阅读说明：本技术 一种气缸加压式环刀型修盘器及其清洗抛光垫的方法 (Cylinder pressurized annular cutter type disc repairing device and method for cleaning polishing pad by using same ) 是由 卓俊辉 孔令沂 邓菁 韩景瑞 孙国胜 李锡光 于 2019-09-20 设计创作，主要内容包括：本发明涉及抛光设备技术领域,尤其涉及一种气缸加压式环刀型修盘器,包括：被吸附平台,开设在所述被吸附平台底部外围的环形刀口,及开设在所述被吸附平台底部的导流槽,所述环形刀口的高度为3mm～20mm、宽度为2mm～5mm,且所述环形刀口有0.5*45°～1*45°的倒角。应用于抛光设备、解决阻尼布抛光垫难以清洗内部、清洗不完全干净等问题,还具有结构设置简单及结构设置合理等特点。另,本发明还提供了一种气缸加压式环刀型修盘器清洗抛光垫的方法。(The invention relates to the technical field of polishing equipment, in particular to a cylinder pressurization type annular cutter type disc repairing device, which comprises: the adsorption device comprises an adsorbed platform, an annular knife edge arranged on the periphery of the bottom of the adsorbed platform, and a diversion trench arranged at the bottom of the adsorbed platform, wherein the height of the annular knife edge is 3-20 mm, the width of the annular knife edge is 2-5 mm, and the annular knife edge is provided with a chamfer angle of 0.5-45 degrees. The damping cloth polishing pad is applied to polishing equipment, solves the problems that the damping cloth polishing pad is difficult to clean the inside and is not completely cleaned, and has the characteristics of simple structure setting, reasonable structure setting and the like. In addition, the invention also provides a method for cleaning the polishing pad by using the air cylinder pressurization type ring cutter type disc repairing device.)

1. The utility model provides a dish ware is repaiied to cylinder pressurization formula cutting ring type which characterized in that includes: the adsorption device comprises an adsorbed platform, an annular knife edge arranged on the periphery of the bottom of the adsorbed platform, and a diversion trench arranged at the bottom of the adsorbed platform, wherein the height of the annular knife edge is 3-20 mm, the width of the annular knife edge is 2-5 mm, and the annular knife edge is provided with a chamfer angle of 0.5-45 degrees.

2. The air cylinder pressurized type ring cutter type disc dresser of claim 1, wherein said adsorbed stage comprises: and an adsorbed table, one side of which is connected with the adsorbed table and is arranged on a side plate surface on the peripheral side of the adsorbed table.

3. The air cylinder pressure type ring cutter type disc dresser for polishing equipment according to claim 2, wherein the sum of the thickness of the adsorbed platform and the height of the side plate surface is 5 to 20mm, and the surface flatness of the adsorbed platform is 2 to 5 wires.

4. The air cylinder pressure type ring cutter type disc dresser for a polishing apparatus according to claim 2 or 3, wherein said sucked table is of a cylindrical shape, and a plan view of said side plate surface is of a circular ring shape.

5. The cylinder-pressing ring cutter type disc dresser of claim 1, wherein the guide groove is substantially U-shaped.

6. The air cylinder pressurized type ring cutter type disc dresser for polishing apparatus according to claim 1 or 4, wherein the height of said guide groove is 2 to 20mm and the width is 5 to 30 mm.

7. The air cylinder pressurized type ring cutter type disc dresser of claim 4, wherein the number of the guide grooves is less than or equal to 4, and the guide grooves are equidistantly distributed.

8. a method for cleaning a polishing pad by using a cylinder pressurization type annular cutter type disc repairing device is characterized by comprising the following steps:

The polishing head adsorbs the disc repairing device;

Introducing water flow with the water flow rate of 10L/min-20L/min;

the polishing disk rotates at the rotating speed of 50rpm-70 rpm;

And slowly starting the polishing head to run at the rotating speed of 30rpm, and pressing the polishing head to the direction of the polishing pad at the pressure of 20kg-30kg for a period of time.

9. The method of claim 8, wherein the polishing head has a run time of less than or equal to 10 minutes.

Technical Field

The invention relates to the technical field of polishing equipment, in particular to a cylinder pressurization type annular cutter type disc repairing device and a method for cleaning a polishing pad by using the same.

Background

Chemical mechanical polishing, abbreviated as CMP, is widely used in the production of semiconductor wafers and integrated circuit fabrication processes to achieve a good flat surface with low roughness and low defect density on the polished surface.

The CMP polishing technology is as follows: the special polishing pad is adhered to a polishing disc of air cylinder pressurization type polishing equipment, special polishing liquid is continuously supplied to the upper side of the polishing pad, one or more ceramic discs are adsorbed on a polishing head of a machine in a vacuum mode, a polished material is fixed to the lower side of the ceramic discs, the surface to be polished of the polished material is in direct contact with the polishing pad and the polishing liquid, the polishing head is pressurized by an air cylinder, set pressure is applied, the polishing disc is kept to rotate at a constant speed to perform corresponding CMP polishing, the polishing pad needs to be cleaned after polishing, next polishing is prepared, and polishing quality is guaranteed.

Traditional method for cleaning polishing pad, it is manual scrubbing with the plastics brush, improved afterwards and replaced with the plastics brush dish, but clean effect is not good enough all the time, can obviously see after soaking evening that still have a large amount of white polishing solution abrasive material to spread in water with the water, a method is washed with water, but the water is washed and then can consume a large amount of water, be not conform to the production needs of enterprise, the reason is that the plastics brush is soft elasticity material, can bending deformation at the scrubbing in-process, can't extrude the washing to the polishing pad nexine, lead to the cleaning performance weak, and the diameter size of the hair of brush is limited, can't direct action in the hole of polishing pad, global nature cleaning capacity is low.

If can not the sanitization for a long time, the abrasive particles of polishing solution can block up the hole of polishing pad, and inside can be full of abrasive particles moreover and lead to the elasticity variation, and even under the untimely moist circumstances that keeps, the polishing solution crystallization leads to the polishing pad sclerosis, and above circumstances all is unfavorable for CMP polishing, can cause the mar damage to being polished material, has shortened polishing pad's life simultaneously greatly.

Disclosure of Invention

the invention provides a cylinder pressurization type annular knife type disc repairing device which is applied to polishing equipment, solves the problems that a damping cloth polishing pad is difficult to clean the inside, is not completely cleaned and the like, and has the characteristics of simple structure arrangement, reasonable structure arrangement and the like.

Correspondingly, the invention also provides a method for cleaning the polishing pad by using the air cylinder pressurization type ring cutter type disc repairing device, which solves the problems that the damping cloth polishing pad is difficult to clean the inside, is not completely cleaned and the like.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a cylinder pressurized type cutting ring type disc repairing device comprises: the adsorption device comprises an adsorbed platform, an annular knife edge arranged on the periphery of the bottom of the adsorbed platform, and a diversion trench arranged at the bottom of the adsorbed platform, wherein the height of the annular knife edge is 3-20 mm, the width of the annular knife edge is 2-5 mm, and the annular knife edge is provided with a chamfer angle of 0.5-45 degrees.

Preferably, the adsorbed platform comprises: and an adsorbed table, one side of which is connected with the adsorbed table and is arranged on a side plate surface on the peripheral side of the adsorbed table.

Preferably, the sum of the thickness of the adsorbed platform and the height of the side plate surface is 5-20 mm, and the surface flatness of the adsorbed platform is 2-5 filaments.

Preferably, the adsorbed platform is cylindrical, and the top view of the side plate surface is circular.

Preferably, the guide groove is U-shaped.

Preferably, the height of the diversion trench is 2-20 mm, and the width is 5-30 mm.

Preferably, the number of the flow guide grooves is less than or equal to 4, and the flow guide grooves are distributed at equal intervals.

According to the cylinder pressurization type circular knife type disc repairing device, the defect that a polishing pad needs to be cleaned manually is overcome by arranging the disc repairing device and applying the disc repairing device to polishing equipment, the annular knife edge is arranged at the bottom of the disc repairing device, when the polishing head is pressed downwards, polishing liquid on the polishing pad can be cleaned conveniently, furthermore, the height of the annular knife edge is set to be 3-20 mm, the width of the annular knife edge is set to be 2-5 mm, and a 0.5-45-1-45-degree chamfer is arranged on the annular knife edge, so that the polishing liquid in the polishing pad can be cleaned completely.

Correspondingly, the invention also provides a method for cleaning the polishing pad by using the air cylinder pressurization type ring cutter type disc repairing device, which comprises the following steps:

The polishing head adsorbs the disc repairing device;

Introducing water flow with the water flow rate of 10L/min-20L/min;

The polishing disk rotates at the rotating speed of 50rpm-70 rpm;

And slowly starting the polishing head to run at the rotating speed of 30rpm, and pressing the polishing head to the direction of the polishing pad at the pressure of 20kg-30kg for a period of time.

preferably, the running time of the polishing head is less than or equal to 10 min.

According to the method for cleaning the polishing pad by using the air cylinder pressurization type circular knife type disc repairing device, after a polishing head adsorbs the disc repairing device, 10L/min-20L/min of water flow is introduced, the rotating speed of the polishing disc is adjusted to 50rpm-70rpm, the polishing head is slowly started to rotate at the rotating speed of 30rpm and is pressed downwards at the same time, the pressure is kept controlled to be within the range of 20kg-30kg for operating for a period of time, and the polishing liquid of the polishing pad is carried out by means of overstocking by the annular knife edge of the disc repairing device, so that the purpose of cleaning the polishing pad is achieved, and meanwhile, the problem of incomplete cleaning in the prior art is solved.

Drawings

fig. 1 is a schematic structural diagram of a cylinder pressurized type cutting ring type disc trimming device.

Fig. 2 is a schematic view of fig. 3 from another perspective.

Fig. 3 is a state diagram of the use of the present invention.

FIG. 4 is a schematic view of a portion of the annular edge cleaning pad of the present invention.

FIG. 5 is a flow chart illustrating the steps of a method for cleaning a polishing pad with a cylinder-pressurized ring-cutter type conditioning disk according to the present invention.

Detailed Description

The embodiments of the present invention will be described in detail with reference to the accompanying drawings, which are for reference and illustration only and are not to be construed as limiting the scope of the invention.