阅读说明：本技术 一种ltcc片式陶瓷滤波器的倒角方法 (Chamfering method of LTCC chip type ceramic filter ) 是由 程飞鹏 黄昆 何以田 陈聪 于 2021-07-05 设计创作，主要内容包括：本发明公开了一种LTCC片式陶瓷滤波器的倒角方法,涉及片式叠层陶瓷元件技术领域。本发明所述LTCC片式陶瓷滤波器的倒角方法包括如下步骤：(1)将LTCC片式陶瓷滤波器、磨料、缓冲物质放入球磨罐中球磨；(2)球磨结束后进行筛分；(3)将分离出的LTCC片式陶瓷滤波器进行排胶烧结；所述磨料为氧化铝磨球或氧化锆磨球；所述缓冲物质包含玉米淀粉、糯米淀粉、木薯粉、粘米粉中的至少一种。本发明所述LTCC片式陶瓷滤波器的倒角方法既可以倒出圆角,还可以保证LTCC片式陶瓷滤波器表面的Mark标识不被磨浅或磨掉。(The invention discloses a chamfering method of an LTCC chip type ceramic filter, and relates to the technical field of chip type laminated ceramic elements. The chamfering method of the LTCC chip type ceramic filter comprises the following steps: (1) putting the LTCC chip type ceramic filter, the grinding material and the buffer substance into a ball milling tank for ball milling; (2) screening after the ball milling is finished; (3) carrying out glue removal and sintering on the separated LTCC chip type ceramic filter; the grinding material is an alumina grinding ball or a zirconia grinding ball; the buffer substance comprises at least one of corn starch, glutinous rice starch, cassava flour and glutinous rice flour. The chamfering method of the LTCC chip type ceramic filter can not only pour out the fillet, but also ensure that the Mark on the surface of the LTCC chip type ceramic filter is not abraded or worn away.)

1. A chamfering method of an LTCC chip type ceramic filter is characterized by comprising the following steps:

(1) putting the LTCC chip type ceramic filter, the grinding material and the buffer substance into a ball milling tank for ball milling;

(2) screening after the ball milling is finished;

(3) carrying out binder removal sintering on the screened materials to obtain a processed LTCC chip type ceramic filter;

the grinding material is an alumina grinding ball or a zirconia grinding ball; the buffer substance comprises at least one of corn starch, glutinous rice starch, cassava flour and glutinous rice flour.

2. The method for chamfering an LTCC chip ceramic filter as claimed in claim 1, wherein the LTCC chip ceramic filter, the buffer substance and the grinding balls have a mass ratio of 1: (0.2-2): (0.5 to 4).

3. The method for chamfering an LTCC chip type ceramic filter according to claim 1, wherein the abrasive has a particle size of 1 to 5 mm.

4. The method for chamfering an LTCC sheet ceramic filter according to claim 1, wherein the ball mill is one of a planetary ball mill, a horizontal chamfering machine, and a shelf ball mill.

5. The method for chamfering an LTCC chip type ceramic filter according to claim 1, wherein the ball milling time is 30 to 60 min.

Technical Field

The invention relates to the technical field of chip type laminated ceramic elements, in particular to a chamfering method of an LTCC chip type ceramic filter.

Background

With the development of 5G communication technology and the permeability improvement of 5G handheld terminal equipment, the chip ceramic filter manufactured based on LTCC technology continuously expands the supply and demand gap at the front end of 5G radio frequency, and simultaneously, higher requirements are provided for the reliability of products. For chip ceramic components manufactured by LTCC technology, such as chip ceramic filters, the manufacturing process includes a chamfering process. Chamfering is achieved by collision of the element with the grinding medium and the element with the element. The purpose of chamfering is to remove the surface burrs of the element, grind off redundant leftover bits to fully expose the inner electrode, facilitate end sealing and waist sealing, and ensure the product performance.

However, a chip-type laminated component manufactured by LTCC technology, such as a chip-type ceramic filter, has a problem that water may enter the interior of the ceramic component through a lamination gap during a general wet chamfering process due to its multilayer/laminated structure, and further, water is vaporized when the end is burned, so that a ceramic body is bubbled and bulges, and the device fails. Meanwhile, the chip type laminated element is soaked in water at a high rotating speed for a long time in the common wet chamfering process, so that the water inlet risk is increased, and the long-term performance reliability of the device is potentially influenced. In addition, the common wet chamfering process such as CN102848285A includes the necessary steps of discharging water washing, high temperature drying, etc., which prolongs the circulation time of the chamfering process and causes waste of resources and energy.

In order to solve the problem that water may enter the inside of the ceramic element through the lamination gap during the general wet chamfering process to cause failure or affect the performance reliability of the device, the introduction of water needs to be fundamentally avoided. Based on this, a dry chamfering process without using water is proposed. However, a chip type ceramic filter manufactured by LTCC technology has a structure different from a chip type multilayer ceramic capacitor (MLCC for short), which has a structure in which upper and lower sides are asymmetrical. Meanwhile, Mark marks for distinguishing the upper surface and the lower surface (or the front surface and the back surface) are printed on the surface of the product for facilitating the test and the packaging integration. The Mark marks on the upper surface of the green ceramic element without sintering are easily ground or abraded in the chamfer preparation process of the chip ceramic capacitor described in the general dry chamfer process such as CN105140027A or CN102315018A, so that the green ceramic element cannot pass through an appearance sorting machine or a testing machine, and the circulation and use of the processes after chamfering are affected.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a chamfering method for an LTCC chip type ceramic filter, which can pour out a required fillet and ensure that Mark marks on the surface of the LTCC chip type ceramic filter are not abraded or worn away.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a chamfering method of an LTCC chip type ceramic filter, the method comprising the steps of:

(1) putting the LTCC chip type ceramic filter, the grinding material and the buffer substance into a ball milling tank for ball milling;

(2) screening after the ball milling is finished;

(3) carrying out binder removal sintering on the screened materials to obtain a processed LTCC chip type ceramic filter;

the grinding material is an alumina grinding ball or a zirconia grinding ball; the buffer substance comprises at least one of corn starch, glutinous rice starch, cassava flour and glutinous rice flour.

According to the invention, a dry chamfering process is selected to chamfer the LTCC chip type ceramic filter. The dry chamfering process is characterized in that: and adding the product, the grinding material and the buffer substance into a ball milling tank according to the amount, separating to obtain the product after chamfering, and sintering to obtain the required product without secondary treatment. Compared with the common wet chamfering process, the method has the advantages that the steps of washing, drying and the like are omitted, the process is simple, and the waste of resources can be reduced; meanwhile, the required equipment is less, and the economic benefit is higher. Water is not introduced in the whole process of the dry chamfering process, the phenomenon that water enters the element through the laminated gap is fundamentally avoided, the failure caused by the fact that the water enters the element is reduced, and the long-term stability of the element is theoretically facilitated. The chip ceramic filter manufactured by the LTCC technology has a structure different from that of a chip multilayer ceramic capacitor (MLCC for short), and Mark marks for distinguishing the upper surface and the lower surface need to be printed on the surface of a product for facilitating test and packaging integration. The Mark marks on the upper surface of the green ceramic element without sintering are easy to be ground or removed in the common dry chamfering process. According to the invention, the common action of the abrasive and the buffer substance is selected to chamfer the LTCC chip type ceramic filter, so that the Mark on the surface of the green blank after chamfering can be ensured to be still clear and visible.

The corn starch, the glutinous rice starch, the cassava flour, the glutinous rice flour and the like which are selected as organic matters are combusted and converted into carbon dioxide and water in a degreasing stage in the element sintering process, so that other impurities cannot be introduced, and multiple experiments prove that the performance of the product cannot be influenced after the chamfering process.

Preferably, the mass ratio of the LTCC chip type ceramic filter to the buffer substance to the grinding balls is 1: (0.2-2): (0.5 to 4). By selecting the mass ratio of the three components, the required fillet effect can be obtained within a short time (30-60 min).

Preferably, the grain diameter of the grinding material is 1-5 mm. Preferably, the ball milling device is one of a planetary ball mill, a horizontal chamfering machine and a shelf ball mill; the total charging volume of the single tank is 40-70% of the total volume of the tank; the ball milling time is 30-60 min.

Compared with the prior art, the invention has the beneficial effects that:

(1) the used raw materials of grinding balls and starch are low in price, easy to obtain and free of pollution in the using process; (2) the treatment process is simple, and the product can be circulated to the next process without further treatment after the chamfering is finished and the product is sieved, separated and subjected to binder removal and sintering; (3) the energy-saving and environment-friendly process is facilitated, washing and drying are not needed, and the use of resources and energy (water and electricity) and the investment of equipment (such as an oven) are reduced; (4) the circulation time of the product in the chamfering process is greatly shortened, and the production efficiency is improved; (5) when the required round angle is poured out, Mark marks on the surface of the LTCC chip type ceramic filter cannot be abraded.

Drawings

FIG. 1 is an external view of an LTCC chip ceramic filter with Mark marks on the surface;

FIG. 2 is an external view of an LTCC chip type ceramic filter chamfered by the method described in example 1;

fig. 3 is an external view of the LTCC sheet type ceramic filter chamfered by the method described in comparative example 1.

Detailed Description

To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to the accompanying drawings and specific embodiments.

Example 1

In an embodiment of the chamfering method for the LTCC chip ceramic filter of the present invention, the chamfering method includes the following steps:

(1) chamfering is carried out on an LTCC chip type ceramic filter with the size specification of 3216 (metric system), aluminum oxide grinding balls with the grain size of 3mm and starch are selected for ball milling, the mass ratio of the LTCC chip type ceramic filter to the starch to the grinding balls is 1:0.5:3, the total charging volume of a single tank is 50% of the total volume of the tank, and ball milling is carried out at the rotating speed of 150rpm for 30 min;

(2) screening the material obtained in the step (1) to remove grinding balls and most of starch;

(3) and (3) carrying out binder removal sintering on the screened materials, wherein the sintering temperature is 850 ℃, and thus obtaining the processed LTCC chip type ceramic filter.

Fig. 1 is an external view of an un-chamfered LTCC sheet type ceramic filter, and fig. 2 is an external view of an LTCC sheet type ceramic filter processed by the method described in example 1; the comparison shows that after chamfering by the method of the embodiment 1, Mark marks on the surface of the LTCC chip type ceramic filter have no obvious change and are still clearly visible, the sizes of four round corners of the filter are uniform, and the round corners R are all 0.075mm without great difference.

Example 2

In an embodiment of the chamfering method for the LTCC chip ceramic filter of the present invention, the chamfering method includes the following steps:

(1) chamfering is carried out on an LTCC chip type ceramic filter of 2012 dimension specifications (metric system), ball milling is carried out on zirconia grinding balls with the grain size of 3mm and starch, the mass ratio of the LTCC chip type ceramic filter to the starch to the grinding balls is 1:1:2, the total charging volume of a single tank is 50% of the total volume of the tank, and ball milling is carried out for 30min at the rotating speed of 150 rpm;

(2) screening the material obtained in the step (1) to remove grinding balls and most of starch;

(3) and (3) carrying out binder removal sintering on the screened materials, wherein the sintering temperature is 850 ℃, and thus obtaining the processed LTCC chip type ceramic filter.

After chamfering by the method of the embodiment, Mark marks on the surface of the LTCC chip type ceramic filter have no obvious change, and are similar to those in embodiment 1, the sizes of four fillets of the filter are uniform, and the R of each fillet is 0.065 mm.

Example 3

In an embodiment of the chamfering method for the LTCC chip ceramic filter of the present invention, the method includes the following steps:

(1) chamfering products of 1608 (metric system) size specifications, selecting zirconia grinding balls with the grain size of 2mm and starch for ball milling, wherein the mass ratio of the LTCC chip type ceramic filter to the starch to the grinding balls is 1:0.8:2, the total charging volume of a single tank is 50% of the total volume of the tank, and ball milling is carried out for 45min at the rotating speed of 165 rpm;

(2) screening the material obtained in the step (1) to remove grinding balls and most of starch;

(3) and (3) carrying out binder removal sintering on the screened materials, wherein the sintering temperature is 850 ℃, and thus obtaining the processed LTCC chip type ceramic filter.

After chamfering by the method of the embodiment, Mark marks on the surface of the LTCC chip type ceramic filter have no obvious change, and are similar to those in embodiment 1, the sizes of four fillets of the filter are uniform, and the fillet R is 0.050 mm.

Example 4

In an embodiment of the chamfering method of the present invention, the method includes the following steps:

(1) chamfering is carried out on an LTCC chip type ceramic filter of 2012 dimension specifications (metric system), ball milling is carried out on zirconia grinding balls with the grain size of 3mm and starch, the mass ratio of the LTCC chip type ceramic filter to the starch to the grinding balls is 1:2:3, the total charging volume of a single tank is 50% of the total volume of the tank, and ball milling is carried out for 30min at the rotating speed of 150 rpm;

(2) screening the material obtained in the step (1) to remove grinding balls and most of starch;

(3) and (3) carrying out binder removal sintering on the screened materials, wherein the sintering temperature is 850 ℃, and thus obtaining the processed LTCC chip type ceramic filter.

After chamfering by the method of the embodiment, Mark marks on the surface of the LTCC chip type ceramic filter have no obvious change, and are similar to those in embodiment 1, the sizes of four fillets of the filter are uniform, and the fillet R is 0.050 mm.

Comparative example 1

A chamfering method, comprising the steps of:

(1) chamfering is carried out on an LTCC chip type ceramic filter with the size specification of 3216 (metric system), and aluminum oxide grinding balls with the grain size of 3mm are selected for ball milling, the mass ratio of the LTCC chip type ceramic filter to the grinding balls is 1:2.5, the total charging volume of a single tank is 50% of the total volume of the tank, and ball milling is carried out for 30min at the rotating speed of 150 rpm;

(2) screening the material obtained in the step (1) to remove grinding balls;

(3) and sintering the screened materials at the sintering temperature of 850 ℃ to obtain the chamfered LTCC chip ceramic filter.

Fig. 3 is an external view of the LTCC sheet type ceramic filter treated by the method of comparative example 1, and it can be seen that Mark marks on the surface of the treated LTCC sheet type ceramic filter are severely worn, which is not favorable for circulation and use after chamfering.

Comparative example 2

A chamfering method, comprising the steps of:

(1) chamfering an LTCC chip type ceramic filter with the size specification (metric system) of 3216, ball-milling with starch, wherein the mass ratio of the LTCC chip type ceramic filter to the starch is 1:2.5, the total volume of the single tank is 50% of the total volume of the tank, and ball-milling is carried out at the rotating speed of 150rpm for 30 min;

(2) screening the material obtained in the step (1) to remove starch;

(3) and (3) carrying out binder removal sintering on the screened materials, wherein the sintering temperature is 850 ℃, and obtaining the processed LTCC chip type ceramic filter.

After chamfering by the method of the comparative example 2, the fillet effect of the LTCC chip type ceramic filter is not obvious, and the production efficiency is reduced.

Comparative example 3

A chamfering method, comprising the steps of:

(1) chamfering is carried out on an LTCC chip type ceramic filter with the size specification of 3216 (metric system), aluminum oxide grinding balls with the grain size of 3mm and starch are selected for ball milling, the mass ratio of the LTCC chip type ceramic filter to the starch to the grinding balls is 1:2.5:3, the total charging volume of a single tank is 50% of the total volume of the tank, and ball milling is carried out at the rotating speed of 150rpm for 30 min;

(2) screening the material obtained in the step (1) to remove grinding balls and most of starch;

(3) and (3) carrying out binder removal sintering on the screened materials, wherein the sintering temperature is 850 ℃, and obtaining the processed LTCC chip type ceramic filter.

Mark marks on the surface of the LTCC chip type ceramic filter processed by the method have no obvious change, but round corners with uniform size are not poured out after ball milling for 30 min. Experiments show that when the mass ratio of the LTCC chip type ceramic filter to the starch to the grinding balls is 1:2.5:3, a proper round angle can be poured out after ball milling for 2 hours.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.