阅读说明：本技术 智能uv辐射系统 (intelligent UV radiation system ) 是由 杨艺新 W·E·约翰森三世 P·K·斯沃因 M·K·韦斯特 C·H·伍德 D·许 D·伦 于 2013-11-19 设计创作，主要内容包括：本公开涉及智能UV辐射系统。公开了一种“智能”紫外线固化组件。“智能”组件允许自动监控内部零件的性能参数、零件寿命和盘存控制。“智能”组件包括灯上微处理器。灯上微处理器可以被配置成识别内部零件、记录每个零件的累积工作时间,以及采样并处理来自多个“智能”传感器的数据。(the present disclosure relates to intelligent UV radiation systems. An "intelligent" ultraviolet curing assembly is disclosed. The "smart" component allows for automatic monitoring of internal part performance parameters, part life, and inventory control. The "smart" component includes an on-light microprocessor. The on-lamp microprocessor may be configured to identify internal parts, record the cumulative operating time of each part, and sample and process data from multiple "smart" sensors.)

1. An intelligent ultraviolet curing apparatus comprising:

A radiator comprising a plurality of components, the radiator comprising a UV emitting bulb;

A microprocessor mounted within the radiator;

A plurality of smart markers in signal communication with the microprocessor and configured to monitor the plurality of components; and

a plurality of sensors in signal communication with the microprocessor and configured to detect a plurality of operating conditions associated with the plurality of components, the plurality of sensors including a UV power detector for providing automatic adjustment of UV power provided by the irradiator.

2. The apparatus of claim 1, wherein the plurality of smart tags comprises at least one of a radio frequency identification tag and a small footprint microcontroller.

3. the apparatus of claim 2, wherein the small footprint microcontroller is configured to be affixed to each monitored component.

4. The device of claim 1, wherein the microprocessor is configured to communicate with each of the plurality of smart tags over a standard serial bus.

5. The apparatus of claim 4, wherein the standard serial bus is a serial peripheral interface bus.

6. The apparatus of claim 1, wherein each tag of the plurality of smart tags is configured to hold manufacturing information including at least a production date, a part number, and an expiration date.

7. The device of claim 1, wherein the microprocessor is configured to:

Identifying a type and parameters for each of the plurality of components;

Recording a cumulative operating time for each of the plurality of components;

Sampling and processing data from the plurality of sensors; and

communicating with a host computer processor via a serial bus.

8. The apparatus of claim 7, wherein the serial bus is a CAN bus.

9. The apparatus of claim 1, wherein the plurality of components being monitored are at least one of one or more magnetrons and a primary reflector.

10. The apparatus of claim 1, wherein the plurality of sensors are at least one of one or more temperature detectors operating as a bulb recognizer, an air pressure sensor for detecting air flow rate from an internal fan, and an RF detector for microwave leakage detection.

11. The apparatus of claim 2, wherein at least one radio frequency identification tag comprises a coil antenna mounted in a vertical plane relative to a magnetron and an internal chip mounted in a horizontal plane relative to the magnetron.

12. The apparatus of claim 1, wherein the plurality of sensors comprises at least a bulb recognizer configured to recognize a presence of Kr 85 in a microwave-driven lamp within the irradiator.

13. The apparatus of claim 12, wherein the bulb recognizer is one of a geiger counter, a CMOS or CCD imager operable with the microprocessor to recognize the emission spectrum of Kr 85, or a PIN diode.

14. The apparatus of claim 12, wherein the bulb identifier is a photodetector configured to detect an initial ignition wavelength of Kr 85.

15. The apparatus of claim 12, wherein at least one of the plurality of components is disposable.

16. a method of operating an intelligent ultraviolet curing apparatus, the method comprising:

Providing a radiator, the radiator comprising:

the UV-emitting light bulb is provided with,

a plurality of components, wherein the components are arranged in a matrix,

A microprocessor mounted in the radiator, an

A plurality of smart tags in signal communication with the microprocessor;

Monitoring the plurality of components using the plurality of smart labels; and is

Detecting a plurality of operating conditions associated with the plurality of components with a plurality of sensors including a UV power detector for providing automatic adjustment of UV power provided by the irradiator.

17. The method of claim 16, further comprising:

Reading, with the microprocessor, information stored in the smart label when initially installing and subsequently installing a disposable component;

Assigning a part ID to each of the plurality of components being monitored; and

A start date and time is recorded for each of the monitored components.

18. The method of claim 17, further comprising: the operating time of the monitored component is compared to the expected maximum life of the monitored component.

19. The method of claim 18, further comprising: sending a message indicating when it is time to inspect or replace the monitored component when the operating time approaches or exceeds a pre-established validity period.

20. The method of claim 18, further comprising: deactivating the monitored component when the operating time approaches or exceeds a stored life span.

Technical Field

The present invention relates generally to Ultraviolet (UV) curing lamp assemblies, and more particularly to UV curing lamp assemblies including on-board intelligence for automated inventory and monitoring of internal parts.

Background

Radiant energy is used in a variety of manufacturing processes to treat surfaces, films, and coatings applied to a wide range of materials. Specific processes include, but are not limited to, curing (e.g., fixing, polymerizing), oxidizing, purifying, and sterilizing. The process of applying radiant energy to effect polymerization or to achieve a desired chemical change is rapid and often inexpensive compared to thermal treatment. The radiation may also be localized to control the surface treatment and allow preferential curing only where the radiation is applied. The curing may also be localized within or at a substantial portion of the coating or film in the interface region. Control of the curing process is achieved by selection of the radiation source type, physical properties (e.g., spectral properties), spatial and temporal variations in the radiation, and the curing chemistry (e.g., coating composition).

A variety of radiation sources are used for curing, fixing, polymerization, oxidation, purification or disinfection applications. Examples of such sources include, but are not limited to, photon, electron or ion beam sources. Typical photon sources include, but are not limited to, arc lamps, incandescent lamps, electrodeless lamps, and a variety of electronic and solid state sources (i.e., lasers). Conventional arc type UV lamp systems and microwave driven UV lamp systems use a tubular bulb envelope made of fused quartz glass or fused silicon.

FIG. 1 is a perspective view of a microwave driven UV curing lamp assembly showing a prior art radiator and shade assembly. FIG. 2 is a partial cross-sectional view of the lamp assembly of FIG. 1 showing a semi-elliptical primary reflector and a light source having a circular cross-section. FIG. 3 is a partial cross-sectional interior view of the shading assembly of FIG. 1, showing a semi-elliptical primary reflector and a light source having a circular cross-section, matched to a secondary reflector and an end reflector.

referring now to fig. 1-3, the device 10 includes a radiator 12 and a shading assembly 14. The radiator 12 includes a primary reflector 16, the primary reflector 16 having a generally smooth semi-elliptical shape and having an opening 18 for receiving microwave radiation to excite a light source 20 (discussed below) and a plurality of openings 22 for receiving airflow to cool the light source 20. The light source 20 comprises a lamp (e.g., a modular lamp, a microwave-driven lamp such as an electrodeless or microwave-driven bulb having a glass-to-metal seal (e.g., a tubular bulb having a generally circular cross-section)). Light source 20 is positioned at the inner focus of the semi-ellipse formed by primary reflector 16. Light source 20 and primary reflector 16 extend linearly along an axis (not shown) that moves out of the page. A pair of end reflectors 24 (one shown) terminate opposite sides of the primary reflector 16 to form a substantially semi-elliptical reflecting cylinder. The shading assembly 14 of fig. 1-3 includes a secondary reflector 25 having a substantially smooth elliptical shape. A second pair of end reflectors 26 (one shown) terminate opposite sides of the secondary reflector 25 to form a substantially semi-elliptical reflecting cylinder.

A workpiece tube 30 having a circular cross-section is received within a circular opening 28 in the end reflector 26. The center of opening 28 and the axis of workpiece tube 30 are typically located at the outer focus of the semi-ellipse formed by primary reflector 16 (i.e., the focus of the semi-ellipse formed by secondary reflector 25). The workpiece tube 28 and secondary reflector 25 extend linearly along an axis (not shown) that moves out of the page.

in operation, the gas in the light source 20 is excited into a plasma state by a Radio Frequency (RF) radiation source, such as a magnetron 29 located in the radiator 12. Atoms of the excited gas in the light source 20 return to a low energy state, thereby emitting ultraviolet light (UV). Ultraviolet light rays 38 radiate from the light source 20 in all directions, striking the inner surfaces of the primary reflector 16, the secondary reflector 25, and the end reflectors 24, 26. Most of the ultraviolet radiation 38 is reflected toward the central axis of the workpiece tube 30. The light source 20 and reflector design are optimized to produce maximum peak light intensity (lamp irradiance) at the surface of the work product placed inside the workpiece tube 30 (also propagating linearly out of the page).

Fig. 4 shows a number of cable connections between the radiator 12 of fig. 1-3 and a conventional external power supply 40. Current radiators made by Fusion UV Systems, Gaithersburg, Maryland, are supplied with high voltage direct current and are monitored for analog parameters such as the detection and measurement of leakage of Radio Frequency (RF) and Ultraviolet (UV) radiation. The external power source 40 includes a three-phase power cable 42 for receiving conventional alternating current. The external power supply 40 converts the alternating current to a high voltage direct current in the range of 4kV-7kV direct current. The high voltage direct current is applied to a high voltage HV cable 44 extending between the external power source 40 and the radiator 12. The HV cable 44 typically includes seven analog signal lines (not shown): two lines are used to carry High Voltage (HV) dc power to the radiator 12; two wires are used to power the filament associated with the microwave-driven UV emitting bulb 20 (i.e., the light source 20); one line for the photodetector and one line for the pressure switching sensor; and the seventh wire is for cable interlock. An RF cable 46 for monitoring microwave leakage conditions is positioned between the external power source 40 and an RF detector 48, the RF cable 46 needs to be mounted close to the radiator 12.

Unfortunately, the currently employed cables 44, 46 between the external power source 40 and the radiator 12 have a number of disadvantages. The cables 44, 46 have a limited range due to losses in the cables. The current radiators 12 are not user friendly with respect to product upgrade, standardization and compatibility. For example, certain critical monitorable parameters, including UV power, temperature, gas pressure and part type, require additional sensors to be installed inside the radiator 12. Due to the limited I/O and the need for the external power supply 40 to be in close proximity to the effective range of the radiator 12, the cables 44, 46 do not allow for the necessary changes to accommodate remote monitoring of the above-mentioned parameters.

Current radiators 12 do not allow monitoring of the UV output power emanating from the UV emitting bulb 20. Each UV emitting bulb 20 is different in its UV output power. There are certain UV curing applications in which a plurality of UV emitting bulbs 20 are mounted adjacent to one another. Manual adjustments are required to reduce or increase the voltage in order to equalize the UV output power difference between the lamps. It is therefore desirable to allow for automatic monitoring and adjustment of UV output power.

The currently used pressure switches (not shown) do not allow real-time monitoring of the air pressure inside the radiator 12. The flow rate of the gas within the radiator 12 is critical to the life of the UV emitting bulb 20 and the magnetron 29. It is therefore desirable to install a monitorable pressure sensor that can transmit real-time data back to the controller. In addition, a monitorable pressure sensor may be integrated with the "smart blower" to automatically manage airflow and speed changes of the "smart blower" based on data received from the monitorable pressure sensor.

What is desired, therefore, but not provided, is a microprocessor controlled UV curing radiator for monitoring internal sensors for performance parameters, part life and inventory control without requiring major changes to the high voltage power supply.

Disclosure of Invention

The above problems are solved and a technical solution is achieved in the art by providing a "smart" radiator that allows automatic monitoring of performance parameters of internal parts, part lifetime and inventory control. The radiator comprises an on-lamp (on lamp) microprocessor. The on-lamp microprocessor may be configured to recognize internal parts, record accumulated operating time for each part, sample and process data from multiple sensors, and communicate via a serial bus cable with a main computer processor located within an external "smart" power supply.

according to one embodiment of the invention, the on-lamp microprocessor is configured to communicate with a plurality of Intelligent Markers (IM) associated with one or more internal magnetrons and an internal primary reflector. The smart tag may include at least one of a radio frequency identification tag (RFID) or a small footprint microcontroller affixed to each part to be monitored. The on-lamp microprocessor communicates with the IM via a standard serial link, such as a Serial Peripheral Interface (SPI) bus. The on-lamp microprocessor also communicates with a plurality of analog/digital sensors including one or more temperature detectors operating as a bulb identifier (BR), an air pressure sensor for detecting air flow rate from an internal fan within the applicator, a UV power sensor, and an RF detector for microwave leak detection.

The "smart" radiator communicates with a "smart" external power supply adapted to include a main computer processor to control the radiator and read data processed by an on-lamp microprocessor on a digital serial communication bus (e.g., a CAN bus) that communicates between the radiator and the power supply using inexpensive standard communication protocols.

Drawings

The present invention will be more readily understood from the detailed description of exemplary embodiments presented below when considered in conjunction with the attached drawings, wherein like reference numerals designate like elements, and in which:

FIG. 1 is a perspective view of a UV curing lamp assembly showing a prior art radiator and shade assembly;

FIG. 2 is a partial cross-sectional view of the lamp assembly of FIG. 1 showing a semi-elliptical primary reflector and a light source having a circular cross-section;

FIG. 3 is a partial internal cross-sectional view of a lamp assembly interconnected with the shading assembly of FIG. 1, showing a semi-elliptical primary reflector and a light source having a circular cross-section, mated with a secondary reflector and an end reflector;

fig. 4 shows a number of cable connections between the radiator of fig. 1-3 and a conventional external power supply;

FIG. 5 is a partial cross-sectional view of the radiator of FIG. 2 modified to include an intelligent control in accordance with one embodiment of the present invention;

Fig. 6 illustrates a plurality of cable connections between the radiator of fig. 5 and an external power source adapted to operate with the radiator, according to one embodiment of the invention;

Fig. 7 is an electrical schematic block diagram of an on-lamp microprocessor board mounted in the radiator of fig. 5 and 6 according to one embodiment of the present invention;

FIG. 8A depicts a conventional RFID tag having a semiconductor chip and a coil antenna located in a common plane; and

FIG. 8B depicts a modification of the RFID tag of FIG. 8A in which the semiconductor chip is located in a horizontal plane and the coil antenna is located in a vertical plane, in accordance with one embodiment of the present invention.

It is to be understood that the drawings are for purposes of illustrating the concepts of the invention and may not be to scale.

Detailed Description

Fig. 5 is a partial cross-sectional view of the UV curing radiator 12 (i.e., radiator 50) of fig. 2 modified to include an intelligent control, according to one embodiment of the invention. In the configuration shown, the radiator 50 includes an on-lamp microprocessor board 52, a plurality of intelligent markers 54a-54n (labeled IM1-IMn), and a plurality of sensors 56a-56n (e.g., a bulb identifier labeled BR 56a, a barometric pressure sensor 56b, and a photodetector 56 c). The arrangement of the components 52, 54a-54n and 56a-56n in fig. 5 represents a preferred, but not exclusive, arrangement. A description of each of the intelligent components 52, 54a-54n and 56a-56n is provided below in connection with fig. 6.

Fig. 6 depicts a plurality of cable connections between a radiator 50 and an external power supply 60 modified to operate with the radiator 50, according to one embodiment of the present invention. The external power source 60 includes a three-phase power cable 42 for receiving conventional alternating current power. The external power supply 60 converts the alternating current to a high voltage direct current in the range of 4kV-7kV direct current. The high voltage direct current is applied to a modified High Voltage (HV) cable 62 extending between the external power supply 60 and the radiator 50. The HV cable 62 includes two wires for carrying High Voltage (HV) dc power and a number of additional conductors for controlling and monitoring the filament current of the magnetron 29. The serial bus cable 63 includes two or more digital serial communication lines for communication between the external power supply 60 and the radiator 50 using a standard serial communication protocol (for example, CAN bus). A main computer processor 64 within the external power supply 60 is configured to control and receive serial data to/from the on-lamp microprocessor board 52. The host computer processor 64 is also configured to communicate with an external smart control system (not shown) for receiving commands from the user 66 and presenting data to the user 66 on a monitor 68 via a standard serial link 70 (e.g., a CAN bus). An RF cable 72 for monitoring microwave radiation leakage from the radiator 50 extends from the external power supply 60 to an RF detector 76. Note that the RF cable 72 associated with the RF detector 76 is typically a short local cable, as compared to the relatively long cable connected between the radiator 12 and the external power source 40 of fig. 2.

Fig. 7 is an electrical schematic block diagram of an on-lamp microprocessor board 52 mounted within the radiator 50 of fig. 5 and 6, according to one embodiment of the present invention. The on-lamp microprocessor board 52 includes an on-lamp microprocessor 80 in signal communication with a computer readable storage medium 82 (i.e., volatile and non-volatile memory, such as RAM and flash memory, respectively). The on-lamp microprocessor 80 may be any commercially available 8/16-bit microprocessor with sufficient speed to process commands and data from the plurality of sensors 56a-56n via an 8-channel analog-to-digital converter (ADC)84 through a sensor port 86. The on-lamp microprocessor 80 also controls and reads digital data from a plurality of intelligent tags 54a-54n (labeled IM1-IMn) via a serial bus 88 and a serial bus port 90, the serial bus port 90 employing a standard serial bus protocol that may be, but is not limited to, a serial peripheral interface bus (SPI bus) protocol.

According to one embodiment of the invention, on-lamp microprocessor 80 may be configured to: (1) identification features including one or two magnetrons 29 associated with the smart markers IM1 and IM2, respectively, a primary reflector 16 associated with the smart marker IM3, and a microwave-driven UV-emitting bulb 20 (i.e., light source 20) associated with a bulb identifier (BR); (2) recording a cumulative operating time for each part, the cumulative operating time being storable in a non-volatile memory (i.e., the computer-readable storage medium 82); (3) data from a plurality of sensors 56a-56n, which may include but are not limited to: one or more temperature sensors 56a operating as a Bulb Recognizer (BR) to detect the type of UV emitting bulb 20, a gas pressure sensor 56b for detecting the gas flow rate from an internal fan (not shown) within the emitter 50, a photo detector 56c for measuring the UV light output from the emitter 50, and other optional sensors such as a filament current sensor and HV cable interlock (not shown); and (4) communicate with a host computer processor 64 within the external power supply 60 via a serial bus cable 63.

Parts may be identified by a plurality of sensors 56a-56n (e.g., light bulb identifiers (BR)) on a sensor port 86 as an analog/digital device, and intelligent markers 54a-54n (labeled IM1-IMn) on a serial bus port 90 as a digital device. As used herein, smart mark (IM) refers to, but is not limited to, a semiconductor chip that permanently retains manufacturing information such as, but not limited to, date of manufacture, part count, and life span. The radiator 50 may include, but is not limited to, one or both of the following two types of IM: radio frequency identification tags (RFID) or small footprint microcontrollers. The IM may be permanently affixed to the part using an epoxy or other adhesive.

When the IM is an RFID tag, the RFID tag is configured to wirelessly communicate with a reader (not shown) via Radio Frequency (RF) waves to exchange data. Several types of RFID products are known, such as RI-103 and 114A-01 by Texas Instruments and AT88SCRF-ADK2 by ATMEL. RFID tags have been used in such diverse applications as driver's licenses, passports, and bus, subway and highway tickets. Current RFID tag designs, such as RFID tag 92 shown in fig. 8A, include a semiconductor chip 94 and a coil antenna 96. Since the magnetron 29/reflector is made of metal, the RFID tag 92 is not suitable for direct mounting to the magnetron 29 or reflector. The metal of the magnetron 29/reflector shields the coil antenna 96, thereby reducing the generation of sufficient current for "reading" the stored RFID data from the semiconductor chip 94. An improvement is shown in fig. 8B, where the magnetron 29/reflector does not shield the coil antenna 98 of the RFID tag 100 because the coil antenna is positioned in a vertical plane, while the chip 102 of the RFID tag 100 is positioned and mounted to the magnetron 29/reflector in a horizontal plane.

An alternative for implementing IM is to employ a microcontroller with a small footprint, such as an 8-bit PIC10F222T-I/OT microcontroller produced by Microchip Technology, or ATTINY10-TSHR produced by Atmel. The small footprint microcontroller type IM may be connected to the on-lamp microprocessor board 52 via 3 to 5 wires. In these cases, the on-lamp microprocessor 80 communicates with the small footprint microcontroller over a serial bus port 90 via a serial bus 88 to access information previously written by the manufacturer of the part to be tracked.

The main difficulty in achieving IM for use as an identifier (BR) is the high operating temperature of the UV emitting bulb 20. A fully operational UV emitting bulb 20 has a temperature in the range of approximately 700-900 c, which may damage all microcontrollers, except a few expensive military-sized microcontrollers. In addition, the IM will be exposed to high levels of UV and microwave radiation. Therefore, it is prohibitive to adhere inexpensive semiconductor-based IM to the UV emitting bulb 20.

an alternative implementation of BR may utilize the features of microwave-driven bulbs manufactured by Fusion UV Systems of Gaithersburg, MD. These bulbs contain a trace isotope of the radioactive element krypton (i.e., "Kr 85") that decays to a non-radioactive byproduct after a predetermined amount of time (i.e., just enough to allow the microwave-driven bulb to reach operating temperature). If the radiator is not used with Kr 85, the time for the microwave-driven bulb to ramp up to full operating temperature is significantly extended, resulting in potentially harmful effects on the magnetron 29. In this case, a sensor that recognizes the presence of Kr 85 may be employed. The sensor detecting the radiation emitted by Kr 85 may be remotely mounted at a safe distance from the UV emitting bulb 20 within the radiator 50. Radiation detector based sensors may include, but are not limited to: a small grid counter, a CMOS or CCD imager operable with the on-lamp microprocessor 80 to recognize the emission spectrum of Kr 85, or a PIN diode such as UM9441 or UM9442 manufactured by microsomi Corp, which is used as a radiation detector in a preferred embodiment.

a further method for implementing BR is to analyze the behavior of the UV emitting bulb 20 when krypton is present. During bulb ignition, the emission spectrum from the UV emitting bulb 20 has a characteristic optical transition wavelength specific to krypton. This optical transition wavelength will only be emitted when the UV emitting bulb 20 is initially ignited, when the mercury pressure is very low. The photodetector can then be used as a BR to detect brief krypton emissions during ignition.

It is desirable that certain internal components of the radiator 50 that are monitored by the IMs 54a-54n be disposable, such as, but not limited to, the UV emitting bulb 20 and the primary reflector 16. All disposable parts inside the radiator 50 can have pre-written information stored in the IM54a-54n as part of the inventory tracking system. The stored information may include, but is not limited to, part number, date of manufacture, and life span. Data representing this information may be transmitted from the IMs 54a-54n to the on-lamp microprocessor 80 and subsequently to the main computer processor 64 within the external power supply 60.

In operation, the information stored in the IMs 54a-54n can be read by the on-lamp microprocessor 80 via the serial bus 88 upon initial installation and any subsequent installation of each disposable part. On-lamp microprocessor 80 assigns a part ID to each part. On-lamp microprocessor 80 records a start date and time for each of the monitored parts. On-lamp microprocessor 80 may compare the operating time of the part to its expected maximum life. When the operating time approaches or exceeds a pre-established product expiration date, the on-lamp microprocessor 80 sends a message over the serial bus cable 63 to the host computer processor 64 within the external power source 50 and from there to the user via the serial link 70 (e.g., CAN bus serial link) and/or the network (e.g., the internet) to inform that it is time to inspect and/or replace the part. An external monitoring system at the user location may be configured to count and display the operating time of each part. In addition, on-lamp microprocessor 80 may store a life span for each part that is 20-30% longer than the manufacturer specified life span. When the operating time exceeds the stored life span, the part and/or radiator 50 may be disabled by the main computer processor 64, or by turning off the external power supply 60.

the radiator 50 can be upgraded without changing the external power supply 60 or the cables 62, 63. For example, the radiator 50 may be equipped with an optional non-contact Infrared (IR) sensor for use as a temperature sensor. The use of a non-contact temperature sensor avoids damage due to potential overheating of the UV emitting bulb 20 (temperatures in excess of 1000 c can be reached). One exemplary IR sensor suitable for use in radiator 50 is the TPD 333/733 thermopile manufactured by Perkin Elmer.

The radiator 50 may also be equipped with an optional UV sensor for detecting the power level of the UV radiation emitted by the UV emitting bulb 20. One type of UV power sensor suitable for use in the radiator 50 may include a UV optical power density photodiode. In the prior art radiator 12, the measured output UV power level (not shown) is used as an aid to manually adjust the UV light power output. The conventional external power supply 40 of fig. 4 may be equipped with a display (not shown) indicating only a percentage of electric power required to drive the magnetron 29.

the conventional radiator 12 is operable to employ UV emitting bulbs 20 of different lengths and types. For a particular length and type of UV emitting bulb 20, it is necessary for a user to manually determine the UV light power emitted from the UV emitting bulb 20 using an external UV light power detector. The use of an on-lamp UV power detector allows the UV power to be automatically adjusted and displayed without any need for manual calibration.

According to one embodiment of the present invention, referring again to FIG. 6, one or more of the sensors 56a-56n may be replaced with one or more photodetectors operable to perform several functions outlined above, including Kr 85 characterization, UV power detection, and light interlock functions.

The radiator 50 shown in fig. 5-8B has several advantages over the prior art radiator 12 shown in fig. 1-3. The digital serial communication lines within the serial bus cable 63 are configured primarily to convey device configuration, command and status transmissions. As a result, the data flow between on-lamp microprocessor 80 and host computer processor 64 is relatively low, thereby allowing the use of inexpensive standard communication protocols/cables (e.g., CAN bus). According to one embodiment of the invention, the on-lamp microprocessor 80 is responsible for locally processing the data received from the plurality of sensors 56a-56n and IMs 54a-54n and sending only the processed results to the host computer processor 64.

Referring again to fig. 6, since all of the connections between the sensors 56a-56n, the IMs 54a-54n and the on-lamp microprocessor board 52 are local connections within the radiator 50, only power and serial communication wiring within the HV cable 62 and the serial bus cable 63, respectively, need to be routed between the radiator 50 and the external power supply 60. As a result, the HV cable 62 and the serial bus cable 63 are low cost alternatives to the HV cable 44. In addition, the signal quality is improved, and the distance between the radiator 50 and the external power supply 60 can be changed. In some applications, it may be desirable to shorten the HV cable 62 and the serial bus cable 63 to improve signal transmission quality and reduce cabling costs. Alternatively, it may be desirable to increase the length of the HV cable 62 and the serial bus cable 63 so that the external power supply 60 and the radiator 50 can be positioned on different levels of the facility. Still further, it is relatively easy to add additional sensors to the radiator 50 without modifying any ports/boards within the HV cable 62 and/or the serial bus cable 63 and/or the external power supply 60.

It should be understood that the exemplary embodiments are merely illustrative of the invention and that numerous modifications of the above-described embodiments may be devised by those skilled in the art without departing from the scope of the present invention. Accordingly, it is intended that all such modifications be included within the scope of the following claims and their equivalents.