阅读说明：本技术 用于给芯片测试单元的温控头上胶的装置 (Device for gluing temperature control head of chip testing unit ) 是由 毛宇成 于 2021-07-23 设计创作，主要内容包括：本发明涉及一种用于给芯片测试单元的温控头上胶的装置,包括:把手；设置在所述把手一端的基座；可移动地设置在所述基座上并且能够在复位弹簧的作用下复位的刮胶器,所述刮胶器具有刮刀；设置在所述刮胶器上方并且装有丝网的上压板,所述刮刀能够对所述丝网上的胶进行刮涂；设置在所述刮胶器的与所述复位弹簧相反一侧并且抵靠所述刮胶器的推动装置；以及设置在所述把手上并且用于驱动所述推动装置的驱动机构。根据本发明,可以确保胶被快速均匀地涂敷到芯片测试单元的温控头上。(The invention relates to a device for gluing a temperature control head of a chip testing unit, which comprises a handle; a base disposed at one end of the handle; the glue scraper is movably arranged on the base and can reset under the action of a reset spring, and is provided with a scraper; the upper pressing plate is arranged above the glue scraper and is provided with a silk screen, and the scraper can scrape glue on the silk screen; the pushing device is arranged on the side, opposite to the return spring, of the glue scraper and abuts against the glue scraper; and a driving mechanism provided on the handle and for driving the pushing device. According to the present invention, it is possible to ensure that the paste is quickly and uniformly applied to the thermal head of the chip test unit.)

1. An apparatus for applying glue to a temperature control head of a chip testing unit, comprising:

a handle (3);

a base (5) disposed at one end of the handle (3);

a stripper (17) movably arranged on the base (5) and capable of being reset under the action of a reset spring (21), wherein the stripper (17) is provided with a scraper;

an upper pressure plate (45) arranged above the glue scraper (17) and provided with a silk screen (43), wherein the scraper can scrape glue on the silk screen (43);

a pushing device (19) arranged on the side of the glue scraper (17) opposite to the return spring (21) and abutting against the glue scraper (17); and

a drive mechanism provided on the handle (3) and for driving the pushing device (19).

2. Device for gluing a temperature control head of a chip testing unit according to claim 1, characterized in that the base (5) comprises a bottom plate (9) supported on the handle (3) and provided with an elongated slot (7), a first end plate (11) arranged at one end of the bottom plate (9), and a second end plate (13) arranged at the other end of the bottom plate (9).

3. Device for gluing a temperature control head of a chip testing unit according to claim 2, characterized in that two elongated guide rods (15) extending in parallel are provided between the first end plate (11) and the second end plate (13), the elongated guide rods (15) passing through the glue scraper (17) so that the glue scraper (17) is guided on the elongated guide rods (15), and the return spring (21) is threaded on the elongated guide rods (15) so that one end of the return spring (21) abuts against the glue scraper (17) and the other end abuts against the first end plate (11).

4. Device for gluing a temperature control head of a chip testing unit according to claim 3, characterized in that the squeegee (17) comprises a support plate arranged through the elongated guide bar (15), the scraper being arranged at the upper edge of the support plate.

5. Device for gluing a temperature control head of a chip testing unit according to claim 3, characterized in that said scraper (17) comprises a base plate (25) crossed by said elongated guide rod (15), side walls (27) projecting upwards from two sides of said base plate (25) respectively, and two glue-pushing blocks (31) arranged between said side walls (27), so as to define jointly by said base plate (25), two said side walls (27) and two said glue-pushing blocks (31) a glue-storage chamber (33) for containing glue, said scraper (35) being arranged at least on said side walls (27) close to said pushing means (19).

6. Device for gluing a temperature control head of a chip testing unit according to claim 5, characterized in that the glue pushing block (31) is movably arranged between the two side walls (27) so as to move the glue pushing block (31) by turning an adjusting screw (41) to reduce or increase the volume of the glue storage chamber (33).

7. Device for gluing a temperature control head of a chip testing unit according to claim 2, characterized in that the upper pressure plate (45) is hinged at one end to the first end plate (11) and fastened at the other end to the second end plate (13).

8. Device for gluing a temperature control head of a chip testing unit according to claim 2, characterized in that the upper pressure plate (45) is hinged at one end to the first end plate (11) and is unlockably locked at the other end to the second end plate (13) by means of a locking pin.

9. Device for gluing a temperature control head of a chip testing unit according to claim 8, characterized in that one of the upper platen (45) and the second end plate (13) is provided with a protrusion (49), the other of the upper platen (45) and the second end plate (13) is provided with a recess (51) for receiving the protrusion (49), one of the walls of the protrusion (49) and the recess (51) is provided with a locking pin (55) with a snap lock button (53) and loaded by a spring, and the other of the walls of the protrusion (49) and the recess (51) is provided with a receiving hole (59) for receiving the locking pin (55).

10. Device for gluing a temperature control head of a chip testing unit according to claim 2, characterized in that the upper platen (45) is provided with a central opening in which a screen mounting frame (61) containing the screen (43) is placed in the upper platen (45).

11. Device for gluing a temperature control head of a chip testing unit according to claim 10, characterized in that the frame of the screen mount (61) is formed with a step in order to match the shape of the temperature control head of the chip testing unit.

12. Device for gumming a thermal head of a chip testing unit according to claim 1, characterized in that said pushing means (19) are rollers.

13. Device for gluing a temperature control head of a chip testing unit according to claim 2, characterized in that the drive mechanism comprises a pressing bar mounted pivotably at an intermediate portion to the handle (3) and in a general X-shape with the handle (3), the pushing means (19) being mounted on the end of the pressing bar passing through the elongated slot (7).

14. Device for gluing a temperature control head of a chip testing unit according to claim 2, characterized in that the drive mechanism comprises a pressing lever (65) pivotally mounted at one end to the handle (3) and an intermediate lever (69) pivotally mounted at the middle to the handle (3), the pushing means (19) being mounted on the end of the intermediate lever (69) passing through the elongated slot (7), the pressing lever (65) being further provided with a push rod (73) extending towards the intermediate lever (69), the push rod (73) pushing the intermediate lever (69) to pivot when pressing the pressing lever (65) and thereby driving the pushing means (19) to push the squeegee (17) to move against the action of the return spring (21).

15. Device for gluing a temperature control head of a chip testing unit according to claim 14, characterized in that at the other end of the intermediate lever (69) opposite to the pushing means (19) an auxiliary spring (71) is fitted, said auxiliary spring (71) tending to pivot the end of the intermediate lever (69) fitted with the pushing means (19) away from the stripper (17).

Technical Field

The present invention relates generally to chip test units, and more particularly to an apparatus for applying glue to a temperature control head of a chip test unit.

Background

After the chip is assembled, the chip needs to be subjected to a hot test and/or a cold test by using a chip test unit. The chip test unit includes a temperature control head having precise thermal conductivity. The temperature control head of the chip testing unit applies pressure to the chip through the heat conducting sheet to ensure that the chip is in a communication state and heat is transferred to the chip. Each of the heat conductive sheets has a film that provides heat conduction and protects the heat conductive sheet. In the thermal test and/or the cold test of the chip by the chip test unit, a paste-like paste such as dow corning lubricant is applied to the film of the thermally conductive sheet to prevent the film of the thermally conductive sheet from being damaged and to promote the thermal conduction. Tools for gluing thermally conductive sheets have been designed earlier, but different chip products require thermally conductive sheets of different sizes and thus different gluing tools, which makes it difficult to manage and store the gluing tools. Since all the heat conductive sheets need to be in contact with the surface of the temperature control head, it has been considered to directly coat a layer of glue on the surface of the temperature control head. Currently, the surface of the temperature control head is glued by slightly wiping the surface of the temperature control head from left to right by a cleaning cloth applied with glue. However, this non-standard sizing method does not allow control of the amount of sizing on the surface of the thermal head. Worse still, uneven and excessive sizing on the surface of the thermal head can lead to the formation of spots on the chip, which spots can cause serious quality problems for the chip. In addition, uneven sizing can also damage the film on the thermally conductive sheet and increase the risk of the film falling off the thermally conductive sheet.

Therefore, there is a need for an apparatus for applying glue to a thermal head of a chip testing unit.

Disclosure of Invention

The invention aims to provide a device for gluing a temperature control head of a chip testing unit, which can quickly and uniformly glue on the surface of the temperature control head of the chip testing unit.

According to an aspect of the present invention, there is provided an apparatus for applying glue to a temperature control head of a chip testing unit, comprising:

a handle;

a base disposed at one end of the handle;

the glue scraper is movably arranged on the base and can reset under the action of a reset spring, and is provided with a scraper;

the upper pressing plate is arranged above the glue scraper and is provided with a silk screen, and the scraper can scrape glue on the silk screen;

the pushing device is arranged on the side, opposite to the return spring, of the glue scraper and abuts against the glue scraper; and

a drive mechanism disposed on the handle and for driving the pushing device.

Preferably, the base includes a base plate supported on the handle and having an elongated slot, a first end plate disposed at one end of the base plate, and a second end plate disposed at the other end of the base plate.

Preferably, two elongated guide rods extending in parallel are provided between the first end plate and the second end plate, the elongated guide rods pass through the glue scraper so that the glue scraper is guided on the elongated guide rods, and the return spring is arranged on the elongated guide rods in a penetrating manner, so that one end of the return spring abuts against the glue scraper and the other end abuts against the first end plate.

Preferably, the squeegee includes a support plate disposed through the elongated guide bar, the blade being disposed at an upper edge of the support plate.

Preferably, the glue scraper comprises a bottom plate penetrated by the elongated guide rod, side walls respectively protruding upwards from two sides of the bottom plate, and two glue pushing blocks arranged between the side walls, so that a glue storage cavity for containing glue is jointly defined by the bottom plate, the two side walls and the two glue pushing blocks, and the scraper is arranged on at least the side walls close to the pushing device.

Preferably, the glue pushing block is movably arranged between the two side walls, so that the glue pushing block is moved by rotating the adjusting screw to reduce or increase the volume of the glue storage cavity.

Preferably, the upper platen is hinged at one end to the first end plate and fastened at the other end to the second end plate.

Preferably, the upper pressure plate is hinged at one end to the first end plate and is releasably locked at the other end to the second end plate by means of a locking pin.

Preferably, one of the upper platen and the second end plate is provided with a protrusion, the other of the upper platen and the second end plate is provided with a recess for receiving the protrusion, one of the walls of the protrusion and the recess is provided with a locking pin with a snap-lock button and loaded by a spring, and the other of the walls of the protrusion and the recess is provided with a receiving hole for receiving the locking pin.

Preferably, the upper platen is provided with a central opening in which a screen mounting frame containing the screen is seated.

Preferably, a frame of the screen mount is formed with a stepped portion so as to match a shape of the temperature control head of the chip testing unit.

Preferably, the urging means is a roller.

Preferably, the drive mechanism comprises a pressing bar pivotally mounted to the handle at an intermediate location and generally X-shaped with the handle, the pushing means being mounted on the end of the pressing bar passing through the elongate slot.

Preferably, the driving mechanism comprises a pressing rod and an intermediate rod, the pressing rod is pivotally mounted on the handle at one end, the intermediate rod is pivotally mounted on the handle at the middle part, the pushing device is mounted on the end part, penetrating through the elongated slot, of the intermediate rod, a push rod extending to the intermediate rod is further mounted on the pressing rod, and when the pressing rod is pressed, the push rod pushes the intermediate rod to pivot so as to drive the pushing device to push the adhesive scraper to move against the action of the return spring.

Preferably, an auxiliary spring is mounted at the other end of the intermediate lever opposite to the pushing device, the auxiliary spring tending to pivot the end of the intermediate lever mounted with the pushing device away from the stripper.

According to the present invention, it is possible to ensure that the paste is quickly and uniformly applied to the thermal head of the chip test unit, thereby avoiding the formation of stains on the chip, preventing serious quality problems of the chip, and preventing damage to the film on the heat conductive sheet and reducing the risk of the film falling off from the heat conductive sheet.

Drawings

The above and other aspects of the present invention will be more fully understood and appreciated in view of the following drawings. It should be noted that the figures are merely schematic and are not drawn to scale. In the drawings:

FIG. 1 schematically shows in perspective view a device for gluing a temperature control head of a chip testing unit according to the invention;

FIG. 2 schematically shows in perspective view a device for gluing a temperature control head of a chip testing unit according to the present invention, wherein half of the grip housing is removed to show the internal structure; and

fig. 3 schematically shows in a perspective view a squeegee of a device for applying glue to a temperature control head of a chip testing unit according to the invention.

Detailed Description

Some preferred embodiments of the present invention are described in detail below with reference to examples. It will be understood by those skilled in the art that these examples are illustrative only and are not meant to limit the present invention in any way. Furthermore, features in the embodiments of the present invention may be combined with each other without conflict. In the drawings, other components have been omitted for the sake of brevity, but this does not indicate that the device for gumming a temperature control head of a chip testing unit according to the present invention may not comprise other components. It is to be understood that the dimensions, proportions and number of parts shown in the attached drawings are not to be considered limiting of the invention.

Fig. 1 shows schematically in a perspective view a device according to the invention for applying glue to a temperature control head of a chip testing unit. Fig. 2 schematically shows in perspective view a device for gluing a temperature control head of a chip testing unit according to the invention, wherein half of the grip housing is removed to show the internal structure. As shown in fig. 1 and 2, the apparatus 1 for applying glue to a thermal head of a chip testing unit according to the present invention includes a handle 3 and a base 5 provided at one end of the handle 3. In the preferred embodiment, the base 5 includes a base plate 9 supported on the handle 3 and having an elongated slot 7, a first end plate 11 disposed at one end of the base plate 9, and a second end plate 13 disposed at the other end of the base plate 9. Two elongated guide rods 15 are arranged on the first end plate 11 at one end and on the second end plate 13 at the other end, such that the two elongated guide rods 15 extend substantially parallel between the first end plate 11 and the second end plate 13. The device 1 for gluing the thermal heads of the chip testing units according to the present invention also comprises a glue scraper 17 passing through the two elongated guide bars 15 so as to move on the two elongated guide bars 15. A pushing device 19 such as a roller or a push block at one side of the squeegee 17 abuts on the squeegee 17, one ends of return springs 21 respectively provided through the two elongated guide rods 15 at the other side of the squeegee 17 abut on the squeegee 17, and the other ends of the return springs 21 abut on the first end plate 11, respectively. It is also possible to provide only one elongated guide bar 15. It will be appreciated that other guiding means may be used to guide the movement of the squeegee 17, for example a guide rail on one of the base plate 9 and the squeegee 17 and a guide groove on the other of the base plate 9 and the squeegee 17 cooperating with the guide rail may be used to guide the movement of the squeegee 17.

In a simplified embodiment, the stripper 17 comprises a support plate arranged through the two elongated guide bars 15, and a scraper arranged at the upper edge of the support plate. One side of the support plate is abutted by the urging means 19 and the other side is abutted by one end of the return spring 21. Fig. 3 schematically shows in a perspective view a preferred embodiment of a squeegee of a device for applying glue to a temperature control head of a chip testing unit according to the invention. In the preferred embodiment, the stripper 17 comprises a bottom plate 25 with a through hole 23 for the passage of the two elongated guide bars 15, the bottom plate 25 having side walls 27 projecting upwards on both sides so as to define a housing space 29 above the bottom plate 25. A movable glue pushing block 31 is respectively arranged at two ends of the accommodating space 29, so that a glue storage cavity 33 is defined by the bottom plate 25, the two side walls 27 and the two glue pushing blocks 31. The glue storage chamber 33 is used for containing paste glue to be coated on the temperature control head of the chip testing unit. A scraper 35 for scraping the glue is arranged on the side wall 27 close to the pushing device 19. Of course, the two side walls 27 may be provided with scrapers 35, respectively. In the case of a scraper 35 on each of the two side walls 27, the scraper 35 on the side wall 27 adjacent to the pushing device 19 is preferably slightly higher than the scraper on the other side wall. The glue scraper 17 may further comprise a stop plate 39 with a guide rod 37, and the guide rod 37 connects the stop plate 39 and the glue pushing block 31 to move together. The stripper 17 further comprises an adjusting screw 41 screwed to the chassis 25 and to the limit plate 39. By rotating the adjusting screw 41 in one direction, the limiting plate 39 drives the two glue pushing blocks 31 to move oppositely, so as to gradually reduce the volume of the glue storage cavity 33; by rotating the adjusting screw 41 in the opposite direction, the limiting plate 39 can move the two glue pushing blocks 31 away from each other, so as to gradually increase the volume of the glue storage cavity 33. In this way, by reducing the volume of the glue reservoir 33, it is possible to maintain the glue in contact with the screen described below even if the glue in the glue reservoir 33 is reduced.

The device 1 according to the invention for gluing the thermal heads of the chip testing units also comprises an upper platen 45 fitted with a screen 43, the upper platen 45 being hinged at one end to the base 5, for example to the first end plate 11 of the base 5 by means of a pivot 47. The upper pressure plate 45 is fastened at the other end to the second end plate 13 of the base 5 by screws. Preferably, the upper pressure plate 45 is releasably locked at the other end to the second end plate 13 of the base 5 by means of a locking pin. For this, the upper platen 45 has a protrusion 49 at an end portion close to the second end plate 13 of the base 5, and a recess 51 for receiving the protrusion 49 is correspondingly formed on the second end plate 13 of the base 5. A locking pin 55 with a snap lock button 53 is provided in the projection 49. The locking pin 55 projects from the projection 49 under the action of a spring 57 and the locking pin 55 can be retracted into the projection 49 against the action of the spring 57 by pressing the snap lock buttons 53 towards each other. Receiving holes 59 are provided on opposite side walls of the recess 51 on the second end plate 13 of the base 5 in correspondence with the locking pins 55. When the projection 49 is received in the recess 51, the locking pin 55 projects into the receiving hole 59 under the action of the spring 57 after the snap-lock button 53 is released, thereby locking the upper platen 45 to the second end plate 13 of the base 5 in a snap-unlocked manner. It should be understood that there may be only one locking pin 55. It is also possible to provide the locking pin 55 on the wall of the recess 51 and the receiving hole 59 in the projection 49. Further, it is also possible to provide the recess 51 on the upper platen 45. The upper platen 45 may be provided with a central opening, and the screen mounting bracket 61, which is loaded with the screen 43, may be seated in the central opening of the upper platen 45. In this way, the screen mounting bracket 61 with the screen 43 mounted thereon is easily removed from the upper platen 45 after a period of use to clean the screen. The frame of the screen mount 61 is preferably formed with a stepped portion so as to match the shape of the temperature control head of the chip testing unit, thereby facilitating quick and accurate positioning of the screen 43 with respect to the temperature control head of the chip testing unit.

The device 1 according to the invention for gluing the thermal heads of a chip testing unit also comprises a drive mechanism supported on the handle 3 for driving the pushing means 19. According to one embodiment of the invention, the drive mechanism comprises a pressing lever which may be pivotally mounted at a central portion to the handle 3 by means of a pin and is generally X-shaped with respect to the handle 3, and pushing means 19, such as a roller, are mounted on the end of the pressing lever which passes through the elongate slot 7 in the base plate 9. Therefore, the pushing device 19 can be driven to push the squeegee 17 with the scraper to move by holding the handle 3 and pressing the pressing lever.

According to another embodiment of the invention, the drive mechanism comprises a pressing lever 65 pivotably mounted at one end to the handle 3 by means of a pin 63, and an intermediate lever 69 pivotably mounted at an intermediate portion to the handle 3 by means of a pin 67. A pushing device 19, such as a roller, is mounted on the end of the intermediate lever 69 that passes through the elongated slot 7 in the base plate 9, the other end of the intermediate lever 69 being provided with an auxiliary spring 71, the auxiliary spring 71 always tending to pivot the end of the intermediate lever 69 that is provided with the pushing device 19, such as a roller, away from the squeegee 17. The pressing lever 65 is also provided with a push rod 73 extending toward the intermediate lever 69 at a position between the end provided with the pushing means 19 such as a roller and the pin 67. Thus, pressing the pressing lever 65 causes the push rod 73 to push the intermediate lever 69 to pivot about the pin 67, which in turn brings the pushing means 19, such as a roller, mounted on the intermediate lever 69 to push the squeegee 17 along the two elongated guide bars 15 towards the first end plate 11 against the action of the return spring 21. When the pressing lever 65 is released, the stripper 17 is moved back along the two elongated guide bars 15 to a position close to the second end plate 13 under the combined action of the return spring 21 and the auxiliary spring 71. It will be appreciated that it is also possible to have no auxiliary spring 71, but that the auxiliary spring 71 contributes to a quick return of the stripper 17.

The operation of the device 1 for gluing a temperature control head of a chip testing unit according to the invention will be described below.

After the screen 43 of the apparatus 1 for applying glue to the thermal heads of the chip testing units according to the present invention is placed on the thermal heads of the chip testing units, the squeegee 17 is moved along the two elongated guide bars 15 away from the second end plate 13 toward the first end plate 11 by pressing the pressing bar, and the squeegee on the squeegee 17 wipes the screen 43, thereby applying the glue on the screen 43 substantially uniformly to the thermal heads of the chip testing units. After releasing the pressing rod, the stripper 17 is returned to a position close to the second end plate 13, and the next thermal head of the chip testing unit can be glued by the device 1 for gluing thermal heads of the chip testing unit according to the present invention, so that the thermal heads of the chip testing unit can be glued quickly and uniformly. In case the glue stripper 17 is not provided with a glue reservoir, the glue can be applied directly to the wire. In case the glue stripper 17 is provided with a glue reservoir, glue may be applied to the glue reservoir. The amount of glue in the glue reservoir is such that the glue is able to contact the screen when the squeegee 17 is moved across the screen. After a period of use, the amount of glue in the glue storage cavity is reduced, and the two glue pushing blocks 31 can be moved towards each other by rotating the adjusting screws 41 on the glue scraper 17 to gradually reduce the volume of the glue storage cavity 33, so that the glue in the glue storage cavity can be ensured to contact the silk screen. For this purpose, a viewing hole 75 may also be provided in the upper platen 45 to view the amount of glue in the glue reservoir 33. When it is observed that the amount of glue in the glue reservoir 33 has been insufficient, the quick lock button 53 may be pressed to unlock the upper platen 45. After the upper press plate 45 is unlocked, the glue storage cavity 33 can be filled with glue by turning the upper press plate 45 upwards. After the glue reservoir 33 has been replenished, the upper pressure plate 45 is locked to the second end plate 13. This enables the glue filling operation for the glue storage chamber 33 to be performed easily and quickly.

According to the present invention, by applying the glue to the thermal head of the chip testing unit using the wire mesh and the squeegee, it is possible to ensure that the glue is quickly and uniformly applied to the thermal head of the chip testing unit, thereby preventing stains from being formed on the chip, preventing serious quality problems from occurring in the chip, and preventing damage to the film on the thermally conductive sheet and reducing the risk of the film falling off from the thermally conductive sheet.

The present invention has been described in detail with reference to the specific embodiments. It is to be understood that both the foregoing description and the embodiments shown in the drawings are to be considered exemplary and not restrictive of the invention. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit of the invention, and these changes and modifications do not depart from the scope of the invention.