus of patent document 1, when pseudo simultaneous pressure bonding is performed, the 1 st substrate is first recognized, and the position of the 1 st substrate is corrected (that is, aligned) based on the recognition result of the substrate, and the electronic component is pressure bonded. Next, when the pressing device presses the 1 st substrate, in other words, when the 1 st substrate is held in a state of being sandwiched between the pressing tool and the support portion, the position of the 2 nd substrate is corrected, and the 2 nd substrate is pressed. In other words, the timing at which the 1 st substrate is sandwiched by the pressure bonding tool and heating and pressing of the substrate are started is slightly different from the timing at which the 2 nd substrate is sandwiched by the pressure bonding tool and heating and pressing of the substrate are started.

Such a slight timing difference causes a difference in production conditions such as heating time and pressing time, and therefore this method is not suitable for a case where 2 substrates need to be produced under exactly the same production conditions.

In order to solve the above problem, a pressure bonding method according to one aspect of the present disclosure is a method of pressure bonding an object to be pressure bonded to a first substrate and a second substrate, respectively, in a pressure bonding apparatus including a first holding portion that is in contact with a part of a lower surface of the first substrate and holds the first substrate, and a second holding portion that is in contact with a part of a lower surface of the second substrate and holds the second substrate, the pressure bonding method including: a first supporting step of moving a holding mechanism including the first holding portion and the second holding portion to support the lower surface of the first substrate held by the first holding portion by a first supporting portion; a first suction step of causing a first suction unit to suck the first substrate and releasing the first substrate from being held by the first holding unit, so as to maintain a state in which the lower surface of the first substrate is supported by the first support unit; a second supporting step of moving the holding mechanism by suction of the first suction portion when the lower surface of the first substrate is supported by the first supporting portion, and supporting the lower surface of the second substrate held by the second holding portion by a second supporting portion; and a pressure bonding step of pressure-bonding a first pressure bonding object to the upper surface of the first substrate, the first substrate being sucked by the first suction portion and supported by the first support portion, and pressure-bonding a second pressure bonding object to the upper surface of the second substrate, the second substrate being held by the second holding portion and supported by the second support portion.

For example, when the holding mechanism moves, the first holding portion and the second holding portion move simultaneously. Therefore, when the position of the second substrate is positioned and the second substrate is supported by the second support portion, it is necessary to separate the first holding portion from the first substrate so as to maintain the state of the first substrate which has been supported and positioned by the first support portion. However, in the pressure bonding method of patent document 1, the pressure bonding tool performs pressure bonding to maintain the state of the first substrate. In other words, the object to be pressure bonded and the first substrate are pressed against the support portion by the pressure bonding tool, and the state of the already positioned first substrate is maintained. As a result, the first substrate starts to be pressed against the object before the second substrate.

In contrast, a pressure bonding method according to one embodiment of the present disclosure performs a first adsorption step and a second support step. Therefore, when positioning the second substrate, the state of the already positioned first substrate is maintained, and the positioning is performed not by the pressure bonding tool but by the suction of the first suction portion. In the pressure bonding step of the pressure bonding method according to one aspect of the present disclosure, the first object to be pressure bonded is pressure bonded to the upper surface of the first substrate sucked by the first suction portion and supported by the first support portion, and the second object to be pressure bonded is pressure bonded to the upper surface of the second substrate held by the second holding portion and supported by the second support portion. In other words, in the pressure bonding method according to one aspect of the present disclosure, in order to perform pressure bonding, the state in which the first substrate and the second substrate are supported by the first support portion and the second support portion, respectively, is maintained by suction by the first suction portion and holding by the second holding portion. Therefore, the 2 pressure bonding tools corresponding to the first substrate and the second substrate can be respectively and easily pressure bonded to the first substrate and the second substrate at the same time. As a result, the production conditions of 2 substrates can be easily equalized.

In the pressure bonding step, a timing at which the pressure bonding of the first pressure bonding object is started on the upper surface of the first substrate may be the same timing as a timing at which the pressure bonding of the second pressure bonding object is started on the upper surface of the second substrate. In the pressure bonding step, a timing at which the pressure bonding of the first pressure bonding object is completed on the upper surface of the first substrate may be the same timing as a timing at which the pressure bonding of the second pressure bonding object is completed on the upper surface of the second substrate.

Accordingly, the first substrate and the second substrate can be simultaneously pressure bonded easily without setting a difference in the control timing of the 2 pressure bonding tools corresponding to the first substrate and the second substrate.

In addition, when the pressure bonding apparatus further includes a third holding portion as a holding portion included in the holding mechanism, the third holding portion may be brought into contact with a part of a lower surface of a third substrate to hold the third substrate, and the pressure bonding method may further include: a third supporting step of moving the holding mechanism after the first suction step is started, and supporting the lower surface of the third substrate held by the third holding portion by a third supporting portion; and a second suction step of causing a second suction unit to suck the third substrate and releasing the third substrate from the third holding unit so as to maintain the state in which the lower surface of the third substrate is supported by the third support unit, in the second supporting step, the lower surface of the first substrate is supported by the first supporting section by suction of the first suction section and the second suction section, and the lower surface of the third substrate is supported by the third support portion, the holding mechanism is moved to support the lower surface of the second substrate held by the second holding portion by the second support portion, in the pressure bonding step, a third pressure bonding object is further pressure bonded to an upper surface of the third substrate, and the third substrate is sucked by the second suction portion and supported by the third support portion.

Therefore, not only 2 substrates but also 3 substrates can be easily pressed at the same time. As a result, the production conditions of 3 substrates can be easily equalized. Note that the start timing of the pressure welding by the 3 pressure welding tools may be set to the same time, or the end timing of the pressure welding by the 3 pressure welding tools may be set to the same time. Thus, it is possible to simultaneously press 3 substrates without setting a difference in the control timing of the 3 press-bonding tools.

Further, a component mounting apparatus according to an aspect of the present disclosure may include: n holding portions which are brought into contact with a part of the lower surfaces of N substrates and hold the N substrates, respectively, wherein N is an integer of 2 or more; n support portions; a moving mechanism that moves a holding mechanism including the N holding portions, and supports, by the N support portions, lower surfaces of the N substrates held by the N holding portions, respectively; (N-1) suction units configured to respectively suck (N-1) substrates corresponding to the (N-1) holding units when the (N-1) holding units of the N holding units release their holding; and N pressure welding tools for respectively pressing the object to be pressure welded to the upper surfaces of the N substrates, (N-1) substrates among the N substrates pressed by the N pressure welding tools are respectively adsorbed by the (N-1) suction parts and respectively supported by the (N-1) supporting parts among the N supporting parts, and the rest one substrate among the N substrates pressed by the N pressure welding tools is held by the rest one holding part among the N holding parts and is supported by the rest one supporting part among the N supporting parts.

Therefore, the pressure bonding can be easily performed for 2 sheets or 3 sheets, and for each of the N sheets of substrates at the same time. As a result, the production conditions of the N substrates can be easily equalized. The timings of starting the pressure welding by the N pressure welding tools may be set to the same timing, or the timings of ending the pressure welding by the N pressure welding tools may be set to the same timing. Accordingly, it is possible to simultaneously press the N substrates without providing a difference in the control timing of the N press tools.

The embodiments are described below in detail with reference to the drawings.

The embodiments described below all represent general or specific examples. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, order of the steps, and the like shown in the following embodiments are merely examples, and the present invention is not limited thereto. Therefore, among the constituent elements of the following embodiments, constituent elements that are not described in the embodiments showing the uppermost concept will be described as arbitrary constituent elements.

The drawings are schematic and not strictly schematic. In the drawings, the same reference numerals are attached to the same components. In the following embodiments, substantially the same expression is used. For example, the substantially same meaning not only has a completely identical meaning, but also has a meaning that is substantially identical, that is, includes an error of about several%, for example. The substantially same means that the same range has the same meaning as the effect of the present disclosure. Other expressions using "approximately" have the same meaning.

(embodiment mode)

Fig. 1 is a plan view of a display panel mounting apparatus in the present embodiment. Fig. 2 is a plan view of a display panel mounted by the display panel mounting apparatus in the present embodiment.

a display panel mounting apparatus mounts a display panel by pressing and mounting electronic components for a driver on a glass substrate (hereinafter, simply referred to as "substrate") via an adhesive tape. In the base 1 shown in fig. 1, a standby table 2, an adhesive tape bonding section 3, a temporary pressure-bonding section 4, a main pressure-bonding section 5, and a carry-out table 6 are arranged in a row in the lateral direction. Here, in the present embodiment, the main pressure-bonding section 5 is a pressure-bonding apparatus for pressure-bonding an object to be pressure-bonded to a substrate. The object to be pressure-bonded is, for example, an electronic component, but may be a component other than an electronic component. In the present embodiment, the conveyance direction of the substrate 7 is referred to as the X-axis direction, and a direction perpendicular to the X-axis direction on a horizontal plane is referred to as the Y-axis direction. The direction orthogonal to the X-axis direction and the Y-axis direction is referred to as a Z-axis direction.

The standby platform 2 includes a panel mounting table 2a on which 2 substrates 7 can be mounted, and electronic components are bonded to the substrates 7. The 2 substrates 7 are aligned in relative positions on the panel mounting table 2a by performing position adjustment by a pre-centering mechanism (not shown).

as shown in fig. 2, the substrate 7 is formed by stacking glass substrates 2 for forming a display panel. The 2 edge portions 7a and 7b orthogonal to each other in the substrate 7 are component mounting surfaces on which the circuit forming surface of the glass substrate is exposed. The driver electronic component 8 is mounted to the connection terminals provided in the edge portions 7a and 7b by pressure bonding.

the adhesive tape bonding section 3 bonds an adhesive tape for electronic component connection to the 2 substrates 7 held by the substrate holding section 30. The adhesive tape is, for example, an ACF (Anisotropic conductive film) tape. The substrate holder 30 includes an XYZ θ table mechanism 31. The substrate holding portion 30 drives the XYZ θ table mechanism 31 to position the edge of the 2 substrates 7 on the first support portion 33A and the second support portion 33B provided adjacent to the substrate holding portion 30 when the adhesive tape is bonded. The adhesive tape bonding section 3 bonds the adhesive tape by the pressure bonding mechanism 32 in a state where the edge portions of the two substrates 7 are supported by the first supporting (backing) section 33A and the second supporting section 33B corresponding to those substrates 7. The pressure bonding mechanism 32 is composed of tape bonding units 32A and 32B, and the tape bonding units 32A and 32B bond the adhesive tape to the substrate 7, respectively.

the temporary pressure-bonding section 4 temporarily pressure-bonds the 2 substrates 7 held by the substrate holding section 40, on which the electronic component 8 for the drive program is mounted, to the adhesive tape bonded by the adhesive tape bonding section 3. The substrate holder 40 includes an XYZ θ table mechanism 41. The substrate holding portion 40 drives the XYZ θ table mechanism 41 to sequentially position the edge portions of the 2 substrates 7 on the support portions 47 provided adjacent to the substrate holding portion 40 when the electronic component 8 is mounted. The temporary pressure-bonding section 4 mounts the electronic component 8 by the electronic component mounting mechanism 42 in a state where the edge of the substrate 7 is supported by the support section 47. Here, the temporary pressure-bonding section 4 sequentially rotates the holding head 45 provided on the index table 42a of the electronic component mounting mechanism 42 in the direction of the arrow, and conveys the electronic component 8 taken out from the electronic component supply section 43 to the pressure-bonding operation position on the support section 47.

The main pressure-bonding section 5 includes 2 pressure-bonding sections 5A and 5B. The pressure-bonding sections 5A and 5B are mainly pressure-bonded by the pressure-bonding mechanisms 52 and 62 to the electronic component 8 temporarily pressure-bonded to the 2 substrates 7 held by the substrate holding sections 50 and 60, respectively. That is, in the main pressure-bonding section 5 as the pressure-bonding device, the electronic component 8 mounted on the substrate 7 via the adhesive tape is an object to be pressure-bonded. The pressure-bonding mechanism 52 is provided with a first support portion 53A and a second support portion 53B, and the pressure-bonding mechanism 62 is provided with a third support portion 63A and a fourth support portion 63B. In the main pressure bonding, the pressure bonding mechanisms 52 and 62 drive the first XYZ θ table mechanism 51 and the second XYZ θ table mechanism 61 to move the edge portions of the 4 substrates 7 held by the substrate holding portions 50 and 60 to the support portions 53A, 53B, 63A, and 63B, respectively.

The carrying-out table 6 includes a panel carrying-out table 6a, and the substrate 7 subjected to main pressure bonding by the main pressure bonding section 5 is placed on the panel carrying-out table 6 a. Further, a substrate transfer mechanism 70 is disposed on the negative side of the Y-axis direction of each of the tables. The substrate transfer mechanism 70 is a moving member 72 that reciprocates in the substrate transfer direction (the left-right direction in fig. 1, that is, the X-axis direction) on a slide table 71, and has a structure in which a plurality of substrate transfer heads are arranged. By the movement of the moving member 72, the plurality of substrate transfer heads can simultaneously transfer the substrate 7 between the respective stations.

of these substrate transfer heads, the first substrate transfer head 75 and the second substrate transfer head 76 are directly coupled to the moving member 72. The third substrate transfer head 77 and the fourth substrate transfer head 78 are coupled to the moving member 72 via the first stretching mechanism 73 and the second stretching mechanism 74, respectively. The first substrate transfer head 75 and the second substrate transfer head 76 simultaneously transfer 2 substrates 7 from the standby stage 2 to the adhesive tape bonding section 3 and from the adhesive tape bonding section 3 to the temporary pressure bonding section 4.

The third substrate transport head 77 and the fourth substrate transport head 78 simultaneously transport 2 substrates 7 from the temporary pressure-bonding section 4 to the main pressure-bonding section 5 and from the main pressure-bonding section 5 to the carry-out stage 6, respectively. At this time, by extending and contracting the rod 73a of the first expanding and contracting mechanism 73, the transfer destination at the time of transferring the substrate 7 to the main pressure-bonding section 5 by the third substrate transfer head 77 can be switched to either of the substrate holders 50 and 60. Further, by extending and contracting the rod 74a of the second extending and contracting mechanism 74, the source of extraction when the substrate 7 is extracted from the main pressure-bonding section 5 by the fourth substrate transport head 78 can be switched to either of the substrate holding sections 50 and 60.

fig. 3 is a perspective view of the main pressure-bonding section 5, which is a pressure-bonding apparatus included in the display panel assembling apparatus according to the present embodiment.

As described above, the main pressure-bonding section 5 in the present embodiment includes 2 pressure-bonding sections 5A and 5B. The pressure-bonding section 5A includes a substrate holding section 50, and the pressure-bonding section 5B includes a substrate holding section 60.

The substrate holders 50 and 60 are provided with a first XYZ θ table mechanism 51 and a second XYZ θ table mechanism 61, respectively. The first XYZ θ table mechanism 51 is configured by stacking an X table 51X, Y, a table 51Y, Z, a table 51Z, and a horizontal rotation drive mechanism 51 θ in this order from bottom to top. Similarly, the second XYZ θ table mechanism 61 is configured by stacking the X table 61X, Y, the table 61Y, Z, the table 61Z, and the horizontal rotation drive mechanism 61 θ in this order. The X tables 51X and 61X are provided on a common rail.

the first XYZ θ table mechanism 51 is provided with a first holding portion 54A and a second holding portion 54B of the substrate holding portion 50. Similarly, the second XYZ θ table mechanism 61 is provided with the third holding portion 64A and the fourth holding portion 64B of the substrate holding portion 60. The pressure bonding section 5A moves the edge portion of the substrate 7 held by the first holding section 54A and the second holding section 54B to a first pressure bonding position where the first pressure bonding tool 52A performs pressure bonding and a second pressure bonding position where the second pressure bonding tool 52B performs pressure bonding, respectively, by driving the first XYZ θ table mechanism 51. Further, the pressure bonding section 5B moves the edge portion of the substrate 7 held by the third holding section 64A and the fourth holding section 64B to a third pressure bonding position where the third pressure bonding tool 62A performs pressure bonding and a fourth pressure bonding position where the fourth pressure bonding tool 62B performs pressure bonding, respectively, by driving the second XYZ θ table mechanism 61.

The first support portion 53A and the second support portion 53B are arranged behind the substrate holding portion 50 (i.e., on the positive direction side in the Y-axis direction). The first support portion 53A and the second support portion 53B support 2 substrates 7 held by the first holding portion 54A and the second holding portion 54B at the same height from below. In other words, the first support portion 53A and the second support portion 53B support 2 substrates 7 from below at a first pressure contact position where the first pressure contact tool 52A is in pressure contact and at a second pressure contact position where the second pressure contact tool 52B is in pressure contact. Further, a third support portion 63A and a fourth support portion 63B are arranged behind the substrate holding portion 60. The third support portion 63A and the fourth support portion 63B support 2 substrates 7 held by the third holding portion 64A and the fourth holding portion 64B from below at the same height. In other words, the third supporting portion 63A and the fourth supporting portion 63B support 2 substrates 7 at the same height from below at the third pressure contact position where the third pressure contact tool 62A is in pressure contact and the fourth pressure contact position where the fourth pressure contact tool 62B is in pressure contact.

Above the substrate holding portions 50 and 60, the substrate recognition camera 56 is arranged so as to be movable in the X direction. The substrate recognition camera 56 photographs 4 substrates 7 on the first holding portion 54A, the second holding portion 54B, the third holding portion 64A, and the fourth holding portion 64B. By this shooting, the main pressure-bonding section 5 recognizes the recognition marks provided on the 4 substrates 7, and detects the positions of the 4 substrates 7. Then, the main pressure-bonding section 5 moves the first holding section 54A, the second holding section 54B, the third holding section 64A, and the fourth holding section 64B in the horizontal direction by driving the first XYZ θ table mechanism 51 and the second XYZ θ table mechanism 61 based on the position detection result. As a result, the held 4 substrates 7 are positioned at the first pressure bonding position, the second pressure bonding position, the third pressure bonding position, and the fourth pressure bonding position, respectively.

above the first support portion 53A, the second support portion 53B, the third support portion 63A, and the fourth support portion 63B, a first pressure bonding tool 52A, a second pressure bonding tool 52B, a third pressure bonding tool 62A, and a fourth pressure bonding tool 62B are arranged, respectively. The main pressure-bonding section 5 positions an edge portion of the substrate 7, which is temporarily pressure-bonded to the adhesive tape by the temporary pressure-bonding section 4, at a pressure-bonding position corresponding to the substrate 7. Then, the main pressure-bonding section 5 lowers the pressure-bonding tool with respect to the substrate 7, and maintains the pressed state for a predetermined pressure-bonding time. Thereby, the electronic component 8 is mainly pressed against the substrate 7 via the adhesive tape.

Fig. 4 is a configuration explanatory diagram of the horizontal rotation driving mechanism 51 θ in the pressure-bonding section 5A of the present embodiment.

as shown in fig. 4 (a), rotation is transmitted from the motor 36 disposed in the horizontal rotation driving mechanism 51 θ to the pulley 35 via the belt 38 and the pulley 37, and the pulley 35 is coupled to the respective rotation shafts of the first holding portion 54A and the second holding portion 54B. Therefore, by driving the motor 36, the first holding portion 34A and the second holding portion 34B rotate in the horizontal plane by θ. Accordingly, the substrate 7 held by each of the first holding portion 34A and the second holding portion 34B can rotate in a horizontal plane.

As shown in fig. 4 (B), the height positions of the upper surfaces of the first holding portion 54A and the second holding portion 54B are different. In other words, the upper surface of the second holding portion 54B is higher by Δ H than the upper surface of the first holding portion 54A. The Δ H is set to be larger than the thickness t of the substrate 7 to be held. Therefore, when the first holding portion 34A and the second holding portion 34B are rotated, the two substrates 7 adjacent to each other are rotated at different heights.

By holding 2 substrates 7 at different height positions in this way, even if the interval between the first holding portion 54 and the second holding portion 54B is narrow, when 2 adjacent substrates 7 are rotated by θ, the substrates 7 can be prevented from interfering with each other. As a result, the dimension of the pressure-bonding section 5A in the substrate conveying direction (i.e., the X-axis direction) can be reduced. The pressure-bonding section 5B is configured similarly to the pressure-bonding section 5A.

Fig. 5 is a diagram illustrating the first support part 53A and the first suction part 53C in the pressure-bonding part 5A.

The pressure-bonding section 5A in the present embodiment includes a first suction section 53C for sucking the substrate 7. In the first suction portion 53C, a suction hole 53D connected to a vacuum source via a valve is formed.

Here, the surface of the first suction portion 53C on which the suction holes 53D are formed is located at substantially the same height as the upper surface of the first support portion 53A. Further, as shown in fig. 4 (a), the first suction portion 53C is provided between the first holding portion 54A and the first support portion 53A.

Therefore, when the lower surface of the edge portion of the substrate 7 held by the first holding portion 54A is supported by the first supporting portion 53A, the first suction portion 53C can suck the substrate 7 by vacuum suction from the suction hole 53D. The substrate 7 sucked by the first suction portion 53C in this way is maintained in a state of being supported by the first support portion 53A even when the first holding portion 54A is released from holding. In other words, the first suction portion 53C maintains the substrate 7 supported by the first support portion 53A, instead of the first holding portion 54A.

The first suction portion 53C may be provided for the first support portion 53A, but may not be provided for the second support portion 53B. As shown in fig. 3, the pressure-bonding section 5B may include a second suction section 63C having the same configuration as the first suction section 53C. The second suction portion 63C may be provided for the third support portion 63A, but may not be provided for the fourth support portion 63B.

Fig. 6 is a block diagram showing a configuration of a control system in the main pressure-bonding section 5 of the pressure-bonding apparatus of the present embodiment.

The main pressure-bonding section 5 in the present embodiment includes, in addition to the above-described components: a substrate position detector 86, first to sixth valves 87 to 92, a vacuum source 82, and a controller 79. The control portion 79 and the vacuum source 82 may be used in combination with the adhesive tape bonding portion 3 and the temporary pressure-bonding section 4. The vacuum source 82 is continuously driven when the display panel mounting apparatus mounts the display panel.

The substrate position detecting unit 86 obtains the observation result of the substrate recognition camera 56, and recognizes the position of the substrate 7 held by each of the first holding unit 54A, the second holding unit 54B, the third holding unit 64A, and the fourth holding unit 64B by performing recognition processing on the observation result. The position recognition result is transmitted to the control unit 79.

The controller 79 controls the pressure bonding mechanisms 52 and 62, the first XYZ θ table mechanism 51, and the second XYZ θ table mechanism 61. At this time, the controller 79 controls the first XYZ θ table mechanism 51 and the second XYZ θ table mechanism 61 based on the position recognition results of the 4 substrates 7. Accordingly, the 4 substrates 7 can be aligned in the horizontal direction, the height direction, and the θ -rotation direction with respect to the pressure bonding mechanisms 52 and 62. That is, the controller 79 controls the XY-direction positions of at least 4 substrates 7 based on the position of the substrate 7 recognized by the substrate position detector 86. By this control, the controller 79 positions the 2 substrates 7 with respect to the first pressure bonding tool 52A and the second pressure bonding tool 52B of the pressure bonding mechanism 52. Further, the controller 79 positions the 2 substrates 7 with respect to the third press tool 62A and the fourth press tool 62B of the press mechanism 62.

The suction hole formed in the upper surface of the first holding portion 54A and the suction hole formed in the upper surface of the second holding portion 54B are connected to the vacuum source 82 via a first valve 87 and a second valve 88, respectively. The suction hole formed in the upper surface of the third holding portion 64A and the suction hole formed in the upper surface of the fourth holding portion 64B are connected to the vacuum source 82 via a third valve 89 and a fourth valve 90, respectively. The controller 79 controls opening and closing of the first valve 87, the second valve 88, the third valve 89, and the fourth valve 90, respectively. Accordingly, the control portion 79 holds or releases the substrate 7 by vacuum suction on the upper surfaces of the first holding portion 54A, the second holding portion 54B, the third holding portion 64A, and the fourth holding portion 64B, respectively.

The main pressure-bonding section 5 in the present embodiment includes a fifth valve 91, and switches between suction of the substrate 7 by the first suction section 53C and release of the suction. The fifth valve 91 is connected to the suction holes 53D of the first suction unit 53C and the vacuum source 82 via pipes, respectively. The controller 79 controls the opening and closing of the fifth valve 91 to suck or release the substrate 7 on the upper surface of the first suction portion 53C by vacuum suction.

Similarly, the main pressure-bonding section 5 in the present embodiment includes a sixth valve 92, and switches between suction of the substrate 7 by the second suction section 63C and release of the suction. The sixth valve 92 is connected to the suction holes of the second suction unit 63C and the vacuum source 82 via pipes. The controller 79 controls the opening and closing of the sixth valve 92 to suck or release the substrate 7 by vacuum on the upper surface of the second suction portion 63C.

Fig. 7A and 7B are flowcharts showing an example of the pressure bonding operation performed by the pressure bonding section 5A in the present embodiment. Fig. 8, 9, and 10 are views for explaining an example of the pressure bonding operation performed by the pressure bonding section 5A. In the following description, in order to distinguish 2 substrates 7 held by the substrate holding portion 50, the 2 substrates 7 are described as a first substrate 7A and a second substrate 7B, respectively. The pressure-bonding section 5B also performs the pressure-bonding operation in the example shown in fig. 7A to 10.

First, as shown in fig. 7A, the control unit 79 turns on the suction of each of the first holding portion 54A and the second holding portion 54B (step S101).

next, the pressure-bonding section 5A moves the first substrate 7A and the second substrate 7B to the observation position of the substrate recognition camera 56 (S102). That is, the pressure-bonding section 5A drives the first XYZ θ table mechanism 51 to move the first holding section 54A and the second holding section 54B. Accordingly, the first substrate 7A is provided between the first support portion 53A and the first pressure bonding tool 52A, and the second substrate 7B is provided between the second support portion 53B and the second pressure bonding tool 52B.

the first level is commanded as the Z table control height in the movement of the first substrate 7A and the second substrate 7B. The first level is a level corresponding to a state in which the lower surface of the first substrate 7A held by the first holding portion 54A (lower holding portion) is positioned higher than the upper surfaces of the first supporting portion 53A and the first suction portion 53C. As a result, as shown in fig. 8 (a), the first substrate 7A and the second substrate 7B are spaced apart from the first support portion 53A and the second support portion 53B and positioned above each other. In fig. 8 to 10, the arrows in the first holding portion 54A and the second holding portion 54B indicate that the substrate 7 is sucked by the holding portions.

In this state, the edge portions 7A (see fig. 2) of the first substrate 7A and the second substrate 7B are positioned above the first supporting portion 33A and the second supporting portion 33B, respectively. The electronic component 8 is mounted on the edge portion 7A of each of the first substrate 7A and the second substrate 7B via an adhesive tape.

Next, the substrate recognition camera 56 observes the first substrate 7A and the second substrate 7B (S103). The substrate position detecting unit 86 can identify the positions of the first substrate 7A and the second substrate 7B by performing an identification process on the observation results. Further, the controller 79 controls the first XYZ image mechanism 51 based on the position recognition result to position the first substrate 7A at the first pressure bonding position as shown in fig. 8 (b) (S104).

Next, the control section 79 commands the second level as the Z table control height. Accordingly, the controller 79 lowers the first holding portion 54A and the second holding portion 54B, and as shown in fig. 8 c, drops the first substrate 7A onto the first supporting portion 53A (S105). At this time, the lower surface of the first substrate 7A is supported by the first support portion 53A. In other words, the control unit 79 moves the holding mechanism including the first holding portion 54A and the second holding portion 54B, and the lower surface of the first substrate 7A held by the first holding portion 54A is supported by the first supporting portion 53A.

Here, the control unit 79 turns on the suction of the first suction portion 53C (step S106). Further, the control unit 79 turns off the suction of the first holding portion 54A (step S107). Accordingly, the first substrate 7A is held by the first suction portion 53C in a state of being set on the first support portion 53A without being held by the first holding portion 54A. In other words, the control unit 79 causes the first suction portion 53C to suck the first substrate 7A and releases the holding of the first substrate 7A by the first holding portion 54A so as to maintain the state in which the lower surface of the first substrate 7A is supported by the first support portion 53A.

The control unit 79 commands the third level as the Z table control height. Accordingly, the controller 79 causes the first suction portion 53C to hold the first substrate 7A and causes the first holding portion 54A and the second holding portion 54B to descend, as shown in fig. 9 (a). As a result, the first XYZ θ table mechanism 51 can slide the second substrate 7B held by the second holding portion 54B horizontally. Then, the controller 79 positions the second substrate 7B at the second pressure bonding position (step S109). In fig. 9 and 10, the arrow mark shown inside the first suction portion 53C indicates that the substrate 7 is sucked by the first suction portion 53C.

The control unit 79 commands the fourth level as the Z table control height. Accordingly, as shown in fig. 9 (B), controller 79 causes second substrate 7B to land on second support portion 53B (step S110). That is, when the lower surface of the first substrate 7A is supported by the first support portion 53A by the suction of the first suction portion 53C, the control portion 79 moves the holding mechanism to support the lower surface of the second substrate 7B held by the second holding portion 54B by the second support portion 53B.

Then, the control unit 79 lowers the first crimping tool 52A and the second crimping tool 52B as shown in fig. 9 (c). Accordingly, the control unit 79 causes the first pressure bonding tool 52A to pressure bond the electronic component 8 as the object to be pressure bonded to the first substrate 7A, and causes the second pressure bonding tool 52B to pressure bond the electronic component 8 as the object to be pressure bonded to the second substrate 7B (step S111). That is, the controller 79 presses the first object to be pressure-bonded to the upper surface of the first substrate 7A sucked by the first suction portion 53C and supported by the first support portion 53A, and presses the second object to be pressure-bonded to the upper surface of the second substrate 7B held by the second holding portion 54B and supported by the second support portion 53B. In this way, the pressure bonding to the first substrate 7A and the pressure bonding to the second substrate 7B are performed simultaneously. In other words, the timing at which the first pressure contact object starts to be pressed against the upper surface of the first substrate 7A is the same timing as the timing at which the second pressure contact object starts to be pressed against the upper surface of the second substrate 7B. Therefore, in step S111, the pressure bonding of the first substrate 7A and the second substrate 7B is started at the same time.

When the simultaneous pressure contact is started, the control unit 79 measures the pressure contact time and determines whether or not a predetermined pressure contact time has elapsed (step S112). When the control unit 79 determines that the predetermined pressure contact time has elapsed (yes in step S112), the control unit raises the first pressure contact tool 52A and the second pressure contact tool 52B as shown in fig. 10 a (step S113). In step S113, the timing at which the pressing of the first object to be pressed on the upper surface of the first substrate 7A is completed is the same timing as the timing at which the pressing of the second object to be pressed on the upper surface of the second substrate 7B is completed. Therefore, in step S113, the crimping started simultaneously in step S111 is ended.

Next, the control section 79 commands the second level as the Z table control height. Accordingly, as shown in fig. 10 (B), the control unit 79 raises the first holding portion 54A and the second holding portion 54B to bring the upper surface of the first holding portion 54A into contact with the lower surface of the first substrate 7A (step S114).

Next, the control unit 79 turns off the suction of the first suction portion 53C (step S115). That is, the control portion 79 releases the suction of the first substrate 7A by the first suction portion 53C. Further, the control unit 79 turns on the suction of the first holding portion 54A (step S116). Accordingly, the first substrate 7A is held by the first holding portion 54A in a state of being not held by the first suction portion 53C and being supported by the upper surface of the first support portion 53A. In other words, the first holding portion 54A holds the first substrate 7A instead of the first suction portion 53C.

The control unit 79 commands the first level as the Z table control height. Accordingly, as shown in fig. 10 c, the first holding portion 54A and the second holding portion 54B are raised, and the first substrate 7A and the second substrate 7B are separated from the respective supporting portions (step S117).

After that, the control portion 79 rotates the first holding portion 54A and the second holding portion 54B by 90 °. Thus, of the first substrate 7A and the second substrate 7B, the edge portion 7B side (refer to fig. 2) orthogonal to the edge portion 7A where the main press-bonding operation of the electronic component 8 has been completed is located at the respective press-bonding positions on the first support portion 53A and the second support portion 53B.

Then, the control unit 79 performs the same operation as in steps S104 to S117. That is, the control unit 79 executes the processing of steps S104 to S117 in the same order as the pressure bonding operation to the edge portion 7A with respect to the edge portion 7B of the first substrate 7A and the second substrate 7B, respectively. At this time, when the substrate position recognition needs to be performed again, the control unit 79 again executes the operations of steps S102 to S103.

After all the operations are completed, the control section 79 rotates the first holding section 54A and the second holding section 54B in opposite directions of 90 °. Accordingly, the orientations of the first substrate 7A and the second substrate 7B are returned to the same orientations as those in the carrying-in, and these substrates 7 are carried to the carry-out stage 6 by the fourth substrate carrier head 78 in this state.

The controller 79 controls the opening and closing of the first to sixth valves 87 to 92 shown in fig. 6 when switching the adsorption of the substrate 7 between on and off as described above. In other words, the control unit 79 can switch between on and off of the suction of the substrate 7 by each of the first holding portion 54A, the second holding portion 54B, and the first suction portion 53C by controlling the opening and closing of each of the first to sixth valves 87 to 92.

As described above, the pressure-bonding section 5A and the pressure-bonding section 5B of the main pressure-bonding section 5 in the present embodiment are pressure-bonding apparatuses capable of simultaneously pressure-bonding objects to be pressure-bonded to 2 substrates 7. For example, the pressure-bonding section 5A is a pressure-bonding device including a first holding section 54A and a second holding section 54B, the first holding section 54A is in contact with a part of the lower surface of the first substrate 7A to hold the first substrate 7A, and the second holding section 54B is in contact with a part of the lower surface of the second substrate 7B to hold the second substrate 7B. The pressure bonding method performed by the pressure-bonding section 5A, i.e., the pressure bonding method for pressure-bonding the object to be pressure-bonded to the first substrate 7A and the second substrate 7B, includes the steps S11 to S14 shown in fig. 11 below.

Fig. 11 is a flowchart showing an example of a processing operation of the pressure-bonding section 5A as the pressure-bonding device in the embodiment. Fig. 11 is a flowchart showing a main step for simultaneously performing pressure bonding in each step shown in fig. 7.

As described above, the pressure bonding method according to the present embodiment includes the steps S11 to S14. Step S11 is a first supporting step of moving the holding mechanism including the first holding portion 54A and the second holding portion 54B to support the lower surface of the first substrate 7A held by the first holding portion 54A by the first supporting portion 53A.

Step S12 is a first suction step of causing the first suction portion 53C to suck the first substrate 7A and releasing the first holding portion 54A from holding the first substrate 7A so as to maintain the state in which the lower surface of the first substrate 7A is supported by the first support portion 53A.

Step S13 is a second supporting step of moving the holding mechanism to support the lower surface of the second substrate 7B held by the second holding portion 54B by the second supporting portion 53B when the lower surface of the first substrate 7A is supported by the first supporting portion 53A by the suction of the first suction portion 53C.

step S14 is a pressure bonding step of pressure bonding the first object to be pressure bonded to the upper surface of the first substrate 7A sucked by the first suction portion 53C and supported by the first support portion 53A, and pressure bonding the second object to be pressure bonded to the upper surface of the second substrate 7B held by the second holding portion 54B and supported by the second support portion 53B.

The pressure-bonding section 5A, which is a pressure-bonding device in the present embodiment, includes: a first holding portion 54A and a second holding portion 54B, a first XYZ θ table mechanism 51, a first suction portion 53C, a first support portion 53A and a second support portion 53B, a first pressure bonding tool 52A and a second pressure bonding tool 52B, and a control portion 79. The first holding portion 54A is a component for holding the first substrate 7A in contact with a part of the lower surface of the first substrate 7A. The second holding portion 54B is a component for holding the second substrate 7B in contact with a part of the lower surface of the second substrate 7B. The first XYZ θ table mechanism 51 is a moving mechanism that moves a holding mechanism including the first holding portion 54A and the second holding portion 54B. The first suction portion 53C is a component for sucking the first substrate 7A. The control unit 79 controls the first holding portion 54A and the second holding portion 54B, the first XYZ θ table mechanism 51, the first suction portion 53C, the first support portion 53A and the second support portion 53B, and the first pressure bonding tool 52A and the second pressure bonding tool 52B. By controlling these operations, the controller 79 executes the steps S11 to S14 shown in fig. 11.

When this holding mechanism moves, the first holding portion 54A and the second holding portion 54B move simultaneously. Therefore, when the second substrate 7B is positioned and the second substrate 7B is supported by the second support portion 53B, it is necessary to separate the first holding portion 54A from the first substrate 7A so as to maintain the state of the first substrate 7A positioned by being supported by the first support portion 53A. However, conventionally, the state of the first substrate 7A is maintained, and the pressing is performed by a pressing tool. In other words, the object to be pressure bonded and the first substrate 7A are pressed against the support portion by the pressure bonding tool, and the state of the already positioned first substrate 7A is maintained. As a result, the first substrate 7A starts pressure-bonding of the object to be pressure-bonded earlier than the second substrate 7B.

In contrast, in the pressure bonding method according to the present embodiment, the first adsorption step of step S12 and the second supporting step of step S13 are performed. In other words, the first suction portion 53C is caused to suck the first substrate 7A and to release the holding of the first substrate 7A by the first holding portion 54A, so that the state in which the lower surface of the first substrate 7A is supported by the first support portion 53A is maintained. When the lower surface of the first substrate 7A is supported by the first support portion 53A by the suction of the first suction portion 53C, the holding mechanism is moved, and the second substrate 7B held by the second holding portion 54B is supported by the second support portion 53B. Therefore, when positioning the second substrate 7B, maintaining the already positioned first substrate 7A is performed by the first suction portion 53C, not the first crimping tool 52A.

in the pressure bonding method of the present embodiment, the second substrate 7B is positioned, and after the second substrate 7B is supported by the second support portion 53B, pressure bonding is performed by the first pressure bonding tool 52A and the second pressure bonding tool 52B. At this time, the first pressure bonding tool 52A is pressed against the first object to be pressure bonded on the upper surface of the first substrate 7A sucked by the first suction portion 53C and supported by the first support portion 53A. Further, the second pressure welding tool 52B is configured to press-contact the second object to be pressure-welded to the upper surface of the second substrate 7B held by the second holding portion 54B and supported by the second support portion 53B. In other words, in the pressure bonding method of the present embodiment, the first substrate 7A and the second substrate 7B are held by the adsorption of the first suction portion 53C and the holding of the second holding portion 54B in a state of being supported by the first support portion 53A and the second support portion 53B, respectively. Therefore, the first and second crimping tools 52A and 52B can be easily crimped to the first and second substrates 7A and 7B at the same time. As a result, the production conditions of the 2 substrates 7 can be easily equalized.

In the present embodiment, the timing at which the first object to be pressure-bonded starts to be pressure-bonded to the upper surface of the first substrate 7A and the timing at which the second object to be pressure-bonded starts to be pressure-bonded to the upper surface of the second substrate 7B may be the same timing. The timing when the pressing of the first object to be pressed is completed on the upper surface of the first substrate 7A may be the same timing as the timing when the pressing of the second object to be pressed is completed on the upper surface of the second substrate 7B.

therefore, it is not necessary to provide a difference in the control timing of the first and second crimping tools 52A and 52B, and the first and second substrates 7A and 7B can be crimped simultaneously.

Here, although the pressure-bonding sections 5A and 5B in the present embodiment each pressure-bond 2 substrates 7, 3 or more substrates 7 may be pressure-bonded. That is, the pressure bonding apparatus may further include, as a holding portion included in the holding mechanism, a third holding portion that is brought into contact with a part of the lower surface of the third substrate 7 and holds the third substrate 7. In this case, the pressure bonding method according to the present embodiment further includes a third supporting step and a second suction step. In the third supporting step, after the first suction step (step S12) is started, the controller 79 moves the holding mechanism to support the lower surface of the third substrate 7 held by the third holding portion by the third supporting portion. In the second suction step, the controller 79 causes the second suction unit to suck the third substrate 7 and releases the holding of the third substrate 7 by the third holding unit so as to maintain the state in which the lower surface of the third substrate 7 is supported by the third support unit. In the second supporting step (step S13), when the lower surface of the first substrate 7A is supported by the first supporting portion 53A and the lower surface of the third substrate 7 is supported by the third supporting portion by the suction of the first suction portion 53C and the second suction portion, the controller 79 moves the holding mechanism to support the lower surface of the second substrate 7B held by the second holding portion 54B by the second supporting portion 53B. In the pressure bonding step (step S14), the control unit 79 further causes the third pressure bonding tool to perform pressure bonding of the third object to be pressure bonded to the upper surface of the third substrate 7 sucked by the second suction unit and supported by the third support unit.

Accordingly, as described above, the 3 substrates can be simply pressed together at the same time. As a result, the production conditions of the 3 substrates 7 are easily equalized. Note that the start timing of the 3 pressure bonding tools may be set to the same time, and the end timing of the 3 pressure bonding tools may be set to the same time. Thus, it is possible to perform simultaneous crimping for each of the 3 substrates 7 while simplifying the control of the 3 crimping tools.

Fig. 12 is a diagram showing another configuration example of a part of the pressure-bonding section 5A. The pressure-bonding section 5A shown in fig. 12 is configured to be capable of simultaneously pressure-bonding 3 substrates 7.

Specifically, the pressure-bonding section 5A includes not only the first pressure-bonding tool 52A and the second pressure-bonding tool 52B but also a pressure-bonding tool 52C corresponding to the third pressure-bonding tool. The crimping tool 52C is disposed between the first crimping tool 52A and the second crimping tool 52B.

The pressure-bonding section 5A further includes a support section 53E corresponding to the third support section in addition to the first support section 53A and the second support section 53B. The support portion 53E is provided between the first support portion 53A and the second support portion 53B.

the pressure-bonding section 5A further includes a suction section 53F corresponding to the second suction section in addition to the first suction section 53C. The suction portion 53F is aligned in the X-axis direction with respect to the first suction portion 53C, and is attached to the support portion 53E.

The pressure-bonding section 5A further includes a holding section 54C corresponding to the third holding section in addition to the first holding section 54A and the second holding section 54B. The holding portion 54C is provided between the first holding portion 54A and the second holding portion 54B in the horizontal rotation driving mechanism 51 θ.

In the pressure bonding step (step S14), the pressure bonding section 5A is configured to pressure bond the object to be pressure bonded to the upper surface of the substrate 7 sucked by the first suction section 53C and supported by the first support section 53A, and to pressure bond the object to be pressure bonded to the upper surface of the substrate 7 held by the second holding section 54B and supported by the second support section 53B. At this time, the pressure-bonding section 5A further pressure-bonds the object to be pressure-bonded to the upper surface of the substrate 7 sucked by the suction section 53F and supported by the support section 53E. So that the pressure bonding can be easily performed at the same time for each of the 3 substrates 7.

The pressure bonding device such as the pressure bonding sections 5A and 5B may include N holding sections, N supporting sections, a moving mechanism, N-1 suction sections, and N pressure bonding tools, where N is an integer of 2 or more. The N holding portions are components that abut against a part of the lower surfaces of the N substrates 7 and hold the N substrates 7. The moving mechanism is a component for moving the holding mechanism including the N holding portions, and the lower surfaces of the N substrates 7 held by the N holding portions are supported by the N support portions, respectively. And (N-1) suction units configured to respectively suck the components of (N-1) substrates 7 corresponding to the (N-1) holding units when the (N-1) holding units of the N holding units release their holding. The N pressure-bonding tools are tools for pressure-bonding the objects to be pressure-bonded to the upper surfaces of the N substrates 7, respectively. Then, (N-1) substrates 7 out of the N substrates 7 to be pressed by the N pressing tools are respectively adsorbed by the (N-1) suction portions and are respectively supported by the (N-1) support portions out of the N support portions. Then, the remaining one substrate 7 of the N substrates 7 to be pressure-bonded by the N pressure-bonding tools is held by the remaining one holding portion of the N holding portions and is supported by the remaining one supporting portion of the N supporting portions.

Therefore, as described above, the N substrates 7 can be easily pressure bonded at the same time. As a result, the production conditions of the N substrates 7 can be easily equalized. Note that the start timing of the N pressure bonding tools may be set to the same time, or the end timing of the N pressure bonding tools may be set to the same time. Accordingly, the control of the N pressure bonding tools can be simplified, and the N substrates 7 can be simultaneously pressure bonded.

The pressure bonding method according to the present disclosure has been described above based on the embodiments, but the present disclosure is not limited to the above embodiments. Various modifications devised by those skilled in the art to which the present invention pertains are intended to be within the scope of the present disclosure, as long as they do not exceed the spirit of the present disclosure.

for example, although the main pressure-bonding section 5 in the present embodiment includes the pressure-bonding sections 5A and 5B, any one of these pressure-bonding sections may be provided, or 3 or more pressure-bonding sections may be provided.

In the main pressure-bonding section 5 of the present embodiment, the first suction portion 53C is provided between the first support portion 53A and the first holding portion 54A, and the second suction portion 63C is provided between the third support portion 63A and the third holding portion 64A. However, the first suction portion 53C and the second suction portion 63C need not be provided as described above. In other words, the position where the first suction portion 53C is provided may be any other position as long as the substrate 7 is supported by the first support portion 53A and can be held by the first suction portion 53C while being sucked by the substrate 7. Similarly, the position where the second suction portion 63C is provided may be any other position as long as the substrate 7 is supported by the third support portion 63A and can be held by the second suction portion 63C while being attracted to the substrate 7.

In the first suction portion 53C and the second suction portion 63C of the present embodiment, the suction holes are formed in a rectangular shape on the XY plane, but the shape of the suction holes may be any other shape. Further, not only 1 suction hole may be formed, but a plurality of suction holes may be formed in each of the first suction portion 53C and the second suction portion 63C.

the display panel assembling apparatus shown in fig. 1 of the above embodiment includes the disk rotation type temporary pressure-bonding section 4, but may include a fixed type temporary pressure-bonding section.

In other words, the temporary pressure-bonding section 4 is configured as a disk rotation type in which the holding head 45 provided on the index table 42a of the electronic component mounting mechanism 42 sequentially indexes as shown in fig. 1. By this indexing, the electronic component 8 taken out from the electronic component supply unit 43 is carried to the pressure bonding position on the support unit 47.

However, the display panel assembling apparatus according to the present embodiment may include a fixed temporary pressure-bonding section that does not perform the indexing rotation.

Fig. 13 is a plan view showing another example of the display panel mounting apparatus.

The display panel mounting apparatus includes a base 111 including a left base 111a, a center base 111b, and a right base 111 c. The 3 base stations are provided in the order of the left base station 111a, the center base station 111b, and the right base station 111c from the left side in the left-right direction (left-right direction of the paper surface in fig. 13, that is, the X-axis direction) when viewed from the operator OP. The left base 111a includes a carry-in substrate mounting portion 121, the center base 111b includes a component mounting execution portion 122, and the right base 111c includes a carry-out substrate mounting portion 123. The substrate 7 is sequentially operated from the left side to the right side in the X-axis direction, that is, in the order of the substrate loading unit 121, the component mounting actuator 122, and the substrate loading unit 123.

The substrate loading unit 121 includes 2 substrate loading stages 121 s. These 2 substrate mounting tables 121s mount 2 substrates 7 sent from the upstream process side of the display panel mounting apparatus.

The substrate carrying-out section 123 has 2 substrate mounting stages 123 s. These 2 substrate mounting tables 123s mount 2 substrates 7 on which the pressing operation of the electronic component 8 is completed by the component mounting execution section 122.

The component mounting execution unit 122 includes an ACF attachment operation unit 122a, a component mounting operation unit 122b, a component pressure bonding operation unit 122c, and a component pressure bonding operation unit 122 d.

here, the center base 111b is provided with a first base portion 131 and a second base portion 132. The first base portion 131 is provided with a left substrate transfer portion 133L having 2 substrate mounting stages 136. Further, the second base portion 132 is provided with a center substrate transfer portion 133C and a right substrate transfer portion 133R each having 2 substrate mounting stages 153. The left substrate transfer unit 133L moves the substrates 7 held on the 2 substrate mounting stages 136 to the operation position of the ACF applying operation unit 122 a. The central substrate transfer unit 133C moves the substrates 7 held on the 2 substrate mounting stages 153 to the operation position of the component mounting operation unit 122b and the operation position of the component pressure bonding operation unit 122C. The right substrate transfer unit 133R moves the substrates 7 held on the 2 substrate mounting stages 153 to the operation position of the component mounting operation unit 122b and the operation position of the component pressure bonding operation unit 122 d.

Further, the base 111 is provided on the moving base 181. The moving base 181 is provided with a left substrate transfer unit 182a, a center substrate transfer unit 182b, and a right substrate transfer unit 182 c. The left substrate transfer unit 182a, the center substrate transfer unit 182b, and the right substrate transfer unit 182c transfer 2 substrates 7. In other words, 2 substrates 7 are transferred from the carried-in substrate placing section 121 to the left substrate transfer section 133L, and from the left substrate transfer section 133L to the center substrate transfer section 133C or the right substrate transfer section 133R. Further, the 2 substrates 7 are transferred from the central substrate transfer portion 133C or the right substrate transfer portion 133R to the carried-out substrate placement portion 123.

The ACF attachment operation unit 122a attaches an adhesive tape (specifically, an ACF tape) to the edge of the substrate 7, and the substrate 7 is held by each of the 2 substrate mounting stages 136 of the left substrate transfer unit 133L and set at an operation position.

The component mounting operation unit 122b is a component mounting device corresponding to the temporary pressure-bonding section 4 in the above embodiment, and performs mounting operation of the electronic component 8 on the substrate 7. In other words, the component mounting operation unit 122b temporarily presses the electronic component 8 against the substrate 7. Specifically, the component mounting operation unit 122b mounts the electronic component 8 on the edge portion of the substrate 7 held by the 2 substrate mounting stages 153 of the central substrate transfer unit 133C or the right substrate transfer unit 133R and disposed at the operation position of the component mounting operation unit 122b via an adhesive tape. More specifically, the component mounting operation unit 122b mounts the electronic component 8 on an edge portion of the substrate 7 held by the substrate mounting table 153 and supported by the support table 164 via an adhesive tape.

Here, the component mounting operation unit 122b includes a mounting head 163 for temporarily pressing the electronic component 8. Unlike the temporary pressure-bonding section 4 of the above-described embodiment, the component mounting operation section 122b is moved in the X-axis direction and the Y-axis direction by the mounting head moving mechanism 162 without performing indexing rotation of the mounting head 163 when temporarily pressing the electronic component 8. Specifically, the mounting head 163 moves to the component supply portion 161 on the rear side of the center base 111b, and sucks the electronic component 8 supplied from the component supply portion 161 from above. Next, the mounting head 163 moves above the substrate 7 supported by the support base 164 while holding the electronic component 8 by suction, and lowers the mounting head to temporarily press the electronic component 8 against the substrate 7.

The component pressure contact operation units 122c and 122d respectively pressure contact the electronic component 8 to the substrate 7 on which the electronic component 8 is mounted by the component mounting operation unit 122 b. In other words, the component pressure bonding operation units 122c and 122d each perform main pressure bonding of the electronic component 8 to the substrate 7. Specifically, the component pressure bonding operation unit 122C is held by the 2 substrate mounting stages 153 of the central substrate transfer unit 133C, and the electronic component 8 is pressure bonded to the substrate 7 disposed at the operation position of the component pressure bonding operation unit 122C. Similarly, the component pressure bonding operation unit 122d is held by the 2 substrate mounting stages 153 of the right substrate transfer unit 133R, and the electronic component 8 is pressure bonded to the substrate 7 disposed at the operation position of the component pressure bonding operation unit 122 d. At this time, the component pressure bonding operation units 122c and 122d simultaneously perform pressure bonding on 2 substrates 7 as in the pressure bonding units 5A and 5B in the above-described embodiment. Accordingly, since 2 substrates can be easily pressure bonded at the same time, the production conditions of 2 substrates can be easily equalized.

As described above, the pressure bonding apparatus and the pressure bonding method of the present disclosure are not limited to the display panel assembling apparatus having the disk rotation type temporary pressure bonding section 4 shown in fig. 1, and can be applied to any type of display panel assembling apparatus.

in the above embodiment, the control unit 79 may be configured by dedicated hardware, or may be realized by executing a software program suitable for the control unit 79. The control unit 79 may be realized by a program execution unit such as a cpu (central Processing unit) or a processor, which reads and executes a software program recorded in a recording medium such as a hard disk or a semiconductor memory. Here, the software that realizes the control unit 79 and the like of the above embodiment may cause a computer to execute each step included in any one of the flowcharts of fig. 7A, 7B, and 11.

the pressure bonding method of the present disclosure has an effect of easily equalizing production conditions of a plurality of substrates, and can be used for devices in which electronic components are mounted on a glass substrate by pressure bonding, display panels are mounted, and the like.

description of the symbols

3 adhesive tape attaching part

4 temporary crimping part

5 Main crimping part

5A, 5B crimping part

7 substrate

7A first substrate

7B second substrate

52A first crimping tool

52B second crimping tool

50, 60 substrate holding part

51 first XYZ theta table mechanism

52A first crimping tool

52B second crimping tool

53A first support part

53B second support part

53C first suction part

54A first holding portion

54B second holding part

79 control part