阅读说明：本技术 电子纸封装结构 (Electronic paper packaging structure ) 是由 黄振勋 沈煌凯 涂克帆 于 2020-04-21 设计创作，主要内容包括：本发明公开一种电子纸封装结构,包括一基板、一电子墨水层、一盖板、一水气阻隔膜以及一黏着层。电子墨水层设置于基板上。盖板覆盖电子墨水层。水气阻隔膜包覆基板与电子墨水层。黏着层直接接合于盖板与水气阻隔膜之间,以密封基板与电子墨水层,且黏着层未接合于盖板与电子墨水层之间。(The invention discloses an electronic paper packaging structure which comprises a substrate, an electronic ink layer, a cover plate, a moisture barrier film and an adhesion layer. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer. The substrate and the electronic ink layer are covered by the water-vapor barrier film. The adhesion layer is directly jointed between the cover plate and the water-air barrier film to seal the substrate and the electronic ink layer, and the adhesion layer is not jointed between the cover plate and the electronic ink layer.)

1. An electronic paper packaging structure, comprising:

a substrate;

an electronic ink layer disposed on the substrate;

a cover plate covering the electronic ink layer;

a moisture barrier film covering the substrate and the electronic ink layer; and

and the adhesion layer is directly jointed between the cover plate and the water-gas barrier film to seal the substrate and the electronic ink layer, and the adhesion layer is not jointed between the cover plate and the electronic ink layer.

2. The electronic paper packaging structure of claim 1, wherein the cover plate comprises a transparent substrate and a light-transmissive moisture barrier layer.

3. The electronic paper packaging structure of claim 1, wherein the cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area correspondingly engages the adhesive layer.

4. The electronic paper packaging structure of claim 1, wherein a side surface of the substrate protrudes a first distance relative to a side surface of the electronic ink layer, and the side surface of the electronic ink layer is spaced a second distance relative to a side surface of the cover plate, wherein the second distance is greater than the first distance.

5. The electronic paper packaging structure of claim 1, wherein the substrate includes an outlet portion extending outside the cover plate, the electronic ink layer is located between the substrate and the cover plate, and a lower surface of the cover plate, a side surface of the electronic ink layer, and an upper surface of the outlet portion define a groove.

6. The electronic paper package structure of claim 5, further comprising a sealant filled in the recess.

7. The electronic paper packaging structure of claim 5, wherein the adhesive layer is not bonded between the cover plate and the wire outlet portion.

8. An electronic paper packaging structure, comprising:

a substrate including an outlet portion;

an electronic ink layer disposed on the substrate;

a cover plate covering the electronic ink layer;

a moisture barrier film covering the substrate and the electronic ink layer;

an adhesive layer directly bonded between the cover plate and the water-gas barrier film, wherein the wire outlet part extends out of the cover plate, the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined on a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the wire outlet part; and

a sealant filled in the groove.

9. The electronic paper packaging structure of claim 8, wherein the adhesive layer is not bonded between the cover plate and the electronic ink layer.

10. The electronic paper packaging structure of claim 8, wherein the adhesive layer is not bonded between the cover plate and the wire outlet portion.

11. The electronic paper packaging structure of claim 8, wherein the cover plate comprises a transparent substrate and a light-transmissive moisture barrier layer.

12. The electronic paper packaging structure of claim 8, wherein the cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area correspondingly engages the adhesive layer.

Technical Field

The present invention relates to an electronic device package structure, and more particularly, to an electronic paper package structure.

Background

With the progress of flat panel display technology, more and more electronic products are equipped with display devices, especially portable electronic products such as mobile phones, electronic books, digital cameras, etc. Since the portable electronic products are developed towards the trend of light weight, small volume and thin thickness, the display devices applied to the portable electronic products also have the advantages of light weight, small volume and thin thickness.

In order to promote paperless, an electronic billboard, such as an electrophoretic display (EPD) or an Electronic Paper Display (EPD), may replace a conventional printed billboard, which is not only light and thin, but also designed to be flexible.

However, the package structure of the electrophoretic display device or the electronic paper display device has to perform two barrier film lamination steps, which results in high cost and poor moisture barrier capability.

Disclosure of Invention

The invention aims to provide an electronic paper packaging structure which can save cost and improve the water vapor barrier capability.

According to an aspect of the present invention, an electronic paper package structure is provided, which includes a substrate, an electronic ink layer, a cover plate, a moisture barrier film, and an adhesive layer. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer. The substrate and the electronic ink layer are covered by the water-vapor barrier film. The adhesion layer is directly jointed between the cover plate and the water-air barrier film to seal the substrate and the electronic ink layer, and the adhesion layer is not jointed between the cover plate and the electronic ink layer.

Wherein, the cover plate comprises a transparent substrate and a light-transmitting water vapor barrier layer.

The cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area is correspondingly connected with the adhesion layer.

The side surface of the electronic ink layer is separated from the side surface of the cover plate by a second distance, wherein the second distance is greater than the first distance.

The substrate comprises an outgoing part extending out of the cover plate, the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined on a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the outgoing part.

Wherein, it further comprises a sealing compound filled in the groove.

Wherein, the adhesion layer is not jointed between the cover plate and the wire outlet part.

According to an aspect of the present invention, an electronic paper package structure is provided, which includes a substrate, an electronic ink layer, a cover plate, a moisture barrier film, an adhesive layer, and a sealant. The substrate comprises an outgoing part. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer. The substrate and the electronic ink layer are covered by the water-vapor barrier film. The adhesive layer is directly jointed between the cover plate and the water-air barrier film, the wire outlet part extends out of the cover plate, the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined on the lower surface of the cover plate, one side surface of the electronic ink layer and one upper surface of the wire outlet part. The sealing compound is filled in the groove.

Wherein, the adhesion layer is not jointed between the cover plate and the electronic ink layer.

Wherein, the adhesion layer is not jointed between the cover plate and the wire outlet part.

Wherein, the cover plate comprises a transparent substrate and a light-transmitting water vapor barrier layer.

The cover plate comprises a display area and a non-display area, the display area correspondingly displays the electronic ink layer, and the non-display area is correspondingly connected with the adhesion layer.

In order to better understand the above and other aspects of the present invention, the following detailed description is given with reference to the accompanying drawings, but not by way of limitation:

drawings

FIG. 1 is a schematic top view illustrating an electronic paper package according to an embodiment of the invention;

FIG. 2 is a schematic view of an electronic paper package structure according to an embodiment of the invention in a cross-section A-A; and

FIG. 3 is a schematic diagram illustrating an electronic paper package structure according to an embodiment of the invention in a cross-section B-B.

Wherein, the reference numbers:

100 electronic paper packaging structure

110 base plate

1101 side surface

1102 upper surface

1103, a wire outlet part

111: groove

112 electronic ink layer

1121 side surface

113 transparent electrode layer

114 cover plate

114a transparent substrate

114b light-transmitting moisture barrier layer

1141 side surface

1142 lower surface

116 moisture barrier film

117 adhesive layer

118 sealing compound

D1 display area

D2 non-display area

Detailed Description

The following embodiments are provided for illustrative purposes only and are not intended to limit the scope of the present invention. The following description will be given with the same/similar reference numerals as used for the same/similar elements. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are referred to only in the direction of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

According to an embodiment of the present invention, an electronic paper package structure is provided, which includes a moisture barrier film bonded to a cover plate by a single adhesive layer, so as to increase the moisture barrier capability of the electronic paper package structure and reduce the cost. In one embodiment, the Water Vapor barrier capability is differentiated by the value of the Water Vapor Transmission Rate (WVTR). Preferably, the WVTR is less than 2-5 g/m at a temperature of 60 ℃ and a humidity of 90%²A day, or less than 1g/m²A day, or less than 0.5g/m²A day, or less than 0.1g/m²A day, or even less than 0.01g/m²The day is.

Referring to fig. 1 to 3, wherein fig. 1 is a schematic top view of an electronic paper package structure 100 according to an embodiment of the invention, fig. 2 is a schematic diagram of the electronic paper package structure 100 according to an embodiment of the invention in a cross section a-a, and fig. 3 is a schematic diagram of the electronic paper package structure 100 according to an embodiment of the invention in a cross section B-B.

In one embodiment, the electronic paper packaging structure 100 may include a substrate 110, an electronic ink layer 112, a cover plate 114, a moisture barrier film 116, an adhesive layer 117, and a molding compound 118.

The substrate 110 is, for example, a transparent glass or plastic substrate or an opaque substrate, and the upper surface 1102 of the substrate 110 is configured with a thin film transistor array (TFT array) or conductive graphite as a lower electrode plate. The cover plate 114 may include a transparent substrate 114a and a light-transmissive moisture barrier layer 114b, wherein the transparent substrate 114a is, for example, plastic or glass, and the material thereof may include a polymer plastic material such as polyethylene terephthalate (PET), Polystyrene (PS), Polycarbonate (PC), and the like. The material of the transparent moisture barrier layer 114b may be at least one of aluminum oxide (AlOx), silicon oxide, silicon nitride, titanium oxide, zirconium oxide, aluminum oxynitride, silicon oxynitride, and amorphous carbon. The moisture barrier ability of the light transmissive moisture barrier layer 114b is greater than that of the transparent substrate 114 a. In addition, the bottom surface 1142 of the cover plate 114 is provided with a transparent electrode layer 113, such as Indium Tin Oxide (ITO), as an upper electrode plate.

The electronic ink layer 112 is disposed on the substrate 110, and the electronic ink layer 112 is located between the substrate 110 and the cover plate 114. The electronic ink layer 112 may, for example, include millions of microcapsules (microcapsules) each containing electrophoretic particles, wherein the electrophoretic particles are negatively charged white and positively charged black particles suspended in a transparent liquid. When the electric field between the substrate 110 and the cover plate 114 is turned on, the electrophoretic particles move to the top of the microcapsule by the principle that the positive and negative charges attract each other, and a user can see the white or black particles on the corresponding block, thereby displaying a pixel pattern. In addition, the electronic ink layer 112 may also be a three-color or multi-color electronic ink layer to realize a full-color domain display effect, but the invention is not limited thereto. In addition, the electronic ink layer 112 may be a microcapsule (microcapsules) type electronic ink layer or a microcup type electronic ink layer.

In one embodiment, the moisture barrier film 116 is used to cover the substrate 110 and the electronic ink layer 112, so that the substrate 110 and the electronic ink layer 112 are sealed between the cover plate 114 and the moisture barrier film 116. In addition, the adhesive layer 117 is directly bonded between the cover plate 114 and the moisture barrier film 116, so as to reduce the moisture of the external environment entering through the adhesive layer 117, thereby increasing the moisture barrier capability of the electronic paper packaging structure 100. In one embodiment, the thickness of the adhesive layer 117 is about 25 μm, which is increased by 2 times (about 50 μm) compared to the conventional method of bonding two barrier films by using a double adhesive layer, so that more moisture in the external environment can enter through the double adhesive layer. Therefore, in the embodiment, the single adhesive layer 117 is directly bonded between the cover plate 114 and the moisture barrier film 116, which can save the cost and increase the moisture barrier capability of the electronic paper packaging structure 100.

In addition, in the embodiment, the single adhesive layer 117 is directly bonded between the cover plate 114 and the moisture barrier film 116, so the adhesive layer 117 is not bonded between the cover plate 114 and the electronic ink layer 112.

The moisture barrier film 116 includes a polymer such as epoxy resin, Polyurethane (PU), silica gel, or aluminum foil, or at least one material selected from aluminum oxide (AlOx), silicon oxide, silicon nitride, titanium oxide, zirconium oxide, aluminum oxynitride, silicon oxynitride, and amorphous carbon. In one embodiment, the moisture barrier film 116 covers the periphery of the substrate 110 and the electronic ink layer 112, wherein the electronic ink layer 112 is correspondingly displayed in a display area D1 of the cover plate 114, and the adhesive layer 117 is correspondingly bonded to a non-display area D2 of the cover plate 114.

In addition, referring to fig. 2, the side surface 1121 of the electronic ink layer 112 is substantially aligned with the side surface 1101 of the substrate 110 or the side surface 1101 of the substrate 110 protrudes a first distance relative to the side surface 1121 of the electronic ink layer 112, and the side surface 1121 of the electronic ink layer 112 is spaced a second distance (i.e., the width of the non-display area D2, for example, 2mm) relative to the side surface 1141 of the cover plate 114, wherein the second distance is greater than the first distance, so that the electronic ink layer 112 is hidden between the substrate 110 and the cover plate 114 to increase the moisture blocking distance and prevent the electronic ink layer 112 from being affected by moisture penetration of the external environment.

Referring to fig. 1 and 3, the substrate 110 may include a wire outlet portion 1103 for inputting/outputting a signal. The wire outlet portion 1103 extends out of the cover plate 114, and a lower surface 1142 of the cover plate 114, a side surface 1121 of the electronic ink layer 112, and an upper surface 1102 of the wire outlet portion 1103 define a groove 111. In the present embodiment, the encapsulant 118 can be filled in the recess 111 to prevent the electronic ink layer 112 from being affected by moisture penetration of the external environment. The molding compound 118 can be a thermoplastic, thermosetting, ultraviolet-curable, or room temperature-curable polymer curing compound, but the invention is not limited thereto.

In addition, since the encapsulant 118 is already sealed between the outgoing line portion 1103 of the substrate 110 and the cover plate 114, the adhesive layer 117 is not required to be bonded between the substrate 110 and the cover plate 114, so as to reduce the amount of the adhesive layer 117.

According to the electronic paper packaging structure disclosed by the embodiment of the invention, only one step of attaching the water-air-resistance diaphragm is needed, the manufacturing process is simplified, and the cost is lower. In addition, since the thickness of the adhesive layer is thin (e.g., less than 25 μm) and the gap between the cover plate and the moisture barrier film is small (e.g., less than 25 μm), moisture in the external environment is less likely to enter through the adhesive layer, thereby increasing the moisture barrier capability of the electronic paper package structure.

In summary, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.